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TW443580U - Distribution structure of net-shaped connecting wire for the scorching pad of wafer - Google Patents

Distribution structure of net-shaped connecting wire for the scorching pad of wafer

Info

Publication number
TW443580U
TW443580U TW88220266U TW88220266U TW443580U TW 443580 U TW443580 U TW 443580U TW 88220266 U TW88220266 U TW 88220266U TW 88220266 U TW88220266 U TW 88220266U TW 443580 U TW443580 U TW 443580U
Authority
TW
Taiwan
Prior art keywords
scorching
wafer
net
pad
connecting wire
Prior art date
Application number
TW88220266U
Other languages
Chinese (zh)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88220266U priority Critical patent/TW443580U/en
Publication of TW443580U publication Critical patent/TW443580U/en

Links

TW88220266U 1999-11-25 1999-11-25 Distribution structure of net-shaped connecting wire for the scorching pad of wafer TW443580U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220266U TW443580U (en) 1999-11-25 1999-11-25 Distribution structure of net-shaped connecting wire for the scorching pad of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220266U TW443580U (en) 1999-11-25 1999-11-25 Distribution structure of net-shaped connecting wire for the scorching pad of wafer

Publications (1)

Publication Number Publication Date
TW443580U true TW443580U (en) 2001-06-23

Family

ID=21656698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220266U TW443580U (en) 1999-11-25 1999-11-25 Distribution structure of net-shaped connecting wire for the scorching pad of wafer

Country Status (1)

Country Link
TW (1) TW443580U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004