[go: up one dir, main page]

TW495035U - Distribution structure of test pad network connection of wafer - Google Patents

Distribution structure of test pad network connection of wafer

Info

Publication number
TW495035U
TW495035U TW88220267U TW88220267U TW495035U TW 495035 U TW495035 U TW 495035U TW 88220267 U TW88220267 U TW 88220267U TW 88220267 U TW88220267 U TW 88220267U TW 495035 U TW495035 U TW 495035U
Authority
TW
Taiwan
Prior art keywords
wafer
network connection
test pad
distribution structure
pad network
Prior art date
Application number
TW88220267U
Other languages
Chinese (zh)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88220267U priority Critical patent/TW495035U/en
Publication of TW495035U publication Critical patent/TW495035U/en

Links

TW88220267U 1999-11-25 1999-11-25 Distribution structure of test pad network connection of wafer TW495035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220267U TW495035U (en) 1999-11-25 1999-11-25 Distribution structure of test pad network connection of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220267U TW495035U (en) 1999-11-25 1999-11-25 Distribution structure of test pad network connection of wafer

Publications (1)

Publication Number Publication Date
TW495035U true TW495035U (en) 2002-07-11

Family

ID=21656699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220267U TW495035U (en) 1999-11-25 1999-11-25 Distribution structure of test pad network connection of wafer

Country Status (1)

Country Link
TW (1) TW495035U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device

Similar Documents

Publication Publication Date Title
GB2323689B (en) Semiconductor test system
TW365770U (en) Structure for diaper pad
IL149107A0 (en) Formulation of substituted benzimidazoles
GB9814073D0 (en) Mounting and testing of electrical devices
TW495035U (en) Distribution structure of test pad network connection of wafer
EP1087042A4 (en) Silicon wafer
GB9917723D0 (en) Telecommunications service equipment
TW491359U (en) Connection distribution structure for etching pad mesh set of wafer
TW510503U (en) Distributing structure of wafer's testing pad and burning pad
TW443580U (en) Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW420304U (en) Construction of interface division in test fixture
TW446183U (en) Wafer surface structure
KR200160561Y1 (en) Conduction test equipment of semiconductor wafer
KR980005300U (en) Vacuum pad structure for wafer transfer of wafer alignment equipment
GB2349016B (en) Electrical distribution equipment
TW453570U (en) Improved socket structure of elevated floor for network
TW366159U (en) Improved structure for connecting equipment of network
TW355322U (en) Structure for cup and cup pad
SG86442A1 (en) Connection for functional inserts of electrical service devices for flush-mounting
TW444554U (en) Improved structure of base of chair
TW405416U (en) Structure of twisting disc for exercising equipment
TW465878U (en) Network line testing device
TW369922U (en) Modified structure of Takundo pad
GB9914307D0 (en) Id test meter
TW410556U (en) Improved structure of bra pad

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004