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TW491359U - Connection distribution structure for etching pad mesh set of wafer - Google Patents

Connection distribution structure for etching pad mesh set of wafer

Info

Publication number
TW491359U
TW491359U TW88220263U TW88220263U TW491359U TW 491359 U TW491359 U TW 491359U TW 88220263 U TW88220263 U TW 88220263U TW 88220263 U TW88220263 U TW 88220263U TW 491359 U TW491359 U TW 491359U
Authority
TW
Taiwan
Prior art keywords
wafer
distribution structure
connection distribution
mesh set
etching pad
Prior art date
Application number
TW88220263U
Other languages
Chinese (zh)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88220263U priority Critical patent/TW491359U/en
Publication of TW491359U publication Critical patent/TW491359U/en

Links

TW88220263U 1999-11-25 1999-11-25 Connection distribution structure for etching pad mesh set of wafer TW491359U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220263U TW491359U (en) 1999-11-25 1999-11-25 Connection distribution structure for etching pad mesh set of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220263U TW491359U (en) 1999-11-25 1999-11-25 Connection distribution structure for etching pad mesh set of wafer

Publications (1)

Publication Number Publication Date
TW491359U true TW491359U (en) 2002-06-11

Family

ID=21656696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220263U TW491359U (en) 1999-11-25 1999-11-25 Connection distribution structure for etching pad mesh set of wafer

Country Status (1)

Country Link
TW (1) TW491359U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees