JP6092233B2 - Component placement machine and component holding device elevation control method - Google Patents

Description

  The present invention relates to a component mounting machine that mounts a component on a board, and also relates to a method for controlling vertical movement of a component holding device that holds and removes a component in the component mounting machine.

  In the operation of mounting a component on a substrate in a component mounting machine, a highly accurate operation is desired so that the component is not damaged or misaligned. For example, the component mounting machine described in the following patent document is configured to estimate the warpage / distortion of the board and correct the height at which the component is mounted.

Japanese Patent Laid-Open No. 11-145682 JP 2000-299597 A

  In a component mounting machine, deformation of the frame or the like that forms the skeleton of the mounting machine may occur with the operation of the component mounting machine. When such deformation of the frame occurs, there is a problem that the relative position in the height direction of the component holding device and the device for holding the substrate or the device for supplying the component changes depending on it. The present invention has been made in view of such circumstances, and a component mounting machine capable of performing an appropriate component mounting operation even when the component mounting head is displaced from a reference position, and It is an object of the present invention to provide a method for controlling the vertical movement of a component holding device for performing an appropriate component mounting operation.

In order to solve the above problems, the component mounting machine of the present invention has (A) a base, (B) a frame fixed to the base, and (C) a component holding device for holding and releasing the component, A component mounting head for mounting the component on the board, (D) a head moving device arranged on the frame and moving the component mounting head along a horizontal plane, and (E) moving the component holding device in the vertical direction. A holding device lifting and lowering device; and (F) a height sensor that is moved together with the component mounting head by the head moving device and measures the height of the measuring point, and (G) disposed on the base. A transport device having a pair of conveyors on which the substrate ends are placed and transporting the substrates; and (ii) a substrate fixing device for sandwiching and fixing the substrates between each of the pair of conveyors. And (H) a control device for controlling the component mounting machine. The control device (a) controls the head moving device and the height sensor to measure the heights of a plurality of measurement points provided on the base, and (b) them. Based on the heights of a plurality of measurement points, the head displacement for estimating the displacement in the height direction with respect to the reference height caused by the heat generated by the operation of the component placement machine of the component placement head moved by the head moving device. (C) Estimating the height of the mounting position of the component on the board transported by the transport device, and determining the target lift amount that is the target of the vertical movement amount of the component holding device at the component mounting position A target lifting amount determination unit that performs the holding and corrects the target lifting amount based on the estimated displacement of the component mounting head when the vertical position of the component holding device is controlled by the holding device lifting device. Device movement amount And a part of a plurality of measurement points are provided in each of the pair of conveyors, and when the target lifting amount determination unit estimates the height of the mounting position of the component, A part of a plurality of measurement points provided on each of the pair of conveyors is used.

Moreover, the holding device raising / lowering control method of the present invention includes the above-described method, and a plurality of measurement points are provided on the base, and a part of the plurality of measurement points is provided on each of the pair of conveyors. In the component mounting machine, a method for controlling the vertical movement of the component holding device, wherein (i) a plurality of measuring points that measure the height of a plurality of measuring points provided on the base by a height sensor (Ii) a reference height generated due to heat generated by the operation of the component mounting machine of the component mounting head moved by the head moving device based on the measured heights of the plurality of measurement points. A head misalignment estimating step for estimating a misalignment in the height direction with respect to the height of the mounting position of the component on the board transported by the transport device, and a plurality of measuring points provided on each of the pair of conveyors. The component parts A target lift amount determining step for determining a target lift amount as a target in the vertical direction of movement of the component hold device in the position, in controlling the vertical position of the component holding device by (iv) holding the device lifting device, And a holding device movement amount correction step of correcting the target lift amount based on the estimated component mounting head displacement.

According to the component mounting machine and the holding device raising / lowering control method of the present invention, even if the component mounting head is displaced due to deformation of the component mounting machine caused by heat generation, It is possible to control the height to an appropriate position. Thereby, for example, it is possible to prevent a large load from being applied to the component or the substrate when the component is attracted or the component is mounted on the substrate. Further, according to the component mounting machine and the holding device lifting / lowering control method of the present invention, a part of the measurement points for estimating the shape of the board is a measurement for estimating the deviation in the height direction of the component mounting head. Since it coincides with the point, the cycle time can be shortened.

It is a perspective view of the component mounting machine which is an Example of this invention. It is a side view of the component mounting machine which is an Example of this invention. It is a perspective view which expands and shows the conveying apparatus shown in FIG. FIG. 2 is a plan view showing positions of a plurality of measurement points provided on a base, omitting the frame shown in FIG. 1. It is a top view which shows the position of the measuring point for estimating the shape of a board | substrate. It is a figure which shows the relationship between the shift | offset | difference of the height direction of the component mounting head in the component mounting machine of a present Example, and the correction amount of the moving amount | distance of the up-down direction of a holding | maintenance device. It is a block diagram which shows the function structure of the control apparatus which manages control of the component mounting machine of a present Example.

<Configuration of component mounting machine>
1 and 2 show a component mounting machine 10 that is an embodiment of the present invention. FIG. 1 is a perspective view of the component mounting machine 10, and FIG. 2 is a side view of the component mounting machine 10. In addition, the operation | work which mounts components in a board | substrate arrange | positions the several component mounting machine 10 in order to mount a several kind of component in a board | substrate. In FIG. 1, two of the plurality of component mounting machines 10 are shown, and one of them shows the one with the exterior panel removed. The component mounting machine 10 includes a base 20, a beam 22 as a frame fixedly provided on the base 20, a board conveyor device 24 that is a transfer device disposed on the base, and a front side of the component mounting machine 10. Any of the plurality of component feeders 26 that are replaceably attached to the base 20, the component camera 28 fixed to the base 20 between the substrate conveyor device 24 and the plurality of component feeders 26, and the plurality of component feeders 26. A component mounting head 30 for holding the component supplied from the substrate and detaching the component for mounting on the substrate S, and a head moving device 32 disposed on the beam 22 to move the component mounting head 30. Has been. In the following description, the direction in which the substrate is conveyed by the substrate conveyor device 24 is the left-right direction (X direction), and the direction perpendicular to the left-right direction on the horizontal plane is the front-rear direction (Y direction). The direction perpendicular to the front-rear direction is referred to as the up-down direction (Z direction).

  In FIG. 3, the perspective view of the board | substrate conveyor apparatus 24 is shown. FIGS. 3A and 3B are perspective views from the viewpoints opposite to each other. The substrate conveyor device 24 has a pair of conveyors 40, and the substrate S placed on the pair of conveyor belts 42 by rotating each conveyor belt 42 of the pair of conveyors 40 by a transport motor 44. Is configured to be conveyed in the left-right direction. Although a detailed description is omitted, one of the pair of conveyors 40 is moved in the front-rear direction by an electromagnetic motor 46 so that it can accommodate substrates S of various widths. Moreover, the board | substrate conveyor apparatus 24 raises the support table 48, and pinches | interposes the board | substrate S between the support table 48 and the collar part 50 provided above each of the pair of conveyors 40, and fixes it. It is possible. That is, the substrate conveyor device 24 includes a substrate fixing device 52 configured to include the support table 48 and the flange portion 50.

  The head moving device 32 is a so-called XY type moving device, and includes a head mounting body 60 to which the component mounting head 30 is detachably mounted, an X direction moving mechanism for moving the head mounting body 60 in the X direction, and the beam 22. The X-direction moving mechanism that is supported includes a Y-direction moving mechanism that moves the mounting head 30 across the component feeder 26 and the substrate S. As shown in FIG. 2, a substrate camera 62 for imaging the surface of the substrate S and a laser sensor 64 as a height sensor for measuring the height are fixed to the lower portion of the head mounting body 60. Has been.

  The component mounting head 30 is a so-called index type mounting head. That is, each of the component mounting heads 30 has eight suction nozzles 70 that function as component holding devices and suck and hold the components at the lower end by supplying negative pressure, and these are held by the revolver 72. ing. The revolver 72 rotates intermittently, and one suction nozzle 70 located at a specific position can be moved up and down by a nozzle lifting mechanism as a holding device lifting and lowering device, that is, can be moved in the vertical direction. When the suction nozzle 70 located at a specific position is lowered, negative pressure is supplied to hold the component, and when the negative pressure supply is cut off, the suction holding component is removed. Let Incidentally, each of the eight suction nozzles 70 can be rotated around its own axis by the nozzle rotation mechanism, that is, around the axis, and the component mounting head 30 is moved by each suction nozzle 70. It is possible to change and adjust the rotational position of the held component.

  As described above, in the component mounting machine 10 of the present embodiment, the holding device lifting device is provided in the component mounting head 30, but instead of the holding device lifting device provided in the component mounting head 30. Alternatively, in addition to the holding device lifting / lowering device provided in the component mounting head 30, the head moving device 32 may be provided. Specifically, it is also possible to employ a structure that moves the head mounting body 60 to which the component mounting head 30 is mounted in the vertical direction as the holding device lifting device.

  Each of the plurality of component feeders 26 is set with a reel on which a component holding tape (a plurality of components are held on the tape, also called “component taping”) is wound. Each of the feeders 26 supplies parts one by one sequentially at a predetermined part supply site by intermittently feeding out the part holding tape. The replenishment of the parts may be performed by splicing the part taping while exchanging the reels (splicing), or may be performed by exchanging the reels together with the part feeder 26. The component mounting machine 10 can be attached with a so-called tray-type component supply device in place of the plurality of component feeders 26.

<Outline of component mounting work by component mounting machine>
If the component mounting operation by the component mounting machine 10 of the present embodiment is described, first, the substrate S to be used for the operation is carried from the upstream side by the substrate conveyor device 24 and fixed at a predetermined operation position. Next, the substrate camera 62 is moved by the head moving device 32, and the reference mark attached to the upper surface of the substrate S is imaged. Based on the imaging data obtained by the imaging, a coordinate system serving as a reference for the mounting position is determined. Next, the laser sensor 64 is moved by the head moving device 32, and the heights of a plurality of measurement points set on the substrate S are measured. Although described in detail later, the height of the component mounting position on the substrate S is obtained based on the measurement results.

  Subsequently, the component moving head 30 is positioned above the plurality of component feeders 26 by the head moving device 32, and the components are sequentially held in each of the eight suction nozzles 70. While the component mounting head 30 is moved above the substrate S, the component camera 28 passes through the component camera 28 and is held by each of the suction nozzles 70 and is imaged by the component camera 28. Based on the imaging data, a positional deviation amount (a concept including a rotational positional deviation) of each component with respect to the nozzle axis is grasped. Subsequently, the component mounting head 30 is moved above the substrate S, and each component is sequentially mounted at a set position determined by the mounting program while performing correction based on the positional deviation amount. The component mounting head 30 is reciprocated between the component feeder 26 and the board S a number of times determined by the mounting program, and the holding and mounting of the component by the component mounting head 30 is repeated as described above, so that one component The component mounting operation by the mounting machine 10 is completed. When one board S passes through a plurality of component mounting machines 10, the above-described component mounting work by each component mounting machine 10 is sequentially performed on one board S, and the mounting work on one board S by the component mounting machine 10 is performed. Is completed.

<Control method in the vertical direction of the component mounting machine>
The component mounting machine 10 of this embodiment is characterized by a method for controlling the vertical movement of the suction nozzle 70 that is a component holding device. In short, in the component mounting machine 10 of the present embodiment, the vertical distance between the component mounting head 30 and the base 20 may change due to heat generated during operation. The raising and lowering of the suction nozzle 70 is controlled so as to cope with this. Below, the raising / lowering control method of the suction nozzle 70 in this component mounting machine 10 is demonstrated in detail.

i) Reference Height Measurement Step When the component mounting machine 10 of this embodiment starts operation, the laser sensor 64 as a height sensor is initialized. As shown in FIG. 2, a reference block 80 is provided adjacent to a pair of conveyors 40 fixed to the base 20. The laser sensor 64 uses the height of the reference block 80 as a reference height H ₀ , and obtains the height of the measurement point based on the vertical difference between the reference block 80 and the measurement point. The reference block 80 has the same height as that of the substrate S when the substrate S is fixed by the substrate fixing device 52 of the substrate conveyor device 24.

ii) Double measuring point measuring step Next, the laser sensor 64 measures each of the twelve measuring points 90 arranged on the base 20. These twelve measurement points 90 are arranged at the same height as the reference block 80 so as to extend over the entire base 20 as shown in FIG. Specifically, three measuring points 90 are arranged in the left-right direction on the front side where the component feeder 26 of the base 20 is attached, and are arranged in the left-right direction on the rear end side of the component mounting machine 10. Three are arranged. In addition, three are arranged side by side in the left-right direction on the upper surface side of the flange 50 of each pair of conveyors 40. In the double measurement point measurement step, which is a step of measuring these twelve measurement points 90, when the set time T has elapsed since the last measurement, the work on the substrate being worked at that time was completed. It is performed later, and is repeatedly performed while the component mounting machine 10 is in operation.

iii) Substrate height measurement process In this component mounting machine 10, when the substrate S is carried in by the substrate conveyor device 24 and fixed at a predetermined work position, the laser sensor 64 is moved by the head moving device 32, and the substrate S is moved. The heights of the three measurement points 100 set above are measured. As shown in FIG. 5, these three measuring points 100 are arranged in the center in the front-rear direction (Y direction) of the substrate S, and are the left end, right end, and center of these left and right ends of the substrate S. This board height measuring step is for obtaining the height of the component mounting position on the board S, which will be described later.

  iv) Target lift amount determination process
  As described above, in the component mounting machine 10, the component mounting head 30 is reciprocated between the component feeder 26 and the substrate S by the head moving device 32, and the component mounting head 30 holds and mounts the component. Is repeated. In the component mounting machine 10, a target position for moving the component mounting head 30 is determined by the head moving device 32. Further, when the component supplied by the component feeder 26 is sucked and when the component is mounted on the substrate S, the suction nozzle 70 is lowered. At that time, the target lowering amount h of the suction nozzle 70 by the nozzle lifting mechanism^*Is determined. By the way, the target descent amount h^*Is the standard height H ₀Is calculated as a descending amount from the height of the component mounting head 30 calculated with reference to.

When the component is mounted on the substrate S, a total of nine measurement values, that is, the measurement values of the three measurement points 100 on the substrate S and the measurement values of the measurement points 90 provided on each of the pair of conveyors 40 are measured. The measured value of the point is used to estimate the height of the substrate S in consideration of the warp of the substrate S and the mounting height is determined based on the height of the substrate S, that is, the target lowering amount h ^* is determined. It has become so.

  v) Head deviation estimation process
  In the component mounting machine 10 according to the present embodiment, the beam 22 may be bent due to heat generated during operation, and the component mounting head 30 causes the reference height H to be bent by the bending of the beam 22. ₀There may be a deviation in the height direction. When the beam 22 is not bent, the height of the twelve measuring points 90 measured by the laser sensor 64 is the height of the reference block 80, that is, the reference height H.₀Should match. That is, as shown in FIG. 6, when a difference occurs between the measurement value at the measurement point 90 and the reference block 80, the difference is the amount of deflection of the beam 22 at the position of the measurement point 90. You can think about it. In the component mounting machine 10 of the present embodiment, the twelve measurement heads 30 are moved by the head moving device 32 and are positioned at any position on the XY plane. Based on each measured value of the point 90, it is possible to estimate the amount of deflection corresponding to the position of the component mounting head 30. In other words, the component mounting machine 10 according to the present embodiment has a reference height H of the component mounting head 30 according to the position of the component mounting head 30 on the XY plane.₀Therefore, it is possible to estimate the amount of deviation Δh in the height direction with respect to.

  vi) Elevating / lowering correction process [holding device movement correction process]
  In the component mounting machine 10, the target lowering amount h of the suction nozzle 70 determined as described above. ^*Is the reference height H of the component mounting head 30₀Based on the amount of deviation Δh in the height direction with respect to, a corrected decrease amount h ′ is determined. Specifically, it is corrected as shown in the following formula to determine the corrected decrease amount h ′.
    h ’= h^*-Δh
The nozzle lifting mechanism is controlled based on the corrected lowering amount h ′.

<Functional configuration of component mounting machine>
The component mounting machine 10 of this embodiment is controlled by the control device 120. More specifically, the control device 120 controls the substrate conveyor device 24, the component feeder 26, the component camera 28, the component mounting head 30, the head moving device 32, and the like of the component mounting machine 10 in an integrated manner. The control device 120 can be considered to have various functional units in order to control the raising and lowering of the suction nozzle 70 as described above. Specifically, it can be considered to have a functional configuration as shown in FIG. More specifically, the control device 120 is a functional unit that performs each of the above-described reference height measurement process, double measurement point measurement process, substrate height measurement process, target lift amount determination process, head deviation estimation process, and lift amount correction process. As shown, the reference height measurement unit 130, the double measurement point measurement unit 132, the substrate height measurement unit 134, the head deviation estimation unit 138, and the lift amount correction unit 140 as a holding device movement amount correction unit are included.

  The reference height measuring unit 130 is a functional unit that controls the head moving device 32 and the height sensor 64 to measure the reference height used for calculating the height by the height sensor 64. The double measurement point measuring unit 132 is a functional unit that measures the heights of a plurality of measurement points 90 provided on the base 20 by controlling the head moving device 32 and the height sensor 64. The substrate height measuring unit 134 is a functional unit that measures the height of a measurement point necessary for estimating the shape of the substrate S by controlling the head moving device 32 and the height sensor 64. The target lift amount determination unit 136 determines the lowering amount of the suction nozzle 70 at the time of component suction based on the reference height, and the suction nozzle 70 at the time of component mounting based on the reference height and the measurement result of the board height measurement unit 134. It is a function part which determines the amount of descending of. The head deviation estimation unit 138 operates the component mounting machine 10 of the component mounting head 30 moved by the head moving device 32 based on the heights of the plurality of measurement points 90 measured by the multi-measurement point measurement unit 132. It is a function part which estimates the shift | offset | difference of the height direction with respect to the reference height which arises due to the heat_generation | fever accompanying with. The vertical movement correction unit 140 controls the vertical direction of the suction nozzle 70 based on the displacement of the component mounting head 30 estimated by the head displacement estimation unit 138 when the vertical position of the suction nozzle 70 is controlled by the holding device lifting device. It is a function part which correct | amends the movement amount.

<Effect of this component mounting machine>
As described above, the component mounting machine 10 according to the present embodiment estimates the amount of displacement Δh in the height direction with respect to the reference height H ₀ of the component mounting head 30 caused by the heat generated during operation, and sets the amount of displacement Δh to the amount of displacement Δh. Based on this, the vertical movement amount of the suction nozzle 70 is corrected. Therefore, according to the component mounting machine 10, the height of the suction nozzle 70 can be controlled to an appropriate position at any position on the base 20. It is possible to prevent a large load from being applied to the components and the board S when the board S is mounted.

  Further, in the component mounting machine 10 of the present embodiment, six of the nine measurement points used for estimating the shape of the substrate S are used for estimating the deviation amount Δh of the component mounting head 30 described above. Since it is a part of the measuring point 90, it is not necessary to measure each substrate S. Therefore, according to the component mounting machine 10, it is possible to shorten the cycle time.

<Modification of component mounting machine>
In the component mounting machine 10 of the above embodiment, the component mounting head 30 is provided with a nozzle lifting mechanism as a holding device lifting device, but instead of the nozzle lifting mechanism or in addition to the nozzle lifting mechanism. The head moving device 32 may have a holding device lifting device. For example, the head moving device 32 may be configured to move the component mounting head 30 in the vertical direction, and may be configured to correct the deviation from the reference height when the component mounting head 30 moves in the vertical direction. Is possible.

In the component mounting apparatus 10 of the above embodiment, the reference height H ₀ is calculated the target lowering amount h ^* as lowering amount from the height of the component mounting head 30, which is calculated as a reference deviation that goal lowering amount h ^* The correction was made based on the amount Δh. However, for example, a configuration in which the reference height at the position where the component holding device is lowered is corrected, and the amount of vertical movement of the holding device is corrected by calculating the target lowering amount based on the corrected reference height. It is also possible to use a component mounting machine. In other words, the component mounting machine according to the modified example simply corrects the vertical movement amount of the holding device by calculating the target lowering amount based on the actual height difference between the component mounting head 30 and the reference height. It can be thought of as a configuration to do.

  In the component mounting machine 10 of the above embodiment, since the plurality of measurement points 90 used for estimating the deviation amount Δh of the component mounting head 30 are fixed on the base 20, the vertical displacements of these measurement points 90. In the component mounting machine 10 of the above embodiment, the cause of the displacement in the height direction of the component mounting head 30 is handled only as the deflection of the frame 22. However, the raising / lowering control method of the holding device of the above embodiment is not only in the vertical displacement of the location where the component mounting head 30 is provided, but also in the case where the location where the measurement point 90 is provided is displaced in the vertical direction. Can be similarly applied. That is, in the holding device lifting / lowering control method of the above embodiment, the frame 22 provided with the component mounting head 30 and the base 20 on which the work target of the component mounting head 30 is disposed are relatively relative in the vertical direction. It is possible to apply to a component mounting machine that is displaced.

10: component mounting machine 20: base 22: beam [frame] 24: substrate conveyor device [transport device] 26: component feeder 30: component mounting head 32: head moving device 40: 1 pair of conveyors 52: substrate fixing device 60: Head mounting body
64: Laser sensor [height sensor] 70: Suction nozzle [part holding device] 80: Reference block 90: Measurement point (on base) 100: Measurement point (on substrate) 120: Control device 130: Reference height measurement unit 132: Double measurement point measurement unit 134: Substrate height measurement unit 136: Target lift amount determination unit 138: Head deviation estimation unit 140: Lift amount correction unit

H ₀ : Reference height h ^* : Target descent amount Δh: Deviation amount h ′: Corrected descent amount

Claims (4)

A component mounting machine for mounting components on a board,
A frame fixed to the base;
A component holding device for holding and releasing the component, and a component mounting head for mounting the component on the board;
A head moving device disposed on the frame and moving the component mounting head along a horizontal plane;
A holding device lifting device for moving the component holding device in the vertical direction;
A height sensor that is moved together with the component mounting head by the head moving device and measures the height of the measuring point;
(A) a pair of conveyors on which the end of the substrate is placed and transports the substrate; and (b) the substrate is sandwiched and fixed between each of the pair of conveyors. A transfer device having a substrate fixing device of
A control device for controlling the component mounting machine,
The control device is
By controlling the head moving device and the height sensor, a multi-measurement point measurement unit that measures the heights of a plurality of measurement points, each of which is the measurement point and provided on the base,
Based on the height of the plurality of measurement points measured by the double measurement point measurement unit, due to the heat generated by the operation of the component mounting machine of the component mounting head moved by the head moving device A head deviation estimation unit that estimates a deviation in the height direction with respect to the generated reference height;
Estimating the height of the mounting position of the component on the board transported by the transport device, and determining the target lifting amount that determines the target lifting amount that is the target for the vertical movement amount of the component holding device at the component mounting position And
When the vertical position of the component holding device is controlled by the holding device lifting / lowering device, the holding device movement amount that corrects the target lift amount based on the shift of the component mounting head estimated by the head shift estimation unit Correction part and
Comprising
A part of the plurality of measurement points is provided on each of the pair of conveyors,
The component mounter configured to use a part of the plurality of measurement points provided on each of the pair of conveyors when the target lifting amount determination unit estimates the height of the component mounting position. . The head misalignment estimation unit,
The component mounting machine according to claim 1, wherein a displacement of the component mounting head is estimated in accordance with a position of the component mounting head moved by the head moving device. The double measurement point measuring unit is
3. The component mounting machine according to claim 1, wherein the component mounting machine is configured to measure heights of the plurality of measurement points each time a set time elapses during operation of the component mounting machine. (A) a base, (B) a frame fixed to the base, (C) a component mounting head for holding and releasing the component, and a component mounting head for mounting the component on the board, (D A head moving device that is disposed on the frame and moves the component mounting head along a horizontal plane; (E) a holding device lifting device that moves the component holding device vertically; and (F) the head moving device. And (G) a height sensor for measuring the height of the measuring point, and (G) disposed on the base. A plurality of conveyors each including a pair of conveyors, and (b) a substrate fixing device for sandwiching and fixing a substrate between each of the pair of conveyors. When the measuring point is provided on the base, , A portion of the plurality of stations is, in the component mounting apparatus provided in each of said pair of conveyors, there is provided a method of controlling the vertical movement of the component holding device,
A multi-measurement point measuring step of measuring the height of the plurality of measurement points by the height sensor;
Based on the height of the plurality of measurement points measured in the double measurement point measurement step, due to the heat generated by the operation of the component mounting machine of the component mounting head moved by the head moving device A head deviation estimation step for estimating a deviation in the height direction with respect to the generated reference height;
The height of the mounting position of the component on the board transported by the transport device is estimated using a part of the plurality of measurement points provided in each of the pair of conveyors, and the height at the component mounting position is estimated. A target lifting / lowering amount determining step for determining a target lifting / lowering amount that is a target of the vertical movement amount of the component holding device ;
When the vertical position of the component holding device is controlled by the holding device lifting / lowering device, the holding device movement amount that corrects the target lift amount based on the shift of the component mounting head estimated in the head shift estimation step A component holding device elevation control method including a correction step.

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