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TW446183U - Wafer surface structure - Google Patents

Wafer surface structure

Info

Publication number
TW446183U
TW446183U TW88220265U TW88220265U TW446183U TW 446183 U TW446183 U TW 446183U TW 88220265 U TW88220265 U TW 88220265U TW 88220265 U TW88220265 U TW 88220265U TW 446183 U TW446183 U TW 446183U
Authority
TW
Taiwan
Prior art keywords
surface structure
wafer surface
wafer
Prior art date
Application number
TW88220265U
Other languages
Chinese (zh)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88220265U priority Critical patent/TW446183U/en
Publication of TW446183U publication Critical patent/TW446183U/en

Links

TW88220265U 1999-11-25 1999-11-25 Wafer surface structure TW446183U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220265U TW446183U (en) 1999-11-25 1999-11-25 Wafer surface structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220265U TW446183U (en) 1999-11-25 1999-11-25 Wafer surface structure

Publications (1)

Publication Number Publication Date
TW446183U true TW446183U (en) 2001-07-11

Family

ID=21656697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220265U TW446183U (en) 1999-11-25 1999-11-25 Wafer surface structure

Country Status (1)

Country Link
TW (1) TW446183U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004