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1992-09-28 |
1994-09-13 |
Sundstrand Corporation |
Power semiconductor integrated circuit package
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1997-01-30 |
1998-06-30 |
Sony Corporation |
Semiconductor package
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USD395423S
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1997-03-13 |
1998-06-23 |
Sony Corporation |
Semiconductor package
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USD432095S
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1998-10-09 |
2000-10-17 |
Vishay Semiconductor Gmbh |
Light-emitting semi-conductor component
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TW404562U
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1999-05-06 |
2000-09-01 |
Advanced Semiconductor Eng |
Semiconductor glue film application platform with positioning structure
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TW452191U
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1999-05-06 |
2001-08-21 |
Advanced Semiconductor Eng |
Semiconductor adhesive-film adhering platen with a positioning structure
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1999-06-18 |
2000-07-11 |
Fujikura Ltd. |
Piezoelectric conversion type semiconductor device
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TW491359U
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1999-11-25 |
2002-06-11 |
Chipmos Technologies Inc |
Connection distribution structure for etching pad mesh set of wafer
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TW510503U
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1999-11-25 |
2002-11-11 |
Chipmos Technolgies Inc |
Distributing structure of wafer's testing pad and burning pad
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TW446183U
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1999-11-25 |
2001-07-11 |
Chipmos Technologies Inc |
Wafer surface structure
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TW495035U
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1999-11-25 |
2002-07-11 |
Chipmos Technologies Inc |
Distribution structure of test pad network connection of wafer
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TW443580U
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1999-11-25 |
2001-06-23 |
Chipmos Technologies Inc |
Distribution structure of net-shaped connecting wire for the scorching pad of wafer
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TW461582U
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2000-11-07 |
2001-10-21 |
Chipmos Technologies Inc |
Laser repair and real-time detection device
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TW529771U
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2001-11-28 |
2003-04-21 |
Advanced Semiconductor Eng |
Flip chip semiconductor device with solder balls
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2002-07-31 |
2003-07-08 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
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2002-08-13 |
2003-10-01 |
Advanced Semiconductor Eng |
Semiconductor wafer and semiconductor device
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2004-06-29 |
2006-07-01 |
Sino American Silicon Products |
Silicon wafer structure for power electronic device
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2007-12-20 |
2009-03-03 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device
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2008-03-17 |
2009-03-24 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device
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2008-10-08 |
2009-03-01 |
Int Semiconductor Tech Ltd |
Semiconductor structure having silver bump
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TWM379066U
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2009-12-18 |
2010-04-21 |
Quality Pro Technology Co Ltd |
Improved structure of semiconductor wafer probe card
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TWM386593U
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2010-03-29 |
2010-08-11 |
Quality Pro Technology Co Ltd |
Improved structure of semiconductor wafer probe
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2010-10-28 |
2012-02-07 |
Fuji Electric Co., Ltd. |
Semiconductor
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2010-12-14 |
2012-02-07 |
Fuji Electric Co., Ltd. |
Semiconductor
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2011-08-12 |
2013-07-16 |
Fuji Electric Co., Ltd |
Semiconductor device
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2012-11-20 |
2014-05-21 |
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Composite array micro-lenses of LED chips
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2013-01-24 |
2014-08-05 |
Fuji Electric Co., Ltd. |
Semiconductor device
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2013-01-24 |
2014-05-13 |
Fuji Electric Co., Ltd. |
Semiconductor device
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2013-01-24 |
2014-05-13 |
Fuji Electric Co., Ltd. |
Semiconductor device
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2013-01-24 |
2014-08-05 |
Fuji Electric Co., Ltd. |
Semiconductor device
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2013-01-24 |
2014-08-05 |
Fuji Electric Co., Inc. |
Semiconductor device
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2013-05-08 |
2014-12-16 |
Mitsubishi Electric Corporation |
Semiconductor device
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2013-08-21 |
2016-04-19 |
Mitsubishi Electric Corporation |
Semiconductor device
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2013-08-24 |
2015-04-28 |
Apex Microelectronics Co., Ltd. |
Ink cartridge chip
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2013-08-29 |
2014-07-11 |
Gallant Micro Machining Co Ltd |
Apparatus for mounting semiconductor dies
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2014-04-02 |
2016-11-22 |
Mitsubishi Electric Corporation |
Power semiconductor device
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2014-08-07 |
2016-08-02 |
Infineon Technologies Ag |
Power semiconductor module
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2014-08-19 |
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2014-08-19 |
2017-01-03 |
Infineon Technologies Ag |
Power semiconductor module
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2014-08-19 |
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2014-08-21 |
2016-07-26 |
Infineon Technologies Ag |
Power semiconductor module
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2014-11-28 |
2016-12-20 |
Fuji Electric Co., Ltd. |
Semiconductor module
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2014-12-24 |
2016-11-22 |
Fuji Electric Co., Ltd. |
Semiconductor module
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2015-02-04 |
2016-09-27 |
Mitsubishi Electric Corporation |
Semiconductor device
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2015-02-04 |
2016-09-20 |
Mitsubishi Electric Corporation |
Semiconductor device
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2015-02-05 |
2016-10-04 |
Armen E. Kazanchian |
Module
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2015-06-17 |
2016-06-21 |
Mitsubishi Electric Corporation |
Semiconductor device
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2016-08-02 |
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