JP7507412B2 - Component mounting device and component mounting system - Google Patents

Description

The present invention relates to a component mounting apparatus and a component mounting system for mounting components on a board.

The component mounting device has a component mounting section that picks up and holds components from a component supply device such as a tape feeder, and mounts the held components at the mounting position on the board. The component mounting section is configured with a mounting head that vertically raises and lowers a nozzle that holds the components, and a mounting head moving mechanism that moves the mounting head horizontally. Some component mounting devices are known that perform an arch motion operation that moves the components held by the component mounting section in parallel in the horizontal and vertical directions when mounting the components, thereby reducing the mounting time (for example, see Patent Document 1).

In the component mounting device (component mounter) described in Patent Document 1, a mounting order that will prevent interference, such as mounting components in ascending order of height first, is determined in advance so that components descending diagonally due to arch motion do not interfere with adjacent components already mounted on the board. By mounting components in the determined order, component interference caused by arch motion is avoided, and mounting efficiency is improved while maintaining mounting quality.

JP 2006-245537 A

However, in conventional technologies including Patent Document 1, the warping of the board on which the components are to be mounted is not taken into consideration when determining the mounting order. Therefore, even if components are mounted in a predetermined mounting order, they may interfere with adjacent components that have already been mounted due to the warping of the board. There is therefore room for further improvement in order to achieve both high mounting quality and high mounting efficiency.

SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a component mounting apparatus and a component mounting system that can achieve both high mounting quality and high mounting efficiency.

a control unit that controls the operation of the component mounting unit; an information acquisition unit that acquires position information regarding the mounting position and board information regarding warping of the board; and a mounting determination unit that determines whether or not the component can be mounted by a first operation based on the position information and the board information, wherein the mounting determination unit determines that the component can be mounted by the first operation when a gradient of the board at the mounting position of the component is within a predetermined range, and when it is determined by the mounting determination unit that the component can be mounted by the first operation, the control unit controls the component mounting unit to mount the component by the first operation, and when it is determined by the mounting determination unit that the component cannot be mounted by the first operation, the control unit controls the component mounting unit to mount the component by a second operation different from the first operation, and the first operation includes an arch motion operation that moves a component held by the component mounting unit in parallel to a horizontal direction and a vertical direction, and the second operation does not include the arch motion operation.

A component mounting system according to the present invention is a component mounting system, and includes the component mounting device according to any one of claims 1 to 3 , and a board warpage measuring device that measures warpage of the board.

The present invention makes it possible to achieve both high mounting quality and high mounting efficiency.

FIG. 1 is a configuration explanatory diagram of a component mounting system according to an embodiment of the present invention; FIG. 1 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present invention; FIG. 1 is a functional explanatory diagram of a component mounting device according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of an example of a measurement position set on a board for measuring the warpage of the board by a component mounting device according to an embodiment of the present invention; FIG. 1 is a block diagram showing a configuration of a component mounting system according to an embodiment of the present invention. FIG. 1 is a diagram showing an example of position information used in a component mounting system according to an embodiment of the present invention. FIG. 1 is a diagram showing an example of a board on which components are mounted by a component mounting device according to an embodiment of the present invention; 1A, 1B, and 1C are process diagrams illustrating an example of component mounting by a first operation in a component mounting device according to an embodiment of the present invention; 4A, 4B, 4C, and 4D are process diagrams illustrating an example of component mounting by a second operation in the component mounting device according to the embodiment of the present invention. FIG. 1A is a diagram showing an example of arch motion stage information in a component mounting system according to an embodiment of the present invention; FIG. 1B is a diagram explaining arch motion stages; FIG. 1 is a diagram for explaining an example in which a component interferes with an adjacent component when the component is placed on a warped board in a placement operation including an arch motion in the component placement device according to an embodiment of the present invention; FIG. 1A is a diagram showing an example of first operation determination information used in a component mounting system according to an embodiment of the present invention; FIG. 1B is a diagram showing an example of arch motion time determination information; FIG. 1C is a diagram showing an example of arch motion stage determination information; and FIG. 1D is a diagram showing an example of precision proximity target height determination information. FIG. 1A is an explanatory diagram of an example of a component mounting operation by a component mounting device according to an embodiment of the present invention, in which (a) there is an adjacent component on the movement path, and (b) there is no adjacent component on the movement path. 1 is a flow diagram of a component mounting method according to a first embodiment of the present invention; 2 is a flow chart of a component mounting method according to a second embodiment of the present invention; 1 is a flow chart of a component mounting method according to a third embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples and can be modified as appropriate depending on the specifications of the component mounting system, component mounting device, board warpage measurement device, and management device. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In FIG. 2 and in a portion described later, the X direction (left-right direction in FIG. 2) in the board transport direction and the Y direction (up-down direction in FIG. 2) perpendicular to the board transport direction are shown as two axial directions perpendicular to each other in a horizontal plane. In FIG. 3 and in a portion described later, the Z direction (up-down direction in FIG. 3) is shown as a height direction perpendicular to the horizontal plane. The Z direction is the up-down direction or perpendicular direction when the component mounting device is installed on a horizontal plane.

First, the configuration of component mounting system 1 will be described with reference to FIG. 1. Component mounting system 1 has the function of mounting components on a board to produce a mounted board. Component mounting system 1 is configured by connecting multiple component mounting devices M1-M3. Component mounting devices M1-M3 are connected to management device 3 via communication network 2. Management device 3 provides overall management of the production of mounted boards by component mounting system 1, and supports the component mounting work in which component mounting devices M1-M3 mount components on the board. Note that the number of component mounting devices M1-M3 provided in component mounting system 1 is not limited to three, and may be one, two, four or more.

Next, the configuration of component mounting devices M1 to M3 will be described with reference to Figures 2 and 3. Component mounting devices M1 to M3 have the same configuration, and component mounting device M1 will be described here. In component mounting device M1, a board transport mechanism 5 is installed in the X direction at the center of base 4. Board transport mechanism 5 transports board 6, which is the target for component mounting and has been carried in from the upstream side, in the X direction, and positions and holds it at a mounting operation position by the mounting head, which will be described below. In addition, board transport mechanism 5 carries board 6 downstream once component mounting operation has been completed.

In FIG. 2, a component supply unit 7 is installed on each side (front and back) of the board transport mechanism 5. Tape feeders 8 are attached to the component supply units 7 on both sides in parallel in the X direction. The tape feeders 8 feed a carrier tape, on which pockets for storing components are formed, in a pitch direction from the outside of the component supply unit 7 toward the board transport mechanism 5 (tape feed direction), thereby supplying components to the component removal position where the mounting head picks up the components.

A Y-axis table 9 equipped with a linear drive mechanism is disposed on both ends in the X-direction on the top surface of the base 4. A beam 10 similarly equipped with a linear mechanism is connected to the Y-axis table 9 so as to be freely movable in the Y-direction. A mounting head 11 is attached to the beam 10 so as to be freely movable in the X-direction. The mounting head 11 is a multiple head equipped with multiple (four in this case) holding heads 12.

In FIG. 3, a suction nozzle 13 that suctions and holds a component D on the suction surface 13a is attached to the bottom end of each holding head 12. Each holding head 12 is equipped with a nozzle lifting mechanism 14 that raises and lowers the suction nozzle 13 up and down (vertical direction), and a nozzle rotation mechanism (not shown) that rotates the suction nozzle 13 by θ around the vertical axis (Z axis). The holding head 12 rotates the suction nozzle 13 to a predetermined rotation angle using the nozzle rotation mechanism, and lowers it to a predetermined mounting height in the Z direction using the nozzle lifting mechanism 14 (arrow a), thereby mounting the component D held by the suction nozzle 13 on the upper surface 6a of the board 6.

In Figures 2 and 3, the Y-axis table 9 and the beam 10 constitute a mounting head moving mechanism 15 that moves the mounting head 11 horizontally (X direction, Y direction). The mounting head 11 equipped with the mounting head moving mechanism 15 and the nozzle lifting mechanism 14 constitutes a component mounting section 16 that performs a component mounting operation of picking up components D from the component supply section 7 and mounting them at the mounting position on the board 6. In other words, the component mounting section 16 has the function of moving the components D it holds in the horizontal and vertical directions. In the component mounting operation, the component mounting section 16 picks up predetermined components D from the component supply section 7 with each suction nozzle 13 equipped on the mounting head 11, and repeats a series of turns to mount the components D held by each suction nozzle 13 at a predetermined rotation angle at the mounting position on the board 6.

The number of holding heads 12 provided on the mounting head 11 is not limited to four. The mounting head 11 may also be a rotary type head with multiple suction nozzles 13 arranged concentrically. The method by which the mounting head 11 holds the component D is not limited to vacuum suction using the suction nozzles 13, and may be a method of gripping the component D with a chuck, etc.

Now, referring to Figure 3, the detailed configuration of the board transport mechanism 5 will be described. In the board transport mechanism 5, a pair of transport conveyors 18 are installed inside a pair of plate-like members 17 extending in the X direction. The transport conveyor 18 supports both ends of the board 6 from below and transports it in the X direction by a transport belt driven by a motor (not shown). A pressure plate 19 (see also Figure 2) that protrudes above the transport conveyor 18 is installed on the upper ends of the pair of plate-like members 17. The distance between the lower surface of the pressure plate 19 and the upper surface of the transport conveyor 18 is wider than the thickness of the board 6 transported by the transport conveyor 18.

Below the board 6 being transported to the mounting position, a lower support member 21 (see also Figure 2) that is raised and lowered (arrow b) by a cylinder 20 is installed. The board transport mechanism 5 positions the board 6 at the mounting position, raises the lower support member 21 to lift the board 6 from the transport conveyor 18, and holds both edges of the board 6 from above with the lower surface of the pressure plate 19, thereby holding the board 6 at the mounting position (state shown in Figure 3). When transporting the board 6, the board transport mechanism 5 lowers the lower support member 21 to a position where it does not interfere with the underside of the board 6.

In Figures 2 and 3, the beam 10 is equipped with a board recognition camera 22 that is located on the underside of the beam 10 and moves integrally with the mounting head 11. As the mounting head 11 moves, the board recognition camera 22 moves above the board 6 positioned at the mounting operation position of the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board 6 to recognize the position of the board 6.

A component recognition camera 23 is installed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11, which has removed a component D from the component supply unit 7, is positioned above the component recognition camera 23, the component recognition camera 23 captures an image of the component D held by the suction nozzle 13 from below. When the mounting head 11 mounts the component D on the board 6, correction is made taking into account the recognition result of the board 6 by the board recognition camera 22 and the recognition result of the component D by the component recognition camera 23.

In FIG. 2, a touch panel 24 operated by the worker is installed in front of the component mounting device M1 at the position where the worker works. The touch panel 24 displays various information on its display, and the worker inputs data and operates the component mounting device M1 using buttons and other buttons displayed on the display.

In Figures 2 and 3, a height sensor S such as a laser displacement sensor that moves integrally with the mounting head 11 by the mounting head moving mechanism 15 is installed on one side of the mounting head 11. The height sensor S includes a laser light source that projects laser light downward, and a light receiving element that receives the reflected light of the laser light projected by the laser light source. The height sensor S is controlled by the height measurement control unit 33 (see Figure 5), and projects and receives laser light to derive the distance to the measurement target using the principle of triangulation. The height sensor S measures the distance Hs to the top surface 6a of the substrate 6 when the substrate 6 is held in the mounting position by the substrate transport mechanism 5.

As shown in FIG. 4, a plurality of measurement positions An (n=1, 2, ... 9) are set on the upper surface 6a of the substrate 6 to measure the distance Hs to the upper surface 6a of the substrate 6 in order to calculate the warpage of the substrate 6. The height sensor S, which is moved above the measurement positions An by the mounting head moving mechanism 15 (Y-axis table 9 and beam 10), projects laser light toward the measurement positions An to measure the distance Hs to the upper surface 6a of the substrate 6.

In FIG. 11, the warpage of the substrate 6 to be measured is measured (calculated) by comparing the distance Hs to the top surface 6a of the substrate 6 at multiple measurement positions An measured by the height sensor S with a reference distance Hs0 to the top surface 6a of the substrate 6 without warping. Hereinafter, the height position of the top surface 6a of the substrate 6 to be measured, calculated from the measured distance Hs and the reference distance Hs0, relative to the top surface 6a of the substrate 6 without warping, is referred to as the height Δh of the substrate 6.

Next, the configuration of the component mounting system 1 will be described with reference to FIG. 5. The component mounting system 1 includes component mounting devices M1 to M3 and a management device 3. The component mounting devices M1 to M3 have the same configuration, and only the component mounting device M1 will be described here. The mounting control device 30 included in the component mounting device M1 is connected to the board transport mechanism 5, the cylinder 20 that raises and lowers the lower support member 21, the tape feeder 8 attached to the component supply unit 7, the nozzle lifting mechanism 14 and mounting head moving mechanism 15 that constitute the component mounting unit 16, the board recognition camera 22, the component recognition camera 23, the touch panel 24, and the height sensor S.

The mounting control device 30 includes a transport control unit 31, a mounting control unit 32, a height measurement control unit 33, a board warpage model extraction unit 34, a mounting position height calculation unit 35, an information acquisition unit 36, a mounting judgment unit 37, an operation decision unit 38, a mounting communication unit 39, and a mounting memory unit 40. The mounting memory unit 40 is a storage device, and stores position information 41, component information 42, board information 43, judgment information 44, mounting operation information 45, mounting information 46, etc. The mounting communication unit 39 is a communication interface, and transmits and receives data between other component mounting devices M2, M3 and the management device 3 via the communication network 2.

In FIG. 5, the management device 3 includes a management processing unit 50, a management memory unit 51, a display unit 52, an input unit 53, and a management communication unit 54. The display unit 52 is a display device such as an LCD panel, and displays various data, operation screens, etc. The input unit 53 is an input device such as a keyboard, touch panel, or mouse, and is used when inputting operation commands and data. The management communication unit 54 is a communication interface, and transmits and receives data to and from component mounting devices M1 to M3 via the communication network 2.

The transport control unit 31 controls the board transport mechanism 5 and cylinder 20 based on various information stored in the mounting memory unit 40 to transport the board 6 and position and hold it at the mounting work position. The mounting control unit 32 controls the tape feeder 8, component mounting unit 16, board recognition camera 22, and component recognition camera 23 based on various information stored in the mounting memory unit 40 to perform component mounting work to mount the components D supplied by the tape feeder 8 at the mounting positions on the board 6 held at the mounting work position. In other words, the mounting control unit 32 is a control unit that controls the operation of the component mounting unit 16.

In FIG. 5, the height measurement control unit 33 controls the mounting head moving mechanism 15 and the height sensor S based on various information stored in the mounting memory unit 40 to measure the height Δh of the substrate 6 at the measurement position An set on the top surface 6a of the substrate 6. The measured height Δh of the substrate 6 at the measurement position An is stored in the mounting memory unit 40 as substrate information 43. The substrate warpage model extraction unit 34 extracts a curved surface model that approximates the shape of the top surface 6a of the substrate 6 based on the measured height Δh of the substrate 6 at the measurement position An. The curved surface model is calculated, for example, as a second-order polynomial with the X coordinate and the Y coordinate as variables.

The extracted curved surface model (such as polynomial coefficients) is stored in the mounting memory unit 40 as board information 43. That is, the mounting memory unit 40 stores board information 43 (curved surface model) related to the warpage of the board 6. In this way, the height measurement control unit 33, the mounting head moving mechanism 15, the height sensor S, and the board warpage model extraction unit 34 constitute a board warpage measurement device that measures the warpage of the board 6. That is, the component mounting system 1 includes component mounting devices M1 to M3 and a board warpage measurement device. Note that the board warpage measurement device is not limited to being configured as one function of the component mounting devices M1 to M3, and the component mounting system 1 may include a board warpage measurement device separate from the component mounting devices M1 to M.

In FIG. 5, the position information 41 includes information on the mounting position where the component D is to be mounted on the board 6. An example of the position information 41 will now be described with reference to FIG. 6 and FIG. 7. FIG. 7 shows a part of the board 6 on which the component D is mounted based on the position information 41 shown in FIG. 6. In FIG. 6, the position information 41 includes information such as a mounting position number 60, mounting position coordinates 61, component name 62, AM operation 63, AM execution time 64, and mounting operation number 65. The mounting position number 60 is information that specifies the mounting position P of the component D on the board 6. FIG. 6 shows information on mounting positions P with mounting position numbers 60 of "P01" to "P10". Hereinafter, the mounting position P with mounting position number 60 of "P01" will be simply referred to as "mounting position P01" (see also FIG. 7).

In FIG. 6, mounting position coordinates 61 are information including the mounting coordinates (XY coordinates) and mounting direction (θ direction) of mounting position P of component D. Component name 62 is information specifying the type of component D to be mounted at mounting position P of mounting position number 60. In FIG. 6, component D with component name 62 "E" is assigned to mounting positions P01, P03 to P05, and P07 to P10, component D with component name 62 "F" is assigned to mounting position P02, and component D with component name 62 "G" is assigned to mounting position P06. Hereinafter, component D with component name 62 "E" will be referred to simply as "component E" (see also FIG. 7).

The AM operation 63 specifies whether component D is to be mounted by a mounting operation including an arch motion operation that moves component D held by component mounting unit 16 in parallel in the horizontal direction (XY direction) and the vertical direction (Z direction) (Y), or whether component D is to be mounted by a mounting operation that does not include an arch motion operation (N). In other words, component D is mounted at mounting position P where AM operation 63 is "Y" by a first operation including an arch motion operation described below, and at mounting position P where AM operation 63 is "N" by a second operation not including an arch motion operation described below.

Now, the first and second operations will be described with reference to Figures 8 and 9. Figures 8(a) to (c) show the process of mounting component D2 held by suction nozzle 13 of component mounting unit 16 at mounting position P adjacent to component D1 already mounted on board 6 in the first operation. In Figure 8(a), component mounting unit 16 moves held component D2 in the horizontal direction at high speed through a high-speed movement section to a predetermined proximity position Q above mounting position P (arrow c1).

8(b), the component mounting unit 16 moves the component D2 held by the component mounting unit 16 in an arch motion through a precision approach section from the approach position Q to a pre-landing position R directly above the mounting position P where the height position of the bottom surface of the component D2 is the precision approach target height h0 from the top surface 6a of the board 6 (arrow c2). That is, the mounting control unit 32 simultaneously operates the mounting head moving mechanism 15 and the nozzle lifting mechanism 14 of the component mounting unit 16 to move the component D2 held by the suction nozzle 13 in parallel in the horizontal and vertical directions (diagonally downward), thereby lowering the component D2 to the precision approach target height h0. The movement speed in the precision approach section is, for example, equal to the movement speed in the high-speed movement section. Alternatively, the movement speed in the precision approach section may be set to be slower than the movement speed in the high-speed movement section. In this case, the mounting accuracy can be improved.

In FIG. 8(c), the component mounting unit 16 vertically lowers the held component D2 through the landing area from the pre-landing position R until the bottom surface of the component D2 lands at the mounting position P (arrow c3). The vacuum suction is then stopped to separate the component D2 from the suction nozzle 13, and the component mounting unit 16 raises the suction nozzle 13 upward, mounting the component D2 on the board 6. In the first operation, the mounting time can be shortened by moving the component D2 through the precision approach section using an arch motion operation.

Figures 9(a) to (d) show the process of mounting component D2 held by suction nozzle 13 of component mounting unit 16 in mounting position P adjacent to component D1 already mounted on board 6 in the second operation. In Figure 9(a), component mounting unit 16 moves component D2 held by component mounting unit 16 in the horizontal direction at high speed (arrow d1) to approach position Q in the high-speed movement section, which is similar to the first operation. The second operation differs from the first operation in that component mounting unit 16 moves held component D2 to pre-landing position R in the precision approach section without including an arch motion operation.

That is, in the precision approach section, the component mounting unit 16 moves the component D2 it holds horizontally to directly above the mounting position P (arrow d2 in FIG. 9(b)). Next, the component mounting unit 16 lowers the component D2 it holds vertically to the pre-landing position R (arrow d3 in FIG. 9(c)). In FIG. 9(d), the component mounting unit 16 vertically lowers the component D2 it holds between the landing areas to land it on the board 6 (arrow d4), which is similar to the first operation. The second operation has the advantage that the movement distance of the component D2 in the precision approach section is longer than in the first operation, and therefore the mounting time is longer than in the first operation, but it has the advantage of being able to avoid interference with the adjacent component D1 already mounted on the board 6.

In FIG. 6, AM execution time 64 is the length of time that the arch motion operation is executed in the mounting operation of part D, which will be described later. Mounting operation number 65 is a number that identifies a number of pre-set mounting operations (arch motion stages) that have different execution times for the arch motion operation, which will be described later. Hereinafter, the "execution time of the arch motion operation" will be simply referred to as the "arch motion time."

Now, referring to FIG. 10, an example of an arch motion stage will be described. FIG. 10(a) shows an example of arch motion stage information stored in the mounting operation information 45. The arch motion stage information includes information such as a mounting operation number 66 and an AM execution time 67. The mounting operation number 66 is a number that identifies the arch motion stage. The AM execution time 67 is the length of the arch motion time in the mounting operation of part D. The position information 41 and the mounting operation information 45 are associated with each other by the numbers specified in the mounting operation number 65 and the mounting operation number 66.

In this example, the arch motion stage information includes six arch motion stages with mounting motion numbers 66 ranging from "1" to "6" and arch motion times ranging from "50 ms" to "0 ms." In other words, mounting motions with different arch motion times are set in increments of 10 ms. Hereinafter, the mounting motion with mounting motion number 66 of "1" included in mounting motion information 45 will be simply referred to as "mounting motion 1," etc.

Figure 10(b) is a diagram for explaining mounting operations 1 to 6. The vertical axis indicates the height h of the bottom surface of component D held by the component mounting unit 16, based on the top surface 6a of the unwarped board 6 held at the mounting work position. The horizontal axis indicates the horizontal (XY) position of component D transferred to mounting position P by mounting operations 1 to 6. In all of mounting operations 1 to 6, the component mounting unit 16 moves component D at high speed in the horizontal direction at a high-speed movement height h2 in the high-speed movement section up to approach position Q. In mounting operation 1, the component mounting unit 16 diagonally descends component D from approach position Q to pre-landing position R using an arch motion in the precision approach section from approach position Q to pre-landing position R. The arch motion time for mounting operation 1 is 50 ms.

In mounting operations 2 to 5, the component mounting unit 16 sequentially moves horizontally, descends diagonally in an arch motion motion, and descends vertically so that the arch motion time in the precision proximity section becomes the set time. In mounting operation 6, the component mounting unit 16 moves horizontally and then descends vertically in the precision proximity section. The arch motion time of mounting operation 6 is 0 ms. In other words, mounting operation 6 is a second operation that does not include an arch motion motion. In all mounting operations 1 to 6, the component mounting unit 16 vertically descends component D to mounting position P between the pre-landing position R and the landing area.

In FIG. 6, the position information 41 has "Y" specified as the AM operation 63 at all mounting positions P as the initial values, "50 ms" specified as the AM execution time 64, and "1" (mounting operation 1) specified as the mounting operation number 65. Note that the position information 41 does not need to include all of the AM operation 63, AM execution time 64, and mounting operation number 65, and it is sufficient if it includes at least one of them. In addition, the AM operation 63, AM execution time 64, and mounting operation number 65 may be stored in the mounting storage unit 40 as information (files) separate from the position information 41, and associated with the position information 41 by the mounting position number 60.

In FIG. 5, the component information 42 includes the size (length, width, height) and electrical characteristics of the component D for each component name 62 of the component D to be mounted on the board 6. The mounting position height calculation unit 35 calculates the height Δh of the upper surface 6a of the board 6 from which the curved model at the mounting position P of the component D is extracted, based on the curved model stored in the board information 43 and the mounting position coordinates 61 stored in the position information 41. The mounting position height calculation unit 35 also calculates the gradient Gr of the upper surface 6a of the board 6 at the mounting position P of the component D. The mounting position height calculation unit 35 calculates the height Δh or gradient Gr of the board 6 for each mounting position P. The calculated height Δh and gradient Gr of the board 6 are stored in the mounting storage unit 40 as board information 43.

Now, referring to FIG. 11, the height Δh and gradient Gr of the top surface 6a of the board 6 calculated by the mounting position height calculation unit 35 will be described. FIG. 11 shows a part of the board 6 with an upward warp. The two-dot chain line indicates the height position of the top surface 6a of the board 6 when the board 6 without warp is held at the mounting work position. The height Δh of the board 6 at the mounting position P is the height from the top surface 6a of the board 6 when there is no warp. The gradient Gr of the board 6 is the ratio of the vertical height variation ΔH to the horizontal distance ΔL, and is expressed as gradient Gr = height variation ΔH / distance ΔL. The greater the absolute value of gradient Gr, the greater the warp of the board 6.

If the board 6 is warped, the placement control unit 32 makes corrections based on the height Δh of the board 6 that has changed due to the warp, and places the component D2 at the placement position P. That is, the precision approach target height h0 of the pre-landing position R in the placement operation is corrected by the height Δh, and the height at which the component D2 lands on the board 6 is corrected to the height Δh. In this way, the placement control unit 32 corrects the placement operation according to the warp of the board 6. However, depending on the relationship between the degree of warping of the board 6, the height of the adjacent component D1, and the distance from the placement position P, the component D2 may interfere with (come into contact with) the adjacent component D1 that has already been placed while moving in the arch motion operation (arrow e) (circle f).

In FIG. 5, the mounting determination unit 37 determines whether or not component D can be mounted by the first operation including an arch motion operation when the board 6 is warped. That is, the mounting determination unit 37 determines whether or not component D2 will interfere with adjacent component D1 during the arch motion operation when mounting component D2 by the first operation. The information acquisition unit 36 acquires information necessary for the mounting determination unit 37 to determine whether or not mounting is possible. Specifically, the information acquisition unit 36 acquires first operation judgment information contained in position information 41, component information 42, board information 43, and judgment information 44 from the mounting storage unit 40. Note that if the component mounting devices M1 to M3 do not measure the warp of the board 6 by themselves, the information acquisition unit 36 acquires board information 43 measured by an upstream device.

Now, referring to FIG. 12(a), an example of the first operation judgment information included in the judgment information 44 will be described. The first operation judgment information specifies that component D is mounted by the first operation when the height Δh of the board 6 at the mounting position P is in the range of -Δh1≦Δh≦Δh1, and that component D is mounted by the second operation when the height Δh is in the range of Δh<-Δh1 or Δh>Δh1. That is, when the height Δh of the board 6 at the mounting position P of component D is within a predetermined range (-Δh1≦Δh≦Δh1), the mounting judgment unit 37 judges that mounting of component D by the first operation is possible. Based on the judgment result, the mounting judgment unit 37 updates the AM operation 63 of the position information 41 and stores it in the mounting storage unit 40 as mounting information 46.

When the placement determination unit 37 determines that placement of component D by the first operation is possible, the placement control unit 32 (control unit) controls the component placement unit 16 to place component D by the first operation (see FIG. 8). When the placement determination unit 37 determines that placement of component D by the first operation is impossible, the placement control unit 32 controls the component placement unit 16 to place component D by a second operation different from the first operation (see FIG. 9). In this way, by using a placement operation that does not include an arch motion operation when placing component D at a placement position P where the board 6 has a large warp, it is possible to prevent component D from interfering with adjacent components D that have already been placed during placement. This makes it possible to achieve both high mounting quality and high mounting efficiency.

Note that while FIG. 12(a) shows the first operation judgment information based on the height Δh of the board 6, the first operation judgment information may be defined based on the gradient Gr of the board 6. That is, the mounting judgment unit 37 judges that mounting of the component D by the first operation is possible when the gradient Gr of the board 6 at the mounting position P of the component D is within a predetermined range. In this way, the mounting judgment unit 37 judges whether or not mounting of the component D by the first operation is possible for each mounting position P of the component D based on whether or not the board information 43 related to the height Δh or gradient Gr of the board 6 at the mounting position P of the component D satisfies a predetermined condition.

In FIG. 5, the operation determination unit 38 determines the arch motion time (the execution time of the arch motion operation) in the mounting operation of the component D according to the warp of the board 6. The information acquisition unit 36 acquires information necessary for the operation determination unit 38 to determine the arch motion time. Specifically, the information acquisition unit 36 acquires arch motion time determination information contained in the position information 41, component information 42, board information 43, and judgment information 44 from the mounting memory unit 40.

Now, referring to FIG. 12(b), the arch motion time determination information included in the judgment information 44 will be described. The arch motion time determination information defines the relationship between the height Δh of the board 6 at the mounting position P and the arch motion time Ta. In this example, the arch motion time Ta is defined by a relationship that linearly decreases from 50 ms when the height Δh of the board 6 is zero to 0 ms when the height Δh of the board 6 is -Δh5 or Δh5.

Note that while FIG. 12(b) shows the relationship between the height Δh of the substrate 6 and the arch motion time Ta as the arch motion time determination information, the arch motion time determination information may be defined by the relationship between the gradient Gr of the substrate 6 and the arch motion time Ta. In other words, the smaller the absolute value of the height Δh of the substrate 6 or the smaller the absolute value of the gradient Gr of the substrate 6, the longer the arch motion time Ta (the execution time of the arch motion operation).

In this way, the operation determination unit 38 determines the arch motion time Ta (the execution time of the arch motion operation) based on the height Δh or gradient Gr of the board 6 at the component mounting position calculated by the mounting height calculation unit 35, or the height Δh or gradient Gr of the board 6 included in the board information 43, and the arch motion time determination information included in the judgment information 44. The operation determination unit 38 updates the AM execution time 64 of the position information 41 based on the determined arch motion time Ta, and stores it in the mounting memory unit 40 as mounting information 46. The mounting control unit 32 controls the mounting operation by the component mounting unit 16 based on the arch motion time Ta determined by the operation determination unit 38. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

In FIG. 5, as another embodiment, the operation determination unit 38 selects component mounting operations 1 to 6 from a plurality of mounting operations (arch motion stages) with different arch motion times Ta (execution time of the arch motion operation) preset according to the warp of the board 6. In this case, the information acquisition unit 36 acquires arch motion stage determination information contained in the position information 41, component information 42, board information 43, and judgment information 44 from the mounting storage unit 40.

Now, referring to FIG. 12(c), the arch motion stage determination information included in the judgment information 44 will be described. The arch motion stage determination information specifies the relationship between the height Δh of the board 6 at the mounting position P and the arch motion stage (mounting operations 1 to 6). In this example, the arch motion stage is specified in stages according to the height Δh of the board 6. That is, when the height Δh of the board 6 is in the range of -Δh1≦Δh≦Δh1, mounting operation 1 with an arch motion time Ta of 50 ms is specified. Furthermore, when the height Δh of the board 6 is in the range of -Δh2≦Δh<-Δh1 or Δh1<Δh≦Δh2, six stages of mounting operations 1 to 6 are specified, such that mounting operation 2 with an arch motion time Ta of 40 ms is specified.

Note that while FIG. 12(c) shows the relationship between the height Δh of the substrate 6 and the arch motion stages (mounting operations 1 to 6) as the arch motion stage determination information, the arch motion stage determination information may also be defined by the relationship between the gradient Gr of the substrate 6 and the arch motion stage. That is, the smaller the absolute value of the height Δh of the substrate 6 is, or the smaller the absolute value of the gradient Gr of the substrate 6 is, the more the operation determination unit 38 selects the arch motion stage (mounting operations 1 to 6) with a longer arch motion time Ta (execution time of the arch motion operation).

The operation determination unit 38 updates the mounting operation number 65 of the position information 41 based on the determined arch motion stage (mounting operations 1 to 6) and stores it in the mounting memory unit 40 as mounting information 46. The mounting control unit 32 controls the mounting operation by the component mounting unit 16 based on the mounting operations 1 to 6 determined by the operation determination unit 38. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

In FIG. 5, as another embodiment, the operation determination unit 38 determines the precision approach target height h0 of the pre-landing position R in the mounting operation of the component D in accordance with the warp of the board 6. That is, the operation determination unit 38 determines the target height (precise approach target height h0) of the component D at the end of the arch motion operation when the component D held by the component mounting unit 16 is lowered diagonally by the arch motion operation in accordance with the warp of the board 6 at the mounting position P. In this case, the information acquisition unit 36 acquires precision approach target height determination information included in the position information 41, the component information 42, the board information 43, and the judgment information 44 from the mounting memory unit 40.

Now, referring to FIG. 12(d), the precision approach target height determination information included in the judgment information 44 will be described. The precision approach target height determination information specifies the relationship between the height Δh of the board 6 at the mounting position P and the precision approach target height h0. In this example, the precision approach target height h0 is specified by a relationship that linearly decreases from h0.max when the height Δh of the board 6 is zero to h0.min when the height Δh of the board 6 is -Δh5 or Δh5. For example, the high-speed movement height h2 shown in FIG. 10(b) is set as h0.max, and the height h1 shown in FIG. 10(b) which is the precision approach target height h0 when the board 6 is not warped is set as h0.min.

Note that while FIG. 12(d) shows the relationship between the height Δh of the board 6 and the precision approach target height h0 as the precision approach target height determination information, the precision approach target height determination information may be defined as the relationship between the gradient Gr of the board 6 and the precision approach target height h0. That is, the smaller the absolute value of the height Δh of the board 6 is, or the smaller the absolute value of the gradient Gr of the board 6 is, the lower the precision approach target height h0 (the target height of the component at the end of the arch motion operation) is set by the operation determination unit 38. The mounting control unit 32 controls the mounting operation by the component mounting unit 16 based on the precision approach target height h0 determined by the operation determination unit 38. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

Next, referring to Figure 13, the determination by the mounting determination unit 37 of whether or not component D can be mounted by the first operation based on the path (movement path) in a plan view along which component D is moved to mounting position P for component D will be described. Figures 13(a) and 13(b) show schematic diagrams of a situation in which component D5 is mounted at mounting position P06 in warped region g of a board 6 that has warpage above a predetermined range (Δh<-Δh1, Δh>Δh1, etc.). An adjacent component D3 has already been mounted at mounting position P02 adjacent to mounting position P06.

In FIG. 13(a), the component mounting unit 16 mounts component D4 at mounting position P01, and then mounts component D5 at mounting position P06. On the movement path i1 along which the component mounting unit 16 moves component D5 held by the component mounting unit 16 to mounting position P06, there is an adjacent component D3 that has already been mounted. In this case, there is a possibility that component D5 may interfere with (come into contact with) the adjacent component D3. Therefore, the mounting determination unit 37 determines that mounting of component D5 at mounting position P06 in the warped region g by the first operation is not possible. That is, component D5 is mounted at mounting position P01 by the second operation.

In FIG. 13B, the component mounting unit 16 mounts component D6 at mounting position P09, and then mounts component D5 at mounting position P06. There is no adjacent component already mounted on the movement path i2 along which the component mounting unit 16 moves the component D5 held by the component mounting unit 16 to mounting position P06. Therefore, the mounting determination unit 37 determines that mounting of component D5 by the first operation at mounting position P06 in the warped region g is possible. Note that in the above example, the mounting determination unit 37 searches for the movement paths i1 and i2 based on the mounting positions P01 and P09 of the previously mounted components D4 and D6, but the method of searching for the movement paths i1 and i2 is not limited to a method based on the mounting order of the components D. For example, the movement paths i1 and i2 may be specified by the mounting information 46.

Similarly, the operation determination unit 38 determines the arch motion time Ta (execution time of the arch motion operation), the arch motion stage (mounting operations 1 to 6), or the precision proximity target height h0 (target height of the component at the end of the arch motion operation) based on the path (movement path) in a plan view along which the component D is moved to the mounting position P of the component D. That is, when there is an adjacent component D3 that has been mounted on the movement path i1 as shown in FIG. 13(a), the operation determination unit 38 determines the arch motion time Ta, etc. based on the height Δh or gradient Gr of the board 6 at the mounting position P06. Also, when there is no adjacent component that has been mounted on the movement path i2 as shown in FIG. 13(b), the operation determination unit 38 determines the arch motion time Ta, etc. to be the same value as that of a board 6 without warping.

Next, the component mounting method for mounting the component D5 on the board 6 will be described with reference to FIG. 13 and following the flow of FIG. 14. First, the height sensor S measures the height Δh of the board 6 at the measurement position An set on the top surface 6a of the board 6 that is the target of the component mounting operation (ST1: height measurement process). Next, the board warp model extraction unit 34 extracts a curved surface model that approximates the shape of the top surface 6a of the board 6 based on the measured height Δh of the board 6 at the measurement position An (ST2: board warp model extraction process). The extracted curved surface model is stored in the mounting storage unit 40 as board information 43. Next, the information acquisition unit 36 acquires the first operation judgment information (see FIG. 12(a)) included in the position information 41, the component information 42, the board information 43, and the judgment information 44 (ST3: information acquisition process).

Then, the component mounting unit 16 takes out and holds the component D supplied by the tape feeder 8 (ST4: component holding process). Next, the mounting position height calculation unit 35 calculates the height Δh or gradient Gr of the board 6 at the mounting position P06 (ST5: board warpage calculation process). Next, the mounting determination unit 37 determines whether the calculated height Δh or gradient Gr of the board 6 is within a predetermined range (ST6: determination process). For example, the mounting determination unit 37 determines whether the height Δh of the board 6 is in the range of -Δh1≦Δh≦Δh1 (see FIG. 12(a)).

In FIG. 14, if the height Δh or gradient Gr of the board 6 is within a predetermined range (Yes in ST6), the placement control unit 32 controls the component placement unit 16 to place the component D5 at the placement position P06 by the first operation (ST7: First operation component placement process) (see FIG. 8). If the height Δh or gradient Gr of the board 6 is not within the predetermined range (No in ST6), the placement control unit 32 determines whether or not there is an adjacent component D3 that has already been placed on the movement path i1, i2 of the component D to the placement position P06 (ST8: Adjacent component determination process).

When there is no adjacent part on movement path i2 as in the example of FIG. 13(b) (No in ST8), part D5 is mounted by the first operation part mounting process (ST7). When there is an adjacent part D3 on movement path i1 as in the example of FIG. 13(a) (Yes in ST8), the mounting control unit 32 controls the part mounting unit 16 to mount part D5 by the second operation (ST9: second operation part mounting process) (see FIG. 9).

In FIG. 14, after component D5 is mounted by the first operation component mounting process (ST7) or the second operation component mounting process (ST9), if the component mounting unit 16 is holding another component D (No in ST10), the process returns to the board warpage calculation process (ST5) and component mounting of the other component D is performed (ST5 to ST9).

If the component mounting unit 16 is not holding any components D (Yes in ST10), it is determined whether mounting of components D on the board 6 is complete (ST11). If there are any components D that have not been mounted (No in ST11), the process returns to the component holding step (ST4) and another component D is held and component mounting is performed (ST4 to ST9). If there are no components D that have not been mounted (Yes in ST11), the component mounting work on the board 6 is complete and component mounting on the next board 6 is performed.

In this way, the component mounting method shown in FIG. 14 (hereinafter referred to as the "first embodiment of the component mounting method") determines whether or not an arch motion operation that moves component D5 in parallel in the horizontal and vertical directions when mounting component D5 at mounting position P06 is included (whether or not the component can be mounted by the first operation) based on position information 41 regarding mounting position P06 of component D5 and board information 43 regarding the warping of board 6. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

Next, a second embodiment of the component mounting method for mounting component D5 on board 6 will be described with reference to FIG. 13 and following the flow of FIG. 15. The second embodiment of the component mounting method differs from the first embodiment of the component mounting method in that, instead of the mounting determination unit 37 determining whether or not the component can be mounted by the first operation, the operation determination unit 38 determines the arch motion time Ta. Hereinafter, the same steps as those in the first embodiment of the component mounting method are given the same reference numerals, and detailed descriptions thereof will be omitted.

In FIG. 15, first, a height measurement process (ST1), a board warpage model extraction process (ST2), and an information acquisition process (ST3) are performed. In the information acquisition process (ST3), the information acquisition unit 36 acquires the arch motion time determination information (see FIG. 12(b)) contained in the position information 41, the part information 42, the board information 43, and the judgment information 44. Next, a part holding process (ST4), a board warpage calculation process (ST5), and an adjacent part judgment process (ST8) are performed.

When there is no adjacent component on the movement path i2 as in the example of FIG. 13(b) (No in ST8), the operation decision unit 38 sets the arch motion time Ta to the same value as that of the unwarped board 6 (ST21: Arch motion time maximum value setting process). In other words, the arch motion time Ta is set to the maximum value. When there is an adjacent component D3 on the movement path i1 as in the example of FIG. 13(a) (Yes in ST8), the operation decision unit 38 calculates the arch motion time Ta when mounting the component D5 at the mounting position P06 based on the height Δh or gradient Gr of the board 6 at the mounting position P06 and the arch motion time determination information (ST22: Arch motion time calculation process).

In FIG. 15, the mounting control unit 32 then controls the component mounting unit 16 to mount component D5 at mounting position P06 based on the arch motion time Ta set in the arch motion time maximum value setting process (ST21) or the arch motion time calculation process (ST22) (ST23: component mounting process). Next, if the component mounting unit 16 is holding another component D (No in ST10), the process returns to the board warpage calculation process (ST5) and the component mounting of the other component D is performed (ST5, ST8, ST21 to ST23).

If the component mounting unit 16 is not holding any components D (Yes in ST10), it is determined whether mounting of components D on the board 6 is complete (ST11). If there are any components D that have not been mounted (No in ST11), the process returns to the component holding step (ST4) to hold other components D and perform component mounting (ST4 to ST5, ST8, ST21 to ST23). If there are no components D that have not been mounted (Yes in ST11), the component mounting work on the board 6 is complete, and component mounting on the next board 6 is performed.

In this way, in the second embodiment of the component mounting method, the operation time (arch motion time Ta) of the arch motion operation that moves component D5 in parallel in the horizontal and vertical directions when mounting component D5 at mounting position P06 is determined based on position information 41 regarding mounting position P06 of component D5 and board information 43 regarding the warpage of the board 6. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6. Note that the operation determination unit 38 may determine the arch motion stage (mounting operations 1 to 6) or the precision proximity target height h0 (target height of the component at the end of the arch motion operation) instead of the arch motion time Ta.

As described above, the component mounting devices M1 to M3 of this embodiment include a component mounting unit 16 that holds a component D and mounts it at a mounting position P on the board 6, a mounting control unit 32 that controls the operation of the component mounting unit 16, an information acquisition unit 36 that acquires position information 41 regarding the mounting position P and board information 43 regarding the warping of the board 6, and a mounting determination unit 37 that determines whether or not the component D can be mounted by the first operation based on the position information 41 and the board information 43. This makes it possible to achieve both high mounting quality and high mounting efficiency even on a warped board 6.

In addition, component mounting devices M1 to M3 in other embodiments include a component mounting unit 16 that holds a component D and mounts it at a mounting position P on a board 6, a mounting control unit 32 that controls the operation of the component mounting unit 16, an information acquisition unit 36 that acquires position information 41 regarding the mounting position P and board information 43 regarding the warping of the board 6, and an operation determination unit 38 that determines the execution time (arch motion time Ta) of an arch motion operation that moves the component D held by the component mounting unit 16 in parallel in the horizontal and vertical directions during the mounting operation of the component D based on the position information 41 and the board information 43. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

In addition, component mounting devices M1 to M3 in other embodiments include a component mounting unit 16 that holds a component D and mounts it at a mounting position P on a board 6, a mounting control unit 32 that controls the operation of the component mounting unit 16, an information acquisition unit 36 that acquires position information 41 regarding the mounting position P and board information 43 regarding the warping of the board 6, and an operation determination unit 38 that determines a target height (precise proximity target height h0) of component D at the end of an arch motion operation that moves component D held by the component mounting unit 16 in parallel in the horizontal and vertical directions during the mounting operation of component D based on the position information 41 and the board information 43. This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

Next, referring to FIG. 5, a management device 3 that manages a production line including component mounting devices M1-M3 that mount components D on a board 6 and a board warpage measurement device that measures the warpage of the board 6 will be described. Here, among the functions of the management device 3, a function of creating (changing) mounting information 51a related to the mounting operation in which the component mounting devices M1-M3 mount components D on the board 6 according to the warpage of the board 6 that is the target of the component mounting operation will be described. In addition to the mounting information 51a, the management memory unit 51 stores information similar to the position information 41, component information 42, and judgment information 44 stored in the mounting memory unit 40.

The management communication unit 54 (communication unit) communicates with the component mounting devices M1-M3 and the board warpage measurement device (the component mounting devices M1-M3 that measured the warpage of the board 6). The management communication unit 54 acquires board information 43 related to the warpage of the board 6 from the board warpage measurement device that measured the warpage of the board 6 that is the target of the component mounting operation. The mounting information change unit 50a provided in the management processing unit 50 changes (or creates) mounting information 51a for mounting the component D on the board 6 measured by the board warpage measurement device based on the position information 41 related to the mounting position P of the component D and the board information 43.

Specifically, the mounting information change unit 50a, like the mounting determination unit 37, determines whether the mounting operation includes an arch motion operation (whether or not the component can be mounted by the first operation), and changes the AM operation 63 included in the mounting information 51a. Alternatively, the mounting information change unit 50a, like the operation determination unit 38, determines the arch motion time Ta (execution time of the arch motion operation), arch motion stage (mounting operations 1 to 6), or precision proximity target height h0 (target height of the component at the end of the arch motion operation) included in the mounting operation, and changes the AM execution time 64 or mounting operation number 65 included in the mounting information 51a. The management communication unit 54 then transmits the modified mounting information 51a to the component mounting devices M1 to M3. The component mounting devices M1 to M3 mount the component D based on the transmitted mounting information 51a.

In this way, the management device 3 includes a management communication unit 54 and a mounting information change unit 50a that changes mounting information 51a related to the mounting operation in which the component mounting devices M1 to M3 mount the component D on the board 6. The management communication unit 54 then acquires board information 43 from the board warpage measurement device, and the mounting information change unit 50a changes the mounting information 51a for mounting the component D on the board 6 measured by the board warpage measurement device based on the position information 41 and the board information 43, and the management communication unit 54 transmits the changed mounting information 51a to the component mounting devices M1 to M3. This makes it possible to achieve both high mounting quality and high mounting efficiency even on a warped board 6.

Next, a third embodiment of the component mounting method for mounting a component D on a board 6 will be described with reference to the flow of FIG. 16. The third embodiment of the component mounting method differs from the first and second embodiments of the component mounting method in that the management device 3 creates mounting information 51a relating to the mounting operation in which component mounting devices M1 to M3 mount components D on a board 6. First, a height measurement process (ST1) and a board warpage model extraction process (ST2) are performed in the board warpage measurement device. Next, the management communication unit 54 of the management device 3 acquires board information 43 from the board warpage measurement device (ST31). Next, position information 41, component information 42, and judgment information 44 are acquired (ST32).

Then, the height Δh or gradient Gr of the board 6 is calculated in the management device 3 (ST33), and the mounting information change unit 50a changes (creates) the mounting information 51a (ST34). The management communication unit 54 then transmits the mounting information 51a to the component mounting devices M1 to M3 (ST35). The component mounting devices M1 to M3 then perform component mounting work based on the mounting information 51a (ST36). This makes it possible to achieve both high mounting quality and high mounting efficiency even for a warped board 6.

The component mounting device, component mounting system, component mounting method, and management device of the present invention have the effect of achieving both high mounting quality and high mounting efficiency, and are useful in fields where components are mounted on boards.

1 Component mounting system 6 Substrate 16 Component mounting section D to G, D1 to D6 Component Gr Gradient h0 Precision proximity target height (target height of component at the end of arch motion)
i1, i2 Movement path (path in plan view)
M1 to M3: Component placement device P, P01 to P10: Placement position Ta: Arch motion time (execution time of arch motion operation)
Δh Height

Claims (4)

A component mounting device that mounts components on a board,
a component mounting section that holds a component and mounts it on a mounting position on a board;
A control unit that controls an operation of the component mounting unit;
an information acquisition unit that acquires position information regarding the mounting position and board information regarding warpage of the board;
a mounting determination unit that determines whether or not a component can be mounted by the first operation based on the position information and the board information,
the placement determination unit determines that placement of the component by the first operation is possible when a gradient of the board at the placement position of the component is within a predetermined range;
When the mounting determination unit determines that mounting of the component by the first operation is possible, the control unit controls the component mounting unit to mount the component by the first operation;
when the mounting determination unit determines that mounting of the component by the first operation is impossible, the control unit controls the component mounting unit to mount the component by a second operation different from the first operation;
the first motion includes an arch motion that moves the component held by the component mounting unit in a horizontal direction and a vertical direction in parallel;
The component mounting apparatus, wherein the second operation does not include the arch motion operation. The component mounting device mounts a plurality of components on a board;
The component mounting device according to claim 1 , wherein the mounting determination unit determines, for each of the mounting positions of the plurality of components, whether or not the components can be mounted by the first operation based on the board information. The component mounting device according to claim 1 or 2, wherein the mounting determination unit further determines whether the component can be mounted by the first operation based on a path in a plan view along which the component is moved to the mounting position of the component. A component mounting system, comprising:
The component mounting device according to any one of claims 1 to 3 ,
and a substrate warpage measuring device that measures the warpage of the substrate.

Images