CN201726637U - Fanless cooling structure for electronic equipment - Google Patents

Abstract

The utility model discloses a fanless heat dissipation structure of electronic equipment, which is applied to the fanless electronic equipment; the electronic equipment is provided with a bearing seat, the bearing seat is provided with a mainboard, the mainboard is provided with electronic elements needing heat dissipation, such as a processor, a north-south bridge chip and the like, plastic radiating fins are respectively attached to the surfaces of the electronic elements needing heat dissipation, a cover body covers the bearing seat, when the electronic elements needing heat dissipation move, the electronic elements needing heat dissipation can be respectively attached between the electronic elements needing heat dissipation and the cover body by virtue of the plasticity of the plastic radiating fins, no gap exists between the cover body and the electronic elements needing heat dissipation, the generated heat is rapidly conducted to the outside by the cover body, the stop of the operation caused by overheating is avoided, and the cover body does not need to be changed along with the positions of the electronic elements needing heat dissipation, and can be produced in a large scale by virtue of the stamping mode of the same specification, so that the material and the working hour are saved.

Description

Fanless cooling structure for electronic equipment

technical field

The utility model relates to a fanless heat dissipation structure of electronic equipment, especially for fanless electronic equipment, which is a kind of close contact between the cover body and the electronic components that need heat dissipation by means of heat dissipation fins, so that the generated The heat can be quickly conducted away, so that the cover does not need to be manufactured in different specifications according to the positions of the various electronic components, which can save costs and man-hours.

Background technique

Computer peripheral equipment has become one of the indispensable life and work tools for modern people. With the electronic information of various materials, many different electronic equipment have emerged accordingly. At present, there are many applications in the market Desktop computer or storage equipment, network equipment and other electronic equipment, please refer to as shown in Figure 1, its appearance mainly includes a frame body 100, and a motherboard 110 is fixedly mounted on the frame body 100, and the motherboard 110 One side facing the frame body 100 is provided with structures such as memory and expansion slots, while the other side is provided with a processor (CPU), south bridge chip (SB), north bridge chip (NB) and some electronic components that need heat dissipation, and The frame body 100 is covered with a cover body 120, and the cover body 120 is in a concave shape 121 and is closely attached to each of the electronic components 130 that need to be dissipated by stamping. The above-mentioned electronic components 130 are used to dissipate the heat generated when the components are actuated to the outside by means of the close contact of the cover body 120. However, such a structure has the following disadvantages:

1. Each cover 120 will not be so precise when it is stamped, and there will be a certain allowable error value, and there will be a certain gap between the electronic components, so that the heat will stay in the frame 100 and cannot Distributed through the cover 120.

2. The size of each electronic component that needs heat dissipation is different, so each cover body 120 requires different specifications for each electronic component that needs heat dissipation during stamping, which easily increases the man-hour.

3. Furthermore, if the configuration of the motherboard 110 is changed due to customers or specifications, the stamping position of the cover body 120 must be changed accordingly, which is not only troublesome in manufacturing, but also wastes a lot of materials.

aim of design:

In view of the troubles of the above-mentioned external hard disk, and to make the product more attractive to consumers when it is practical, the designer of this utility model began to seek improvement and make up for its lack, in order to seek a reasonable solution. Numerous studies and designs have finally completed the fanless heat dissipation structure of the electronic equipment of the present utility model.

Utility model content

The purpose of the utility model is to provide a fanless heat dissipation structure for electronic equipment, especially a fanless heat dissipation structure for fanless electronic equipment. It is provided with a bottom plate, and a socket is arranged in the bottom plate, and a motherboard is arranged on the socket, and a processor, a north-south bridge chip and many electronic components are arranged on the motherboard, and the processor, Plastic heat sinks are attached to the surfaces of the north and south bridge chips or electronic components that generate a lot of heat during operation, and a cover is covered on the seat.

The utility model relates to a fanless cooling structure for electronic equipment, especially for electronic equipment without a fan, which includes:

a socket; and

a main board, which is arranged in the socket, and the electronic components that need to be dissipated are arranged on the main board; and

A plurality of plastic heat sinks, which are respectively attached to the surface of the electronic components that need to be dissipated; and

A cover, which is closed on the seat and tightly attached to the plastic heat sink.

In the fanless heat dissipation structure of electronic equipment, the cover body can be made of heat dissipation material.

In the fanless heat dissipation structure of electronic equipment, the surface of the cover is provided with a plurality of neatly arranged heat dissipation fins.

The beneficial effect of the utility model is that the fanless heat dissipation structure of the electronic equipment provided can make use of the plastic effect of the plastic heat dissipation sheet to make it closely adhere to the components and the cover body that need heat dissipation, and There is no gap between the cover and the heat-dissipating elements, so that the heat generated by the cover is quickly transferred to the outside world, and the action will not stop or malfunction due to overheating, and the cover does not need to dissipate heat as required The configuration of electronic components changes the production method to save materials and man-hours. The cover body of the utility model can be made of heat-dissipating materials, and the surface of the cover body is provided with a plurality of heat-dissipating fins arranged in order to accelerate heat dissipation.

Regarding the technical means and effects of the utility model to achieve the above-mentioned purpose, a feasible embodiment is given and described in detail as follows in conjunction with the drawings, so as to make the structure of the utility model easier for the examiner to understand.

Description of drawings

Fig. 1 is the schematic diagram of existing device;

Fig. 2 is a three-dimensional exploded schematic view of the first embodiment of the utility model;

Fig. 3 is a combined cross-sectional schematic diagram of the first embodiment of the utility model;

Fig. 4 is a partially enlarged schematic diagram of a combined section of the first embodiment of the present invention;

Fig. 5 is a three-dimensional exploded schematic view of the second embodiment of the present invention.

Explanation of the drawing numbers of the main components:

Bottom plate 10

Seat 20

Motherboard 30

Electronic components requiring heat dissipation 31

Plastic heat sink 40

Cover body 50

Detailed ways

First, please refer to Figures 2, 3, and 4. The utility model is a fanless heat dissipation structure for electronic equipment, especially a fanless electronic equipment, which is provided with a bottom plate 10. In this embodiment, it is a U-shaped frame. A seat 20 is provided in the bottom plate 10. The seat 20 is locked in the bottom plate 10 in a locking manner, and the seat 20 A motherboard 30 is arranged on it, and said motherboard 30 is provided with electronic components 31 that need to be dissipated on the side facing away from the bottom plate 10, such as: a processor, a southbridge chip or a northbridge chip, and many electronic components. The surface of the electronic components 31 that need to dissipate heat is respectively attached to the plastic heat sink 40, the shape and thickness of the plastic heat sink 40 can be changed at will, and the cover 50 is closed on the seat 20, which is A U-shaped frame body, the cover body 50 is also fixed on the seat 20 in a locking manner, and the cover body 50 is closely attached to the plastic heat sink 40. When in use, the plastic heat sink 40 can be used to The plastic effect makes it closely adhere to the electronic components 31 that need heat dissipation and the cover body 50, so that there is no gap between the cover body 50 and the electronic components 31 that need heat dissipation, and then make it The generated heat is quickly conducted from the cover 50 to the outside world, and will not stop or fail due to overheating (as shown in Figures 3 and 4). The configuration change of the heat-dissipating electronic components 31 can be mass-produced with the same specification to save materials and man-hours.

Please refer to FIG. 5 , the cover body 50 can be made of heat-dissipating materials, and the surface of the cover body 50 is provided with a plurality of heat-dissipating fins 51 arranged in order to accelerate heat dissipation.

To sum up, the structure of the utility model has a simple and reliable overall structure, and can be used on any kind of electronic equipment. It is very convenient to use and can improve utility.

Claims (3)

1. the no fan radiator structure of an electronic equipment refers to be applied to not have on the electronic equipment of fan especially, it is characterized in that, includes:

A bearing; And

A motherboard, it is arranged in the bearing, and described motherboard is provided with the electronic component that needs heat radiation; And

A plurality of plasticity fin, it is to abut in respectively on the electronical elements surface that needs heat radiation; And

A lid, it covers on bearing, and is close on the plasticity fin.

2. the no fan radiator structure of electronic equipment as claimed in claim 1 is characterized in that, described lid is made for the thermal diffusivity material.

3. the no fan radiator structure of electronic equipment as claimed in claim 1 is characterized in that described top surface is provided with the radiating fin of a plurality of marshallings.

Images