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TW452191U - Semiconductor adhesive-film adhering platen with a positioning structure - Google Patents

Semiconductor adhesive-film adhering platen with a positioning structure

Info

Publication number
TW452191U
TW452191U TW88207198U TW88207198U TW452191U TW 452191 U TW452191 U TW 452191U TW 88207198 U TW88207198 U TW 88207198U TW 88207198 U TW88207198 U TW 88207198U TW 452191 U TW452191 U TW 452191U
Authority
TW
Taiwan
Prior art keywords
platen
positioning structure
film adhering
semiconductor adhesive
adhesive
Prior art date
Application number
TW88207198U
Other languages
Chinese (zh)
Inventor
Jau-Yuan Su
Dau-You Chen
Shu Tau
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW88207198U priority Critical patent/TW452191U/en
Publication of TW452191U publication Critical patent/TW452191U/en

Links

TW88207198U 1999-05-06 1999-05-06 Semiconductor adhesive-film adhering platen with a positioning structure TW452191U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88207198U TW452191U (en) 1999-05-06 1999-05-06 Semiconductor adhesive-film adhering platen with a positioning structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88207198U TW452191U (en) 1999-05-06 1999-05-06 Semiconductor adhesive-film adhering platen with a positioning structure

Publications (1)

Publication Number Publication Date
TW452191U true TW452191U (en) 2001-08-21

Family

ID=21647778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88207198U TW452191U (en) 1999-05-06 1999-05-06 Semiconductor adhesive-film adhering platen with a positioning structure

Country Status (1)

Country Link
TW (1) TW452191U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
US10366965B2 (en) 2017-10-30 2019-07-30 Industrial Technology Research Institute Chip bonding apparatus, chip bonding method and a chip package structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD195587S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195624S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
TWD195586S (en) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
US10366965B2 (en) 2017-10-30 2019-07-30 Industrial Technology Research Institute Chip bonding apparatus, chip bonding method and a chip package structure

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model