CN201167451Y - Flat plate type heat dissipation device - Google Patents

Abstract

The utility model relates to a flat plate type heat dissipation device, which comprises a heat conduction base, a temperature equalizing plate and a fin group; the heat conducting base is provided with a heat conducting surface, the temperature equalizing plate is in heat transfer connection with the heat conducting surface, the temperature equalizing plate extends towards the lateral direction of the heat conducting base, the fin group is configured on the part of the temperature equalizing plate extending towards the lateral direction of the heat conducting base, and the fin group and the heat conducting base are both positioned on the same side of the temperature equalizing plate. The utility model discloses a flat plate heat abstractor reducible this flat plate heat abstractor shared space in height can be applied to restricted occasion in height or thickness.

Description

Flat heat sink

technical field

The utility model relates to a radiator, in particular to a flat-plate heat dissipation device formed by extending a uniform temperature plate.

Background technique

At present, as the scope of application of computers is becoming wider and wider, it is also increasingly moving toward portable designs. Therefore, in order to cooperate with the cooling device used in the computer, its form must also be changed for the applicable occasions of the central processing unit in the computer. For example: the heat dissipation device used in a personal computer, due to its large internal space and enough space to install a fan, it can still be provided by a basic aluminum or copper heat sink and its matching fan. Heat dissipation; however, the heat dissipation devices used in notebook or portable computers are often limited by the narrow space, not only cannot use the more common aluminum extruded heat sink, but even the fan is limited to centrifugal type, so it can be used.

In addition, heat conduction components such as heat pipes or vapor chambers that provide heat transfer through the circulation of vapor and liquid phases are often used in the field of heat dissipation. Especially the heat pipe, because the heat pipe is easier to manufacture in shape, does not take up space, and can guide the heat generated by the central processing unit along its lateral direction to the heat dissipation area through the extension of its tube length, and then pass through fins or heat pipes. Fans and other heat dissipation means are used to achieve the purpose of heat dissipation. Therefore, the heat pipe is quite suitable for applications where space is limited, such as notebook computers. Vapor chambers are often used to replace the solid base of radiators in the past, so although the principle is the same as that of heat pipes, the actual application conditions are different due to the difference in shape between the two. .

However, although the heat pipe takes up less space, its pipe diameter is still not as thin as the chamber thickness compared with the chamber thickness. However, the manufacturing of the vapor chamber is often limited by the large area of the plate body, and it is easy to cause deformation problems such as inward depression of the plate body during the degassing operation, and it is difficult to form a flat heating surface or heat dissipation surface. If it is directly used Attaching a heat source also cannot achieve a good heat transfer contact effect.

Utility model content

In view of this, the main purpose of the present invention is to provide a thinner flat-plate heat sink with reduced height and occupied space.

In order to achieve the above purpose, the utility model provides a flat-plate heat dissipation device, which includes a heat conduction base, a vapor chamber and a fin group; wherein, the heat conduction base has a heat conduction surface, and the heat conduction plate is connected to the On the heat conduction surface, the temperature chamber extends laterally toward the heat conduction base, the fin group is arranged at the part where the temperature chamber extends laterally toward the heat conduction base, and the fin group and the heat conduction base are located on the same side of the vapor chamber.

It can be seen from the above technical solutions that the plate heat sink of the present invention makes use of the thinner thickness of the vapor chamber to make the plate heat sink overall thinner, and the heat transfer path can also extend along the length of the plate body, and the The heat conduction base and the fin group of the flat heat sink are located on the same side of the vapor chamber, which greatly reduces the space occupied by the flat heat sink in height, so it can be applied to occasions with limited height or thickness.

Description of drawings

Fig. 1 is the three-dimensional exploded schematic view of the utility model;

Fig. 2 is the three-dimensional combination schematic diagram of the present utility model;

Fig. 3 is a schematic cross-sectional view of the utility model;

Fig. 4 is the enlarged schematic diagram of part A in Fig. 3;

Fig. 5 is a schematic diagram of the usage state of the utility model.

Explanation of reference signs

Thermal base 1

Heating surface 10 Heat conduction surface 11

Keyhole 12

Vapor plate 2

Fin set 3

Fin 30 Hem 300

Recessed area 31 Locking piece 32

Electronic heating component 4 circuit board 40 bolt 41

Detailed ways

In order to further explain the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the accompanying drawings are for reference and illustration only, and are not intended to limit the present utility model.

Please refer to FIG. 1 and FIG. 2 , which are respectively a three-dimensional exploded schematic diagram and a three-dimensional combined schematic diagram of the utility model. A flat-plate heat dissipation device provided by the utility model includes a heat conduction base 1 , a uniform temperature plate 2 , and at least one fin group 3 .

Wherein, as shown in FIG. 1 , the heat conduction base 1 is approximately flat and made of a material with good heat conductivity, such as aluminum and copper. The bottom surface of the heat conduction base 1 is a heat receiving surface 10, which is used for bonding with electronic heating components 4 (as shown in FIG. 5 ) such as a central processing unit; and the top surface of the heat conduction base 1 is a heat conduction surface 11, through which 11 and heat transfer connection with the above-mentioned temperature chamber 2, so that the heat conduction base 1 can guide the heat absorbed by it to the temperature chamber 2. In addition, the heat conduction base 1 can also be further pierced with lock holes 12 near the periphery or corners, which can be inserted by the fixed components (omitted in the figure) that cooperate with each other, and then the heat conduction base 1 can be fixed on such as a central processing unit. on the circuit board (such as the motherboard) where the device is installed.

The vapor chamber (Vapor chamber) 2 is vacuum-sealed, and has capillary tissue on its inner wall, and is filled with working fluid inside. The vapor chamber 2 is a heat conduction component that provides heat transfer through vapor-liquid phase change . The vapor chamber 2 is a long flat body, one part of which is attached to the heat conduction surface 11 of the heat conduction base 1 for heat transfer connection, and the other part extends laterally toward the heat conduction base 1 . In the example of the present utility model, the vapor chamber 2 is attached and fixed to the heat conduction surface 11 of the heat conduction base 1 at its mid-section, and the other two ends in the form of elongated strips protrude respectively. Extending outside the heat conduction base 1, the heat conduction base 1 can guide the absorbed heat to the middle part of the chamber 2, and then through the high heat conduction characteristics of the chamber 2, the The heat is conducted respectively via both ends of the vapor chamber 2 .

The fin group 3 is composed of two or more fins 30 arranged at intervals in the transverse direction, and each fin 30 is bent with a folded edge 300 . Please refer to Fig. 3 and Fig. 4 together, the folded edge 300 of each fin 30 can be used as the pitch of these fins 30 on the horizontal spaced arrangement, and the folded edge 300 of each fin 30 can be bent after bending. A recessed area 31 is formed above the fin group 3, so that the part of the above-mentioned temperature chamber 2 extending from the heat conduction base 1 is accommodated in the recessed area 31, and is folded with the edge of each fin 30. 300, so that the fin group 3 is located below the chamber 2, that is, it is located on the same side of the chamber 2 as the heat conduction base 1 above. In this way, the height of the flat heat sink can reduce the space it occupies, so it can be applied to occasions with limited height or thickness.

The joints between the heat conduction base 1 , the chamber 2 and the fin group 3 can be joined by means or methods with heat conduction, such as soldering or heat conduction glue, so as to facilitate the solid connection between the components.

Therefore, the flat heat sink of the present invention can be obtained by the above-mentioned structural composition.

Accordingly, as shown in FIG. 5, when the flat heat sink is applied to an electronic heating component 4 such as a central processing unit, the heat receiving surface 10 of the heat conduction base 1 is attached to the upper surface of the electronic heating component 4, and It can be positioned through the lock hole 12 on the heat conduction base 1; in addition, the outermost fins 30 of the fin group 3 can also form an outwardly bent locking piece 32 for threaded components such as bolts 41 to penetrate. The flat heat sink is positioned on the circuit board 40 . The flat heat dissipation device uses the structure extending laterally of the chamber 2 as a heat conduction path, especially the heat conduction base 1 is arranged below the middle part of the chamber 2, so that both ends of the chamber 2 can be used as condensation ends and respectively The fin group 3 is connected, and in the practical application of the flat heat sink, the fin group 3 is arranged here by means of the gap between the vapor chamber 2 and the circuit board 40, so that The overall height of the flat heat sink is close to the circuit board 40, which effectively reduces the occupied space.

But the above description is only the preferred feasible embodiment of the present utility model, and is not used to limit the patent application scope of the present utility model, so all equivalent structural changes made by using the specification of the utility model and the contents of the accompanying drawings are equally valid. Included in the application scope of the present utility model.

Claims (7)

1. A flat heat sink, characterized in that the flat heat sink comprises: a thermally conductive base having a thermally conductive surface; a vapor chamber, which is thermally connected to the heat-conducting surface and extends laterally toward the heat-conducting base; and A fin group is arranged on the position where the temperature chamber extends laterally toward the heat conduction base, and the fin group and the heat conduction base are located on the same side of the temperature chamber. 2. The flat heat sink according to claim 1, wherein a lock hole for positioning is provided on the heat conduction base. 3. The flat heat dissipation device according to claim 1, characterized in that, the vapor chamber is a long flat body, and the heat conduction base is arranged at the middle part of the vapor chamber, and the vapor chamber Two ends of the temperature chamber are formed by the parts extending laterally toward the heat conduction base. 4. The flat-plate heat sink according to claim 3, characterized in that the flat-plate heat sink further comprises another set of fins, and the two sets of fins are respectively arranged at two ends of the chamber department. 5. The flat-plate heat sink according to claim 1, wherein the fin group is composed of two or more fins, and each fin is bent with a folded edge, and the folded edge and the folded edge are The vapor chamber is attached. 6. The flat-plate heat sink according to claim 5, wherein the folded edge of each fin is bent to form a recessed area on the fin group, and the temperature chamber is accommodated in the recessed area. area and attach to each of the hems. 7. The flat heat sink according to claim 1, wherein the fin group is composed of two or more fins, and the outermost fins are formed with outwardly bent Locking tabs for positioning.

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