TW452191U - Semiconductor adhesive-film adhering platen with a positioning structure - Google Patents
Semiconductor adhesive-film adhering platen with a positioning structureInfo
- Publication number
- TW452191U TW452191U TW88207198U TW88207198U TW452191U TW 452191 U TW452191 U TW 452191U TW 88207198 U TW88207198 U TW 88207198U TW 88207198 U TW88207198 U TW 88207198U TW 452191 U TW452191 U TW 452191U
- Authority
- TW
- Taiwan
- Prior art keywords
- platen
- positioning structure
- film adhering
- semiconductor adhesive
- adhesive
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88207198U TW452191U (en) | 1999-05-06 | 1999-05-06 | Semiconductor adhesive-film adhering platen with a positioning structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88207198U TW452191U (en) | 1999-05-06 | 1999-05-06 | Semiconductor adhesive-film adhering platen with a positioning structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW452191U true TW452191U (en) | 2001-08-21 |
Family
ID=21647778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88207198U TW452191U (en) | 1999-05-06 | 1999-05-06 | Semiconductor adhesive-film adhering platen with a positioning structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW452191U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD195587S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195624S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195586S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
US10366965B2 (en) | 2017-10-30 | 2019-07-30 | Industrial Technology Research Institute | Chip bonding apparatus, chip bonding method and a chip package structure |
-
1999
- 1999-05-06 TW TW88207198U patent/TW452191U/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD195587S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195624S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
TWD195586S (en) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | Part for semiconductor device |
USD864883S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864882S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
US10366965B2 (en) | 2017-10-30 | 2019-07-30 | Industrial Technology Research Institute | Chip bonding apparatus, chip bonding method and a chip package structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |