JP7487075B2 - Interference checking device and processing machine equipped with the same - Google Patents

Description

The present invention relates to an interference checking device used to check for interference between push-up pins that support a substrate from below and an object already mounted on the supported surface of the substrate, and a processing machine equipped with the interference checking device.

Conventionally, mounting machines have been known as processing machines that mount electronic components (hereinafter simply referred to as "components") on substrates such as printed wiring boards. This type of mounting machine includes a substrate support device that supports the substrate, and a head unit that mounts components on the substrate. The substrate support device includes a push-up plate and push-up pins that are arranged on the push-up plate. The substrate support device supports the substrate from below using the push-up pins that are arranged on the push-up plate.

When supporting a board with push-up pins, if there are already mounted components on the supported surface of the board that were installed in a previous process, it is necessary to prevent interference between the push-up pins and the already mounted components. In this case, it is necessary to identify support positions on the supported surface of the board where the push-up pins can avoid interference, and determine the placement of the push-up pins on the push-up plate to correspond to those support positions.

Patent Document 1 discloses a technology that assists in determining the placement of push-up pins (support pins). This technology displays a composite image consisting of a planar image in which a board image showing a board on which components have already been mounted and a pin placement image showing push-up pins are superimposed.

JP 2014-146728 A

In the case of the technology disclosed in Patent Document 1, the operator checks for interference between the push-up pin and the components already mounted on the board based on the displayed composite image. In this case, there is an issue that it is difficult to check the details of the interference area, such as which part of the push-up pin interferes with the already mounted component.

The present invention was made in consideration of these circumstances, and its purpose is to provide an interference checking device that can check more precisely the interference between components already mounted on a board and push-up pins, and a processing machine equipped with the same.

An interference checking device according to one aspect of the present invention is a device used to check interference between push-up pins that support a board from below and an already-mounted component on the supported surface of the board. This interference checking device includes a graphic data creation unit that creates graphic data including a board figure that shows a three-dimensional solid of the board in a projection view, a pin figure that shows a three-dimensional solid of the push-up pin when supporting the board in a projection view, and an already-mounted component figure that shows a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection view, a display unit that displays the graphic data on a display screen, and a display control unit that controls the display unit. Then, when there is an interference area in the graphic data where the pin figure and the already-mounted component figure overlap, the display control unit controls the display unit so that the interference area is displayed on the display screen.

According to this interference checking device, the graphic data creation unit creates graphic data, and the display unit controlled by the display control unit displays the graphic data on the display screen. The graphic data created by the graphic data creation unit includes a board figure corresponding to the board, a pin figure corresponding to the push-up pin, and an already-mounted component figure corresponding to the component already mounted on the board, and each of these figures is a projection drawing of a three-dimensional solid. Then, if there is an interference area in the graphic data where the pin figure and the already-mounted component figure overlap, the display control unit controls the display unit so that the interference area is displayed on the display screen.

In other words, if an interfering area is present, the pin figure, which is a three-dimensional projection drawing, and the already-mounted component figure placed on the board figure are displayed on the display unit with the interfering area appearing on the display screen. Such graphic data, which is composed of the figures which are three-dimensional projection drawings of the board, push-up pins, and already-mounted components, precisely represents the positional relationship between the push-up pins and the already-mounted components when the push-up pins support the board on which the already-mounted components are placed. Therefore, by looking at the graphic data displayed on the display unit, the operator can confirm whether there is interference between the push-up pins and the already-mounted components, and if interference does occur, can more precisely confirm the area of interference.

In the above interference checking device, the display control unit controls the display unit so that the interfering part in the graphic data is displayed on the display screen in a specific display form that allows the interfering part to be distinguished from the remaining parts other than the interfering part.

In this manner, it becomes easier to distinguish between interfering areas and remaining areas in the graphic data displayed on the display screen, making it easier to check the details of the interfering areas.

In the above interference checking device, the display control unit executes a viewpoint setting process that sets the viewpoint position of the graphic data, and a display control process that controls the display unit so that the graphic data viewed from the viewpoint is displayed on the display screen.

In this embodiment, the viewpoint position of the graphic data is set in the viewpoint setting process by the display control unit. This makes it possible to automatically display on the display screen the graphic data viewed from a viewpoint that makes it easy to check whether there are any interfering areas, and if there are any interfering areas, to precisely check them.

The interference checking device further includes a data acquisition unit that acquires data on pin misalignment tolerance range indicating the allowable range of misalignment of the support position when the push-up pin supports the board, and data on mounting misalignment tolerance range indicating the allowable range of misalignment of the mounting position of the already-mounted component on the supported surface of the board. The graphic data creation unit creates a pin misalignment frame figure that indicates the area of the pin misalignment tolerance range from the pin figure and surrounds the pin figure, and creates a mounting misalignment frame figure that indicates the area of the mounting misalignment tolerance range from the already-mounted component figure on the board figure and surrounds the already-mounted component figure. The display control unit controls the display unit so that the pin misalignment frame figure and the mounting misalignment frame figure are displayed on the display screen.

In this embodiment, the display unit displays on the display screen a pin misalignment frame figure that represents a case where the support position of the board by the push-up pins is misaligned within an allowable range, and a mounting misalignment frame figure that represents a case where the mounting position of an already mounted component on the board is misaligned within an allowable range. By looking at each frame figure displayed on the display screen, the operator can easily confirm the relationship between the amount of misalignment of the support position by the push-up pins and interference, and the relationship between the amount of misalignment of the mounting position of an already mounted component and the occurrence of interference.

The interference checking device further includes a data acquisition unit that acquires pin misalignment tolerance data indicating the allowable range of misalignment of the support position when the push-up pin supports the board, and mounting misalignment tolerance data indicating the allowable range of misalignment of the mounting position of the already-mounted component on the supported surface of the board. The graphic data creation unit creates a plurality of graphic data each including the pin figure indicating a state in which the support position of the board by the push-up pin differs within the pin misalignment tolerance range, and the already-mounted component figure indicating a state in which the mounting position of the already-mounted component differs within the mounting misalignment tolerance range. The display control unit controls the display unit so that the plurality of graphic data are continuously displayed on the display screen.

In this embodiment, the display unit continuously displays, like a video, on the display screen a number of pieces of graphic data that represent cases where the support position of the board by the push-up pins has shifted within an acceptable range, or cases where the mounting position of an already mounted component on the board has shifted within an acceptable range. By viewing the multiple pieces of graphic data that are continuously displayed on the display screen, the operator can easily confirm the relationship between the amount of shift in the support position by the push-up pins and interference, and the relationship between the amount of shift in the mounting position of an already mounted component and the occurrence of interference, etc.

The interference checking device further includes a distance calculation unit that calculates the distance between the pin figure and the already-mounted component figure. The display control unit controls the display unit so that the distance calculation result by the distance calculation unit is displayed on the display screen.

In this embodiment, the display unit displays the calculation result of the distance between the pin figure in the figure data and the already-mounted component figure on the display screen. By looking at the calculation result displayed on the display screen, the operator can easily confirm the distance between the push-up pin and the already-mounted component.

The interference checking device further includes an operation unit that accepts input operations of commands for the display mode of the display screen, including an overall display command for commanding the display of the entire board figure and an individual display command for commanding an enlarged display of the area near the pin figure. The display control unit controls the display unit so that the display mode of the display screen is switched in response to the command input to the operation unit.

In this manner, the operator can manually switch the display mode by inputting information into the operation unit, for example, to display the entire board diagram or to enlarge the area near the pin diagram.

The interference checking device further includes a warpage calculation unit that calculates a board warpage amount related to the board warpage. The graphic data creation unit creates assumed warpage graphic data including a warped board graphic obtained by deforming the board graphic according to the board warpage amount, the pin graphic, and the already-mounted component graphic located on the warped board graphic. The display control unit controls the display unit so that the assumed warpage graphic data is displayed on the display screen.

A board on which components have already been mounted may warp during the process of mounting the components or during a subsequent reflow process. When a board with such warping is supported by push-up pins, interference with the components may occur in places where interference would not occur if a flat board without warping were supported. The graphic data creation unit then creates assumed warp graphic data consisting of a warped board graphic, pin graphics, and already-mounted component graphics positioned on the warped board graphic, assuming that board warping will occur. The display unit controlled by the display control unit then displays the assumed warp graphic data. By viewing the assumed warp graphic data displayed on the display unit, the operator can check whether or not there will be interference between the push-up pins and the already-mounted components when board warping occurs, and if interference does occur, can precisely check the location of the interference.

In the interference checking device, the push-up pin can be raised and lowered between an abutment position where its tip can abut against the supported surface of the board and a retracted position below the abutment position, and the board is transported into a predetermined position above the push-up pin and is transported out of the predetermined position by being transported while the push-up pin is being raised and lowered. The graphic data creation unit creates a plurality of graphic data each including the board figure showing the transport state of the board and the pin figure showing the raised and lowered state of the push-up pin. The display control unit controls the display unit so that the plurality of graphic data are continuously displayed on the display screen.

In this embodiment, the display unit continuously displays multiple pieces of graphic data representing the transport state of the substrate and the raising and lowering state of the push-up pins on the display screen like a video. By viewing the multiple pieces of graphic data continuously displayed on the display screen, the operator can easily confirm the relationship between the timing of the start of transport of the substrate and the occurrence of interference when the substrate is transported while the push-up pins are being raised and lowered.

In the above interference checking device, the graphic data creation unit creates multiple pieces of graphic data in which the horizontal relative positions of the board graphic to the pin graphic are different, and the display control unit controls the display unit so that, if there is an interference area in the multiple pieces of graphic data where the pin graphic overlaps with the already-mounted component graphic on the board graphic, the interference area is displayed on the display screen.

The horizontal positional relationship between the push-up pins and the board is not necessarily constant. For example, when the board is brought into a specified position above the push-up pins, the board may stop at a different position. In this case, the horizontal position of the board relative to the push-up pins will not be constant. Therefore, the graphic data creation unit creates multiple graphic data in which the horizontal relative positions of the board figure to the pin figure are different. Then, the display unit controlled by the display control unit displays the interference area on the display screen if there is an interference area in the multiple graphic data where the pin figure overlaps with the figure of a component already mounted on the board figure. This allows the operator to check whether there is interference between the push-up pins and the already mounted component when the horizontal relative position of the board to the push-up pins changes, and if interference occurs, to precisely check the interference area.

A processing machine according to another aspect of the present invention includes a substrate support device having push-up pins that support a substrate from below, a processing section that performs a predetermined process on the substrate, and the above-mentioned interference checking device that is used to check for interference between the push-up pins and components already mounted on the supported surface of the substrate.

As described above, the present invention provides an interference checking device that can check more precisely the interference between components already mounted on a board and push-up pins, and a processing machine equipped with the same.

1 is a block diagram of a mounting machine to which an interference checking device according to an embodiment of the present invention is applied. FIG. 2 is a plan view showing a configuration of a mounting machine main body in the mounting machine. FIG. 2 is an enlarged view showing a head unit provided in the mounting machine main body. FIG. 2 is a diagram showing a board supporting device provided in the mounting machine main body. FIG. 13 is a diagram showing a state in which graphic data is displayed on a display screen of a display unit in the interference checking device. 13 is a diagram showing a state in which an interfering portion of graphic data is displayed on the display screen of the display unit. FIG. FIG. 13 is a diagram showing a first modified example of a display form of an interfering portion in graphic data. FIG. 13 is a diagram showing a second modified example of a display form of an interfering portion in graphic data. 11A and 11B are diagrams illustrating a viewpoint setting process executed by a display control unit of the interference checking device; 13 is a diagram showing a state in which a display unit displays a display screen including a command input guide area. FIG. 13 is a diagram showing a state in which the display unit displays graphic data including a pin misalignment frame graphic and a mounting misalignment frame graphic. FIG. FIG. 13 is a diagram showing a state in which a display unit continuously displays a plurality of graphic data. 11A and 11B are diagrams illustrating a display state of a display unit when an overall display command and an individual display command are input to an operation unit in the interference checking device. 13 is a diagram illustrating a state in which the display unit displays assumed warpage figure data. FIG. 13 is a diagram showing a state in which the display unit continuously displays a plurality of graphic data items, assuming that the push-up pins are raised when the board is carried in. FIG. 13 is a diagram showing a state in which the display unit continuously displays a plurality of graphic data items, assuming that the push-up pins are lowered when the substrate is unloaded. FIG. 13 is a diagram showing a display mode of an interfering portion in the graphic data when a board graphic is moved relative to a pin graphic. FIG.

Below, an interference checking device and a processing machine equipped with the same according to an embodiment of the present invention will be described with reference to the drawings.

1 is a block diagram of a mounting machine 1 to which an interference confirmation device 5 according to one embodiment of the present invention is applied. The mounting machine 1 is a device for producing an electronic circuit board in which electronic components (hereinafter referred to as "components") are mounted on a printed circuit board (hereinafter referred to as "board"). The mounting machine 1 is an example of a processing machine that performs a predetermined process on the board. Boards to be produced by the mounting machine 1 include those in which components are mounted on both sides of the board. The mounting machine 1 includes a mounting machine main body 2, a control device 3, a storage device 4, and an interference confirmation device 5. The mounting machine main body 2 constitutes a structural part that performs a component mounting operation. The mounting machine main body 2 is an example of a processing unit. The storage device 4 stores board data 41 that is referenced when the mounting machine main body 2 performs a component mounting operation. The control device 3 reads out the board data 41 stored in the storage device 4 and controls the component mounting operation of the mounting machine main body 2 based on the board data 41. The interference checking device 5 is used by an operator to check for interference between the push-up pins 282 (see FIG. 4 below) of the board support device 28 supporting the board during the component mounting operation of the mounting machine main body 2 and components already mounted in the previous process on the supported surface of the board.

First, the mounting machine main body 2 will be described with reference to Figs. 2 to 4 in addition to Fig. 1. Note that in the following, directional relationships will be described using XY Cartesian coordinates that are mutually orthogonal on a horizontal plane.

Before the mounting machine main body 2 mounts components, a solder paste pattern is printed on the board PP. In other words, the mounting machine main body 2 mounts components on the board PP on which the solder paste pattern has been printed by the pattern forming device. The mounting machine main body 2 comprises a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a board support device 28.

The main frame 21 is a structure in which each part constituting the mounting machine main body 2 is arranged, and is formed in a substantially rectangular shape in a plan view seen from a direction perpendicular to both the X-axis direction and the Y-axis direction (vertical direction). The conveyor 23 extends in the X-axis direction and is arranged on the main frame 21. The conveyor 23 transports the substrate PP in the X-axis direction. The substrate PP transported on the conveyor 23 is carried into a predetermined position above the push-up pins 282 in the substrate support device 28, and is carried out from the predetermined position.

The substrate PP brought into the predetermined position is positioned by the substrate support device 28. As shown in FIG. 4, the substrate support device 28 includes a push-up plate 281, push-up pins 282, and an elevating device 283. The elevating device 283 mainly has a support 2831 whose upper end is raised and lowered vertically by an air cylinder or the like, and a plate-shaped fixed base 2832 fixed approximately horizontally to the upper end of the support 2831, and is installed at a predetermined position on the main frame 21.

The push-up plate 281 is a flat plate fixed to the fixed base 2832. That is, the push-up plate 281 is disposed on the main frame 21 via the fixed base 2832. The push-up pins 282 are disposed in an upright state on the upper surface of the push-up plate 281. The upper surface of the push-up plate 281 may be a flat surface, or may have multiple recesses formed thereon. If the upper surface is flat, the push-up pins 282 are disposed in an upright state directly on the upper surface of the push-up plate 281. On the other hand, if multiple recesses are formed, the push-up pins 282 are disposed in a state of being fitted into the recesses.

The push-up pin 282 is a pin-shaped member arranged in an upright state on the upper surface of the push-up plate 281. When the push-up pin 282 is arranged on the upper surface of the push-up plate 281, the tip of the push-up pin 282 supports the substrate PP from below. When the mounting target surface PP2 of the substrate PP on which the component is to be mounted faces upward, the push-up pin 282 supports the supported surface PP1 opposite the mounting target surface PP2 from below. At this time, there may be cases where a component PT has already been placed on the supported surface PP1 of the substrate PP. The push-up pin 282 can be raised and lowered based on the raising and lowering of the push-up plate 281 in response to the raising and lowering of the fixed base 2832 by the lifting device 283. In other words, when the push-up pin 282 is arranged on the push-up plate 281, it can be raised and lowered between an abutment position where its tip can abut against the supported surface PP1 of the substrate PP and a retracted position below the abutment position. The push-up pin 282 supports the substrate PP from below when placed in the abutment position, and releases support for the substrate PP when placed in the retracted position.

As shown in FIG. 2, a pin station 29 is also arranged on the main frame 21. The pin station 29 is a section in which push-up pins 282 that are not being used to support the substrate PP are stored in an upright position with their base ends, opposite their tips, facing downward.

The component supply units 24 are arranged in each of the areas on both sides of the Y-axis direction of the main frame 21, sandwiching the conveyor 23. The component supply unit 24 is an area in the main frame 21 where multiple feeders 24F are installed side by side. The component supply unit 24 is partitioned into set positions for each feeder 24F for each component to be held by the mounting head 251 provided in the head unit 25 described below. The feeders 24F are detachably attached to the component supply unit 24. The feeder 24F is not particularly limited as long as it can hold multiple components and supply the held components to a predetermined component supply position set in the feeder, and is, for example, a tape feeder. The tape feeder is a feeder that has a reel around which a component storage tape that stores components at predetermined intervals is wound, and is configured to supply components by feeding the component storage tape from the reel.

The head unit 25 is held by the moving frame 27. On the main frame 21, a fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged. The moving frame 27 is arranged on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is screwed onto the ball screw shaft 262. In addition, a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274 are arranged on the moving frame 27. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction by the operation of the Y-axis servo motor 263, and the head unit 25 moves in the X-axis direction relative to the moving frame 27 by the operation of the X-axis servo motor 274. That is, the head unit 25 can move in the Y-axis direction in conjunction with the movement of the moving frame 27, and can move in the X-axis direction along the moving frame 27.

The head unit 25 can move between the component supply unit 24 and the substrate PP supported by the push-up pins 282, and can also move between the push-up plate 281 and the pin station 29. The head unit 25 performs a component mounting operation to mount components on the substrate PP by moving between the component supply unit 24 and the substrate PP. When the component mounting operation for one type of substrate PP is completed and the type of substrate PP is switched, the head unit 25 moves between the push-up plate 281 and the pin station 29. As a result, the head unit 25 performs a pin placement operation to take out the push-up pin 282 from the pin station 29 and place the push-up pin 282 on the push-up plate 281. That is, the head unit 25 performs two operations: a component mounting operation and a pin placement operation. Note that a head unit for the component mounting operation and a head unit for the pin placement operation may be provided separately.

As shown in FIG. 3, the head unit 25 has a plurality of mounting heads 251. The mounting heads 251 can be raised and lowered vertically relative to the frame of the head unit 25, and can rotate around a head axis extending vertically. When performing the component mounting operation, the mounting heads 251 take out components from the component supply unit 24 and mount (mount) the taken-out components on the substrate PP. On the other hand, when performing the pin placement operation, each mounting head 251 takes out push-up pins 282 from the pin station 29 and places the taken push-up pins 282 on the push-up plate 281. The mounting heads 251 have suction nozzles 2511 attached to their tips (lower ends). The suction nozzles 2511 include a component-holding nozzle capable of suction-holding components, and a pin-holding nozzle capable of suction-holding push-up pins 282. The suction nozzle 2511 can be connected to either a negative pressure generator, a positive pressure generator, or the atmosphere via an electric switching valve. In other words, when negative pressure is supplied to the suction nozzle 2511, the suction nozzle 2511 can suction and hold (remove) a component or a push-up pin 282, and then when positive pressure is supplied, the suction and holding of the component or the push-up pin 282 is released.

As shown in FIG. 2, the mounting machine main body 2 further includes a first imaging unit C1, a second imaging unit C2, and a third imaging unit C3.

The first imaging unit C1 is installed between the component supply unit 24 and the conveyor 23 on the main frame 21, and is an imaging camera equipped with an imaging element such as a complementary metal-oxide-semiconductor (CMOS) or a charged-coupled device (CCD). While the head unit 25 is moving from the component supply unit 24 toward the board PP supported by the push-up pins 282, the first imaging unit C1 captures an image of the component held by suction nozzle 2511 of the mounting head 251 from below to obtain a first component recognition image. The first component recognition image obtained by the first imaging unit C1 is used to determine whether the component has fallen from the suction nozzle 2511.

The second imaging unit C2 is disposed in the head unit 25 and is an imaging camera equipped with an imaging element such as a CMOS or CCD. The second imaging unit C2 captures an image of the marks from above in order to recognize the various marks attached to the upper surface of the substrate PP supported by the push-up pins 282. The amount of positional deviation of the substrate PP from the origin coordinates is detected by the recognition of the marks on the substrate PP by the second imaging unit C2.

The third imaging unit C3 is disposed in the head unit 25 and is an imaging camera equipped with an imaging element such as a CMOS or CCD. Just before the head unit 25 places the component on the board PP, the third imaging unit C3 captures an image of the component held by suction nozzle 2511 from the side to obtain a second component recognition image. The second component recognition image obtained by the third imaging unit C3 is used to determine whether the component has fallen from the suction nozzle 2511.

As shown in FIG. 1, the storage device 4 is a storage unit that stores board data 41. The board data 41 includes, for example, three-dimensional board data 411, three-dimensional component data 412, three-dimensional pin data 413, pin placement position data 414, pin misalignment tolerance data 415, and mounting misalignment tolerance data 416.

The substrate three-dimensional data 411 is data that indicates three-dimensional solid shape information of the substrate PP. For example, the type of substrate PP, the external dimensions in the X-axis direction and the Y-axis direction, the thickness, etc. are registered as the substrate three-dimensional data 411.

The component three-dimensional data 412 is data that indicates three-dimensional solid shape information of the already-mounted component PT that has been placed on the supported surface PP1 of the substrate PP. For example, the type of the already-mounted component PT, its external dimensions in the X-axis and Y-axis directions, its thickness, etc. are registered as the component three-dimensional data 412.

The three-dimensional pin data 413 is data that indicates three-dimensional solid shape information of the push-up pin 282. The three-dimensional pin data 413 is data that specifies, for example, the outer shape of the push-up pin 282 as a collection of many dots.

The pin arrangement position data 414 is data that indicates information on the arrangement position on the push-up plate 281 of the push-up pin 282 that supports the substrate PP when components are mounted on the mounting target surface PP2 of the substrate PP by the component mounting operation of the head unit 25. In the pin arrangement position data 414, the arrangement position of the push-up pin 282 on the push-up plate 281 is indicated using XY coordinates. That is, the pin arrangement position data 414 registers the X and Y coordinates that indicate the arrangement position of the push-up pin 282 on the push-up plate 281. The support position on the supported surface PP1 when the push-up pin 282 supports the substrate PP is determined by the arrangement position of the push-up pin 282 on the push-up plate 281.

The pin misalignment tolerance data 415 is data that indicates the allowable range of misalignment of the support position when the push-up pin 282 supports the substrate PP. This pin misalignment tolerance range is the same as the allowable range of misalignment of the placement position of the push-up pin 282 on the push-up plate 281. The pin misalignment tolerance data 415 is registered with the support position by the push-up pin 282 corresponding to the placement position indicated by the pin placement position data 414 on the supported surface PP1 of the substrate PP as a reference support position, and with respect to this reference support position, the maximum allowable misalignment in the X-axis direction, the maximum allowable misalignment in the Y-axis direction, and the like are registered.

The data 416 on the acceptable range of mounting deviation is data indicating the acceptable range of deviation of the mounting position of the already-mounted component PT on the supported surface PP1 of the substrate PP. The data 416 on the acceptable range of mounting deviation registers the maximum allowable amounts of deviation in the X-axis direction and Y-axis direction relative to a preset reference mounting position on the supported surface PP1 of the substrate PP. Furthermore, the data 416 on the acceptable range of mounting deviation registers the maximum allowable amount of rotation angle of the already-mounted component PT around the vertical axis as the acceptable range of deviation of the mounting attitude of the already-mounted component PT.

The control device 3 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) that stores a control program, a RAM (Random Access Memory) used as a working area for the CPU, and the like. The control device 3 controls the operation of each component of the mounting machine main body 2 by the CPU executing the control program stored in the ROM, and referring to the board data 41 stored in the storage device 4. As shown in FIG. 1, the control device 3 includes, as its main functional components, a board transport control unit 31, a head control unit 32, and a board support control unit 33.

The head control unit 32 controls the movement of the head unit 25 in the X-axis and Y-axis directions, and the lifting and rotation of the mounting head 251. In this way, the head control unit 32 causes the head unit 25 to perform two operations: a component mounting operation and a pin placement operation.

When the head unit 25 executes the component mounting operation, the head control unit 32 specifies the set position of the feeder 24F that supplies the component to be adsorbed and held by the mounting head 251, and controls the movement of the head unit 25 so that the head unit 25 moves toward the set position. When the head unit 25 arrives directly above the set position, the head control unit 32 controls the lifting and rotating operations of the mounting head 251 to adsorb and hold the component on the mounting head 251. Next, the head control unit 32 specifies the mounting position on the mounting target surface PP2 of the substrate PP of the component adsorbed and held by the mounting head 251, and controls the movement of the head unit 25 so that the head unit 25 moves toward the mounting position. Then, when the head unit 25 arrives directly above the mounting position on the mounting target surface PP2 of the substrate PP, the head control unit 32 controls the lifting and rotating operations of the mounting head 251 so that the component adsorbed and held by the mounting head 251 is mounted at the mounting position, and the component is mounted on the mounting target surface PP2 of the substrate PP.

When the component mounting operation for one type of substrate PP is completed and the type of substrate PP is switched, the head control unit 32 refers to the pin arrangement position data 414 stored in the storage device 4 and causes the head unit 25 to execute the pin arrangement operation. The head control unit 32 controls the movement operation of the head unit 25 so that it moves toward the pin station 29. When the head unit 25 arrives at the pin station 29, the head control unit 32 controls the lifting and rotating operation of the mounting head 251 and causes the mounting head 251 to adsorb and hold the push-up pin 282. Next, the head control unit 32 identifies the arrangement position of the push-up pin 282 on the push-up plate 281 based on the pin arrangement position data 414, and controls the movement operation of the head unit 25 so that the head unit 25 moves toward the arrangement position. Then, when the head unit 25 arrives directly above the placement position on the push-up plate 281, the head control unit 32 controls the lifting and rotating operations of the mounting head 251 so that the push-up pin 282 held by suction by the mounting head 251 is placed at the placement position. As a result, the push-up pin 282 is placed at the placement position on the push-up plate 281 indicated by the pin placement position data 414.

The board support control unit 33 controls the support operation of the board PP by the board support device 28. Specifically, the board support control unit 33 controls the support operation of the board PP by the board support device 28 with the push-up pins 282 arranged on the push-up plate 281 based on the pin arrangement position data 414. When mounting components on the mounting target surface PP2 of the board PP, the board support control unit 33 causes the lifting device 283 to raise the push-up pins 282 from the retracted position to the abutment position so that the push-up pins 282 can support the supported surface PP1 of the board PP. In addition, when mounting of components on the mounting target surface PP2 of the board PP is completed, the board support control unit 33 causes the lifting device 283 to lower the push-up pins 282 from the abutment position to the retracted position so that support of the board PP by the push-up pins 282 is released.

The substrate transport control unit 31 controls the transport operation of the substrate PP by the conveyor 23. Specifically, the substrate transport control unit 31 controls the transport operation of the substrate PP by the conveyor 23 so that the substrate PP is transported to a predetermined position above the push-up pins 282 while the lifting device 283 is lifting the push-up pins 282 from their retracted position to their abutment position. The substrate transport control unit 31 also controls the transport operation of the substrate PP by the conveyor 23 so that the substrate PP is transported out of the predetermined position while the lifting device 283 is lowering the push-up pins 282 from their abutment position to their retracted position.

When supporting the substrate PP with the push-up pins 282, if a previously mounted component PT is disposed on the supported surface PP1 of the substrate PP, it is necessary to prevent interference between the push-up pins 282 and the previously mounted component PT. In this case, it is necessary to identify a support position by the push-up pins 282 on the supported surface PP1 of the substrate PP where interference can be avoided, and to update the pin arrangement position data 414 to data indicating the arrangement of the push-up pins 282 on the push-up plate 281 that corresponds to the support position. The interference confirmation device 5 assists in updating the pin arrangement position data 414 in this manner.

The interference checking device 5 is a device used to check interference between the already mounted component PT on the supported surface PP1 of the substrate PP and the push-up pin 282. The operator checks interference using the interference checking device 5. As shown in FIG. 1, the interference checking device 5 includes a calculation processing unit 51, a display unit 52, an operation unit 53, and a data acquisition unit 54. The calculation processing unit 51 is configured, for example, by a microcomputer, and executes various calculation processes. The calculation processing unit 51 includes, as functional components, a graphic data creation unit 511, a display control unit 512, a distance calculation unit 513, and a warpage amount calculation unit 514. The display unit 52, the operation unit 53, and the data acquisition unit 54 are connected to this calculation processing unit 51.

The interference checking device 5 will be described with reference to Figs. 5 to 9 in addition to Fig. 1. Figs. 5 to 8 are diagrams showing the state in which the graphic data 6 is displayed on the display screen 7 of the display unit 52. Fig. 9 is a diagram explaining the viewpoint setting process executed by the display control unit 512 of the calculation processing unit 51.

The operation unit 53 is composed of a keyboard, mouse, touch panel, etc., and accepts input operations related to the input of various commands and data by the operator.

The display unit 52 is configured, for example, by a liquid crystal display. The display unit 52 displays on the display screen 7 the graphic data 6 created by the graphic data creation unit 511 described below, and also displays on the display screen 7 an area that guides the operator's input operations using the operation unit 53. By looking at the graphic data 6 displayed on the display screen 7, the operator can confirm interference between the already-mounted components PT on the supported surface PP1 of the substrate PP and the push-up pins 282. The display unit 52 is controlled by a display control unit 512 described below.

The data acquisition unit 54 reads and acquires from the storage device 4 various data required for the graphic data creation unit 511 to create the graphic data 6.

The graphic data creation unit 511 creates graphic data 6 including a board graphic 61, a pin graphic 62, and an already-mounted component graphic 63 when the supported surface PP1 of the substrate PP on which the already-mounted component PT is arranged is supported by the push-up pin 282. The board graphic 61 is a graphic that represents the three-dimensional solid of the substrate PP in a projection drawing. The board graphic 61 has a first surface 611 corresponding to the supported surface PP1 of the substrate PP, and a second surface 612 corresponding to the mounting target surface PP2 of the substrate PP. The pin graphic 62 is a graphic that represents the three-dimensional solid of the push-up pin 282 when supporting the supported surface PP1 of the substrate PP in a projection drawing. The already-mounted component graphic 63 is a graphic that represents the three-dimensional solid of the already-mounted component PT on the supported surface PP1 of the substrate PP in a projection drawing. In the graphic data 6, the tip of the pin graphic 62 abuts against the first surface 611 of the board graphic 61, and the already-mounted component graphic 63 is placed.

The graphic data creation unit 511 creates graphic data 6 based on the board three-dimensional data 411, the component three-dimensional data 412, the pin three-dimensional data 413, and the reference pin arrangement position data 414 before the update, which are included in the board data 41 stored in the storage device 4. The graphic data creation unit 511 recognizes the shape of the board PP based on the board three-dimensional data 411, and creates a board figure 61 according to that shape. The graphic data creation unit 511 also recognizes the shape of the push-up pin 282 based on the pin three-dimensional data 413, and creates a pin figure 62 according to that shape. The graphic data creation unit 511 then identifies the position of the pin figure 62 relative to the first surface 611 of the board figure 61 based on the reference pin arrangement position data 414. The graphic data creation unit 511 also recognizes the shape of the already-mounted component PT based on the component three-dimensional data 412, and creates an already-mounted component figure 63 according to that shape. Then, the graphic data creation unit 511 identifies the position of the already mounted component graphic 63 on the first surface 611 of the board graphic 61 based on the data of the mounting position of the already mounted component PT.

The board figure 61, pin figure 62, and already-mounted component figure 63 that make up the figure data 6 are not particularly limited as long as they are projection views that allow easy understanding of the three-dimensional shape of the solid, and are selected from central projection views (perspective projection views) and parallel projection views. Parallel projection views include vertical projection views, including axonometric projection views, and oblique projection views.

The graphic data 6 created by the graphic data creation unit 511 is displayed on the display screen 7 of the display unit 52. Normally, multiple already-mounted components PT are placed on the supported surface PP1 of the substrate PP, and the substrate PP is supported by multiple push-up pins 282. For this reason, as shown in FIG. 5, one piece of graphic data 6 contains one substrate figure 61, and multiple pin figures 62 and already-mounted component figures 63.

The display control unit 512 controls the display unit 52. When an interference area 64 exists in the graphic data 6 where the pin graphic 62 and the already-mounted component graphic 63 overlap, the display control unit 512 controls the display unit 52 so that the interference area 64 is displayed on the display screen 7 (see FIG. 6). In other words, when an interference area 64 exists, the pin graphic 62, which is a projection drawing of a three-dimensional solid, and the already-mounted component graphic 63 arranged on the first surface 611 of the board graphic 61 are displayed on the display unit 52 with the interference area 64 appearing on the display screen 7.

The graphic data 6, which is composed of the graphics 61, 62, and 63 that represent the three-dimensional projections of the substrate PP, the push-up pins 282, and the already-mounted components PT, precisely represents the positional relationship between the push-up pins 282 and the already-mounted components PT when the push-up pins 282 support the supported surface PP1 of the substrate PP on which the already-mounted components PT are arranged. Therefore, by looking at the graphic data 6 displayed on the display unit 52, the operator can confirm whether or not there is interference between the push-up pins 282 and the already-mounted components PT, and if interference does occur, the operator can precisely confirm the details of the interference area through the interference area 64 in the graphic data 6 displayed on the display screen 7.

The display control unit 512 controls the display unit 52 so that the interference part 64 in the graphic data 6 is displayed on the display screen 7 in a specific display form that allows the interference part 64 to be distinguished from the remaining parts other than the interference part 64. In this case, the display control unit 512 may be configured to control the display unit 52 so that the color of the interference part 64 is displayed in a specific color (e.g., red) different from the color of the remaining parts as the specific display form. By displaying the interference part 64 in the graphic data 6 in a specific display form, it becomes easier to distinguish between the interference part 64 and the remaining parts in the graphic data 6 displayed on the display screen 7, and the details of the interference part 64 can be more easily confirmed. In particular, when the interference part 64 is displayed in a specific color different from the color of the remaining parts, the ease of confirmation of the interference part 64 becomes more noticeable.

Specifically, the display control unit 512 controls the display unit 52 so that the interference part 64 is displayed in a display form in which a portion corresponding to the interference part 64 is cut out from the pin graphic 62, as shown in FIG. 6. At this time, the boundary line between the cut-out portion of the pin graphic 62 and the already-mounted component graphic 63, i.e., the frame line indicating the boundary line between the cut-out pin graphic 62 and the interference part 64, may be displayed with a specific line type or thick line, or may be displayed in the specific color, so that it can be distinguished from the outline of the remaining part. The display control unit 512 may control the display unit 52 so that the interference part 64 is displayed in a display form in which a portion corresponding to the interference part 64 is cut out from the already-mounted component graphic 63. The display control unit 512 may also be configured to control the display unit 52 so that the entire interference part 64 in the graphic data 6 is displayed in the specific color, as shown in FIG. 7. In this case, as shown in FIG. 8, the outline of the interference area 64 may be displayed in a specific line type or thick line in addition to being displayed in the specific color so that it can be distinguished from the outline of the remaining area.

The display control unit 512 also executes a viewpoint setting process for setting the position of the viewpoint 71 of the graphic data 6, and a display control process for controlling the display unit 52 so that the graphic data 6 viewed from the set viewpoint 71 is displayed on the display screen 7. In the viewpoint setting process, the display control unit 512 moves the viewpoint 71 by rotating the graphic data 6 by a predetermined angle around the first axis AX1 and the second axis AX2, which are orthogonal to each other on the display screen 7, as rotation axes (see FIG. 9). The display control unit 512 sets the position of the viewpoint 71 of the graphic data 6 by moving the viewpoint 71. This makes it possible to automatically display on the display screen 7 the graphic data 6 viewed from the viewpoint 71 that makes it easy to check whether there is an interference part 64 in the graphic data 6, and to precisely check the interference part 64 if it exists.

Figure 10 is a diagram showing the state in which the display unit 52 displays the display screen 7 including the command input guidance area 72. The command input guidance area 72 displayed on the display screen 7 is a display area for guiding the operator when using the operation unit 53 to input various commands related to the display. The command input guidance area 72 includes a viewpoint change guidance area 721, a magnification change guidance area 722, and a position change guidance area 723.

The viewpoint change guidance area 721 is an area for guiding the operator to input a viewpoint change command that commands a change in the position of the viewpoint 71 using the operation unit 53. When the viewpoint change command is input via the operation unit 53 by an input operation guided in the viewpoint change guidance area 721, the display control unit 512 sets the position of the viewpoint 71 in the viewpoint setting process to a position according to the viewpoint change command. This allows the operator to manually change the position of the viewpoint 71 of the graphic data 6 on the display screen 7 by an input operation using the operation unit 53.

The magnification change guidance area 722 is an area for guiding the input operation of a magnification change command that commands a change in the magnification of the enlargement and reduction of the graphic data 6 on the display screen 7. When the magnification change command is input via the operation unit 53 by an input operation guided by the magnification change guidance area 722, the display control unit 512 controls the display unit 52 in the display control process so that the graphic data 6 is displayed on the display screen 7 at a size according to the magnification change command. This allows the operator to manually change the size of the graphic data 6 on the display screen 7 by an input operation using the operation unit 53.

The position change guidance area 723 is an area for guiding the input operation of a position change command that commands a change in the position of the graphic data 6 on the display screen 7. When the position change command is input via the operation unit 53 by an input operation guided by the position change guidance area 723, the display control unit 512 controls the display unit 52 in the display control process so that the graphic data 6 is displayed at a position on the display screen 7 according to the position change command. This allows the operator to manually change the position of the graphic data 6 on the display screen 7 by an input operation using the operation unit 53.

In the mounting machine main body 2, the position of the push-up pin 282 on the push-up plate 281 may deviate from the position indicated by the pin position data 414. In addition, the mounting position of the already mounted component PT on the supported surface PP1 of the substrate PP may also deviate from the reference mounting position.

The graphic data creation unit 511 may be configured to create graphic data 6 that assumes the above-mentioned misalignment of the placement position of the push-up pins 282 and the misalignment of the mounting position of the already-mounted component PT. In this case, the graphic data creation unit 511 creates the graphic data 6 based on the pin misalignment tolerance data 415 and the mounting misalignment tolerance data 416 acquired from the storage device 4 by the data acquisition unit 54. The operation of the graphic data creation unit 511 and the operation of the display control unit 512 in this case will be described below with reference to FIGS. 11 and 12.

First, the example shown in FIG. 11 will be described. The graphic data creation unit 511 creates a pin misalignment frame graphic 62A that indicates the area of the pin misalignment tolerance range from the pin graphic 62 and surrounds the pin graphic 62 based on the pin misalignment tolerance data 415. Furthermore, the graphic data creation unit 511 creates a mounting misalignment frame graphic 63A that indicates the area of the mounting misalignment tolerance range from the already-mounted component graphic 63 on the first surface 611 of the board graphic 61 and surrounds the already-mounted component graphic 63 based on the mounting misalignment tolerance data 416.

When the pin misalignment frame figure 62A and the mounting misalignment frame figure 63A are created by the figure data creation unit 511, the display control unit 512 controls the display unit 52 so that the pin misalignment frame figure 62A and the mounting misalignment frame figure 63A are displayed on the display screen 7. In this case, the display unit 52 displays on the display screen 7 the pin misalignment frame figure 62A, which represents a case where the support position of the substrate PP by the push-up pins 282 is misaligned within the allowable range, and the mounting misalignment frame figure 63A, which represents a case where the mounting position of the already mounted component PT on the supported surface PP1 of the substrate PP is misaligned within the allowable range. By looking at each of the frame figures 62A and 63A displayed on the display screen 7, the operator can easily confirm the relationship between the amount of misalignment of the support position by the push-up pins 282 and interference, the relationship between the amount of misalignment of the mounting position of the already mounted component PT and the occurrence of interference, etc.

When the graphic data 6 is displayed on the display screen 7, the pin graphic 62 may be movable within the range of the pin misalignment frame graphic 62A based on an input operation via the operation unit 53. Similarly, the already mounted component graphic 63 may be movable within the range of the mounting misalignment frame graphic 63A based on an input operation via the operation unit 53.

Next, the example shown in FIG. 12 will be described. The graphic data creation unit 511 creates multiple pieces of graphic data 6 based on the pin misalignment tolerance data 415 and the mounting deviation tolerance data 416. Each of the multiple pieces of graphic data 6 includes a board figure 61, a pin figure 62 indicating a state in which the support position of the board PP by the push-up pins 282 differs within the pin misalignment tolerance range, and an already-mounted component figure 63 indicating a state in which the mounting position of the already-mounted component PT differs within the mounting deviation tolerance range. That is, in the multiple pieces of graphic data 6, the position of the pin figure 62 differs within the pin misalignment tolerance range with respect to the first surface 611 of the board figure 61, and the position of the already-mounted component figure 63 differs within the mounting deviation tolerance range.

When the plurality of pieces of graphic data 6 are created by the graphic data creation unit 511, the display control unit 512 controls the display unit 52 so that the plurality of pieces of graphic data 6 are continuously displayed on the display screen 7. In this case, the display unit 52 continuously displays, like a video, the plurality of pieces of graphic data 6 on the display screen 7, which represent a case in which the support position of the substrate PP by the push-up pins 282 has shifted within an acceptable range, or a case in which the mounting position of the already mounted component PT on the supported surface PP1 of the substrate PP has shifted within an acceptable range. By viewing the plurality of pieces of graphic data 6 continuously displayed on the display screen 7, the operator can easily confirm the relationship between the amount of shift in the support position by the push-up pins 282 and interference, and the relationship between the amount of shift in the mounting position of the already mounted component PT and the occurrence of interference.

In the interference checking device 5, the distance calculation unit 513 included in the calculation processing unit 51 calculates the distance (margin) between the pin figure 62 and the already-mounted component figure 63 constituting the figure data 6. The distance calculation unit 513 calculates the distance in each of the X-axis direction and the Y-axis direction between the pin figure 62 and the already-mounted component figure 63. For the interference area 64 where the pin figure 62 and the already-mounted component figure 63 overlap, the distance calculation unit 513 calculates "0.00 mm" as the distance between the pin figure 62 and the already-mounted component figure 63.

As described above, one piece of graphic data 6 contains a plurality of pin figures 62 and a plurality of already-mounted component figures 63. When the pin figures 62 and the already-mounted component figures 63 are selected one by one based on an input operation via the operation unit 53, the distance calculation unit 513 calculates the distance between the selected pin figures 62 and the already-mounted component figures 63. When a plurality of pieces of graphic data 6 are created by the graphic data creation unit 511, the distance calculation unit 513 calculates the distance between the pin figures 62 and the already-mounted component figures 63 corresponding to each of the plurality of pieces of graphic data 6. When the distance calculation unit 513 calculates the distance between the pin figures 62 and the already-mounted component figures 63, it generates distance calculation data 73 (see FIG. 12) indicating the calculation result.

When the distance calculation data 73 is generated by the distance calculation unit 513, the display control unit 512 controls the display unit 52 so that the distance calculation data 73 is displayed on the display screen 7 (see FIG. 12). In the example of FIG. 12, the distance calculation data 73 is displayed corresponding to each of the multiple graphic data 6 that are displayed continuously on the display screen 7. By looking at the distance calculation data 73 displayed on the display screen 7, the operator can easily check the distance between the push-up pin 282 and the already-mounted component PT.

The display control unit 512 may be configured to control the display unit 52 so that the display mode of the display screen 7 is switched in response to a command input to the operation unit 53. FIG. 13 is a diagram illustrating the display mode of the display unit 52 when an overall display command and an individual display command are input to the operation unit 53. In the example of FIG. 13, the display unit 52 displays the display screen 7 including an overall display command area 74 and a pin list display area 75.

The full display command area 74 is an area for guiding the operator in inputting an full display command using the operation unit 53. The full display command is a command for displaying the entire board figure 61 in the graphic data 6 on the display screen 7. When an full display command is input via the operation unit 53 by inputting the full display command area 74, the display control unit 512 controls the display unit 52 so that the entire board figure 61 in the graphic data 6 is displayed on the display screen 7.

The pin list display area 75 is an area that displays a list of multiple pin figures 62 in one piece of graphic data 6. In the pin list display area 75, the X coordinate 752 and the Y coordinate 753 indicating the position of each of the multiple pin figures 62 relative to the first surface 611 of the board figure 61 are arranged in the order of the number 751. In the pin list display area 75, for example, the column of the number 751 is an area for guiding the operator to input an individual display command using the operation unit 53. The individual display command is a command to enlarge and display the vicinity area of one pin figure 62 in the graphic data 6 on the display screen 7. When an individual display command is input via the operation unit 53 by an input operation to select one number 751 in the pin list display area 75, the display control unit 512 controls the display unit 52 so that the vicinity area of one pin figure 62 in the graphic data 6 is enlarged and displayed on the display screen 7.

As described above, the operator can manually switch the display mode by inputting information into the operation unit 53, such as displaying the entire board figure 61 or enlarging the area surrounding one pin figure 62.

A substrate PP on which already-mounted components PT are placed may warp during the mounting process of the already-mounted components PT or during a subsequent reflow process. When the supported surface PP1 of a substrate PP on which such warping has occurred is supported by push-up pins 282, interference may occur even in places where interference with the already-mounted components PT would not occur if a flat substrate PP without warping were supported.

In the interference confirmation device 5, the warpage calculation unit 514 included in the calculation processing unit 51 calculates the amount of substrate warpage related to the warpage of the substrate PP. The warpage calculation unit 514 assumes that the substrate PP warps so that the supported surface PP1 side curves inward, and calculates the amount of substrate warpage by assuming that the amount of substrate warpage is maximum at the center of the substrate PP and that the warpage occurs uniformly from the center outward. The warpage calculation unit 514 may calculate the amount of substrate warpage based on past actual measurements of the amount of substrate warpage. After calculating the amount of substrate warpage, the warpage calculation unit 514 generates warpage calculation data 76 (see FIG. 14) that indicates the calculation result.

When the warpage calculation data 76 is generated by the warpage calculation unit 514, the graphic data creation unit 511 creates the assumed warpage graphic data 6A shown in FIG. 14. The assumed warpage graphic data 6A is graphic data that includes a warped board graphic 61A obtained by deforming the board graphic 61 according to the amount of board warpage, a pin graphic 62, and an already-mounted component graphic 63 located on a first surface 611 of the warped board graphic 61A.

When the assumed warpage figure data 6A is created by the figure data creation unit 511, the distance calculation unit 513 calculates the distance between the pin figure 62 and the already-mounted component figure 63 that constitute the assumed warpage figure data 6A, and generates distance calculation data 73 that indicates the calculation result.

The display control unit 512 controls the display unit 52 so that the assumed warpage figure data 6A is displayed on the display screen 7. At this time, as shown in FIG. 14, the display control unit 512 may control the display unit 52 so that the distance calculation data 73 and the warpage amount calculation data 76 are displayed on the display screen 7 together with the assumed warpage figure data 6A.

By looking at the expected warpage graphic data 6A displayed on the display unit 52, the operator can check whether or not there will be interference between the push-up pin 282 and the already-mounted component PT if board warpage occurs, and if interference does occur, the operator can precisely check the details of the interference area through the interference area 64 in the expected warpage graphic data 6A displayed on the display screen 7.

As described above, while the lifting device 283 in the board support device 28 raises and lowers the push-up pins 282, the conveyor 23 transports the board PP. In this case, while the push-up pins 282 are being raised and lowered and while the board PP is being transported, interference may occur between the push-up pins 282 and the already-mounted components PT arranged on the supported surface PP1 of the board PP.

The interference checking device 5 may be configured to be able to check for interference between the already mounted components PT and the push-up pins 282 in the assumed raised and lowered states of the push-up pins 282 and the transport state of the substrate PP. A specific configuration in this case will be described with reference to Figures 15A and 15B. Figure 15A is a diagram showing a state in which the display unit 52 successively displays multiple pieces of graphic data 6, assuming that the push-up pins 282 are raised when the substrate PP is brought in. Figure 15B is a diagram showing a state in which the display unit 52 successively displays multiple pieces of graphic data 6, assuming that the push-up pins 282 are lowered when the substrate PP is unloaded.

The graphic data creation unit 511 creates multiple pieces of graphic data 6 each including a board graphic 61 indicating the transport state of the board PP, a pin graphic 62 indicating the raised and lowered state of the push-up pins 282, and an already-mounted component graphic 63 arranged on the first surface 611 of the board graphic 61.

In the example of FIG. 15A, the graphic data creation unit 511 creates multiple pieces of graphic data 6 including a board graphic 61 showing the transport state when the board PP is brought into a predetermined position above the push-up pins 282, and a pin graphic 62 showing the state when the push-up pins 282 rise from the retracted position to the abutment position.

When the graphic data creation unit 511 creates multiple pieces of graphic data 6 that assume the loading of the substrate PP while the push-up pins 282 are rising, the distance calculation unit 513 calculates the distance between the pin graphic 62 and the already-mounted component graphic 63 for each of the multiple pieces of graphic data 6. The distance calculation unit 513 then generates recommended pin rise start data 77 based on the calculation results. The recommended pin rise start data 77 is data that indicates a recommended value for the timing at which the push-up pins 282 start rising after the start of loading the substrate PP, so that interference between the already-mounted components PT and the push-up pins 282 can be avoided when the substrate PP is loaded. Specifically, the recommended pin rise start data 77 is data that specifies a recommended value for the timing at which the push-up pins 282 start rising after the start of loading the substrate PP. In other words, after the loading of the substrate PP has begun, the push-up pins 282 begin to rise at the timing indicated by the recommended pin rise start data 77, making it possible to avoid interference between the already mounted components PT and the push-up pins 282 when the substrate PP is loaded.

The display control unit 512 controls the display unit 52 so that the multiple pieces of graphic data 6 created by the graphic data creation unit 511 are continuously displayed on the display screen 7. At this time, as shown in FIG. 15A, the display control unit 512 may control the display unit 52 so that pin rise start recommendation data 77 is displayed on the display screen 7 together with the graphic data 6.

The display unit 52 controlled by the display control unit 512 continuously displays, like a video, multiple pieces of graphic data 6 representing the loading state of the substrate PP and the raised state of the push-up pins 282 on the display screen 7. By looking at the multiple pieces of graphic data 6 continuously displayed on the display screen 7, the operator can easily confirm the relationship between the timing at which the push-up pins 282 start to rise after the substrate PP begins to be loaded and the occurrence of interference when the substrate PP is loaded while the push-up pins 282 are rising.

On the other hand, in the example of FIG. 15B, the graphic data creation unit 511 creates multiple pieces of graphic data 6 including a substrate graphic 61 showing the transport state when the substrate PP is transported out of a predetermined position, and a pin graphic 62 showing the state when the push-up pin 282 descends from the abutment position to the retracted position.

When the graphic data creation unit 511 creates multiple pieces of graphic data 6 that assume the removal of the substrate PP while the push-up pins 282 are descending, the distance calculation unit 513 calculates the distance between the pin graphic 62 and the already-mounted component graphic 63 for each of the multiple pieces of graphic data 6. The distance calculation unit 513 then generates recommended removal start data 78 based on the calculation results. The recommended removal start data 78 is data that indicates a recommended value for the removal start timing of the substrate PP that makes it possible to avoid interference between the already-mounted components PT and the push-up pins 282 when removing the substrate PP. Specifically, the recommended removal start data 78 is data that specifies the recommended value for the removal start timing of the substrate PP by the pin descent amount that indicates the descent amount from the abutment position of the push-up pins 282. In other words, by starting to unload the substrate PP at the timing when the push-up pins 282 have been lowered according to the pin descent amount indicated in the recommended unloading start data 78, it is possible to avoid interference between the already mounted components PT and the push-up pins 282 when the substrate PP is being unloaded.

The display control unit 512 controls the display unit 52 so that the multiple pieces of graphic data 6 created by the graphic data creation unit 511 are continuously displayed on the display screen 7. At this time, as shown in FIG. 15B, the display control unit 512 may control the display unit 52 so that removal start recommendation data 78 is displayed on the display screen 7 together with the graphic data 6.

The display unit 52 controlled by the display control unit 512 continuously displays, like a video, multiple pieces of graphic data 6 representing the removal state of the substrate PP and the lowering state of the push-up pins 282 on the display screen 7. By looking at the multiple pieces of graphic data 6 continuously displayed on the display screen 7, the operator can easily confirm the relationship between the timing at which the substrate PP starts to be removed and the occurrence of interference when the substrate PP is removed while the push-up pins 282 are lowering.

The positional relationship between the push-up pins 282 and the substrate PP in the horizontal direction (X-axis direction and Y-axis direction) is not necessarily constant. For example, when the substrate PP is brought into a predetermined position above the push-up pins 282, a deviation may occur in the stopping position of the substrate PP. In this case, the horizontal relative position of the substrate PP with respect to the push-up pins 282 will not be constant.

The interference checking device 5 may be configured to assume a shift in the stopping position of the board PP and to be able to check for interference between the already-mounted component PT and the push-up pin 282 in that state. A specific configuration in this case will be described with reference to FIG. 16. FIG. 16 is a diagram showing the display state of the interference area 64 in the graphic data 6 when the board graphic 61 is moved relative to the pin graphic 62.

The graphic data creation unit 511 creates multiple pieces of graphic data 6 in which the relative position of the board figure 61 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the pin figure 62 is different. In this case, the graphic data creation unit 511 creates multiple pieces of graphic data 6 in which the relative position of the board figure 61 with respect to the pin figure 62 is different, while maintaining a constant positional relationship between the board figure 61 and the already-mounted component figure 63. Specifically, the graphic data creation unit 511 moves the board figure 61 in the X-axis direction and Y-axis direction with respect to the pin figure 62 and rotates it around the vertical axis, thereby creating multiple pieces of graphic data 6 in which the relative position of the board figure 61 with respect to the pin figure 62 is different.

When the graphic data creation unit 511 creates multiple graphic data 6 with different relative positions of the board graphic 61 with respect to the pin graphic 62, the distance calculation unit 513 calculates the distance between the pin graphic 62 and the already-mounted component graphic 63 for each of the multiple graphic data 6. The distance calculation unit 513 then generates interference list data 79 based on the calculation result. The interference list data 79 is data that lists the amount of movement of the board graphic 61 with respect to the pin graphic 62 when the pin graphic 62 and the already-mounted component graphic 63 overlap (when the calculated distance is 0.00 mm). Specifically, the interference list data 79 is data in which the pin identification number 793 and the component mounting position 794, which are information for identifying the overlapping pin graphic 62 and the already-mounted component graphic 63, are associated with the board movement amount 792 indicating the amount of movement of the board graphic 61 with respect to the pin graphic 62, in the order of the numbers 791.

When an interference portion 64 exists in the plurality of graphic data 6 created by the graphic data creation portion 511, where an already mounted component graphic 63 and a pin graphic 62 on the first surface 611 of the board graphic 61 overlap, the display control portion 512 controls the display portion 52 so that the interference portion 64 is displayed on the display screen 7. At this time, as shown in FIG. 16, the display control portion 512 controls the display portion 52 so that interference list data 79 is displayed on the display screen 7 together with the graphic data 6.

In the interference list data 79 displayed on the display screen 7, for example, the column for number 791 is an area for guiding the operator to input an interference part display command using the operation unit 53. The interference part display command is a command to display an interference part 64, which is a nearby area of a pin figure 62 and an already-mounted component figure 63 that overlap each other and are shown in the interference list data 79, on the display screen 7. When an interference part display command is input via the operation unit 53 by an input operation to select one number 791 in the interference list data 79, the display control unit 512 controls the display unit 52 so that the interference part 64 between the pin figure 62 and the already-mounted component figure 63 corresponding to the number 791 selected in the interference list data 79 is displayed on the display screen 7.

By looking at the interference area 64 displayed on the display screen 7, the operator can confirm whether or not there is interference between the push-up pin 282 and the already-mounted component PT when the horizontal relative position of the substrate PP to the push-up pin 282 changes due to a shift in the stopping position of the substrate PP, etc., and if interference does occur, the operator can precisely confirm the details of the interference area through the interference area 64 in the graphic data 6 displayed on the display screen 7.

The operator can use the interference checking device 5 to check for interference between the push-up pins 282 and the already-mounted components PT, thereby identifying support positions by the push-up pins 282 on the supported surface PP1 of the substrate PP at which interference can be avoided. The operator can then update the pin arrangement position data 414 to data indicating the arrangement of the push-up pins 282 on the push-up plate 281 that corresponds to the identified support positions. The interference checking device 5 may be configured to identify support positions by the push-up pins 282 on the supported surface PP1 of the substrate PP at which interference can be avoided, and automatically update the pin arrangement position data 414.

When the pin arrangement position data 414 is updated, the head unit 25 executes a pin arrangement operation to arrange the push-up pin 282 on the push-up plate 281 based on the updated pin arrangement position data 414. This allows the push-up pin 282 to be automatically arranged in a position that avoids interference with the already mounted component PT.

The above describes the interference checking device 5 and mounting machine 1 according to an embodiment of the present invention, but the present invention is not limited to this, and for example, the following modified embodiments can be adopted.

In the above embodiment, a configuration in which the interference checking device 5 is applied to the mounting machine 1 has been described, but the present invention is not limited to this configuration. The interference checking device 5 may be applied to, for example, a pattern forming device, which is an example of a processing machine, that prints a solder paste pattern on the substrate PP. In this case, the interference checking device 5 is used to check for interference between the push-up pins 282 that support the substrate PP on which the pattern is to be formed, and the already-mounted components PT that are arranged on the supported surface PP1 of the substrate PP.

1. Mounting machine (processing machine)
2 Mounting machine main body (processing section)
28 Board support device 281 Push-up plate 282 Push-up pin 5 Interference check device 51 Calculation processing unit 511 Graphic data creation unit 512 Display control unit 513 Distance calculation unit 514 Warpage amount calculation unit 52 Display unit 53 Operation unit 54 Data acquisition unit 6 Graphic data 6A Estimated warpage graphic data 61 Board graphic 61A Warped board graphic 62 Pin graphic 62A Pin misalignment frame graphic 63 Already mounted component graphic 63A Mounting misalignment frame graphic 64 Interference portion 7 Display screen 71 Viewpoint

Claims (10)

1. An interference checking device used to check interference between push-up pins that support a board from below and components already mounted on a supported surface of the board, comprising:
a graphic data creation unit that creates graphic data including a board graphic that represents a three-dimensional solid of the board in a projection drawing, a pin graphic that represents a three-dimensional solid of the push-up pin when supporting the board in a projection drawing, and an already-mounted component graphic that represents a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection drawing;
a display unit for displaying the graphic data on a display screen;
A display control unit that controls the display unit;
a data acquiring unit that acquires data on a pin misalignment tolerance range that indicates an allowable range of a misalignment amount of a support position when the push-up pins support the board, and data on a mounting misalignment tolerance range that indicates an allowable range of a misalignment amount of a mounting position of the already-mounted component on the supported surface of the board,
the graphic data creation unit creates a pin misalignment frame graphic that indicates an area of the pin misalignment allowable range from the pin graphic and surrounds the pin graphic, and creates a mounting misalignment frame graphic that indicates an area of the mounting misalignment allowable range from the already-mounted component graphic on the board graphic and surrounds the already-mounted component graphic,
The display control unit controls the display unit so that, when an interference area where the pin figure and the already-mounted component figure overlap in the figure data exists, the interference area is displayed on the display screen, and the display control unit controls the display unit so that the pin misalignment frame figure and the mounting misalignment frame figure are displayed on the display screen. 1. An interference checking device used to check interference between push-up pins that support a board from below and components already mounted on a supported surface of the board, comprising:
a graphic data creation unit that creates graphic data including a board graphic that represents a three-dimensional solid of the board in a projection drawing, a pin graphic that represents a three-dimensional solid of the push-up pin when supporting the board in a projection drawing, and an already-mounted component graphic that represents a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection drawing;
a display unit for displaying the graphic data on a display screen;
A display control unit that controls the display unit;
a data acquiring unit that acquires data on a pin misalignment tolerance range that indicates an allowable range of a misalignment amount of a support position when the push-up pins support the board, and data on a mounting misalignment tolerance range that indicates an allowable range of a misalignment amount of a mounting position of the already-mounted component on the supported surface of the board,
the graphic data creation unit creates a plurality of graphic data each including the pin graphic, which indicates a state in which the support positions of the push-up pins on the board differ within the pin misalignment tolerance range, and the already-mounted component graphic, which indicates a state in which the mounting positions of the already-mounted components differ within the mounting misalignment tolerance range;
The display control unit controls the display unit so that, when an interference area where the pin figure and the already-mounted component figure overlap in the figure data exists, the interference area is displayed on the display screen, and the display control unit controls the display unit so that a plurality of the figure data are continuously displayed on the display screen. 1. An interference checking device used to check interference between push-up pins that support a board from below and components already mounted on a supported surface of the board, comprising:
a graphic data creation unit that creates graphic data including a board graphic that represents a three-dimensional solid of the board in a projection drawing, a pin graphic that represents a three-dimensional solid of the push-up pin when supporting the board in a projection drawing, and an already-mounted component graphic that represents a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection drawing;
a display unit for displaying the graphic data on a display screen;
A display control unit that controls the display unit;
a warpage calculation unit that calculates a substrate warpage amount related to the warpage of the substrate,
the graphic data creation unit creates assumed warpage graphic data including a warped board graphic obtained by deforming the board graphic in accordance with the amount of board warpage, the pin graphic, and the already-mounted component graphic located on the warped board graphic,
The display control unit controls the display unit so that, when an interference area where the pin figure and the already-mounted component figure overlap in the figure data exists, the interference area is displayed on the display screen, and the display control unit controls the display unit so that the warp assumed figure data is displayed on the display screen. 1. An interference checking device used to check interference between push-up pins that support a board from below and components already mounted on a supported surface of the board, comprising:
a graphic data creation unit that creates graphic data including a board graphic that represents a three-dimensional solid of the board in a projection drawing, a pin graphic that represents a three-dimensional solid of the push-up pin when supporting the board in a projection drawing, and an already-mounted component graphic that represents a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection drawing;
a display unit for displaying the graphic data on a display screen;
A display control unit that controls the display unit,
the push-up pin is movable between a contact position where a tip of the push-up pin can contact the supported surface of the substrate and a retracted position below the contact position,
the substrate is transported to a predetermined position above the push-up pins and transported out of the predetermined position by being transported while the push-up pins are raised and lowered;
the graphic data creation unit creates a plurality of pieces of graphic data each including the board graphic showing a transport state of the board and the pin graphic showing a lifting state of the push-up pins;
The display control unit controls the display unit so that, when an interference area where the pin figure and the already-mounted component figure overlap in the figure data exists, the interference area is displayed on the display screen, and the display control unit controls the display unit so that a plurality of the figure data are continuously displayed on the display screen. 1. An interference checking device used to check interference between push-up pins that support a board from below and components already mounted on a supported surface of the board, comprising:
a graphic data creation unit that creates graphic data including a board graphic that represents a three-dimensional solid of the board in a projection drawing, a pin graphic that represents a three-dimensional solid of the push-up pin when supporting the board in a projection drawing, and an already-mounted component graphic that represents a three-dimensional solid of the already-mounted component on the supported surface of the board in a projection drawing;
a display unit for displaying the graphic data on a display screen;
A display control unit that controls the display unit,
the graphic data creation unit creates a plurality of pieces of graphic data in which the horizontal relative positions of the board graphic with respect to the pin graphic are different,
The display control unit controls the display unit so that, when an interference area exists in the plurality of graphic data where the pin graphic and the already-mounted component graphic on the board graphic overlap, the interference area is displayed on the display screen. 6. The interference checking device according to claim 1 , wherein the display control unit controls the display unit so that the interfering portion in the graphic data is displayed on the display screen in a specific display form that enables the interfering portion to be distinguished from remaining portions other than the interfering portion. The display control unit is
A viewpoint setting process for setting a viewpoint position of the graphic data;
and a display control process for controlling the display unit so that the graphic data viewed from the viewpoint is displayed on the display screen . a distance calculation unit that calculates a distance between the pin figure and the already-mounted component figure,
8. The interference checking device according to claim 1 , wherein the display control unit controls the display unit so that a result of the distance calculation by the distance calculation unit is displayed on the display screen. an operation unit that receives an input operation of a command for a display mode of the display screen, the command including an entire display command for commanding display of the entire board figure and an individual display command for commanding enlarged display of a region near the pin figure,
The interference checking device according to claim 1 , wherein the display control unit controls the display unit so that a display mode of the display screen is switched in response to a command input to the operation unit. a substrate support device having push-up pins for supporting the substrate from below;
A processing section that performs a predetermined process on the substrate;
10. A processing machine comprising: an interference checking device according to claim 1 , which is used to check interference between said push-up pins and components already mounted on the supported surface of said substrate.