JP6777644B2 - How to install parts - Google Patents

Description

The present invention relates to a component mounting how to mount the component to the substrate.

The following Patent Documents 1 and 2 describe a component mounting machine for mounting a component by lowering a component holding device capable of holding and detaching the component on a substrate held by a substrate support device. The substrate support device includes not only a structure that supports from the lower surface but also a support portion provided with a plurality of suction ports on the upper surface as shown in Patent Documents 3 and 4 below, and the suction ports are provided. There is a so-called vacuum backup type substrate support device which is configured to support the substrate by adsorbing the lower surface of the substrate to the upper surface of the support portion by utilizing the support portion.

Japanese Unexamined Patent Publication No. 2002-185193 International Publication No. WO2015 / 107354A1 Pamphlet Japanese Unexamined Patent Publication No. 2003-142896 Japanese Unexamined Patent Publication No. 7-15191

A component mounting machine equipped with a vacuum backup type board support device as described above can flatten the board and hold it firmly by adsorbing the board even if the board is warped. is there. However, even with such a component mounting machine, there is still much room for improvement, and it is possible to improve the practicality of such a component mounting machine by making improvements. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component mounting method for improving the practicality of a component mounting machine provided with a vacuum backup type substrate support device .

In order to solve the above problems, the component mounting method of the present invention includes (A) a component holding device for holding and detaching a component, and a component mounting device for lowering the component holding device to mount the component on a substrate. , (B) A substrate support having a support portion provided with a plurality of suction ports on the upper surface, and using the suction ports to attract the lower surface of the substrate to the support surface which is the upper surface of the support portion to support the substrate. It is a component mounting method for mounting a component on a board in a component mounting machine equipped with a device.
In the component mounting method according to the first invention, the height of the support surface is measured when the component mounting machine is started or when the type of the substrate on which the component mounting machine performs the component mounting work is changed. It is a component mounting method that lowers the component holding device based on the measured height of the support surface when mounting components on a plurality of boards .
The method of mounting the parts is
As the height of the support surface, the heights of a plurality of measurement points set on the support surface are measured, and the difference in height between the two of the plurality of measurement points is calculated from the set value. When it is large, it is characterized in that the component mounting work on the plurality of boards is not started.
In the component mounting method according to the second invention, the height of the support surface is measured when the component mounting machine is started or when the type of substrate on which the component mounting machine performs component mounting work is changed. This is a component mounting method for lowering the component holding device based on the measured height of the support surface during component mounting work on a plurality of substrates.
The method of mounting the parts is
For each of the plurality of substrates supported by the substrate support device, the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface. However, if it is larger than the set height difference set to a value larger than the thickness of the substrate, the component mounting work is stopped.
The component mounting method according to the third invention is a plurality of measurements set on the support surface as the height of the support surface before the component mounting work, which is the work of mounting the component on a plurality of substrates. When the heights of the points are measured and the parts are mounted on the plurality of substrates, the part holding device is lowered based on the measured heights of the support surfaces, and among the plurality of measurement points. When the height difference between the two objects is larger than the set value, the component mounting work on the plurality of boards is not started.
The component mounting method according to the fourth invention is a plurality of measurements set on the support surface as the height of the support surface before the component mounting work, which is the work of mounting the component on a plurality of substrates. When the height of the points is measured and the component mounting work is performed on the plurality of boards, the component holding device is lowered based on the measured height of the support surface, and the component holding device is supported by the substrate support device. For each of the plurality of substrates, the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface is a value larger than the thickness of the substrate. When the height difference is larger than the set height difference set in, the component mounting operation is stopped.

According to the component mounting how the present invention, for example, since the substrate supporting device for attracting and holding the substrate, the height of the support surface of the substrate supporting device, it is possible to estimate the height of the substrate, It is possible to carry out component mounting work without increasing the height of each board. On the other hand, if the height of the substrate is measured for each substrate, it is possible to detect the adsorption deficiency based on the difference between the height of the substrate and the height of the support surface. By having such advantages, the utility of parts article placement machine is of being allowed to greatly improve. Further, the component mounting method of the present invention that can be used for such a component mounting machine contributes to the improvement of the practicality of the component mounting machine.

It is a perspective view of the component mounting machine in which the component mounting method according to the embodiment of the present invention is performed . It is a side view of a component mounting machine shown in FIG. It is an enlarged perspective view which shows the substrate transfer apparatus and the substrate support apparatus shown in FIG. It is a side view which shows the substrate support device in an enlarged manner. It is a top view which shows the position of the plurality of measurement points provided on the support surface.

<Configuration of parts mounting machine>
The component mounting machine 10 on which the component mounting method according to the embodiment of the present invention is performed is shown in FIGS. 1 and 2. FIG. 1 is a perspective view of the component mounting machine 10, and FIG. 2 is a side view of the component mounting machine 10. In the work of mounting the components on the board, a plurality of component mounting machines 10 are arranged in order to mount the plurality of types of components on the board. FIG. 1 shows two of the plurality of component mounting machines 10, and one of them shows a state in which the exterior panel is removed. The component mounting machine 10 includes a base 20, a beam 22 fixedly provided on the base 20, a board conveyor device 24 which is a board transport device arranged on the base, and a base on the front side of the component mounting machine 10. A component as a component mounting device that holds a plurality of component feeders 26 interchangeably attached to 20 and components supplied from any of the plurality of component feeders 26 and detaches the components for mounting on the substrate S. It is configured to include a mounting head 28, a head moving device 30 arranged on the beam 22 to move the component mounting head 28, and a control device 32 that controls itself. In the following description, the direction in which the base material is conveyed by the substrate conveyor device 24 is the left-right direction (X direction), the direction perpendicular to the left-right direction on the horizontal plane is the front-back direction (Y direction), and the left-right directions. And the direction perpendicular to the front-back direction is referred to as the up-down direction (Z direction).

FIG. 3 shows a perspective view of the substrate conveyor device 24. 3 (a) and 3 (b) are perspective views from the viewpoints opposite to each other. The substrate conveyor device 24 has a pair of conveyors 40, and the substrates S mounted on the pair of conveyor belts 42 by rotating each conveyor belt 42 of the pair of conveyors 40 by a transfer motor 44. Is structured to be conveyed in the left-right direction. Although detailed description will be omitted, one of the pair of conveyors 40 can be moved in the front-rear direction by the electromagnetic motor 46, and can be used for substrates S having various widths.

Further, a substrate support device 50 for fixing and supporting the substrate S is provided between the pair of conveyors 42 of the substrate conveyor device 24. The board support device 50 is a vacuum backup type support device, and raises and lowers a backup plate 54 as a support portion provided with a plurality of suction ports 52 on the upper surface, a negative pressure source (not shown), and a backup plate 54. It is configured to include a support elevating device 56 to be operated. In the substrate support device 50, with the substrate S placed on the upper surface of the backup plate 54, negative pressure is supplied from a negative pressure source to the suction port 52 of the backup plate 54, and the substrate S is attracted and supported. Further, in the support portion elevating device 56, in a state where the substrate S is attracted and supported on the backup plate 54, the backup plate 54 is raised to a height at which the component mounting work is performed. It is raised until it comes into contact with the collar 58 provided above each of the 40s. By the way, the thickness t of the substrate S is registered in the control device 32, and the amount of increase L of the backup plate 54 until the substrate S comes into contact with the flange portion 58 is calculated from the thickness t of the substrate S, and the increase is calculated. The support elevating device 56 is controlled by the control device 32 based on the quantity L.

The head moving device 30 is a so-called XY type moving device, and is attached to a head mounting body 60 to which a component mounting head 28 is detachably mounted, an X direction moving mechanism for moving the head mounting body 60 in the X direction, and a beam 22. The X-direction moving mechanism that is supported includes a Y-direction moving mechanism that moves the component mounting head 28 between the component feeder 26 and the substrate S. As shown in FIG. 2, a camera 62 for photographing the surface of the substrate S and a laser sensor 64 as a height sensor for measuring the height are fixed to the lower part of the head mounting body 60. ing.

The component mounting head 28 is a so-called index type mounting head. That is, each of the component mounting heads 28 has eight suction nozzles 70 that function as component holding devices and suck and hold the component at the lower end portion by supplying negative pressure, and these are held by the revolver 72. ing. The revolver 72 rotates intermittently, and one suction nozzle 70 located at a specific position can be raised and lowered by a nozzle raising and lowering device, that is, can be moved in the vertical direction. When the suction nozzle 70 located at a specific position is lowered, a negative pressure is supplied to hold the component, and the negative pressure supply is cut off to release the suction-holding component. Let me. By the way, each of the eight suction nozzles 70 is rotated around its own axis by the nozzle rotation mechanism, that is, around the axis, and the component mounting head 28 is rotated by each suction nozzle 70. It is possible to change and adjust the rotation position of the held parts.

As described above, in the component mounting machine 10 of this embodiment, the device for raising and lowering the holding device (holding device lifting device) is provided in the component mounting head 28, but is provided in the component mounting head 28. It may be provided in the head moving device 30 in place of the holding device elevating device, or in addition to the holding device elevating device provided in the component mounting head 28. Specifically, as the holding device elevating device, it is also possible to adopt a device having a configuration in which the head mounting body 60 to which the component mounting head 28 is mounted is moved in the vertical direction.

Each of the plurality of component feeders 26 is set with a reel on which a component holding tape (a plurality of components are held on the tape and is also called "part taping") is wound, and a plurality of components are set. Each of the feeders 26 sequentially supplies parts one by one at a predetermined part supply portion by intermittently feeding out the part holding tape. Parts may be replenished by connecting the parts taping while exchanging the reels (splicing), or by exchanging the reels together with the parts feeder 26. The component mounting machine 10 can be equipped with a so-called tray-type component supply device instead of the plurality of component feeders 26.

<Work with parts mounting machine>
(I) Support surface height measurement In the component mounting machine 10 of this embodiment, the height of the support surface, which is the upper surface of the backup plate 54, is measured before the component mounting work is repeatedly performed on the plurality of substrates S. Will be done. The process of measuring the height of the support surface of the back plate 54 will be described below. This step is executed when the component mounting machine 10 is started, when the type of the substrate on which the component mounting work is performed is changed, or when so-called setup change is performed. In this step, first, the backup plate 54 is raised by the support elevating device 56, and is positioned at a height position for mounting the component on the substrate S when it is assumed that the substrate S is supported. Then, the laser sensor 64 is moved by the head moving device 30, and nine measurement points AI (see FIG. 4) set on the support surface of the backup plate 54 are measured. As will be described in detail later, the heights of the nine measurement points AI on the measured support surfaces are used to control the amount of descent of the suction nozzle 70.

(II) Support surface inclination determination As described above, after the heights of the nine measurement points AI are measured, the heights of two of the nine measurement points are compared, and the heights of the nine measurement points are compared. If the difference is larger than the set value, the support surface may be greatly tilted, so that the component mounting work is not started and a warning is issued. More specifically, first, the heights of two adjacent objects are obtained from the nine measurement points AI, and the set values determined based on the distance between the two measurement points and the inclination from the horizontal plane are used. If there is a large part, the parts mounting work is not started and a warning is issued. Further, even when the difference between the highest and lowest of the nine measurement points AI is larger than the set value, the component mounting work is not started and a warning is issued.

(III) Parts mounting work Next, the parts mounting work by the component mounting machine 10 will be described. First, the board S to be used for the work is carried in from the upstream side by the board conveyor device 24 and reaches a predetermined position. Be transported. The substrate S transported to a predetermined position is sucked and held by the vacuum backup type substrate support device 50, and is raised to a predetermined height. Subsequently, the head moving device 30 positions the component mounting head 28 above the plurality of component feeders 26, and the components are sequentially held by each of the eight suction nozzles 70. Next, the component mounting head 28 is moved above the substrate S by the head moving device 30, and is sequentially mounted at a set position determined by the mounting program.

As described above, since the substrate S is attracted and held on the support surface of the backup plate 54 by the substrate support device 50, the height at the component mounting position on the substrate S even if some warpage occurs. Is higher than the previously measured height on the support surface by the thickness t of the substrate S stored in the control device 32. Therefore, in the component mounting machine 10, the height of the component mounting position on the substrate S is obtained based on the height of the support surface of the backup plate 54. Specifically, for example, the height of the mounting position a shown in FIG. 4 is a support corresponding to the mounting position a interpolated from the heights of the three measurement points A, B, and D around the mounting position a. It is obtained by adding the thickness t of the substrate S to the height on the surface. Then, the lowering amount of the suction nozzle 70 is determined from the height of the mounting position a on the substrate S.

The component mounting head 28 is reciprocated between the component feeder 26 and the board S a number of times determined by the mounting program, and the component mounting head 28 repeats holding and mounting the component as described above to obtain one component. The component mounting work by the mounting machine 10 is completed. The board S for which the component mounting work has been completed is sent by the board conveyor device 24 to the next board working machine such as the component mounting machine 10. Then, in one component mounting machine 10, the above-mentioned component work is repeatedly performed on the plurality of substrates S. That is, in the component mounting machine 10 of the present embodiment, the height of the support surface is used to control the lowering amount of the suction nozzle 70 during the component mounting work on the substrate S, so that the height of the support surface is used for each of the plurality of substrates S. It is not necessary to measure the height of the substrate S for each substrate. Therefore, according to the component mounting machine 10, it is possible to shorten the cycle time.

(IV) Substrate Adsorption Judgment For example, if the warp of the substrate S becomes too large, there may be a portion where the substrate support device 50 cannot adsorb. In such a case, if the lowering amount of the suction nozzle 70 is controlled based on the height of the support surface, there is a possibility that the parts cannot be properly mounted. Therefore, in the component mounting machine 10, it is possible to determine for each substrate S whether or not it is reliably attracted and held by the substrate support device 50. It is possible to switch whether or not to make the determination by an operation by an operator or the like.

More specifically, first, the substrate S, which is attracted and held by the substrate support device 50 and raised to a position where the component mounting operation is performed, is measured by the laser sensor 64. Specifically, the height on the substrate S is the height of the position corresponding to the plurality of suction ports 52 provided on the backup plate 54 on the substrate S, or the height on the substrate S is due to the fact that parts are mounted at that position. If measurement is not possible, the height of the position close to the position corresponding to the suction port 52 is measured by the laser sensor 64. Next, the height of the support surface at the position corresponding to the suction port 52 is obtained from three of the nine measurement points measured earlier. Then, at the position corresponding to each suction port 52, the difference between the obtained height of the support surface and the measured height on the substrate S is obtained, and the difference is set to a value larger than the thickness t of the substrate S. If it is larger than the set height difference, it is determined that the substrate support device 50 may not be able to attract the substrate S. Then, in that case, the component mounting work is stopped and a warning is issued.

By making the above determination, the component mounting machine 10 can detect the adhesion defect of the substrate by the substrate support device 50 with high accuracy. Therefore, according to the component mounting machine 10, it is possible to manufacture a highly accurate product without causing a component mounting defect due to a suction defect.

<Modification example>
In the component mounting machine 10 of the above-described embodiment, a plate-shaped backup plate 54 has been adopted for the support portion of the substrate support device 50, but instead of the backup plate 54, a suction port is provided at the upper end. It is also possible to employ a plurality of support pins that support the substrate at its upper end. If the component mounting machine is equipped with a board support device including such a plurality of support pins, the height of the upper end of each of the plurality of support pins is prior to the component mounting operation. Can be configured to measure and control the amount of descent of the component holding device based on the height of the top edge of each of those support pins.

10: Parts mounting machine 20: Base 22: Beam 24: Board conveyor device
26: Parts feeder 28: Parts mounting head [Parts mounting device] 30: Head moving device 32: Control device 50: Board support device 52: Suction port 54: Backup plate [Support part] 56: Support part lifting device 64: Laser sensor [Height sensor]

Claims (7)

(A) A component mounting device that has a component holding device that holds and detaches the component, and lowers the component holding device to mount the component on the board, and (B) a support portion provided with a plurality of suction ports on the upper surface. In a component mounting machine provided with a substrate support device that supports the substrate by attracting the lower surface of the substrate to the support surface that is the upper surface of the support portion using the suction port, the component is mounted on the substrate. It is a method of mounting parts to be used.
When the component mounting machine is started, or when the component mounting machine changes the type of board on which the component mounting work is performed, the height of the support surface is measured, and when the component mounting work is performed on a plurality of boards. , A component mounting method for lowering the component holding device based on the measured height of the support surface .
The method of mounting the parts is
As the height of the support surface, the heights of a plurality of measurement points set on the support surface are measured, and the difference in height between the two of the plurality of measurement points is calculated from the set value. A component mounting method characterized in that the component mounting work on the plurality of boards is not started when the size is large . The method of mounting the parts is
For each of the plurality of substrates supported by the substrate support device, the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface. However, the component mounting method according to claim 1 , wherein the component mounting operation is stopped when the height difference is larger than the set height difference set to a value larger than the thickness of the substrate. (A) A component mounting device that has a component holding device that holds and detaches the component, and lowers the component holding device to mount the component on the board, and (B) a support portion provided with a plurality of suction ports on the upper surface. In a component mounting machine provided with a substrate support device that supports the substrate by attracting the lower surface of the substrate to the support surface that is the upper surface of the support portion using the suction port, the component is mounted on the substrate. It is a method of mounting parts to be used.
When the component mounting machine is started, or when the component mounting machine changes the type of board on which the component mounting work is performed, the height of the support surface is measured, and when the component mounting work is performed on a plurality of boards. , A component mounting method for lowering the component holding device based on the measured height of the support surface.
The method of mounting the parts is
For each of the plurality of substrates supported by the substrate support device, the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface. However, when the height difference is larger than the set height difference set to a value larger than the thickness of the substrate, the component mounting operation is stopped. The substrate support device has a support part elevating device for raising and lowering the support part.
Measuring the height of the support surface
When the component mounting machine is started, or when the component mounting machine changes the type of the board on which the component mounting work is performed, it is assumed that the support portion is supported by the support portion elevating device. The component mounting method according to any one of claims 1 to 3 , wherein the height of the support surface is measured after the component is raised to a height position for mounting the component on the substrate. The method of mounting the parts is
Based on the measured height of the support surface and the thickness of each of the plurality of substrates known in advance, the height of the upper surface of each of the plurality of substrates is estimated to determine the amount of descent of the component holding device. The component mounting method according to any one of claims 1 to 4, which is controlled. (A) A component mounting device that has a component holding device that holds and detaches the component, and lowers the component holding device to mount the component on the board, and (B) a support portion provided with a plurality of suction ports on the upper surface. In a component mounting machine provided with a substrate support device that supports the substrate by attracting the lower surface of the substrate to the support surface that is the upper surface of the support portion using the suction port, the component is mounted on the substrate. It is a method of mounting parts to be used.
Before performing the component mounting work, which is the work of mounting components on a plurality of boards, the heights of a plurality of measurement points set on the support surface are measured as the height of the support surface, and the heights of the plurality of measurement points are measured. During the component mounting operation on the substrate, the component holding device is lowered based on the measured height of the support surface, and the height difference between the two of the plurality of measurement points is set. A component mounting method, characterized in that the component mounting work on the plurality of boards is not started when the value is larger than the value. (A) A component mounting device that has a component holding device that holds and detaches the component, and lowers the component holding device to mount the component on the board, and (B) a support portion provided with a plurality of suction ports on the upper surface. In a component mounting machine provided with a substrate support device that supports the substrate by attracting the lower surface of the substrate to the support surface that is the upper surface of the support portion using the suction port, the component is mounted on the substrate. It is a method of mounting parts to be used.
Before performing the component mounting work, which is the work of mounting components on a plurality of boards, the heights of a plurality of measurement points set on the support surface are measured as the height of the support surface, and the heights of the plurality of measurement points are measured. During the component mounting operation on the substrate, the component holding device is lowered based on the measured height of the support surface, and the components are lowered with respect to each of the plurality of substrates supported by the substrate support device. When the height of the upper surface of each of the substrates is measured, and the difference between the measured height of the upper surface of the substrate and the height of the support surface is larger than the set height difference set to a value larger than the thickness of the substrate. Is a component mounting method, characterized in that the component mounting operation is stopped.

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