HK1193879A1 - 曝光設備和曝光方法 - Google Patents
曝光設備和曝光方法Info
- Publication number
- HK1193879A1 HK1193879A1 HK14107076.6A HK14107076A HK1193879A1 HK 1193879 A1 HK1193879 A1 HK 1193879A1 HK 14107076 A HK14107076 A HK 14107076A HK 1193879 A1 HK1193879 A1 HK 1193879A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- exposure apparatus
- exposure method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
- G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Optical Transform (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006237045 | 2006-08-31 | ||
JP2006237606 | 2006-09-01 | ||
JP2006237491 | 2006-09-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1193879A1 true HK1193879A1 (zh) | 2014-10-03 |
Family
ID=39136023
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108556.0A HK1130944A1 (zh) | 2006-08-31 | 2009-09-18 | 曝光裝置、曝光方法、以及設備製造方法 |
HK12109422.5A HK1168662A1 (zh) | 2006-08-31 | 2012-09-25 | 曝光方法和裝置、以及組件製造方法 |
HK12110558.9A HK1169863A1 (zh) | 2006-08-31 | 2012-10-24 | 移動體驅動方法和移動體驅動系統、以及曝光方法和裝置 |
HK14107076.6A HK1193879A1 (zh) | 2006-08-31 | 2014-07-11 | 曝光設備和曝光方法 |
HK16106083.7A HK1218184A1 (zh) | 2006-08-31 | 2016-05-30 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及組件製造方法 |
HK16106141.7A HK1218187A1 (zh) | 2006-08-31 | 2016-05-31 | 可移動體驅動方法和可移動體驅動系統、模式形成方法和裝置、曝光方法和裝置以及設備製造方法 |
HK16112134.4A HK1224021A1 (zh) | 2006-08-31 | 2016-10-20 | 曝光裝置,曝光方法和器件製造方法 |
HK16112168.3A HK1224022A1 (zh) | 2006-08-31 | 2016-10-24 | 曝光裝置、曝光方法和設備製造方法 |
HK18107772.9A HK1248325B (zh) | 2006-08-31 | 2018-06-15 | 曝光設備、曝光方法以及裝置製造方法 |
HK19101492.0A HK1259005A1 (zh) | 2006-08-31 | 2019-01-29 | 曝光設備、曝光方法以及裝置製造方法 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108556.0A HK1130944A1 (zh) | 2006-08-31 | 2009-09-18 | 曝光裝置、曝光方法、以及設備製造方法 |
HK12109422.5A HK1168662A1 (zh) | 2006-08-31 | 2012-09-25 | 曝光方法和裝置、以及組件製造方法 |
HK12110558.9A HK1169863A1 (zh) | 2006-08-31 | 2012-10-24 | 移動體驅動方法和移動體驅動系統、以及曝光方法和裝置 |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16106083.7A HK1218184A1 (zh) | 2006-08-31 | 2016-05-30 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及組件製造方法 |
HK16106141.7A HK1218187A1 (zh) | 2006-08-31 | 2016-05-31 | 可移動體驅動方法和可移動體驅動系統、模式形成方法和裝置、曝光方法和裝置以及設備製造方法 |
HK16112134.4A HK1224021A1 (zh) | 2006-08-31 | 2016-10-20 | 曝光裝置,曝光方法和器件製造方法 |
HK16112168.3A HK1224022A1 (zh) | 2006-08-31 | 2016-10-24 | 曝光裝置、曝光方法和設備製造方法 |
HK18107772.9A HK1248325B (zh) | 2006-08-31 | 2018-06-15 | 曝光設備、曝光方法以及裝置製造方法 |
HK19101492.0A HK1259005A1 (zh) | 2006-08-31 | 2019-01-29 | 曝光設備、曝光方法以及裝置製造方法 |
Country Status (9)
Country | Link |
---|---|
US (6) | US20080094592A1 (zh) |
EP (8) | EP2991101B1 (zh) |
JP (13) | JP5035245B2 (zh) |
KR (14) | KR101585370B1 (zh) |
CN (3) | CN102520588B (zh) |
HK (10) | HK1130944A1 (zh) |
SG (2) | SG10201407395SA (zh) |
TW (8) | TWI602032B (zh) |
WO (1) | WO2008026742A1 (zh) |
Families Citing this family (116)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG2014011563A (en) | 2006-01-19 | 2014-05-29 | Nippon Kogaku Kk | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
CN104460241B (zh) * | 2006-08-31 | 2017-04-05 | 株式会社尼康 | 移动体驱动系统及方法、图案形成装置及方法、曝光装置及方法、组件制造方法 |
KR101585370B1 (ko) * | 2006-08-31 | 2016-01-14 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
KR101565272B1 (ko) | 2006-08-31 | 2015-11-02 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
TWI434326B (zh) | 2006-09-01 | 2014-04-11 | 尼康股份有限公司 | Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method |
KR101442449B1 (ko) * | 2006-09-01 | 2014-09-22 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
WO2009013903A1 (ja) * | 2007-07-24 | 2009-01-29 | Nikon Corporation | 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法 |
US8237919B2 (en) * | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
US9013681B2 (en) * | 2007-11-06 | 2015-04-21 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US9256140B2 (en) * | 2007-11-07 | 2016-02-09 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction |
US8665455B2 (en) * | 2007-11-08 | 2014-03-04 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US8422015B2 (en) | 2007-11-09 | 2013-04-16 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
US8711327B2 (en) * | 2007-12-14 | 2014-04-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8792079B2 (en) * | 2007-12-28 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body |
TW201443578A (zh) * | 2007-12-28 | 2014-11-16 | 尼康股份有限公司 | 曝光裝置、移動體驅動系統、圖案形成裝置、及曝光方法、以及元件製造方法 |
US8269945B2 (en) | 2007-12-28 | 2012-09-18 | Nikon Corporation | Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method |
US8237916B2 (en) * | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
JP5126594B2 (ja) * | 2008-04-04 | 2013-01-23 | 株式会社ニコン | 較正方法、露光方法及びデバイス製造方法、並びに露光装置 |
US8786829B2 (en) * | 2008-05-13 | 2014-07-22 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8228482B2 (en) * | 2008-05-13 | 2012-07-24 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8817236B2 (en) | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
US8325325B2 (en) | 2008-09-22 | 2012-12-04 | Nikon Corporation | Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method |
JP5151852B2 (ja) * | 2008-09-22 | 2013-02-27 | 株式会社ニコン | 補正情報作成方法、露光方法及び露光装置、並びにデバイス製造方法 |
US8994923B2 (en) * | 2008-09-22 | 2015-03-31 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8508735B2 (en) * | 2008-09-22 | 2013-08-13 | Nikon Corporation | Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method |
US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8634442B1 (en) | 2009-04-13 | 2014-01-21 | Soraa Laser Diode, Inc. | Optical device structure using GaN substrates for laser applications |
US8837545B2 (en) | 2009-04-13 | 2014-09-16 | Soraa Laser Diode, Inc. | Optical device structure using GaN substrates and growth structures for laser applications |
DE112010001615T5 (de) | 2009-04-13 | 2012-08-02 | Soraa, Inc. | Stuktur eines optischen Elements unter Verwendung von GaN-Substraten für Laseranwendungen |
EP3144955A1 (en) | 2009-05-20 | 2017-03-22 | Mapper Lithography IP B.V. | Method for exposing a wafer |
US8970820B2 (en) | 2009-05-20 | 2015-03-03 | Nikon Corporation | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method |
US8553204B2 (en) | 2009-05-20 | 2013-10-08 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8792084B2 (en) * | 2009-05-20 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8488109B2 (en) | 2009-08-25 | 2013-07-16 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8514395B2 (en) | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US20110056444A1 (en) * | 2009-09-08 | 2011-03-10 | Im Chai S | Polarity sequenced electro magnetic head gasket engine and replacement kit |
NL2005322A (en) * | 2009-09-11 | 2011-03-14 | Asml Netherlands Bv | A shutter member, a lithographic apparatus and device manufacturing method. |
US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
TWI402641B (zh) * | 2009-12-04 | 2013-07-21 | Ind Tech Res Inst | 聯結多系統達成多軸同步插值裝置與方法 |
US8488106B2 (en) * | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
NL2006004A (en) * | 2010-03-25 | 2011-09-27 | Asml Netherlands Bv | Imprint lithography. |
NL2006913A (en) | 2010-07-16 | 2012-01-17 | Asml Netherlands Bv | Lithographic apparatus and method. |
NL2007818A (en) | 2010-12-20 | 2012-06-21 | Asml Netherlands Bv | Method of updating calibration data and a device manufacturing method. |
NL2007802A (en) | 2010-12-21 | 2012-06-25 | Asml Netherlands Bv | A substrate table, a lithographic apparatus and a device manufacturing method. |
WO2012143541A1 (en) | 2011-04-20 | 2012-10-26 | Mapper Lithography Ip B.V. | Arrangement of optical fibers, and a method of forming such arrangement |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
JP6219320B2 (ja) | 2012-03-08 | 2017-10-25 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | ウェーハなどのターゲットを処理するためのリソグラフィシステム及び方法 |
US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
JP5936478B2 (ja) * | 2012-08-03 | 2016-06-22 | キヤノン株式会社 | 計測装置、リソグラフィー装置、および物品の製造方法 |
JP5936479B2 (ja) * | 2012-08-03 | 2016-06-22 | キヤノン株式会社 | 計測装置、リソグラフィー装置、および物品の製造方法 |
CN104838469B (zh) | 2012-10-02 | 2018-04-24 | 株式会社尼康 | 曝光装置及曝光方法、以及器件制造方法 |
WO2014122223A1 (en) * | 2013-02-08 | 2014-08-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP6381184B2 (ja) * | 2013-07-09 | 2018-08-29 | キヤノン株式会社 | 校正方法、測定装置、露光装置および物品の製造方法 |
CN105684108A (zh) | 2013-09-04 | 2016-06-15 | Ckd株式会社 | 电磁致动器用电枢线圈、电磁致动器、曝光装置及器件制造方法 |
JP6452086B2 (ja) * | 2013-10-31 | 2019-01-16 | キヤノン株式会社 | 形状算出装置及び方法、計測装置、物品製造方法、及び、プログラム |
DE102014205523A1 (de) * | 2014-03-25 | 2015-10-01 | Etel S.A. | Positioniereinrichtung in Portalbauweise |
WO2015147039A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
TWI701514B (zh) | 2014-03-28 | 2020-08-11 | 日商尼康股份有限公司 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法 |
JP6465565B2 (ja) | 2014-05-19 | 2019-02-06 | キヤノン株式会社 | 露光装置、位置合わせ方法およびデバイス製造方法 |
JP6342738B2 (ja) * | 2014-07-24 | 2018-06-13 | 株式会社Screenホールディングス | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
NL2015211A (en) * | 2014-08-29 | 2016-07-12 | Asml Netherlands Bv | Encoder system calibration method, object positioning system, lithographic apparatus and device device manufacturing method. |
TWI693477B (zh) | 2015-02-23 | 2020-05-11 | 日商尼康股份有限公司 | 測量裝置、微影系統及曝光裝置、以及元件製造方法 |
WO2016136691A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 基板処理システム及び基板処理方法、並びにデバイス製造方法 |
CN111290221B (zh) | 2015-02-23 | 2023-07-28 | 株式会社尼康 | 测量装置、光刻系统、曝光装置、测量方法、曝光方法以及元件制造方法 |
JP6819887B2 (ja) * | 2015-09-30 | 2021-01-27 | 株式会社ニコン | 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法 |
CN111929992A (zh) | 2015-09-30 | 2020-11-13 | 株式会社尼康 | 移动体装置、曝光装置、平面显示器的制造方法、及元件制造方法、以及物体的移动方法 |
WO2017057583A1 (ja) | 2015-09-30 | 2017-04-06 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
US10732510B2 (en) * | 2015-09-30 | 2020-08-04 | Nikon Corporation | Exposure apparatus and exposure method, and flat panel display manufacturing method |
US10802407B2 (en) | 2015-09-30 | 2020-10-13 | Nikon Corporation | Exposure apparatus, exposure method, manufacturing method of flat-panel display, and device manufacturing method |
CN108139677B (zh) | 2015-09-30 | 2021-06-22 | 株式会社尼康 | 曝光装置、平面显示器之制造方法、以及元件制造方法 |
JP6828688B2 (ja) | 2015-09-30 | 2021-02-10 | 株式会社ニコン | 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法 |
CN113900361B (zh) * | 2015-09-30 | 2024-02-09 | 株式会社尼康 | 曝光装置及曝光方法、以及平面显示器制造方法 |
KR20180058734A (ko) | 2015-09-30 | 2018-06-01 | 가부시키가이샤 니콘 | 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법 |
WO2017057465A1 (ja) * | 2015-09-30 | 2017-04-06 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに計測方法 |
US10338481B2 (en) * | 2015-10-27 | 2019-07-02 | Asml Holding N.V. | Polarization independent metrology system |
US10585357B2 (en) | 2015-12-28 | 2020-03-10 | Asml Netherlands B.V. | Alternative target design for metrology using modulation techniques |
CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺系统 |
JP6925783B2 (ja) * | 2016-05-26 | 2021-08-25 | 株式会社アドテックエンジニアリング | パターン描画装置及びパターン描画方法 |
JP6438441B2 (ja) * | 2016-08-04 | 2018-12-12 | ファナック株式会社 | エンコーダの信号処理装置、エンコーダ、信号処理方法及びプログラム |
CN109863457A (zh) * | 2016-08-24 | 2019-06-07 | 株式会社尼康 | 测量系统及基板处理系统、以及元件制造方法 |
JP6855011B2 (ja) | 2016-09-30 | 2021-04-07 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
CN113641082B (zh) * | 2016-09-30 | 2023-10-24 | 株式会社尼康 | 移动体装置、移动方法、曝光装置、曝光方法、平板显示器的制造方法、以及器件制造方法 |
JP6791255B2 (ja) | 2016-09-30 | 2020-11-25 | 株式会社ニコン | 搬送装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、デバイス製造方法、及び搬送方法 |
CN113504712B (zh) * | 2016-09-30 | 2023-09-19 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、以及元件制造方法 |
WO2018077873A1 (en) * | 2016-10-27 | 2018-05-03 | Asml Netherlands B.V. | System and method for determining and calibrating a position of a stage |
WO2018083930A1 (ja) * | 2016-11-01 | 2018-05-11 | 株式会社島津製作所 | 放射線断層撮影装置の撮像倍率校正方法 |
EP3581984A4 (en) * | 2017-03-14 | 2021-01-13 | Pioneer Corporation | DISPLAY DEVICE |
US10877370B2 (en) * | 2017-07-31 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stretchable layout design for EUV defect mitigation |
CN107806822B (zh) * | 2017-09-21 | 2020-06-09 | 中国科学院长春光学精密机械与物理研究所 | 一种测量装置 |
CN107687814B (zh) * | 2017-09-21 | 2020-05-12 | 中国科学院长春光学精密机械与物理研究所 | 一种测量装置 |
TWI663845B (zh) * | 2017-11-09 | 2019-06-21 | 美商Tt電子公司 | 光學編碼裝置及方法 |
US10481421B2 (en) * | 2018-03-02 | 2019-11-19 | Gooch & Housego Plc | Mounting ring for maintaining optical device alignment |
JP7137363B2 (ja) * | 2018-06-11 | 2022-09-14 | キヤノン株式会社 | 露光方法、露光装置、物品の製造方法及び計測方法 |
DE102019210274A1 (de) | 2019-07-11 | 2021-01-14 | Dr. Johannes Heidenhain Gmbh | Optische Positionsmesseinrichtung |
US11764111B2 (en) * | 2019-10-24 | 2023-09-19 | Texas Instruments Incorporated | Reducing cross-wafer variability for minimum width resistors |
CN113155053B (zh) | 2020-01-22 | 2024-09-06 | 株式会社三丰 | 三维几何形状测量装置和三维几何形状测量方法 |
JP7360978B2 (ja) * | 2020-03-18 | 2023-10-13 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
CN111580455B (zh) * | 2020-06-05 | 2021-06-25 | 广东省智能制造研究所 | 一种数控设备的定位精度可靠性评估方法 |
US11874144B2 (en) * | 2020-07-28 | 2024-01-16 | Li Lin | Displacement measurement system |
JP7633045B2 (ja) | 2021-03-09 | 2025-02-19 | 株式会社Screenホールディングス | 露光方法および露光装置 |
JP7633044B2 (ja) | 2021-03-09 | 2025-02-19 | 株式会社Screenホールディングス | 露光方法および露光装置 |
JP2023000112A (ja) * | 2021-06-17 | 2023-01-04 | キオクシア株式会社 | 計測装置および計測プログラム |
CN113552534B (zh) * | 2021-08-05 | 2022-02-01 | 中国人民解放军战略支援部队航天工程大学 | 基于脉冲信号的旋转基线干涉仪相位标校方法 |
TWI791343B (zh) * | 2021-12-01 | 2023-02-01 | 財團法人工業技術研究院 | 旋轉軸的幾何誤差的獲取方法與獲取設備 |
CN116674205B (zh) * | 2023-08-01 | 2023-12-15 | 易加三维增材技术(杭州)有限公司 | 位移控制方法、装置、非易失性存储介质及电子设备 |
CN117733873B (zh) * | 2024-02-19 | 2024-04-19 | 深圳市德富莱智能科技股份有限公司 | 一种三维自动校准系统 |
CN118565393B (zh) * | 2024-07-29 | 2024-10-18 | 汇丰金属科技(溧阳)有限公司 | 一种粉末冶金轴承精度检测装置 |
Family Cites Families (210)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE224448C (zh) | ||||
US4465A (en) | 1846-04-18 | Improvement in plows | ||
DE221563C (zh) | ||||
US368A (en) | 1837-08-31 | John williamson | ||
US4215938A (en) * | 1978-09-28 | 1980-08-05 | Farrand Industries, Inc. | Method and apparatus for correcting the error of a position measuring interferometer |
US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
JPS57153433A (en) * | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
JPS60119407A (ja) * | 1983-11-30 | 1985-06-26 | Nippon Kogaku Kk <Nikon> | 比較検査装置 |
DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
JPS6144429A (ja) | 1984-08-09 | 1986-03-04 | Nippon Kogaku Kk <Nikon> | 位置合わせ方法、及び位置合せ装置 |
JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
JPS63292005A (ja) * | 1987-05-25 | 1988-11-29 | Nikon Corp | 走り誤差補正をなした移動量検出装置 |
US5070250A (en) | 1989-02-28 | 1991-12-03 | Nikon Corporation | Position detection apparatus with adjustable beam and interference fringe positions |
US5489986A (en) * | 1989-02-28 | 1996-02-06 | Nikon Corporation | Position detecting apparatus |
US5021649A (en) * | 1989-03-28 | 1991-06-04 | Canon Kabushiki Kaisha | Relief diffraction grating encoder |
JP2784225B2 (ja) | 1989-11-28 | 1998-08-06 | 双葉電子工業株式会社 | 相対移動量測定装置 |
JP3077149B2 (ja) * | 1990-01-22 | 2000-08-14 | 株式会社ニコン | 測定装置、測定方法、及び露光装置、露光方法、及び回路パターンチップ |
US5523843A (en) * | 1990-07-09 | 1996-06-04 | Canon Kabushiki Kaisha | Position detecting system |
DE4033556A1 (de) * | 1990-10-22 | 1992-04-23 | Suess Kg Karl | Messanordnung fuer x,y,(phi)-koordinatentische |
JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JP3149472B2 (ja) * | 1991-08-30 | 2001-03-26 | 株式会社ニコン | 走査露光装置および物体の移動測定装置 |
US5506684A (en) | 1991-04-04 | 1996-04-09 | Nikon Corporation | Projection scanning exposure apparatus with synchronous mask/wafer alignment system |
JP3030386B2 (ja) | 1991-05-15 | 2000-04-10 | 敏一 中村 | 抗ガン剤 |
DE4219311C2 (de) * | 1991-06-13 | 1996-03-07 | Sony Magnescale Inc | Verschiebungsdetektor |
JPH0562877A (ja) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | 光によるlsi製造縮小投影露光装置の光学系 |
JPH05129184A (ja) * | 1991-10-30 | 1993-05-25 | Canon Inc | 投影露光装置 |
JPH05173639A (ja) * | 1991-12-20 | 1993-07-13 | Fujitsu Ltd | 位置制御装置及びその制御方法 |
JPH06124873A (ja) | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
JP3316833B2 (ja) | 1993-03-26 | 2002-08-19 | 株式会社ニコン | 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法 |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3303386B2 (ja) | 1993-02-03 | 2002-07-22 | 株式会社ニコン | 投影露光装置及び方法 |
US5461237A (en) * | 1993-03-26 | 1995-10-24 | Nikon Corporation | Surface-position setting apparatus |
US5583609A (en) | 1993-04-23 | 1996-12-10 | Nikon Corporation | Projection exposure apparatus |
JP3375076B2 (ja) | 1993-04-27 | 2003-02-10 | 株式会社ニコン | 投影露光方法及び装置、並びに素子製造方法 |
JP3309871B2 (ja) * | 1993-04-27 | 2002-07-29 | 株式会社ニコン | 投影露光方法及び装置、並びに素子製造方法 |
US5581324A (en) | 1993-06-10 | 1996-12-03 | Nikon Corporation | Thermal distortion compensated projection exposure method and apparatus for manufacturing semiconductors |
JP3319819B2 (ja) * | 1993-06-25 | 2002-09-03 | 株式会社リコー | 画像形成装置管理システム |
US6122036A (en) | 1993-10-21 | 2000-09-19 | Nikon Corporation | Projection exposure apparatus and method |
JPH09223650A (ja) | 1996-02-15 | 1997-08-26 | Nikon Corp | 露光装置 |
US5625453A (en) * | 1993-10-26 | 1997-04-29 | Canon Kabushiki Kaisha | System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating |
JP3382389B2 (ja) * | 1993-10-26 | 2003-03-04 | キヤノン株式会社 | 位置ずれ検出方法及びそれを用いた位置ずれ検出装置 |
JPH07190741A (ja) * | 1993-12-27 | 1995-07-28 | Nippon Telegr & Teleph Corp <Ntt> | 測定誤差補正法 |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
JPH07318699A (ja) * | 1994-05-27 | 1995-12-08 | Canon Inc | ステージ装置及びこれを有する露光装置とデバイス製造方法 |
US6018384A (en) | 1994-09-07 | 2000-01-25 | Nikon Corporation | Projection exposure system |
JP3379238B2 (ja) | 1994-09-08 | 2003-02-24 | 株式会社ニコン | 走査型露光装置 |
JPH0883753A (ja) * | 1994-09-13 | 1996-03-26 | Nikon Corp | 焦点検出方法 |
JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JPH08316124A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JPH09115820A (ja) * | 1995-10-13 | 1997-05-02 | Nikon Corp | 走査型露光装置及び露光方法 |
JPH09318321A (ja) * | 1996-05-30 | 1997-12-12 | Olympus Optical Co Ltd | 測長装置 |
JPH1022218A (ja) * | 1996-07-02 | 1998-01-23 | Nikon Corp | 基板のアライメント方法 |
EP2343693A3 (en) * | 1996-08-12 | 2012-09-12 | Tyco Electronics Coroporation | Acoustic condition sensor employing a plurality of mutually non-orthogonal waves |
JPH1063011A (ja) | 1996-08-14 | 1998-03-06 | Nikon Corp | 走査型露光装置及び走査露光方法 |
US5917580A (en) * | 1996-08-29 | 1999-06-29 | Canon Kabushiki Kaisha | Scan exposure method and apparatus |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
EP1944654A3 (en) * | 1996-11-28 | 2010-06-02 | Nikon Corporation | An exposure apparatus and an exposure method |
JP4029183B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
JPH10223528A (ja) | 1996-12-30 | 1998-08-21 | Nikon Corp | 投影露光装置及び位置合わせ方法 |
DE69829614T2 (de) | 1997-03-10 | 2006-03-09 | Asml Netherlands B.V. | Lithographiegerät mit einer positioniervorrichtung mit zwei objekthaltern |
JP3963037B2 (ja) * | 1997-03-19 | 2007-08-22 | ソニー株式会社 | 記録装置及び再生装置 |
JPH10270535A (ja) | 1997-03-25 | 1998-10-09 | Nikon Corp | 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法 |
JP3747566B2 (ja) | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
JP3817836B2 (ja) | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
JPH1116816A (ja) | 1997-06-25 | 1999-01-22 | Nikon Corp | 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法 |
JPH11121325A (ja) * | 1997-09-03 | 1999-04-30 | Canon Inc | 投影露光装置 |
JP4210871B2 (ja) * | 1997-10-31 | 2009-01-21 | 株式会社ニコン | 露光装置 |
US6020964A (en) | 1997-12-02 | 2000-02-01 | Asm Lithography B.V. | Interferometer system and lithograph apparatus including an interferometer system |
JPH11176727A (ja) | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
JP3809268B2 (ja) | 1997-12-19 | 2006-08-16 | キヤノン株式会社 | デバイス製造方法 |
JPH11191585A (ja) * | 1997-12-26 | 1999-07-13 | Canon Inc | ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法 |
JPH11233420A (ja) | 1998-02-18 | 1999-08-27 | Nikon Corp | 投影露光装置及び位置検出方法 |
KR100819239B1 (ko) | 1998-03-11 | 2008-04-03 | 가부시키가이샤 니콘 | 자외 레이저 장치, 레이저 장치, 노광 장치와 노광 방법, 디바이스 제조 방법, 자외광 조사 장치, 물체 패턴 검출 장치, 자외광 조사 방법 및 물체 패턴 검출 방법 |
US6008610A (en) | 1998-03-20 | 1999-12-28 | Nikon Corporation | Position control apparatus for fine stages carried by a coarse stage on a high-precision scanning positioning system |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
WO1999060361A1 (fr) | 1998-05-19 | 1999-11-25 | Nikon Corporation | Instrument et procede de mesure d'aberrations, appareil et procede de sensibilisation par projection incorporant cet instrument, et procede de fabrication de dispositifs associe |
JP2000058436A (ja) | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
JP2000068192A (ja) | 1998-08-18 | 2000-03-03 | Nikon Corp | 露光装置、露光方法及び位置検出方法 |
US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
EP1014199B1 (en) | 1998-12-24 | 2011-03-30 | Canon Kabushiki Kaisha | Stage control apparatus, exposure apparatus and method of manufacturing a semiconductor device |
TW490596B (en) * | 1999-03-08 | 2002-06-11 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus |
US6924884B2 (en) * | 1999-03-08 | 2005-08-02 | Asml Netherlands B.V. | Off-axis leveling in lithographic projection apparatus |
US6381004B1 (en) * | 1999-09-29 | 2002-04-30 | Nikon Corporation | Exposure apparatus and device manufacturing method |
JP2001118768A (ja) * | 1999-10-15 | 2001-04-27 | Nikon Corp | マスクのアライメント方法および露光装置 |
WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
JP4428781B2 (ja) | 1999-12-28 | 2010-03-10 | キヤノン株式会社 | 光学式ロータリエンコーダ及びモータ制御装置 |
WO2001052004A1 (en) * | 2000-01-11 | 2001-07-19 | Electro Scientific Industries, Inc. | Abbe error correction system and method |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP2001313250A (ja) | 2000-02-25 | 2001-11-09 | Nikon Corp | 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法 |
TW546699B (en) | 2000-02-25 | 2003-08-11 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
JP2001332490A (ja) * | 2000-03-14 | 2001-11-30 | Nikon Corp | 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法 |
US6639686B1 (en) | 2000-04-13 | 2003-10-28 | Nanowave, Inc. | Method of and apparatus for real-time continual nanometer scale position measurement by beam probing as by laser beams and the like of atomic and other undulating surfaces such as gratings or the like relatively moving with respect to the probing beams |
JP2002014005A (ja) | 2000-04-25 | 2002-01-18 | Nikon Corp | 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置 |
US20020041377A1 (en) | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
US6970245B2 (en) * | 2000-08-02 | 2005-11-29 | Honeywell International Inc. | Optical alignment detection system |
JP2002090114A (ja) * | 2000-07-10 | 2002-03-27 | Mitsutoyo Corp | 光スポット位置センサ及び変位測定装置 |
JP2002031895A (ja) | 2000-07-18 | 2002-01-31 | Nikon Corp | 露光装置 |
TW527526B (en) | 2000-08-24 | 2003-04-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7289212B2 (en) * | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
US7561270B2 (en) * | 2000-08-24 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
US6557190B2 (en) | 2001-08-31 | 2003-05-06 | National Rv Holdings, Inc. | Storable bed assembly |
JP2002164269A (ja) * | 2000-11-27 | 2002-06-07 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
KR100815222B1 (ko) | 2001-02-27 | 2008-03-19 | 에이에스엠엘 유에스, 인크. | 리소그래피 장치 및 적어도 하나의 레티클 상에 형성된 적어도 두 개의 패턴으로부터의 이미지로 기판 스테이지 상의 필드를 노출시키는 방법 |
GB2376595B (en) * | 2001-03-27 | 2003-12-24 | 1 Ltd | Method and apparatus to create a sound field |
JP2002305140A (ja) * | 2001-04-06 | 2002-10-18 | Nikon Corp | 露光装置及び基板処理システム |
JP4198338B2 (ja) * | 2001-07-09 | 2008-12-17 | 株式会社 東北テクノアーチ | ステージ装置 |
JP2003031474A (ja) * | 2001-07-16 | 2003-01-31 | Oki Electric Ind Co Ltd | 露光装置および露光方法 |
TW529172B (en) * | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
KR20010112204A (ko) * | 2001-12-01 | 2001-12-20 | 엄경미 | 위생패드 |
JP2003249443A (ja) | 2001-12-21 | 2003-09-05 | Nikon Corp | ステージ装置、ステージ位置管理方法、露光方法及び露光装置、並びにデバイス製造方法 |
CN100345252C (zh) | 2002-01-29 | 2007-10-24 | 株式会社尼康 | 成像状态调节系统、曝光方法和曝光装置以及程序和信息存储介质 |
US6987555B2 (en) * | 2002-04-23 | 2006-01-17 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
JP4168665B2 (ja) | 2002-05-22 | 2008-10-22 | 株式会社ニコン | 露光方法及び露光装置、デバイス製造方法 |
JP2004014876A (ja) * | 2002-06-07 | 2004-01-15 | Nikon Corp | 調整方法、空間像計測方法及び像面計測方法、並びに露光装置 |
JP3833148B2 (ja) | 2002-06-25 | 2006-10-11 | キヤノン株式会社 | 位置決め装置及びその制御方法、露光装置、デバイスの製造方法、半導体製造工場、露光装置の保守方法 |
JP2004041362A (ja) | 2002-07-10 | 2004-02-12 | Sankyo Kk | 弾球遊技機およびスロットマシン |
AU2003252349A1 (en) * | 2002-07-31 | 2004-02-16 | Nikon Corporation | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method |
EP1532489A2 (en) | 2002-08-23 | 2005-05-25 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
JP2004101362A (ja) | 2002-09-10 | 2004-04-02 | Canon Inc | ステージ位置計測および位置決め装置 |
KR100632889B1 (ko) * | 2002-09-20 | 2006-10-13 | 에이에스엠엘 네델란즈 비.브이. | 2개이상의 파장을 사용하는 리소그래피시스템용정렬시스템 및 정렬방법 |
CN1245668C (zh) * | 2002-10-14 | 2006-03-15 | 台湾积体电路制造股份有限公司 | 曝光系统及其曝光方法 |
DE60335595D1 (de) * | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
CN101470360B (zh) * | 2002-11-12 | 2013-07-24 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
EP2495613B1 (en) | 2002-11-12 | 2013-07-31 | ASML Netherlands B.V. | Lithographic apparatus |
US7393804B2 (en) * | 2002-11-18 | 2008-07-01 | Ict Co., Ltd. | Exhaust gas purifying catalyst and process for purification of exhaust gas |
WO2004051184A1 (ja) * | 2002-12-03 | 2004-06-17 | Nikon Corporation | 形状計測方法、形状計測装置、チルト計測方法、ステージ装置、露光装置、露光方法、及びデバイス製造方法 |
KR20050085235A (ko) | 2002-12-10 | 2005-08-29 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
EP1571696A4 (en) * | 2002-12-10 | 2008-03-26 | Nikon Corp | EXPOSURE DEVICE AND METHOD OF MANUFACTURE |
KR101745223B1 (ko) | 2003-04-10 | 2017-06-08 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템 |
SG2012031738A (en) * | 2003-04-11 | 2015-07-30 | Nippon Kogaku Kk | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
KR101647934B1 (ko) | 2003-05-06 | 2016-08-11 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 노광 방법 |
US7025498B2 (en) * | 2003-05-30 | 2006-04-11 | Asml Holding N.V. | System and method of measuring thermal expansion |
JP4437474B2 (ja) * | 2003-06-19 | 2010-03-24 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US20050027487A1 (en) * | 2003-07-15 | 2005-02-03 | Supriya Iyer | Product defect analysis and resolution system |
JP4492239B2 (ja) * | 2003-07-28 | 2010-06-30 | 株式会社ニコン | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
KR20190002749A (ko) * | 2003-07-28 | 2019-01-08 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법 |
KR101381563B1 (ko) * | 2003-08-21 | 2014-04-04 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JP4524601B2 (ja) * | 2003-10-09 | 2010-08-18 | 株式会社ニコン | 露光装置及び露光方法、デバイス製造方法 |
TWI295408B (en) * | 2003-10-22 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method, and measurement system |
JP2005159322A (ja) * | 2003-10-31 | 2005-06-16 | Nikon Corp | 定盤、ステージ装置及び露光装置並びに露光方法 |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US7102729B2 (en) * | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
WO2005076325A1 (ja) | 2004-02-04 | 2005-08-18 | Nikon Corporation | 露光装置及び方法、位置制御方法並びにデバイス製造方法 |
JP2005252246A (ja) | 2004-02-04 | 2005-09-15 | Nikon Corp | 露光装置及び方法、位置制御方法、並びにデバイス製造方法 |
JP4429037B2 (ja) * | 2004-02-27 | 2010-03-10 | キヤノン株式会社 | ステージ装置及びその制御方法 |
JP2005249452A (ja) | 2004-03-02 | 2005-09-15 | Konica Minolta Medical & Graphic Inc | リニアエンコーダ、画像読取装置及び画像記録装置 |
JP4622340B2 (ja) | 2004-03-04 | 2011-02-02 | 株式会社ニコン | 露光装置、デバイス製造方法 |
JP2005268608A (ja) | 2004-03-19 | 2005-09-29 | Sumitomo Heavy Ind Ltd | ステージ装置 |
JP2005283357A (ja) * | 2004-03-30 | 2005-10-13 | Sendai Nikon:Kk | 光電式エンコーダ |
US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4751032B2 (ja) | 2004-04-22 | 2011-08-17 | 株式会社森精機製作所 | 変位検出装置 |
US20050241694A1 (en) | 2004-04-29 | 2005-11-03 | Red Flame Hot Tap Services Ltd. | Hot tapping method, system and apparatus |
US7126109B2 (en) * | 2004-06-14 | 2006-10-24 | Gsi Group Corporation | Encoder scale error compensation employing comparison among multiple detectors |
JP4873242B2 (ja) | 2004-06-22 | 2012-02-08 | 株式会社ニコン | ベストフォーカス検出方法及び露光方法、並びに露光装置 |
US20060013959A1 (en) * | 2004-07-15 | 2006-01-19 | Morales Hector D | Process to apply a polimeric coating on non-ferrous substrates |
US7256871B2 (en) * | 2004-07-27 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and method for calibrating the same |
US7701550B2 (en) * | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006030902A1 (ja) | 2004-09-17 | 2006-03-23 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
JP4852951B2 (ja) * | 2004-09-17 | 2012-01-11 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
CN101052916B (zh) | 2004-09-30 | 2010-05-12 | 株式会社尼康 | 投影光学设备和曝光装置 |
EP2426700B1 (en) * | 2004-10-15 | 2018-01-10 | Nikon Corporation | Exposure apparatus and device manufacturing method |
JP4424739B2 (ja) | 2004-10-19 | 2010-03-03 | キヤノン株式会社 | ステージ装置 |
US7388663B2 (en) * | 2004-10-28 | 2008-06-17 | Asml Netherlands B.V. | Optical position assessment apparatus and method |
KR101318037B1 (ko) * | 2004-11-01 | 2013-10-14 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
TWI649790B (zh) * | 2004-11-18 | 2019-02-01 | 日商尼康股份有限公司 | 位置測量方法、位置控制方法、測量方法、裝載方法、曝光方法及曝光裝置、及元件製造方法 |
JP4807629B2 (ja) | 2004-11-25 | 2011-11-02 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US20060139595A1 (en) * | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
JP4450739B2 (ja) | 2005-01-21 | 2010-04-14 | 富士フイルム株式会社 | 露光装置 |
JP2006210570A (ja) | 2005-01-27 | 2006-08-10 | Nikon Corp | 調整方法、露光装置 |
US7161659B2 (en) * | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7515281B2 (en) * | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7349069B2 (en) * | 2005-04-20 | 2008-03-25 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
US7405811B2 (en) * | 2005-04-20 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
JP2007054987A (ja) * | 2005-08-23 | 2007-03-08 | Soshiodaiya Systems Kk | 印刷装置及び印刷方法 |
US7348574B2 (en) * | 2005-09-02 | 2008-03-25 | Asml Netherlands, B.V. | Position measurement system and lithographic apparatus |
US7362446B2 (en) * | 2005-09-15 | 2008-04-22 | Asml Netherlands B.V. | Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit |
JP2007093546A (ja) * | 2005-09-30 | 2007-04-12 | Nikon Corp | エンコーダシステム、ステージ装置及び露光装置 |
US7978339B2 (en) * | 2005-10-04 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus temperature compensation |
JP4164508B2 (ja) * | 2005-10-04 | 2008-10-15 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
SG2014011563A (en) | 2006-01-19 | 2014-05-29 | Nippon Kogaku Kk | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
EP2003679B1 (en) * | 2006-02-21 | 2016-11-16 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
CN101385121B (zh) | 2006-02-21 | 2011-04-20 | 株式会社尼康 | 图案形成装置及图案形成方法、移动体驱动系统及移动体驱动方法、曝光装置及曝光方法、以及组件制造方法 |
KR20090015888A (ko) * | 2006-02-21 | 2009-02-12 | 가부시키가이샤 니콘 | 위치 계측 장치 및 위치 계측 방법, 이동체 구동 시스템 및이동체 구동 방법, 패턴 형성 장치 및 패턴 형성 방법, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
WO2007097466A1 (ja) * | 2006-02-21 | 2007-08-30 | Nikon Corporation | 測定装置及び方法、処理装置及び方法、パターン形成装置及び方法、露光装置及び方法、並びにデバイス製造方法 |
US7602489B2 (en) * | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7253875B1 (en) * | 2006-03-03 | 2007-08-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7636165B2 (en) * | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
US7576832B2 (en) | 2006-05-04 | 2009-08-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7483120B2 (en) * | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
JP4393540B2 (ja) | 2006-08-01 | 2010-01-06 | シャープ株式会社 | 樹脂含有粒子の凝集体の製造方法、トナー、現像剤、現像装置および画像形成装置 |
US20080050680A1 (en) * | 2006-08-24 | 2008-02-28 | Stefan Brandl | Lithography systems and methods |
KR101585370B1 (ko) * | 2006-08-31 | 2016-01-14 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
KR101565272B1 (ko) * | 2006-08-31 | 2015-11-02 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
CN104460241B (zh) * | 2006-08-31 | 2017-04-05 | 株式会社尼康 | 移动体驱动系统及方法、图案形成装置及方法、曝光装置及方法、组件制造方法 |
TWI434326B (zh) * | 2006-09-01 | 2014-04-11 | 尼康股份有限公司 | Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method |
KR101442449B1 (ko) * | 2006-09-01 | 2014-09-22 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
US7619207B2 (en) * | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7903866B2 (en) | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
US7710540B2 (en) * | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8547527B2 (en) * | 2007-07-24 | 2013-10-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method |
TW201443578A (zh) * | 2007-12-28 | 2014-11-16 | 尼康股份有限公司 | 曝光裝置、移動體驅動系統、圖案形成裝置、及曝光方法、以及元件製造方法 |
-
2007
- 2007-08-31 KR KR1020147034198A patent/KR101585370B1/ko active IP Right Grant
- 2007-08-31 KR KR1020167000307A patent/KR101670638B1/ko active IP Right Grant
- 2007-08-31 TW TW105113707A patent/TWI602032B/zh not_active IP Right Cessation
- 2007-08-31 KR KR1020187002349A patent/KR101933360B1/ko active IP Right Grant
- 2007-08-31 US US11/896,448 patent/US20080094592A1/en not_active Abandoned
- 2007-08-31 TW TW105100233A patent/TWI596444B/zh not_active IP Right Cessation
- 2007-08-31 KR KR1020177000847A patent/KR101824374B1/ko active IP Right Grant
- 2007-08-31 KR KR1020187036725A patent/KR20180137600A/ko not_active Application Discontinuation
- 2007-08-31 CN CN201110384985.9A patent/CN102520588B/zh not_active Expired - Fee Related
- 2007-08-31 WO PCT/JP2007/067074 patent/WO2008026742A1/ja active Application Filing
- 2007-08-31 TW TW105100234A patent/TWI649631B/zh not_active IP Right Cessation
- 2007-08-31 SG SG10201407395SA patent/SG10201407395SA/en unknown
- 2007-08-31 KR KR1020147017741A patent/KR101529845B1/ko active IP Right Grant
- 2007-08-31 KR KR1020137020821A patent/KR101477448B1/ko active IP Right Grant
- 2007-08-31 EP EP15182527.0A patent/EP2991101B1/en not_active Not-in-force
- 2007-08-31 EP EP16164422.4A patent/EP3067748B1/en not_active Not-in-force
- 2007-08-31 CN CN2007800102592A patent/CN101405840B/zh not_active Expired - Fee Related
- 2007-08-31 TW TW106129977A patent/TWI653511B/zh not_active IP Right Cessation
- 2007-08-31 SG SG2011060241A patent/SG174091A1/en unknown
- 2007-08-31 EP EP15182526.2A patent/EP2993688B1/en not_active Not-in-force
- 2007-08-31 EP EP17200084.6A patent/EP3312676B1/en not_active Not-in-force
- 2007-08-31 TW TW102132750A patent/TWI537687B/zh not_active IP Right Cessation
- 2007-08-31 KR KR1020167000308A patent/KR101670639B1/ko active IP Right Grant
- 2007-08-31 KR KR1020157036552A patent/KR101698291B1/ko active Application Filing
- 2007-08-31 CN CN201110386387.5A patent/CN102520589B/zh not_active Expired - Fee Related
- 2007-08-31 KR KR1020137020822A patent/KR101409011B1/ko active IP Right Grant
- 2007-08-31 EP EP07806547.1A patent/EP2065920B1/en not_active Not-in-force
- 2007-08-31 EP EP18184704.7A patent/EP3418807A1/en not_active Withdrawn
- 2007-08-31 EP EP14153959.3A patent/EP2738608B9/en not_active Not-in-force
- 2007-08-31 TW TW096132674A patent/TWI416269B/zh not_active IP Right Cessation
- 2007-08-31 EP EP16163509.9A patent/EP3064999B1/en not_active Not-in-force
- 2007-08-31 KR KR1020087026015A patent/KR101400615B1/ko active IP Right Grant
- 2007-08-31 KR KR1020147034199A patent/KR101565275B1/ko active IP Right Grant
- 2007-08-31 TW TW105100232A patent/TWI594083B/zh not_active IP Right Cessation
- 2007-08-31 KR KR1020157019884A patent/KR101645909B1/ko active IP Right Grant
- 2007-08-31 JP JP2008532138A patent/JP5035245B2/ja not_active Expired - Fee Related
- 2007-08-31 KR KR1020157036553A patent/KR101711323B1/ko active IP Right Grant
- 2007-08-31 TW TW102132751A patent/TWI529501B/zh not_active IP Right Cessation
-
2009
- 2009-09-18 HK HK09108556.0A patent/HK1130944A1/zh not_active IP Right Cessation
-
2012
- 2012-03-30 JP JP2012078997A patent/JP5522488B2/ja active Active
- 2012-04-20 JP JP2012096250A patent/JP5522489B2/ja active Active
- 2012-09-25 HK HK12109422.5A patent/HK1168662A1/zh not_active IP Right Cessation
- 2012-10-24 HK HK12110558.9A patent/HK1169863A1/zh not_active IP Right Cessation
-
2013
- 2013-08-01 JP JP2013160145A patent/JP5686164B2/ja not_active Expired - Fee Related
- 2013-10-30 US US14/067,110 patent/US9958792B2/en not_active Expired - Fee Related
- 2013-10-30 US US14/067,503 patent/US9983486B2/en not_active Expired - Fee Related
-
2014
- 2014-05-29 JP JP2014110768A patent/JP5729578B2/ja active Active
- 2014-07-11 HK HK14107076.6A patent/HK1193879A1/zh not_active IP Right Cessation
-
2015
- 2015-01-08 JP JP2015002486A patent/JP5999392B2/ja not_active Expired - Fee Related
- 2015-06-17 JP JP2015121621A patent/JP6143122B2/ja not_active Expired - Fee Related
- 2015-09-14 JP JP2015180799A patent/JP6143125B2/ja not_active Expired - Fee Related
- 2015-09-14 JP JP2015180800A patent/JP6029037B2/ja not_active Expired - Fee Related
-
2016
- 2016-01-13 JP JP2016004087A patent/JP6339599B2/ja not_active Expired - Fee Related
- 2016-02-23 JP JP2016031588A patent/JP6143138B2/ja not_active Expired - Fee Related
- 2016-05-30 HK HK16106083.7A patent/HK1218184A1/zh not_active IP Right Cessation
- 2016-05-31 HK HK16106141.7A patent/HK1218187A1/zh not_active IP Right Cessation
- 2016-09-15 JP JP2016180108A patent/JP6241632B2/ja not_active Expired - Fee Related
- 2016-10-20 HK HK16112134.4A patent/HK1224021A1/zh not_active IP Right Cessation
- 2016-10-24 HK HK16112168.3A patent/HK1224022A1/zh not_active IP Right Cessation
-
2017
- 2017-10-17 JP JP2017200693A patent/JP6508285B2/ja not_active Expired - Fee Related
-
2018
- 2018-04-24 US US15/961,061 patent/US10338482B2/en not_active Expired - Fee Related
- 2018-06-15 HK HK18107772.9A patent/HK1248325B/zh not_active IP Right Cessation
- 2018-08-28 US US16/114,498 patent/US10353301B2/en not_active Expired - Fee Related
- 2018-08-30 US US16/117,893 patent/US10353302B2/en not_active Expired - Fee Related
-
2019
- 2019-01-29 HK HK19101492.0A patent/HK1259005A1/zh unknown
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1252345A1 (zh) | 曝光裝置和曝光方法 | |
HK1193879A1 (zh) | 曝光設備和曝光方法 | |
HK1197695A1 (zh) | 曝光裝置與曝光方法 | |
HK1220516A1 (zh) | 曝光裝置與曝光方法 | |
TWI348596B (en) | Exposure apparatus and method | |
HK1199771A1 (zh) | 曝光裝置和方法 | |
TWI317807B (en) | Positioning apparatus and method | |
HK1127961A1 (en) | Exposure apparatus and device manufacturing method | |
GB0625526D0 (en) | Apparatus and method | |
GB2438875B (en) | Photo apparatus and method | |
EP1993121A4 (en) | EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD | |
GB0616555D0 (en) | Apparatus and method | |
GB0625191D0 (en) | Apparatus and method | |
EP2092454A4 (en) | METHOD AND DEVICE FOR GEOMODELL SHARING | |
GB2442608B (en) | Apparatus and method | |
TWI347597B (en) | Recording-and-reproducing apparatus and content-managing method | |
GB0623475D0 (en) | Imaging method and apparatus | |
GB0701010D0 (en) | Method and apparatus | |
GB0615752D0 (en) | Method and apparatus | |
GB0609349D0 (en) | Method and apparatus | |
GB2437303B (en) | Fixing apparatus and method | |
GB0618942D0 (en) | Apparatus and method | |
GB0704868D0 (en) | Method and apparatus | |
GB0624916D0 (en) | Apparatus and method | |
GB0611982D0 (en) | Method and apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20200903 |