CN206178630U - Vacuum cavity radiator - Google Patents

Abstract

The utility model provides a vacuum cavity radiator, includes soaking plate and fin, the inside vacuum cavity that is equipped with of soaking plate, the vacuum cavity holds phase transition working medium, the soaking plate has upper surface and lower surface, the fin with the upper surface heat conduction of soaking plate is connected, the lower surface is used for contacting with a source of heat generation, the radiator still including set up in the mounting structure of soaking plate lower surface, mounting structure be used for with the radiator is installed to one and is born on the component in the source of heat generation, makes the soaking plate lower surface with the source of heat generation contacts, mounting structure is including setting up the connecting structure of soaking plate lower surface and with connecting structure fixed connection's fixed knot constructs, fixed knot construct be used for with bear the component fixed connection in the source of heat generation.

Description

Vacuum chamber radiator

technical field

The invention relates to a heat sink, in particular to a heat sink in a vacuum chamber that can meet the changing requirements of the installation position.

Background technique

Electronic components, such as computer CPUs, generate a lot of heat when they work, and radiators are generally used to dissipate them. With the application of the vacuum chamber, the radiator has greatly improved the heat dissipation capacity of the computer and other systems. More and more computers use the radiator with the vacuum chamber. Traditional heat sinks with a vacuum chamber structure have holes on both sides and lock screws, as shown in Figure 9. The screw hole pitch is relatively large, and it is difficult to meet the installation requirements for some systems that require a smaller hole pitch. If the screw holes are closer to the middle, it will inevitably affect the cavity structure of the vacuum chamber, thereby affecting the heat dissipation performance of the product. Since the vacuum chamber must be a completely closed and vacuum chamber to have good thermal conductivity, it is not possible to open holes directly. If the hole is opened and then sealed, there will be a risk of air leakage, and it will change the structure of the chamber and its thermal conductivity. It also got worse.

Therefore, how to install the radiator on the main board or other components carrying the heat source without affecting the cavity structure of the vacuum chamber requires a small hole pitch or a change in the installation position is an urgent problem to be solved by those skilled in the art.

Contents of the invention

In view of this, the present invention proposes a vacuum chamber heat sink that can meet the requirements of changing installation positions.

The invention provides a vacuum chamber radiator, which includes a vapor chamber and heat sinks. A vacuum chamber is arranged inside the chamber, and a phase-change working medium is contained in the chamber. The chamber has an upper surface and a The lower surface, the heat sink is thermally connected to the upper surface of the vapor chamber, the lower surface is used to contact a heat source, and the radiator also includes an installation structure arranged on the lower surface of the vapor chamber, The mounting structure is used to mount the heat sink on a component carrying the heat source, so that the lower surface of the vapor chamber is in contact with the heat source, and the mounting structure includes The connecting structure on the lower surface and the fixing structure fixedly connected with the connecting structure, the fixing structure is used for fixedly connecting with the element carrying the heat source.

In one embodiment, the connection structure includes a metal sheet with a middle opening, the metal sheet is fixedly connected to the lower surface of the heat chamber, and the middle opening exposes a part of the lower surface of the heat chamber so that the The portion of the lower surface of the vapor chamber can be in contact with the heat source.

In one embodiment, the metal sheet is fixed to the lower surface of the vapor chamber by welding.

In an embodiment, a buckle portion extends from a side of the metal sheet, and the buckle portion is buckled and fixed to an edge of the heat chamber.

In some embodiments, the fixing structure includes several studs fixed on the metal sheet.

In one embodiment, the connection structure is a plastic part, including a plastic sheet with a central opening and a buckle part connected to the plastic sheet, and the plastic sheet is attached to the lower surface of the vapor chamber, so The buckle part is buckled and fixed to the edge of the heat chamber, and the central opening exposes a part of the lower surface of the heat chamber so that the part of the lower surface of the heat chamber can be in contact with the heat source.

In one embodiment, the buckle part includes several buckle strips extending from the side of the plastic sheet, the ends of the buckle strips are bent structures, and the bent structures are connected to the uniform The edge of the hot plate snaps into place.

In one embodiment, the buckle part includes a buckle piece extending integrally from the side of the plastic sheet and two bending strips integrally and vertically extending from both sides of the end of the buckle piece. The two bending strips are fastened to the edges of the vapor chamber with buckles.

In one embodiment, the fixing structure includes several studs fixed on the plastic sheet.

In one embodiment, the fixing structure is several studs, and the connection structure includes several dimples arranged on the lower surface of the vapor chamber, and the dimples do not penetrate through the bottom wall of the vacuum chamber and are in contact with The vacuum cavity is connected, and the several studs are fixed in the several pits through threaded connection, welding or riveting.

To sum up, the vacuum cavity radiator provided by the present invention is provided with some additional installation structures or simple concave structures, such as metal sheets fixed on the bottom surface of the radiator vapor chamber, plastic parts fixed on the radiator with undercuts or It is to punch out a pit that is not connected with the vacuum chamber on the bottom surface of the vapor chamber. By setting studs on these metal sheets, plastic parts or pits, and using the studs to connect and fix the main board, the assembly requirements are completed. The position of the studs can be adjusted according to the actual installation position. Therefore, without changing the structure of the vacuum chamber, the installation position of the radiator of the present invention can meet the requirements of changing installation positions. The radiator of the present invention is simple in structure, easy to realize, low in cost, convenient to install and disassemble, and has a wide range of applications. It meets the installation requirements of the smaller hole distance of the main board without changing the vacuum chamber structure of the radiator, and ensures better product quality. Thermal performance, while providing the possibility of a smaller motherboard design. Moreover, compared with the existing installation method that needs to destroy or reduce a part of the heat sink, the installation method of the present invention can avoid any impact on the heat sink.

Description of drawings

Fig. 1 is a schematic diagram of an embodiment of the radiator of the present invention.

Fig. 2 is an exploded schematic view of the radiator in Fig. 1 .

Fig. 3 is a schematic diagram of another embodiment of the radiator of the present invention.

FIG. 4 is an exploded schematic diagram of the radiator in FIG. 3 .

Fig. 5 is a schematic diagram of another embodiment of the radiator of the present invention.

FIG. 6 is an exploded schematic view of the radiator in FIG. 5 .

Fig. 7 is a schematic diagram of another embodiment of the radiator of the present invention.

FIG. 8 is an exploded schematic diagram of the radiator in FIG. 7 .

Fig. 9 is a schematic diagram of a conventional heat sink.

detailed description

Before describing the embodiments in detail, it should be understood that the present invention is not limited to the detailed structures or arrangements of elements described herein below or in the accompanying drawings. The present invention can be implemented in other ways. Also, it should be understood that the phraseology and terminology used herein are for descriptive purposes only and should not be interpreted as limiting. The terms "including", "comprising", "having" and similar expressions used herein are meant to include the items listed thereafter, their equivalents and other additional items. In particular, when "a certain element" is described, the present invention does not limit the number of the element to one, but may also include a plurality.

The invention provides a radiator for a vacuum cavity, which includes a soaking plate, several cooling fins and an installation structure. A vacuum cavity is provided inside the vapor chamber, and a phase-change working medium is contained in the vacuum cavity to provide good heat dissipation performance for the radiator. The vapor chamber has an upper surface and a lower surface. Several cooling fins are thermally connected with the upper surface of the heat vapor chamber, so that the heat on the heat vapor chamber can be conducted to the heat dissipation fins for dissipating. The lower surface of the vapor chamber is used to be in contact with a heat source, such as a CPU, so as to absorb heat generated by the heat source. The mounting structure is arranged on the lower surface of the vapor chamber, and is used for mounting the heat sink on a component carrying the CPU, such as a computer motherboard, while making the lower surface of the vapor chamber contact the CPU. The installation structure includes a connection structure arranged on the lower surface of the heat chamber and a fixing structure fixedly connected with the connection structure. Wherein, the connection structure is used as an intermediate structure connecting the vapor chamber and the fixed structure at the same time, the fixed structure and the vapor chamber are fixed together, and then the fixed structure is fixedly connected with the computer motherboard, thereby fixing the radiator on the computer motherboard.

The present invention will be described in detail below in conjunction with multiple embodiments.

Embodiment one

As shown in Figures 1 and 2, a vacuum chamber radiator 2 is provided, including a vapor chamber 4, a heat sink 6 and an installation structure. A vacuum chamber (not shown) is provided inside the vapor chamber 4, and the vacuum chamber accommodates There is a phase change working substance. The vapor chamber 4 has an upper surface 8 and a lower surface 10 , and the cooling fins 6 are thermally connected to the upper surface 8 of the vapor chamber 4 , so that the heat on the vapor chamber 4 can be conducted to the cooling fins 6 for dissipating. The lower surface 10 of the vapor chamber 4 is used to contact a computer CPU to absorb the heat generated by the CPU. The mounting structure is arranged on the lower surface 10 of the vapor chamber 4 for mounting the heat sink 2 on the computer motherboard carrying the CPU, and at the same time makes the lower surface 10 of the vapor chamber be in contact with the CPU. The installation structure includes a connection structure arranged on the lower surface 10 of the heat chamber and a fixing structure fixedly connected to the connection structure.

In the illustrated embodiment, the vapor chamber 4 has a square structure, and in other embodiments, the vapor chamber 4 may also be in other shapes, such as a circle, according to design requirements. The connection structure is a metal sheet 16, which is fixedly connected to the lower surface 10 of the vapor chamber 4. In this embodiment, the metal sheet 16 is fixed on the lower surface 10 of the vapor chamber 4 by welding. In other embodiments, it can also be fixed in other ways, for example, a buckle part is extended on the side of the metal sheet 16, and the buckle part is fastened with the edge of the heat vapor chamber 4, so that the metal sheet 16 is fixed on the On the lower surface 10 of the vapor chamber 4 .

In this embodiment, the fixing structure is a stud 18 fixed on the metal sheet 16, and the stud 18 is used to connect and fix with the computer motherboard. In this embodiment, the stud 18 is welded and fixed on the metal sheet 16 , but the present invention is not limited thereto. In other embodiments, the stud 18 may also be fixedly connected to the metal sheet 16 by means of screw connection or riveting. The metal sheet 16 is configured to have an opening in the middle, so that the CPU of the computer motherboard or other heat sources can pass through the opening and contact the vapor chamber 4 to achieve the purpose of heat dissipation.

In the illustrated embodiment, the metal sheet 16 has a square structure, and the number of studs 18 is set to four, and the four studs 18 are respectively arranged symmetrically on both sides of the metal sheet 16 . In other embodiments, the metal sheet 16 can also be designed in other shapes, such as circular or polygonal, according to specific design requirements. Correspondingly, other numbers of studs 18 can also be set, as long as the radiator 2 can be stably fixed on the main board.

In this embodiment, the area enclosed by the sides of the metal sheet 16 is smaller than the area of the lower surface of the vapor chamber, so the studs 18 fixed on the metal sheet 16 can be close to the middle of the vapor chamber 4 . The specific position of the stud 18 can be determined according to the actual installation requirements of the radiator, such as the pitch of the screw holes. Since the stud 18 is fixed by the metal sheet 16, the position of the stud 18 on the metal sheet 16 can be adjusted arbitrarily according to requirements. Therefore, the position of the stud 18 can be adjusted arbitrarily without damaging the vacuum chamber in the vapor chamber 4 , which greatly improves the installation adaptability of the heat sink in the vacuum chamber.

Embodiment two

As shown in FIG. 3 and FIG. 4 , the structures and installation methods of the vapor chamber 4 and the heat sink 6 in this embodiment are similar to those in the first embodiment, and will not be repeated here.

In this embodiment, the installation structure includes a connection structure arranged on the lower surface 10 of the vapor chamber and a fixing structure fixedly connected to the connection structure. Wherein, the connecting structure is a plastic part 20 , which is fixed on the lower surface 10 of the vapor chamber 4 by buckles, so the plastic part 20 can be easily installed and removed from the vapor chamber 4 .

Specifically, the plastic part 20 includes a plastic sheet 24 with a central opening and a snap part connected to the plastic sheet 24. The plastic sheet 24 is attached to the lower surface 10 of the vapor chamber 4, and the snap part is connected to the vapor chamber 4. The edge of the vapor chamber is fastened with buckles, and the central opening exposes a part of the lower surface 10 of the vapor chamber so that this part of the lower surface 10 of the vapor chamber can be in contact with the CPU. In the illustrated embodiment, the vapor chamber 4 extends outwardly along its side to form a ring of protrusions 28 .

In the embodiment shown in FIG. 3 and FIG. 4 , the buckle part includes several buckle strips 26 extending integrally from the side of the plastic sheet 24 , and the ends of the buckle strips 26 are arranged as bent structures 30 , which The bending structure 30 is buckled on the upper edge of the protruding portion 28 of the heat chamber 4 to fix the plastic part 20 on the heat chamber 4 .

In this embodiment, the buckle part cooperates with the protruding part 28 formed on the vapor chamber 4 to realize buckle fixing. It should be understood that, in other embodiments, the buckle part can also be fixed to the vapor chamber 4 in other ways, for example, opening a hole on the side of the heat chamber 4 to cooperate with the buckle part, as long as the buckle part can It only needs to be buckled and fixed with the vapor chamber 4, and the present invention is not limited thereto.

In this embodiment, the fixing structure is a stud 22 fixed on the plastic sheet 24, and the stud 22 is used for connecting and fixing with the computer main board. Wherein, the stud 22 can be fixed on the plastic sheet 24 in various ways, such as riveting or integral injection molding. In this embodiment, the stud 22 is fixedly connected with the plastic sheet 24 through integral injection molding.

In this embodiment, the plastic sheet 24 has a square structure, and there are two buckle strips 26 extending from each side of the plastic sheet 24 . Of course, the design of two buckle strips 26 on each side of the plastic sheet 24 is only illustrative. In other embodiments, the number of buckle strips 26 on each side can also be other numbers, as long as it meets the design requirements. And it only needs to be able to fix the plastic part 20 well on the vapor chamber 4 . The number of studs 22 is set to four, and the four studs 22 are symmetrically arranged on both sides of the plastic sheet 24 . In other embodiments, the plastic sheet 24 can also be designed in other shapes according to specific design requirements, such as circular or polygonal. Correspondingly, the number of studs 22 can also be set to other numbers, as long as the radiator 2 can be stably fixed on the computer motherboard.

Fig. 5 and Fig. 6 illustrate another embodiment of the buckle part. As shown in Figures 5 and 6, the buckle part includes a buckle piece 32 extending integrally from the middle of the side of the plastic sheet 24 and two bending strips 34 extending vertically from both sides of the end of the buckle piece 32 integrally. The buckle 32 is attached to the lower surface 10 of the vapor chamber, and the bent strip 34 is buckled on the upper edge of the protrusion 28 of the vapor chamber 4 to fix the plastic part 20 on the vapor chamber 4 .

In this embodiment, there is one locking piece 32 extending from each side of the plastic sheet 24 , and there are two bending strips 34 extending from the locking piece 32 . Of course, the design of two bending strips 34 is only illustrative. In other embodiments, in order to enhance the buckling ability of the buckle part, the number of bending strips 34 can also be increased, or the bending strips 34 can be designed directly It is a bent piece, as long as it meets the design requirements and can well fix the plastic part 20 on the vapor chamber 4 .

Likewise, in this embodiment, the area enclosed by the sides of the plastic sheet 24 is smaller than the area of the lower surface 10 of the vapor chamber, so the studs 22 fixed on the plastic sheet 24 can be close to the middle of the vapor chamber 4 . The specific position of the stud 22 can be determined according to the actual installation requirements of the radiator, such as the pitch of the screw holes. Since the stud 22 is integrally formed with the plastic sheet 24, the position of the stud 22 on the plastic sheet 24 can be adjusted arbitrarily according to requirements. Therefore, the position of the studs 22 can be adjusted arbitrarily without damaging the vacuum chamber in the vapor chamber 4 , which greatly improves the installation adaptability of the heat sink in the vacuum chamber.

Embodiment three

As shown in FIG. 7 and FIG. 8 , the structures and installation methods of the vapor chamber 4 and the heat sink 6 in this embodiment are similar to those in the first embodiment, and will not be repeated here.

In this embodiment, the installation structure includes a connection structure arranged on the lower surface 10 of the vapor chamber and a fixing structure fixedly connected to the connection structure. Wherein, the connecting structure is a pit 36 provided on the lower surface 10 of the vapor chamber, and the pit 36 does not penetrate through the bottom wall of the vacuum chamber of the vapor chamber 4 but communicates with the vacuum chamber. The fixing structure is a stud 38, and the stud 38 is used for connecting and fixing with the computer main board.

The studs 38 can be fixed into the recesses 36 by screwing, welding or riveting. In this embodiment, threads are provided on the inner wall of the pit 36 , and then the stud 38 is screwed into the pit 36 . In other embodiments, it is also possible to put the stud 38 into the pit 36 and then weld it with solder, or to use riveting, as long as the stud 38 can be firmly fixed in the pit 36. Can.

In the illustrated embodiment, the number of the dimples 36 and the studs 38 are both set to four, and the four dimples 36 are arranged in a square shape. In other embodiments, the number of the dimples 36 and the studs 38 can also be other numbers according to actual design requirements, as long as the heat sink 2 can be stably fixed on the computer motherboard.

In this embodiment, the recess 36 is formed on the lower surface 10 of the vapor chamber, and the studs 38 are fixed in the recess 36 . Since the pit 36 is formed on the lower surface 10 of the vapor chamber 4 , the position of the pit 36 can be adjusted arbitrarily according to requirements. Therefore, without damaging the vacuum chamber in the vapor chamber 4 , the position of the recess 36 , that is, the stud 18 can be adjusted arbitrarily, which greatly improves the installation adaptability of the heat sink in the vacuum chamber.

It should be understood that, in the above-mentioned embodiments, the heat sink 2 is fixed to a computer motherboard by using the mounting structure, but the present invention is not limited thereto. In other embodiments, the mounting structure, or using the The heat sink 2 with the above mounting structure can also be applied to components of other electronic devices, such as LED chip motherboards.

It should also be understood that the fixing structures used in the above embodiments are all studs, and in other embodiments, other types of fixing structures may also be used according to the type of the main board and actual design and installation requirements.

To sum up, the vacuum cavity radiator provided by the present invention is provided with some additional installation structures or simple concave structures, such as metal sheets fixed on the bottom surface of the radiator vapor chamber, plastic parts fixed on the radiator with undercuts or It is to punch out a pit that is not connected with the vacuum chamber on the bottom surface of the vapor chamber. By setting studs on these metal sheets, plastic parts or pits, and using the studs to connect and fix the main board, the assembly requirements are completed. The position of the studs can be adjusted according to the actual installation position. Therefore, without changing the structure of the vacuum chamber, the installation position of the radiator of the present invention can meet the requirements of changing installation positions. The radiator of the present invention is simple in structure, easy to realize, low in cost, convenient to install and disassemble, and has a wide range of applications. It meets the installation requirements of the smaller hole distance of the main board without changing the vacuum chamber structure of the radiator, and ensures better product quality. Thermal performance, while providing the possibility of a smaller motherboard design. Moreover, compared with the existing installation method that needs to destroy or reduce a part of the heat sink, the installation method of the present invention can avoid any impact on the heat sink.

The concepts described herein may be implemented in other forms without departing from their spirit and characteristics. The particular embodiments disclosed are to be considered as illustrative rather than restrictive. Accordingly, the scope of the invention is to be determined by the appended claims rather than by these preceding descriptions. Any change within the literal meaning of the claims and within the range of equivalency shall belong to the scope of these claims.

Claims (10)

1. A vacuum cavity radiator, comprising a soaking plate and a cooling fin, the inside of the soaking plate is provided with a vacuum cavity, and a phase change working fluid is accommodated in the vacuum cavity, and the soaking plate has an upper surface and a lower surface surface, the heat sink is thermally connected to the upper surface of the vapor chamber, and the lower surface is used to be in contact with a heat source. It is characterized in that the radiator also includes a The installation structure is used to install the heat sink on a component carrying the heat source so that the lower surface of the vapor chamber is in contact with the heat source, and the installation structure includes a The connecting structure on the lower surface of the vapor chamber and the fixing structure fixedly connected to the connecting structure, the fixing structure is used to be fixedly connected to the element carrying the heat source. 2. The vacuum chamber radiator according to claim 1, wherein the connecting structure comprises a metal sheet with a middle opening, the metal sheet is fixedly connected to the lower surface of the vapor chamber, and the middle opening exposes A portion of the lower surface of the vapor chamber enables the portion of the lower surface of the vapor chamber to be in contact with the heat generating source. 3. The vacuum chamber heat sink according to claim 2, wherein the metal sheet is fixed to the lower surface of the vapor chamber by welding. 4 . The vacuum chamber heat sink according to claim 2 , wherein a buckle portion is extended from a side of the metal sheet, and the buckle portion is fastened to an edge of the vapor chamber. 5 . 5 . The vacuum chamber heat sink according to any one of claims 2 to 4 , wherein the fixing structure includes several studs fixed on the metal sheet. 6 . 6. The vacuum cavity radiator according to claim 1, wherein the connecting structure is a plastic part, comprising a plastic sheet with a central opening and a buckle part connected to the plastic sheet, and the plastic sheet is attached to It is provided on the lower surface of the vapor chamber, the buckle part is fastened with the edge of the vapor chamber, and the central opening exposes a part of the lower surface of the vapor chamber so that the lower surface of the vapor chamber is This part can be in contact with the heat source. 7. The vacuum chamber heat sink according to claim 6, wherein the buckle part includes a plurality of buckle strips extending from the side of the plastic sheet, and the ends of the buckle strips are bent A folding structure, and the bending structure is fastened with the edge of the heat chamber. 8. The vacuum chamber heat sink according to claim 6, wherein the buckle part includes a buckle piece extending integrally from the side of the plastic sheet and two ends of the buckle piece Two bending strips vertically extending side by side, the two bending strips are fastened with the edge of the heat chamber. 9 . The vacuum chamber heat sink according to any one of claims 6 to 8 , wherein the fixing structure includes several studs fixed on the plastic sheet. 10 . 10. The vacuum chamber radiator according to claim 1, wherein the fixing structure is a plurality of studs, and the connection structure includes a plurality of pits arranged on the lower surface of the vapor chamber, and the pits The pit does not pass through the bottom wall of the vacuum chamber but communicates with the vacuum chamber, and the several studs are fixed into the several pits by threaded connection, welding or riveting.