M379066 * » 五、新型說明： 【新型所屬之技術領域】 本創作係一種半導體晶圓探針卡之改良結構，尤指一 ，在一探針卡之各探針上設有一波浪狀之彈性部，而使該 等探針具有較佳彈性之結構者。 【先前技術】. 。按，一般習用之探針卡，如我國專利公告第200912319 ，發明專利，其揭露有一種探針卡，該探針卡包含：一第一 平板組，其包括上下相互疊合之一第一上平板及一·第一下 平板，其中該第一上平板係設有複數個相互平行且穿透該 /第一上平板之溝槽，而該第一下平板係設有複數個相互平 行且穿透該第一下平板之溝槽，且以上該等二平板上所設 之溝槽係彼此相互垂直設置，如此當該二平板相互疊合 時.，可形成一具有穿透該第一平板組之複數個穿孔的陣 列；一第二平板組，其包括上下相互疊合之一第二上平板 及一第二下平板，同理，其亦利用以上相同之方法以形成 一具有穿透該第二平板組之複數個穿孔的陣列丨至少一支 撐，其設置於該第一平板組及第二平板組間，以使該第— 平板組及第二平板組可以一預訂之距離大致相互平行設 置；以及複數個探針，其各別之兩端係分別設置於該第一 平板組及第二平板組上彼此相互對應之陣列穿孔中，且該 探針之探測端係可穿設並突出於該其中一平板組之外表 面，俾透過探針之扎點細小，可達到完全測試之目的。 惟，該專利雖可透過探針之扎點細小，達到完全之測 試效能，但是其探針為圓柱形體或矩形體，僅能蠻 替代彈著之伸縮，導致探針卡之穿孔之間的空;:須：：來 而使探針卡之體積大幅增加。 【新型内容】 創作人有鑑於前述先前技術之缺點，乃依其從事各種 3 M379066 • * ^试儀器之製造經驗和技術累積，針對上述缺失悉心研究 各種解決的方法，在經過不斷的研究、實驗與改良後，終 於開發設計出本創作之一種全新半導體晶圓探針卡之改良 釔構之創作，以期能摒除先前技術所產生之缺失。 本創作之目的，係提供一種半導體晶圓 結構、，係在該探針卡之每__探針上設有—波浪狀之彈1 部’以使該等探針具有較佳之彈性。 、，根據上述之目的，本創作之探針卡，其係設有一第一 ^組、-第二平板組、至少一支撐板、及複數個探針丨 其中’該第-平板組係由一第一上平板及一第一下平板上 :相互疊合構成，該第一平板組上形成有一穿透該第一 平板組之複數個穿孔的陣列；該第二平板組係由-第二上 平板及-第二下平板上、下相互疊合構成，該第二平:组 f形成有-穿透該第二平板組之複數 支撐板設置於該第-平板組及第二平板組之間，以\吏= 平板组及第二平板組可以—預訂之距離大致相互平行設 置，該等探針係各别之兩端分別設置於該第一平板組及第 二：3 =相互對應之陣列穿孔中，各該探針之探測 1穿玟並犬出於該其中一平板組之外表面，每一探針上 f有-彈性部’該彈性部設有連續1弧段與連接段而呈 波浪狀’因而具有較佳之彈性；俾藉由該較佳之彈性 縮小體積減少該探針卡之穿孔之間的空間。 样微，ί Λ審查委M能對本創作之目的、形狀、構造裝置 in、做更進一步之認識與瞭解，兹舉實施例配 合圖式’洋細說明如下： 【實施方式】 本創作乃有關-種「半導體晶圓探針卡之改良 閱第卜2圖所示’本創作之探針卡5，其係設；i 則板Λ1、;，平板組2、至少—支撑板3、及複數個ΐ 針4,其中，该第-平板係由一第一上平板^及一第一 4 下平板12上、下相互疊合構成，該第一平板組丨上形成有一 穿透該第一平板組1之複數個穿孔10的陣列；而該第二平板 組2係由一第二上平板21及一第二下平板22上下;相互疊合 構成，該第二平板組2上形成有一穿透該第二平板組2之複 數個穿孔20的陣列；該等支撐板3設置於該第一平板組 第二平板組2之間，以使該第一平板組丨及第二平板組2可以 一預訂之距離大致相互平行設置；該等探針4係各別之兩端 分別設置於該第-平板組！及第二平板組2上彼此相互對應 之陣列穿孔1G、2G中’各該探針4之探測額係穿設並突出 於該其中一平板組丨之外表面，每一探針4上設有一彈性部 42，該彈性部42設有連續之彎弧段421與連接段422而呈波 浪狀（如第2、3a、3b、3c圖所示），目而具有較佳之彈性 ，如此’可使該等探針4之探測端41可接觸欲探測之待測物 (如：晶圓…等）（圖中未示）。 藉上述構件之組成，測試時，可藉由該等探針4具有較 佳之彈性，可縮小探針4之體積而減少該探針卡5之穿孔1〇 、20之間的空間。 請參閱第3a、3b、3c圖所示，.本創作之最佳實施例中 货該等探針4之彈性部42可為任_型體，例如：矩形體（如 第3a、3b圖所示）、圓柱形體（如第3c圖所示）…等；嗜等 ，針4可-端具有探測端41，或者二端皆具有探測㈣，因 ’不同之待測物而设，該探測端41可為矩形體或圓柱形體 =合上所述，本創作之半導體晶圓探針卡之改良結構 ’ ^實具有前所未有之創新構造，其既未見於任何刊物， 有任何類似的產品，是以，其具有新穎性 ’二，、，本創作所具有之獨特特徵以及功能遠非 =所I比擬’所以其確實㈣収具有其進步性，而符 利法有關新型專利之申請要件， 起專利申請。 M379066 以上所述，僅為本創作最佳具體實施例，惟本創作之 構造特徵並不侷限於此’任何熟悉該項技藝者在本創作領 域内，可輕易思及之變化或修飾，皆可涵蓋在以下本案之 專利範圍。 八 【圖式簡單說明】 第1圓為本創作探針卡之立體外觀圖。 第2圖為本創作探針卡之剖面示意圖。 第3a、3b、3c圖為本創作探針卡之各種類型探針之 示意圖。 【主要元件符號說明】 第一平板組1 第一上平板11 第一下平板12 穿孔10 第二平板組2 第二上平板21 第二下平板22 穿孔20 支撐板3 探針4 探測端41 彈性部42 彎弧段421 連接段422 .探針卡5 6M379066 * » V. New Description: [New Technology Field] This is a modified structure of a semiconductor wafer probe card, especially one that has a wavy elastic portion on each probe of a probe card. And the probes have a structure with better elasticity. [Prior Art]. According to the commonly used probe card, such as the Chinese Patent Publication No. 200912319, the invention patent discloses a probe card comprising: a first plate set including one of the upper and lower sides of the first plate a flat plate and a first lower plate, wherein the first upper plate is provided with a plurality of grooves parallel to each other and penetrating the/first upper plate, and the first lower plate is provided with a plurality of parallel and wearing Passing through the groove of the first lower plate, and the grooves provided on the two plates are perpendicular to each other, so that when the two plates are overlapped with each other, a first plate group can be formed a plurality of perforated arrays; a second plate set comprising a second upper plate and a second lower plate stacked one on top of the other, similarly, the same method is used to form a penetrating The plurality of perforated arrays of the two plate sets are at least one supported, and are disposed between the first plate group and the second plate group, so that the first plate group and the second plate group can be arranged substantially parallel to each other at a predetermined distance. ; and plural a needle, each of which is disposed on the first plate group and the second plate group respectively in an array of perforations corresponding to each other, and the probe end of the probe can be pierced and protruded from the one plate group The outer surface, through the probe's small point, can achieve the purpose of complete testing. However, although the patent can achieve complete test performance through the small point of the probe, the probe is a cylindrical body or a rectangular body, which can only replace the elastic expansion and contraction, resulting in the gap between the perforations of the probe card. ;: Must:: Come and increase the volume of the probe card. [New content] The creators, in view of the shortcomings of the aforementioned prior art, are engaged in the manufacturing experience and technical accumulation of various 3 M379066 • * ^ test instruments, and carefully study various solutions to the above-mentioned deficiencies, after continuous research and experimentation. After the improvement, the development of a new semiconductor wafer probe card of this creation was finally developed, in order to eliminate the defects caused by the prior art. The purpose of the present invention is to provide a semiconductor wafer structure in which a wavy portion 1 is provided on each probe of the probe card to provide better flexibility of the probes. According to the above purpose, the probe card of the present invention is provided with a first group, a second plate group, at least one support plate, and a plurality of probes, wherein the first plate group is composed of one The first upper plate and the first lower plate are formed by overlapping each other, and the first plate group is formed with an array of a plurality of perforations penetrating the first plate group; the second plate group is composed of - the second plate The flat plate and the second lower plate are stacked on each other, and the second flat: the group f is formed with a plurality of support plates penetrating the second plate group disposed between the first plate group and the second plate group , the \ 吏 = plate group and the second plate group can be - the distance of the reservation is substantially parallel to each other, the two ends of the probe are respectively disposed in the first plate group and the second: 3 = the array corresponding to each other In the perforation, the probe 1 of each probe passes through and the dog is out of the outer surface of one of the flat plates, and each probe has an elastic portion. The elastic portion is provided with one continuous arc segment and a connecting portion. Wavy-like thus having better elasticity; reducing the volume by the preferred elastic reduction volume The space between the perforation.样 Λ Λ Λ Λ M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The "Semiconductor Wafer Probe Card Improvement" is shown in Figure 2, the probe card 5 of the present invention is set up; i is the board 1, the tablet group 2, at least the support board 3, and a plurality of a needle 4, wherein the first plate is formed by superposing a first upper plate and a first lower plate 12 on top of each other, and the first plate group is formed with a first plate group An array of a plurality of perforations 10; and the second plate group 2 is formed by a second upper plate 21 and a second lower plate 22; and the second plate group 2 is formed with a penetration. An array of a plurality of perforations 20 of the second plate group 2; the support plates 3 are disposed between the first plate group 2 and the second plate group 2, so that the first plate group and the second plate group 2 can be booked The distances are substantially parallel to each other; the respective ends of the probes 4 are respectively disposed in the first plate group! And the array of perforations 1G, 2G corresponding to each other on the second plate group 2, the probes of the probes 4 are pierced and protruded from the outer surface of the one of the plate sets, and each probe 4 is provided with a The elastic portion 42 is provided with a continuous curved portion 421 and a connecting portion 422 and has a wave shape (as shown in Figures 2, 3a, 3b, and 3c), and has a better elasticity, so that The detecting end 41 of the probe 4 can contact the object to be tested (such as a wafer, etc.) (not shown). By the composition of the above components, the probe 4 can be used for testing. The preferred elasticity reduces the volume of the probe 4 and reduces the space between the perforations 1 and 20 of the probe card 5. See Figures 3a, 3b, and 3c, in the preferred embodiment of the present creation. The elastic portion 42 of the probe 4 may be any type of body, such as a rectangular body (as shown in Figures 3a and 3b), a cylindrical body (as shown in Figure 3c), etc.; The detectable end 41 has a detecting end 41, or both ends have a detecting (4), which is provided by a different object to be tested, and the detecting end 41 can be a rectangular body or a cylindrical body = closed As mentioned, the improved structure of the semiconductor wafer probe card of this creation ' has an unprecedented innovative structure, which is not found in any publication, has any similar products, and is novel, '2,,, this creation The unique features and functions are far from being compared with the other ones. Therefore, it is indeed (4) that it has its progressiveness, and the patent application for the patent application of the new patents by the patent law. M379066 The above is only the best for this creation. In the specific embodiment, the structural features of the present invention are not limited to the following. Anyone who is familiar with the art in the field of creation can easily think of changes or modifications, and can be covered in the following patent scope of the present invention. Brief description of the formula] The first circle is the stereoscopic appearance of the creation probe card. Figure 2 is a schematic cross-sectional view of the authoring probe card. Figures 3a, 3b, and 3c are schematic illustrations of various types of probes for creating probe cards. [Description of main component symbols] First plate set 1 First upper plate 11 First lower plate 12 Perforation 10 Second plate set 2 Second upper plate 21 Second lower plate 22 Perforation 20 Support plate 3 Probe 4 Probe end 41 Elastic Section 42 curved section 421 connecting section 422. Probe card 5 6