CN204392738U - heat sink - Google Patents

Abstract

A heat dissipating double-fuselage, including a heat-dissipating part and a heat-conducting piece and a support piece, should heat-conducting piece one side and should heat-dissipating part correspond to paste and establish, and should heat-conducting piece relative week side forms at least a connecting portion and perforation respectively, and this support piece corresponds to make up in this heat-conducting piece opposite side, and this support piece relative week side also forms at least a connecting portion and this connecting portion corresponding combination respectively to this support piece central point department forms a fretwork district, sees through the utility model discloses the design of this structure, can increase this heat-conducting piece by a wide margin with the locking power that bears when the heat-dissipating part combines to improve this heat-conducting piece deformation problem person.

Description

heat sink

【Technical field】

The utility model relates to a heat dissipation device that can greatly increase the locking force when combined with the heat dissipation element, and can also improve the deformation of the heat conduction element.

【Background technique】

Due to the advancement of the technology era, the operating performance of electronic components is getting higher and higher, so that the functional requirements for the heat dissipation unit are also increasing. In order to increase the heat dissipation effect, the conventional heat dissipation units have adopted a large number of stacked heat dissipation fins. , and continue to develop and improve the heat dissipation fins, so high-efficiency heat dissipation devices have become one of the most important research and development priorities in the industry today, or a heat dissipation element is arranged above the electronic component and through the heat dissipation element. The element dissipates heat, and the heat sink is usually a radiator or a heat dissipation fin correspondingly equipped with a heat dissipation fan for heat dissipation, and the heat source is guided to one side for heat dissipation through the heat conduction element attached to the heat dissipation element.

It is known that the heat conduction element that uses the vapor chamber to provide heat transfer through the cycle change of the vapor-liquid phase is often used in the field of heat dissipation; The thickness of the plate body corresponding to the cover is quite thin, so when the heat sink is locked on the heat conduction element, due to the increasing demand for the locking force of the heat conduction element, the current heat conduction element cannot withstand such a situation. A large locking force will lead to the problem of bending and deformation of the heat-conducting element, resulting in greatly reduced heat-conducting effect, and even failure in severe cases.

As mentioned above, conventional knowledge has the following shortcoming:

1. Unable to withstand large locking force;

2. Cause deformation problems;

3. Poor thermal conductivity.

Therefore, how to solve the above-mentioned common problems and deficiencies is the direction that the utility modeler of this case and the relevant manufacturers engaged in this industry want to study and improve.

【Content of utility model】

In order to effectively solve the above problems, the main purpose of this utility model is to provide a heat dissipation device that can increase the locking force that the heat conduction element and the heat dissipation element are subjected to when combined.

The secondary purpose of this utility model is to provide a heat dissipation device that improves the deformation problem of the heat conduction element.

The secondary purpose of this utility model is to provide a heat dissipation device that greatly improves the heat conduction effect.

In order to achieve the above purpose, the utility model provides a heat dissipation device, comprising: a heat dissipation element with a plurality of heat dissipation fins; Respectively form at least one joint portion; and a support member, which is correspondingly combined on the other side of the heat conduction member, and at least one joint portion is formed on the opposite side of the support member to be correspondingly combined with the joint portion, and the support member A hollow area is formed at the central position.

The heat conduction element is a uniform temperature plate, and a boss is formed at the central position of the temperature uniform plate to be correspondingly accommodated in the hollowed out area.

The heat conducting element has a first side and a second side, the first side is combined with the supporting element correspondingly, and the second side is attached correspondingly with the heat dissipation element.

The support has an upper side and a lower side, the upper side is protruded with at least one protruding part, the lower side forms at least one groove corresponding to the position of the protruding part, and the protruding part is distributed on the support part upper side.

An extension portion is further extended from the peripheral edge of the support member toward the lower side, and the extension portion covers the heat conducting member.

Four corners of the supporting member further have at least one hole.

The four corners of the heat conducting member further have at least one perforation corresponding to communicate with the hole.

The heat sink further forms at least one depression, and the holes and perforations correspond to the depression.

The material of the support member can be selected as either metal or non-metal.

Through the design of this structure of the utility model, when the heat-conducting element and the supporting element are combined with each other, the heat-dissipating element can withstand a greater locking force when locked. In addition, it can also improve the conventional Heat conduction parts are prone to deformation problems.

【Description of drawings】

Fig. 1A is a perspective view 1 of the first embodiment of the support member of the heat dissipation device of the present invention;

Fig. 1B is the second perspective view of the first embodiment of the support member of the heat dissipation device of the present invention;

Fig. 2A is a three-dimensional exploded view of the first embodiment of the heat dissipation device of the present invention;

Fig. 2B is a three-dimensional assembly diagram of the first embodiment of the heat dissipation device of the present invention;

Fig. 3 is a perspective view of the second embodiment of the heat dissipation device of the present invention;

Fig. 4A is a three-dimensional exploded view of the second embodiment of the heat dissipation device of the present invention;

FIG. 4B is a three-dimensional assembled view of the second embodiment of the heat dissipation device of the present invention.

The component names corresponding to the reference signs in the figure are:

Heat sink 2

Radiator 21

Radiating fins 211

Depression 212

Heat conduction 22

first side 221

second side 222

Boss 223

Assembly part 224

Perforation 225

Support 23

upper side 231

Protrusion 2311

Lower side 232

Groove 2312

Extension 233

hole 234

docking part 235

Hollow area 236

【Detailed ways】

The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Figure 1A and 1B and 2A and 2B are the perspective view of the first embodiment of the heat dissipation device of the present invention, the three-dimensional exploded view and the three-dimensional combination diagram of the support member, and the heat dissipation device. As shown in the figure, a heat dissipation device 2 includes a A cooling element 21, a heat conducting element 22 and a supporting element 23, the cooling element 21 has several cooling fins 211 and forms at least one depression 212;

One side of the heat conduction element 22 is attached to the heat dissipation element 21 correspondingly, and at least one joint portion 224 and at least one through hole 225 are formed on opposite sides of the heat conduction element 22 ;

The supporting member 23 is correspondingly combined on the other side of the heat conducting member 22, and the opposite sides of the supporting member 23 respectively form at least one pair of connecting portions 235 correspondingly combined with the connecting portion 224, and the central position of the supporting member 23 A hollowed-out area 236 is formed at the center, and at least one hole 234 is formed at the four corners of the support member 23;

The aforementioned heat conducting element 22 is a uniform temperature plate, and a boss 223 is formed at the central position of the temperature equalizing plate, and the boss 223 is accommodated in the hollow area 236 and is flush or slightly convex on the upper side 231 of the support member 23 , and the heat conducting member 22 has a first side 221 and a second side 222 opposite to the first side 221, the first side 221 is combined with the support member 23 correspondingly, the second side 222 is connected to the heat sink 21 is attached correspondingly, and the four corners of the heat conduction element 22 have at least one perforation 225 corresponding to the hole 234, and the aforementioned heat sink 21 is formed with the depression 212 corresponding to the hole 234 and the perforation 225;

The aforementioned supporting member 23 has an upper side 231 and a lower side 232, the upper side 231 is provided with at least one protruding portion 2311, and the lower side 232 forms at least one groove 2312 corresponding to the position of the protruding portion 2311. Outlets 2311 are distributed on the upper side 231 of the support member 23 to strengthen the structural strength of the support member 23, wherein the material of the support member 23 can be selected as either metal or non-metal;

Through the design of this structure of the utility model, when the support member 23 is combined with the heat conduction member 22, since the heat conduction member 22 is made of copper or aluminum or a metal material with heat conduction, it is selected in the utility model Taking a copper plate as an illustration, the material used for the support member 23 is harder than that of the heat conduction member 22, and with the arrangement of the protruding parts 2311 distributed on the support member 23, the heat dissipation member 21 can be locked. When it is fixed, a greater locking force can be endured through the setting of the supporting member 23. In addition, it can also prevent the problem of easy deformation of the conventional heat-conducting member, thereby greatly increasing the heat-conducting effect.

Figures 3 and 4A and 4B are the perspective view of the support member of the second embodiment of the heat dissipation device of the present invention, the three-dimensional exploded view and the three-dimensional assembly view of the heat dissipation device, and the corresponding parts of the heat dissipation device and the components. It is the same as the heat dissipation device mentioned above, so it will not be repeated here, but the main difference between this heat dissipation device and the foregoing is that the peripheral edge of the support member 23 further extends an extension part 233 toward the lower side 232, and the extension part 233 covers or positions the heat conduction element 22, that is to say, in this embodiment, the overall structure of the support element 23 covers the heat conduction element 22, when the support element 23 is combined with the heat conduction element 22 The material of the supporting member 23 is harder than that of the heat conducting member 22, so that the heat dissipating member 21 can bear a greater locking force when it is locked, and it can also prevent the conventional heat conducting member from easily deforming. problem, thereby greatly increasing the effect of heat conduction.

As mentioned above, the utility model has the following advantages compared with the prior art:

1. Can withstand greater locking force;

2. Improve the deformation problem;

3. Greatly improve the heat conduction effect.

The utility model has been described in detail above, but the above description is only one of the preferred embodiments of the utility model, and should not limit the scope of implementation of the utility model. That is, all equivalent changes and modifications made according to the application scope of the utility model should still fall within the scope of the patent of the utility model.

Claims (9)

1. A cooling device, characterized in that, comprising: A heat sink with a plurality of heat sink fins; A heat conduction element, one side of which is attached corresponding to the heat dissipation element, and at least one joint is formed on the opposite sides of the heat conduction element; and A support member is correspondingly assembled on the other side of the heat conducting member, and at least one pair of joint portions are respectively formed on opposite sides of the support member to correspondingly combine with the assembly portion, and a hollow area is formed at the central position of the support member. 2 . The heat dissipation device according to claim 1 , wherein the heat conduction element is a uniform temperature plate, and a boss is formed at a central position of the temperature uniform plate to be correspondingly accommodated in the hollow area. 3 . 3. The heat dissipation device according to claim 2, wherein the heat conducting member has a first side and a second side, the first side is correspondingly combined with the supporting member, and the second side is connected with the heat dissipation The parts are correspondingly posted. 4. The heat dissipation device according to claim 3, wherein the supporting member has an upper side and a lower side, the upper side is protruded with at least one protrusion, and the lower side corresponds to the position of the protrusion At least one groove is formed, and the protrusion is distributed on the upper side of the support member. 5 . The heat dissipation device according to claim 4 , wherein an extension portion is further extended from the peripheral edge of the support member toward the lower side, and the extension portion covers the heat conducting member. 6 . 6 . The heat dissipation device according to claim 1 , wherein four corners of the supporting member further have at least one hole. 7 . The heat dissipation device according to claim 6 , wherein the four corners of the heat conducting element further have at least one through hole corresponding to communicate with the hole. 8 . 8 . The heat dissipation device according to claim 7 , wherein the heat dissipation element further forms at least one depression, and the holes and perforations correspond to the depression. 9 . The heat dissipation device according to claim 1 , wherein the material of the support member can be selected from either metal or non-metal. 10 .