JP2023170361A - Work device and camera check method - Google Patents

Abstract

To detect an angle of a camera or displacement which occurs in a scale.SOLUTION: A visual field V51 including a center Cw of a target component Wpt is imaged by a wafer camera 51, and a pre-movement image I1 (first image) including the center Cw of the target component Wpt is acquired. A relative moving amount M of a center Cv of the visual field V51 with respect to the center Cw of the target component Wpt required for matching the center Cv to the center Cw of the target component Wpt is calculated based on the pre-movement image I1, and the wafer camera 51 is moved just for the moving amount M with respect to a wafer W by an X-axis motor 356 and a Y-axis motor 355. A post-movement image I2 (second image) including the center Cw of the target component Wpt is acquired and based on a positional relation between the center Cv and the center Cw in the post-movement image I2, an angle of the wafer camera 51 or a displacement amount of a scale is calculated.SELECTED DRAWING: Figure 5

Description

The present invention relates to a technique for calibrating a camera that images a workpiece on which a predetermined work is being performed.

In a component mounting machine that uses a mounting head to hold components supplied by a feeder and mounts them on a board, various controls are executed based on images captured by a camera. Specifically, the position of the recognition mark on a board carried into a component mounting machine is recognized based on an image taken by a camera (Patent Document 1), or the position of the recognition mark is recognized based on an image taken of a component picked up by a mounting head. Based on this, control such as recognizing the position of parts is executed.

Japanese Patent Application Publication No. 5304739

Incidentally, deviations (in other words, errors) may occur in the angle at which the camera is attached and the scale of the camera due to various factors. In a state where such a shift occurs, control based on the image captured by the camera cannot be accurately executed. Therefore, there was a need for technology that could detect shifts in camera angle or scale.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology that makes it possible to detect a shift that occurs in the angle or scale of a camera.

The working device according to the present invention includes a support part that supports a workpiece having a predetermined feature, a work part that performs a predetermined work on the workpiece supported by the support part, and a workpiece that has a predetermined field of view and is within the field of view. a camera that captures an image of a control unit that acquires an image of a portion of the workpiece that overlaps the field of view by causing the camera to perform imaging while adjusting the position; A first imaging operation that acquires an image including the feature location as the first image, and calculating the amount of relative movement of the reference position to the feature location, which is necessary to match the reference location with the feature location, based on the first image. a movement amount calculation operation, a movement operation in which the drive section moves the camera by the movement amount with respect to the workpiece, and a second imaging operation in which an image including the characteristic location is acquired as a second image after the movement operation is executed. Based on the positional relationship between the reference position and the characteristic location in the second image, a shift amount calculation operation is performed to calculate the shift amount of at least one of the camera angle and the scale indicating the length of one pixel of the image.

The camera check method according to the present invention includes driving at least one of a drive target of a support part that supports a workpiece having a predetermined characteristic location and a camera that has a predetermined field of view and captures an image within the field of view. By having the camera take an image while facing the workpiece using a drive unit that moves the camera relative to the workpiece, the feature location can be included in the field of view with the feature location shifted from a predetermined reference position. A step of executing a first imaging operation to obtain a first image, and a movement amount of calculating a relative movement amount of the reference position with respect to the feature location, which is necessary to match the reference position with the feature location, based on the first image. a step of executing a calculation operation, a step of executing a movement operation of moving the camera by the amount of movement with respect to the workpiece by the driving unit, and a second image of acquiring a second image including the characteristic location after the execution of the movement operation. Based on the step of performing the imaging operation and the positional relationship between the reference position and the characteristic location in the second image, calculate the amount of deviation in at least one of the camera angle and the scale indicating the length of one pixel of the image captured by the camera. and a step of executing a deviation amount calculation operation.

A camera check program according to the present invention causes a computer to execute the above camera check method.

In the present invention (work device, camera check method, and camera check program) configured as described above, the field of view including the characteristic points is imaged by the camera while the reference position of the field of view of the camera and the characteristic points of the workpiece are shifted from each other. and a first image including the characteristic location is acquired (first imaging operation). Next, the amount of movement of the reference position relative to the feature point, which is necessary to match the reference position of the field of view with the feature point of the workpiece, is calculated based on the first image (movement amount calculation operation), and the drive unit moves the camera by the amount of movement relative to the workpiece (moving operation). If there is no deviation in the angle and scale of the camera, the reference position and the characteristic location match (in other words, overlap) within the field of view of the camera after the movement operation is performed. On the other hand, if a shift occurs in the angle or scale of the camera, the reference position and the characteristic location do not match (in other words, do not overlap) within the field of view of the camera after the movement operation is executed. Therefore, after the movement operation is executed, a second image including the characteristic location is acquired (second imaging operation), and based on the positional relationship between the reference position and the characteristic location in the second image, at least the camera angle and scale are adjusted. One of the deviation amounts is calculated (deviation amount calculation operation). In this way, it is possible to detect deviations that occur in the angle or scale of the camera.

Further, the control unit may configure the work device to calculate the angular shift amount of the camera in the shift amount calculation operation. With such a configuration, it is possible to detect a shift that occurs in the angle of the camera.

The control unit further includes a notification unit configured to notify the operator, and the control unit causes the notification unit to perform notification when the amount of deviation of the angle of the camera calculated in the deviation amount calculation operation is equal to or greater than a predetermined threshold angle. The working device may be configured as follows. With such a configuration, the operator can understand that a deviation amount equal to or greater than the threshold angle has occurred in the camera angle, and can appropriately perform maintenance such as adjusting the camera angle.

Further, the control unit may configure the work device to calculate the angle of the target portion included in the image while correcting the angular deviation amount of the camera calculated in the deviation amount calculation operation. In such a configuration, correction is performed based on the amount of deviation that occurs in the angle of the camera. Therefore, the angle of the target portion included in the image captured by the camera can be appropriately calculated.

The camera drive unit further includes a camera drive unit that changes the angle of the camera by driving the camera, and the control unit drives the camera by the camera drive unit based on the amount of deviation of the angle of the camera calculated in the deviation amount calculation operation. The working device may be configured to correct the angle of the camera. With such a configuration, it is possible to correct deviations that occur in the camera angle.

Further, the control unit may configure the work device to calculate the scale shift amount in the shift amount calculation operation. With such a configuration, it is possible to detect a shift that occurs in the scale of the camera.

Further, the control unit may configure the work device to calculate the position of the target portion included in the image while correcting the scale shift amount calculated in the shift amount calculation operation. With such a configuration, it is possible to correct any deviations that occur in the scale of the camera.

Note that various specific examples of the reference position of the visual field are envisioned. For example, the reference position may be the center of the field of view.

Further, various specific examples of the working device can be considered. Therefore, the workpiece includes a sheet and a bare chip pasted on the sheet, and the work unit is a mounting head that performs a mounting operation for mounting the bare chip taken out from the sheet onto a board as a predetermined operation. The device may also be configured. That is, the working device may be a component mounting machine.

At this time, the control unit controls the control unit after replacing the workpiece supported by the support unit, after unloading the board from the working device, when detecting a positional shift of the bare chip held by the mounting head, at the start of mounting work, and when the workpiece lot The working device is configured to execute the first imaging operation, the movement amount calculation operation, the movement operation, the second imaging operation, and the deviation amount calculation operation at either of the timing of switching and the elapse of a certain period of time. It's okay. At such timing, it is possible to accurately detect a shift that occurs in the camera angle or scale.

As described above, according to the present invention, it is possible to detect a shift that occurs in the angle or scale of the camera.

FIG. 1 is a plan view schematically showing an example of a component mounting machine that is an example of a working device according to the present invention. FIG. 2 is a block diagram showing an example of an electrical configuration included in the component mounting machine of FIG. 1. FIG. 5 is a flowchart showing an example of a camera check performed on a wafer camera. FIG. 3 is a plan view schematically showing the relationship between the field of view of the wafer camera and the wafer. 4 is a diagram schematically showing each operation performed in the camera check of FIG. 3. FIG. FIG. 4 is a diagram schematically showing the content calculated by the camera check in FIG. 3; FIG. 3 is a block diagram showing a modification of the component mounting machine.

FIG. 1 is a plan view schematically showing an example of a component mounting machine which is an example of a working device according to the present invention. As shown in FIG. 1, in this specification, orthogonal coordinate axes composed of an X direction, a Y direction, and a Z direction that are orthogonal to each other are used as appropriate. Here, each of the X direction and the Y direction is a horizontal direction, and the Z direction is a vertical direction.

The component mounting machine 1 mounts components on a board B that is carried in from the upstream side in the X direction (board transport direction) and carries it out to the downstream side in the X direction. A plurality of mounting target points Bp are provided on the board B, and the control unit 100 included in the component mounter 1 controls each part of the component mounter 1 to place the component Wp at each mounting target point Bp. Implement. Here, the component Wp is a bare chip of a diced wafer W, and is attached to an adhesive sheet Ws.

This component mounting machine 1 includes a transport section 2 that transports a board B in the X direction. The transport section 2 has an incoming conveyor 21, a mounting conveyor 22, and an outgoing conveyor 23 that are arranged in this order in the X direction, and these conveyors 21 to 23 work together to transport the substrate B in the X direction. The carry-in conveyor 21 makes the board B carried in from the outside of the component mounter 1 stand by, or delivers it to the mounting conveyor 22. The mounting conveyor 22 is provided for a mounting position Pm located downstream of the carrying-in conveyor 21 in the X direction, and fixes the board B received from the carrying-in conveyor 21 at the mounting position Pm, or transfers it to the carrying-out conveyor 23. The carry-out conveyor 23 is provided at a downstream position in the X direction of the mounting position Pm, and carries the board B received from the mounting conveyor 22 to the outside of the component mounter 1.

The component mounting machine 1 also includes a component supply mechanism 3 that supplies components Wp. The component supply mechanism 3 includes a wafer table 31 that supports a wafer W, and a component take-out section 35 that takes out a component Wp of the wafer W supported by the wafer table 31. The component take-out section 35 has a take-out head 36 that takes out the component Wp from the wafer table 31, and can drive the take-out head 36 in the X direction and the Y direction. In other words, the component extraction section 35 includes an X-axis rail 351 that supports the extraction head 36 movably in the X direction, and an X-axis motor 352 that extends in the X direction and drives a ball screw attached to the extraction head 36. By driving the ball screw with the X-axis motor 352, the extraction head 36 can be moved in the X direction. The component extraction unit 35 also drives a Y-axis rail 353 that supports the X-axis rail 351 movably in the Y direction, a ball screw 354 that extends in the Y direction and is attached to the Y-axis rail 353, and a ball screw 354. It has a Y-axis motor 355. Therefore, by driving the ball screw 354 with the Y-axis motor 355, the take-out head 36 can be moved in the Y direction together with the X-axis rail 351.

The extraction head 36 includes a bracket 361 extending in the X direction and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 rotates about a rotation axis parallel to the X direction, and is positioned at either a suction position facing downward or a delivery position facing upward (the position shown in FIG. 1). Further, the bracket 361 can be moved up and down together with each nozzle 362.

In this component supply mechanism 3, when the nozzle 362 positioned at the suction position is opposed to the component Wp on the wafer table 31 from above, the nozzle 362 is lowered and brought into contact with the component Wp. In addition, the component supply mechanism 3 has a push-up needle that faces the component Wp from below through the sheet Ws, and by pushing up the center of the component Wp with the push-up needle, the component Wp is peeled from the sheet Ws, and Negative pressure is applied to the nozzle 362 to cause the nozzle 362 to adsorb the component Wp from the sheet Ws. Then, the component supply mechanism 3 takes out the component Wp from the wafer table 31 by lifting the nozzle 362. Furthermore, the component supply mechanism 3 supplies the component Wp by positioning the nozzle 362 at the delivery position.

The component mounting machine 1 includes a mounting section 4 that mounts the component Wp supplied by the component supply mechanism 3 onto the board B. The mounting section 4 includes a support member 41 that is movable along a fixed rail provided on the ceiling of the component mounter 1 in the Y direction, and a mounting head 42 supported by the support member 41 so as to be movable in the X direction. However, the mounting head 42 can be moved in the XY directions. The mounting head 42 has two nozzles 421 facing downward.

When sucking and mounting the component Wp, the mounting section 4 moves above the take-out head 36 and makes the nozzle 421 face from above the component Wp held by the nozzle 362 located at the delivery position. 421 is lowered and brought into contact with the component Wp. Subsequently, the component supply mechanism 3 releases the negative pressure in the nozzle 362, and the mounting section 4 raises the nozzle 421 while applying negative pressure to the nozzle 421. When the component Wp is thus attracted by the mounting head 42, the mounting section 4 mounts the component Wp on the mounting target point Bp of the board B fixed at the mounting position Pm.

The component mounting machine 1 also includes a wafer camera 51 supported movably in the X direction by an X-axis rail 351. Correspondingly, the component extraction section 35 has an X-axis motor 356 that extends in the X direction and drives a ball screw attached to the wafer camera 51. By driving the ball screw with the X-axis motor 356, The wafer camera 51 can be moved in the X direction. Furthermore, by driving the ball screw 354 with the Y-axis motor 355, the wafer camera 51 can be moved in the Y direction together with the X-axis rail 351. That is, the control unit 100 adjusts the position of the wafer camera 51 in the X direction with the X-axis motor 352 and adjusts the position of the wafer camera 51 in the Y direction with the Y-axis motor 355, thereby controlling the parts on the wafer table 31. While the wafer camera 51 is opposed to Wp from above, the wafer camera 51 images the part Wp, thereby making it possible to obtain an image showing the part Wp.

FIG. 2 is a block diagram showing an example of the electrical configuration of the component mounting machine shown in FIG. 1. As shown in FIG. 2, the component mounting machine 1 includes a control section 100 and a storage section 110. The storage unit 110 is a storage device such as an HDD (Hard Disk Drive) or an SSD (Solid State Drive), and stores a camera check program 120, which will be described later, and various images I (a pre-movement image I1 and a post-movement image I2).

The control unit 100 includes a calculation unit 101, a drive control unit 102, an imaging control unit 103, and a UI control unit 104. The calculation unit 101 is a processor such as a CPU (Central Processing Unit), and controls the drive control unit 102, the imaging control unit 103, and the UI control unit 104.

The drive control unit 102 controls the movement of the wafer camera 51 in the X direction and the Y direction by controlling the X-axis motor 356 and the Y-axis motor 355. Specifically, X-axis motor 356 and Y-axis motor 355 are servo motors. In contrast, the drive control unit 102 controls the X-axis motor 356 based on the command value regarding the X direction received from the calculation unit 101 and the output value from the encoder of the X-axis motor 356, thereby controlling the wafer camera 51. Controls the position in the X direction. Further, the drive control unit 102 controls the Y-axis motor 355 based on the command value regarding the Y-direction received from the calculation unit 101 and the output value from the encoder of the Y-axis motor 355, thereby moving the wafer camera 51 in the Y-direction. control the position of

The imaging control unit 103 controls the wafer camera 51. That is, the imaging control unit 103 causes the wafer camera 51 to perform imaging at a timing according to the imaging command received from the calculation unit 101, and acquires the image I captured by the wafer camera 51. Further, the imaging control unit 103 transmits the image I acquired from the wafer camera 51 to the calculation unit 101.

Specifically, the calculation unit 101 images the component Wp on the wafer table 31 with the wafer camera 51, and the imaging control unit 103 acquires an image I showing the obtained component Wp from the imaging control unit 103. Then, the calculation unit 101 calculates the position (XY coordinates) of the wafer camera 51 indicated by the output values of the encoders of the X-axis motor 356 and Y-axis motor 355 that drive the wafer camera 51, and the position (XY coordinates) of the component Wp in the image I. The position of the part Wp is recognized based on the coordinates). The calculation unit 101 positions the nozzle 362 with respect to the part Wp by controlling the X-axis motor 356 and the Y-axis motor 355 based on the position of the part Wp recognized in this way. Thereby, the component Wp can be taken out from the wafer table 31 using the nozzle 362.

Further, the UI control unit 104 controls a UI (User Interface) 52 provided in the component mounting machine 1 . For example, the UI 52 is a touch panel display, and the UI control unit 104 acquires an input operation on the touch panel display by an operator from the UI 52 and sends it to the calculation unit 101, or displays content according to a display command from the calculation unit 101. or display it on a touch panel display.

FIG. 3 is a flowchart showing an example of a camera check performed on the wafer camera, FIG. 4 is a plan view schematically showing the relationship between the field of view of the wafer camera and the wafer, and FIG. 6 is a diagram schematically showing each operation executed in the check, and FIG. 6 is a diagram schematically showing the content calculated by the camera check in FIG. 3. FIG.

The camera check in FIG. 3 is executed under the control of the calculation unit 101. In step S101, the drive control unit 102 controls the X-axis motor 356 and the Y-axis motor 355 to cause the wafer camera 51 to face the wafer W on the wafer table 31 from above. As shown in FIG. 4, the wafer camera 51 has a field of view V51, and images the inside of the field of view V51 by detecting light from the field of view V51 with a solid-state image sensor. In particular, in step S101, since the wafer camera 51 faces the wafer W, the field of view V51 overlaps with the plurality of parts Wp that constitute the wafer W, and the plurality of parts Wp falls within the field of view V51.

In step S102, the wafer camera 51 images the parts Wp forming the wafer W. As a result, as shown in the column of step S102 in FIG. 5, a pre-movement image I1 showing the part Wp within the field of view V51 is obtained. Note that, in FIG. 5, among the parts Wp within the visual field V51, only five parts Wp near the center of the visual field V51 are representatively shown. However, the number of parts Wp is not limited to five, and parts Wp included within the field of view V51 appear in the pre-movement image I1. This pre-movement image I1 includes one target part Wpt among the plurality of parts Wp. Further, as shown in the column of step S102 in FIG. 5, the pre-movement image I1 is captured in a state where the center Cw of the target part Wpt is shifted from the center Cv of the visual field V51.

In step S103, the calculation unit 101 calculates the amount of movement M by which the wafer camera 51 should be moved in order to match the center Cv of the field of view V51 with the center Cw of the target part Wpt, based on the pre-movement image I1. Specifically, the calculation unit 101 calculates the position of the center Cv indicated by the pre-movement image I1 and the position of the center Cw indicated by the pre-movement image I1, and sets the vector from the center Cv toward the center Cw as the amount of movement M, and calculates the position of the center Cv indicated by the pre-movement image I1. Calculated from image I1.

In step S104, the calculation unit 101 transmits a drive command to move the wafer camera 51 by the amount of movement M to the drive control unit 102, and the drive control unit 102 controls the X-axis motor 356 and the Y-axis motor based on this drive command. 355. As a result, the wafer camera 51 moves by the amount of movement M.

In step S105, the wafer camera 51 that has moved by the amount of movement M of the vector shown in the column of step 103 in FIG. 5 images the component Wp. As a result, as shown in the column of step S105 in FIG. 5, a moved image I2 showing the part Wp within the visual field V51 is acquired. If there is no error in the angle and scale of the wafer camera 51, the center Cv of the field of view V51 and the center Cw of the target part Wpt match in the post-movement image I2. However, in the example shown in the column of step S105 of the steps in FIG. 5, the center Cv and the center Cw do not match but are shifted from each other. This is because an error has occurred in at least one of the angle and scale of the wafer camera 51.

In step S106, the calculation unit 101 calculates the scale error of the wafer camera 51 based on the moved image I2. Here, the scale indicates the length per pixel of the wafer camera 51. For example, in the field of view V51 of the wafer camera 51, if the number of pixels of the wafer camera 51 arranged within a length L in the X direction is N, the scale SC is calculated by the following formula: SC=L/N
Calculated by Note that the same applies to the Y direction. The set value of the scale SC is held in the storage unit 110, for example.

Therefore, when calculating the movement amount M in step S104 above, a pixel corresponding to the center Cv and a pixel corresponding to the center Cw are specified. Then, the amount of movement M from the former pixel to the latter pixel in the visual field V51 is determined based on the product of the number of pixels existing between these pixels and the scale SC. Therefore, as shown in FIG. 6, the calculation unit 101 calculates the actual movement amount Mr (vector) from the position of the center Cv of the visual field V51 in the pre-movement image I1 to the position of the center Cv of the visual field V51 in the post-movement image I2, By comparing the movement amount M with the movement amount M, an error (scale error) occurring in the scale SC can be determined.

Furthermore, in step S107, the calculation unit 101 calculates the angle θ between the movement amount M and the actual movement amount Mr as the angular error of the wafer camera 51. Here, the angle θ is an angle with the rotation axis parallel to the Z direction as the center Cr.

In step S108, the calculation unit 101 corrects the scale error. Specifically, a value obtained by subtracting the scale error from the scale SC setting value held in the storage unit 110 is held in the storage unit 110 as a new scale SC setting value. In this way, by updating the set value of the scale SC in the storage section 110, the scale error is corrected.

In step S109, the calculation unit 101 determines whether the angle θ is greater than or equal to a predetermined threshold angle. If the angle θ is less than the threshold angle (“NO” in step S109), the calculation unit 101 corrects the angle error. Specifically, by adjusting the angle of the coordinate axis (camera coordinate axis) used by the calculation unit 101 when calculating the position of the object in the image I based on the image I captured by the wafer camera 51, by the angle θ, Angular errors are corrected.

On the other hand, if the angle θ is equal to or greater than the threshold angle (“YES” in step S109), the calculation unit 101 displays on the touch panel display of the UI 52 content notifying that the angular error of the wafer camera 51 is large. (Step S111).

In the embodiment described above, the center Cv (reference position) of the field of view V51 of the wafer camera 51 (camera) and the center Cw (characteristic location) of the target part Wpt of the wafer W (work) are shifted from each other, and the target A visual field V51 including the center Cw of the component Wpt is imaged by the wafer camera 51, and a pre-movement image I1 (first image) including the center Cw of the target component Wpt is acquired (step S102, first imaging operation). Subsequently, a relative movement amount M of the center Cv with respect to the center Cw of the target part Wpt, which is necessary for aligning the center Cv of the visual field V51 with the center Cw of the target part Wpt, is calculated based on the pre-movement image I1. (Step S103, movement amount calculation operation), the X-axis motor 356 and Y-axis motor 355 (driver) move the wafer camera 51 by the movement amount M relative to the wafer W (Step S104, movement operation). If there is no deviation in the angle and scale of the wafer camera 51, the center Cv and the center Cw of the target part Wpt match within the field of view V51 of the wafer camera 51 after the movement operation in step S104 is performed ( In other words, they overlap). On the other hand, if there is a shift in the angle or scale of the wafer camera 51, the center Cv and the center Cw do not match within the field of view V51 of the wafer camera 51 after the movement operation in step S104 is performed (in other words, the center Cw does not match). (If they do not overlap) Therefore, after performing the moving operation in step S104, a moved image I2 (second image) including the center Cw of the target part Wpt is acquired (step S105, second imaging operation), and the center Cv in the moved image I2 is acquired (step S105, second imaging operation). Based on the positional relationship between Cw and the center Cw, the amount of deviation of at least one of the angle and scale of the wafer camera 51 is calculated (steps S106 and S107, deviation amount calculation operation). In this way, it is possible to detect a shift that occurs in the angle or scale of the wafer camera 51.

Furthermore, the calculation unit 101 calculates the amount of angular deviation (error) of the wafer camera 51 (step S107). With such a configuration, a shift occurring in the angle of the wafer camera 51 can be detected.

Further, a UI 52 (notification unit) is provided to notify the operator, and the calculation unit 101 notifies the UI 52 that the amount of angular deviation of the wafer camera 51 calculated in step S107 is equal to or greater than a predetermined threshold angle. Execute. With this configuration, the operator can understand that a deviation amount of the angle of the wafer camera 51 or more has occurred in the angle of the wafer camera 51, and can appropriately perform maintenance such as adjusting the angle of the wafer camera 51.

Furthermore, the calculation unit 101 corrects the angular error in step S110. That is, from now on, the calculation unit 101 calculates the angle of the target portion included in the image I while correcting the amount of angular deviation of the wafer camera 51 calculated in step S107. In this configuration, correction is performed based on the amount of deviation that occurs in the angle of the wafer camera 51. Therefore, the angle of the target portion included in the image I captured by the wafer camera 51 can be appropriately calculated.

Furthermore, the calculation unit 101 calculates the amount of scale deviation of the wafer camera 51 (step SS108). With this configuration, a shift occurring in the scale of the wafer camera 51 can be detected.

Furthermore, the calculation unit 101 corrects the scale error in step S108. That is, from now on, the calculation unit 101 calculates the position of the target portion included in the image I while correcting the amount of shift of the wafer camera 51 calculated in step S106. With this configuration, it is possible to correct a deviation that occurs in the scale of the wafer camera 51.

As explained above, in this embodiment, the component mounting machine 1 corresponds to an example of the "work device" of the present invention, the control section 100 corresponds to an example of the "control section" of the present invention, and the wafer table 31 corresponds to an example of the "control section" of the present invention. The X-axis motor 356 and Y-axis motor 355 correspond to an example of the "supporting section" of the present invention, the mounting head 42 corresponds to an example of the "working section" of the present invention. Correspondingly, the wafer camera 51 corresponds to an example of the "camera" of the present invention, the wafer camera 51 corresponds to an example of the "driving object" of the present invention, and the UI 52 corresponds to an example of the "notification unit" of the present invention. , the pre-movement image I1 corresponds to an example of the "first image" of the present invention, the post-movement image I2 corresponds to an example of the "second image" of the present invention, and the amount of movement M corresponds to the "movement amount" of the present invention. The field of view V51 corresponds to an example of the "field of view" of the present invention, the wafer W and the sheet Ws correspond to an example of the "work" of the present invention, and the sheet Ws corresponds to an example of the "sheet" of the present invention. , the component Wp corresponds to an example of the "bare chip" of the present invention, the center Cv of the visual field V51 corresponds to an example of the "reference position" of the present invention, and the center Cw of the target component Wpt corresponds to an example of the "feature" of the present invention. Step S102 corresponds to an example of the "first imaging operation" of the present invention, step S103 corresponds to an example of the "movement amount calculation operation" of the present invention, and step S104 corresponds to an example of the "movement amount calculation operation" of the present invention. This corresponds to an example of a "moving operation," step S105 corresponds to an example of a "second imaging operation" of the present invention, and steps S106 and S107 correspond to an example of a "deviation amount calculation operation" of the present invention.

Note that the present invention is not limited to the above-described embodiments, and various changes can be made to the above-described embodiments without departing from the spirit thereof. For example, the component mounting machine 1 may be configured as shown in FIG.

FIG. 7 is a block diagram showing a modification of the component mounting machine. The component mounting machine 1 shown in FIG. 7 includes a camera rotation drive unit 53 that rotates the wafer camera 51 around a rotation axis parallel to the Z direction. This camera rotation drive unit 53 drives the wafer camera 51 using, for example, a motor or an actuator. On the other hand, the control unit 100 includes a camera drive control unit 105 that controls the drive of the wafer camera 51 by the camera rotation drive unit 53.

In this component mounter 1, in step S110 of the camera check in FIG. 3, the calculation unit 101 calculates a rotation command value for rotating the wafer camera 51 by the angle necessary to eliminate the angular error calculated in step S107. It is transmitted to the drive control section 105. Then, the camera drive control unit 105 controls the camera rotation drive unit 53 based on this rotation command value, thereby rotating the wafer camera 51 by the angle indicated by the rotation command value. In this way, the angle error of the wafer camera 51 is eliminated.

That is, this modification includes a camera rotation drive unit 53 (camera drive unit) that changes the angle of the wafer camera 51 by driving the wafer camera 51. Then, the calculation unit 101 corrects the angle of the wafer camera 51 by driving the wafer camera 51 using the camera rotation drive unit 53 based on the angular deviation amount (angular error) of the wafer camera 51 calculated in step S107. (Step S110). With this configuration, it is possible to correct a deviation that occurs in the angle of the wafer camera 51.

Moreover, various timings for performing the camera check in FIG. 3 are assumed. Therefore, the calculation unit 101
- After replacing the wafer W supported by the wafer table 31 - After carrying out the board B from the component mounter 1 - When detecting a positional shift of the component Wp held by the mounting head 42 - When the component mounter 1 removes the component Wp The camera check may be performed at any one of the following timings: when starting the mounting work on the substrate B, when changing lots of wafers W, or after a certain period of time has elapsed. At such timing, a shift occurring in the angle or scale of the wafer camera 51 can be accurately detected. Note that detection of the positional shift of the component Wp held by the mounting head 42 can be performed based on an image captured by a camera from below of the component Wp held by the mounting head 42. Specifically, if the distance between the center of the component Wp and the center of the nozzle 421 that sucks the component Wp is equal to or greater than a predetermined threshold distance, it can be determined that a positional shift of the component Wp has occurred.

Further, the relative movement of the wafer camera 51 with respect to the wafer W held on the wafer table 31 may be performed by driving the wafer table 31 instead of by driving the wafer camera 51. Alternatively, this relative movement may be performed by driving both the wafer camera 51 and the wafer table 31.

Further, the reference position of the visual field V51 is not limited to the center Cv of the visual field V51, and may be a position other than the center Cv. Further, the characteristic location is not limited to the center Cw of the target part Wpt, but may be a position other than the center Cw (for example, a corner of the target part Wpt).

Furthermore, the camera check shown in FIG. 3 is not limited to the wafer camera 51, but may be any other camera provided in the component mounting machine 1. In short, the camera check described above may be performed for the characteristic parts of the workpiece that can be imaged by the camera and the camera.

Further, as described above, the component mounting machine 1 inverts the component Wp using the take-out head 36 and supplies the component Wp. However, the configuration of the component mounter 1 is not limited to this, and the camera check can be similarly performed in the surface mounter described in, for example, Japanese Patent No. 4308736. That is, in this surface mounter, the transfer head transfers the component from the wafer on the XY table to the transfer stage, and the head unit mounts the component from the transfer stage to the substrate. Additionally, a camera is provided to take an image of the wafer on the XY table from above. Therefore, in order to detect errors occurring in the angle or scale of this camera, the camera check described above can be performed.

Further, the device equipped with a camera that is subject to camera check is not limited to the component mounting machine 1. Therefore, a camera check may be performed on a fiducial camera installed in the printing apparatus described in Japanese Patent Application Publication No. 2011-151222. This printing device (work device) includes a printing stage that supports a substrate, and a squeegee that performs a printing operation of printing solder on the substrate on the printing stage through a mask. Furthermore, a fiducial camera is provided to take an image of the fiducial mark on the substrate supported by the printing stage. Therefore, in order to detect errors occurring in the angle or scale of this fiducial camera, the above camera check can be performed. At this time, a fiducial mark or a land on the substrate can be used as the characteristic location.

Alternatively, a camera check may be performed on an imaging camera installed in the visual inspection apparatus described in WO2015/104799. This visual inspection device includes a conveyor that supports substrates and an inspection head that inspects the substrates on the conveyor. The inspection head also includes an imaging camera that images the substrate. Therefore, in order to detect errors occurring in the angle or scale of this imaging camera, the camera check described above can be performed. At this time, for example, a fiducial mark on the substrate can be used as the characteristic location.

1...Component mounting machine (work equipment)
100...Control unit 31...Wafer table (support unit)
355...Y-axis motor (drive part)
356...X-axis motor (drive unit)
42...Mounting head (working part)
51...Wafer camera (camera, driving target)
52...UI (Notification Department)
I1... Image before movement (first image)
I2... Image after movement (second image)
M...Movement amount V51...Field of view W...Wafer (work)
Ws…sheet (work)
Wp…Parts (bare chip)
Wpt...Target part Cv...Center (reference position)
Cw...center (characteristic location)
S102...Step S102 (first imaging operation)
S103...Step S103 (movement amount calculation operation)
S104...Step S104 (moving operation)
S105...Step S105 (second imaging operation)
S106...Step S106 (deviation amount calculation operation)
S107...Step S107 (deviation amount calculation operation)

Claims (11)

a support part that supports a workpiece having a predetermined characteristic location;
a working part that performs a predetermined work on the workpiece supported by the supporting part;
a camera that has a predetermined field of view and captures an image within the field of view;
a drive unit that moves the camera relative to the workpiece supported by the support unit by driving at least one of the support unit and the camera;
a control unit that acquires an image of a portion of the workpiece that overlaps with the field of view by causing the camera to perform imaging while adjusting the position of the camera with respect to the workpiece by the drive unit;
The control unit includes:
a first imaging operation of acquiring, as a first image, the image including the characteristic point in a state where the characteristic point is shifted from a predetermined reference position in the field of view;
a movement amount calculation operation of calculating, based on the first image, a relative movement amount of the reference position with respect to the feature location, which is necessary for making the reference position coincide with the feature location;
a movement operation of moving the camera by the movement amount with respect to the workpiece by the drive unit;
a second imaging operation of acquiring the image including the characteristic location as a second image after performing the moving operation;
a shift amount calculation operation of calculating a shift amount of at least one of the angle of the camera and a scale indicating the length of one pixel of the image based on the positional relationship between the reference position and the characteristic location in the second image; Work equipment to perform. The working device according to claim 1, wherein the control unit calculates an angular shift amount of the camera in the shift amount calculation operation. It further includes a notification unit that notifies the worker,
The working device according to claim 1, wherein the control unit causes the notification unit to issue a notification when the angular deviation amount of the camera calculated in the deviation amount calculation operation is equal to or greater than a predetermined threshold angle. The working device according to claim 2 or 3, wherein the control unit calculates the angle of the target portion included in the image while correcting the angular deviation amount of the camera calculated in the deviation amount calculation operation. further comprising a camera drive unit that changes the angle of the camera by driving the camera,
The control unit corrects the angle of the camera by driving the camera with the camera drive unit based on the angular deviation amount of the camera calculated in the deviation amount calculation operation. working equipment. The working device according to claim 1, wherein the control unit calculates the amount of deviation of the scale in the amount of deviation calculating operation. The working device according to claim 6, wherein the control unit calculates the position of the target portion included in the image while correcting the amount of deviation of the scale calculated in the amount of deviation calculation operation. The working device according to claim 1, wherein the reference position is the center of the field of view. The workpiece includes a sheet and a bare chip attached to the sheet,
2. The working device according to claim 1, wherein the working unit is a mounting head that performs, as the predetermined work, a mounting work of mounting the bare chip taken out from the sheet onto a substrate. The control unit starts the mounting operation when detecting a positional shift of the bare chip held by the mounting head after replacing the workpiece supported by the support unit, after carrying out the substrate from the work device, and when detecting a positional shift of the bare chip held by the mounting head. the first imaging operation, the movement amount calculation operation, the movement operation, the second imaging operation, and the deviation amount calculation operation at any of the following timings: when the lot of the work is changed, and when a certain period of time has elapsed. The working device according to claim 9, which performs the following. For the workpiece supported by the supporter by driving at least one driving target of a supporter that supports the workpiece having a predetermined characteristic location and a camera that has a predetermined field of view and captures an image within the field of view. By causing the camera to take an image while facing the workpiece using a drive unit that moves the camera relatively, the characteristic portion can be captured in a state where the characteristic portion is deviated from a predetermined reference position in the field of view. performing a first imaging operation to obtain a first image including;
performing a movement amount calculation operation of calculating a relative movement amount of the reference position with respect to the feature point, which is necessary to make the reference position coincide with the feature point, based on the first image;
performing a movement operation of moving the camera by the movement amount with respect to the workpiece by the drive unit;
After performing the movement operation, performing a second imaging operation to obtain a second image including the characteristic location;
A shift amount for calculating a shift amount of at least one of the angle of the camera and a scale indicating the length of one pixel of the image captured by the camera, based on the positional relationship between the reference position and the characteristic location in the second image. and performing a calculation operation.

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