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DK0735590T3 - Bipolær siliciumtransistor - Google Patents

Bipolær siliciumtransistor

Info

Publication number
DK0735590T3
DK0735590T3 DK96103580T DK96103580T DK0735590T3 DK 0735590 T3 DK0735590 T3 DK 0735590T3 DK 96103580 T DK96103580 T DK 96103580T DK 96103580 T DK96103580 T DK 96103580T DK 0735590 T3 DK0735590 T3 DK 0735590T3
Authority
DK
Denmark
Prior art keywords
silicon transistor
bipolar silicon
bipolar
transistor
silicon
Prior art date
Application number
DK96103580T
Other languages
English (en)
Inventor
Klaus Gnannt
Jakob Huber
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of DK0735590T3 publication Critical patent/DK0735590T3/da

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • H10D10/051Manufacture or treatment of vertical BJTs
    • H10D10/056Manufacture or treatment of vertical BJTs of vertical BJTs having the main current going through the whole substrate, e.g. power BJTs
    • H10D10/058Manufacture or treatment of vertical BJTs of vertical BJTs having the main current going through the whole substrate, e.g. power BJTs having multi-emitter structures, e.g. interdigitated, multi-cellular or distributed emitters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/40Vertical BJTs
    • H10D10/421Vertical BJTs having both emitter-base and base-collector junctions ending at the same surface of the body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/919Elements of similar construction connected in series or parallel to average out manufacturing variations in characteristics
DK96103580T 1995-03-27 1996-03-07 Bipolær siliciumtransistor DK0735590T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19511251A DE19511251A1 (de) 1995-03-27 1995-03-27 Bipolarer Siliziumtransistor

Publications (1)

Publication Number Publication Date
DK0735590T3 true DK0735590T3 (da) 2003-10-27

Family

ID=7757904

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96103580T DK0735590T3 (da) 1995-03-27 1996-03-07 Bipolær siliciumtransistor

Country Status (6)

Country Link
US (1) US5965929A (da)
EP (1) EP0735590B1 (da)
JP (1) JPH08274111A (da)
KR (1) KR960036118A (da)
DE (2) DE19511251A1 (da)
DK (1) DK0735590T3 (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009029900A1 (en) * 2007-08-31 2009-03-05 Applied Materials, Inc. Improved methods of emitter formation in solar cells
US8461032B2 (en) * 2008-03-05 2013-06-11 Varian Semiconductor Equipment Associates, Inc. Use of dopants with different diffusivities for solar cell manufacture
US20100304527A1 (en) * 2009-03-03 2010-12-02 Peter Borden Methods of thermal processing a solar cell
CN102315256B (zh) * 2010-07-08 2014-05-14 旺宏电子股份有限公司 双极接面晶体管装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2917455A1 (de) * 1979-04-30 1980-11-13 Ibm Deutschland Verfahren zur vollstaendigen ausheilung von gitterdefekten in durch ionenimplantation von phosphor erzeugten n-leitenden zonen einer siliciumhalbleitervorrichtung und zugehoerige siliciumhalbleitervorrichtung
US4379727A (en) * 1981-07-08 1983-04-12 International Business Machines Corporation Method of laser annealing of subsurface ion implanted regions
JPS5933860A (ja) * 1982-08-19 1984-02-23 Toshiba Corp 半導体装置およびその製造方法
JPS5987856A (ja) * 1982-11-10 1984-05-21 Toshiba Corp 半導体装置の製造方法
JPS59152665A (ja) * 1983-02-21 1984-08-31 Nec Corp 半導体装置とその製造方法
JPS6063961A (ja) * 1983-08-30 1985-04-12 Fujitsu Ltd 半導体装置の製造方法
JP2504553B2 (ja) * 1989-01-09 1996-06-05 株式会社東芝 バイポ―ラトランジスタを有する半導体装置の製造方法
US5150184A (en) * 1989-02-03 1992-09-22 Texas Instruments Incorporated Method for forming emitters in a BiCMOS process
US5047357A (en) * 1989-02-03 1991-09-10 Texas Instruments Incorporated Method for forming emitters in a BiCMOS process
JPH04159721A (ja) * 1990-10-23 1992-06-02 Nec Corp 半導体装置
JPH0529327A (ja) * 1991-07-19 1993-02-05 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
DE59610612D1 (de) 2003-08-28
EP0735590B1 (de) 2003-07-23
US5965929A (en) 1999-10-12
JPH08274111A (ja) 1996-10-18
EP0735590A2 (de) 1996-10-02
DE19511251A1 (de) 1996-10-02
EP0735590A3 (de) 1996-12-18
KR960036118A (ko) 1996-10-28

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