CN101907903A - Industrial computer - Google Patents
Industrial computer Download PDFInfo
- Publication number
- CN101907903A CN101907903A CN2009101426405A CN200910142640A CN101907903A CN 101907903 A CN101907903 A CN 101907903A CN 2009101426405 A CN2009101426405 A CN 2009101426405A CN 200910142640 A CN200910142640 A CN 200910142640A CN 101907903 A CN101907903 A CN 101907903A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- heat
- industrial computer
- housing
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种工业用电脑包括第一壳体、第二壳体、储存单元及散热单元。第二壳体与第一壳体形成封闭壳体，第二壳体的外部具有容置区，储存单元设置于封闭壳体内，并接触第二壳体且对应容置区，散热单元设置于容置区。
An industrial computer includes a first shell, a second shell, a storage unit and a heat dissipation unit. The second shell and the first shell form a closed shell, the second shell has a receiving area outside, the storage unit is arranged in the closed shell, contacts the second shell and corresponds to the receiving area, and the heat dissipation unit is arranged in the receiving area.
Description
Technical field
The present invention is about a kind of computer, especially in regard to a kind of industrial computer.
Background technology
Industrial computer (industrial computer) means the non-computer that is used in general consumer or commercial purposes, owing to not only be applied to industrial circle, therefore the someone is referred to as the industry computer again.The environment for use of industrial computer product is relatively poor usually, so product often needs characteristics such as anti-high temperature, low temperature resistant, good heat dissipation, dustproof, waterproof.
Please refer to shown in Figure 1ly, it is the synoptic diagram of known notebook computer 1.Notebook computer 1 can be divided into display part 11 and main frame portion 12, and main frame portion 12 has upper shell 121 and lower house 122, and the main frame (not shown) then is arranged between upper shell 121 and the lower house 122.In notebook computer 1,, can on lower house 122, hold louvre H in the position of corresponding hard disk 123 usually for the heat sinking function of the hard disk 123 of strengthening main frame.
Yet when notebook computer 1 residing environment temperature was comparatively harsh, the heat that hard disk 123 is produced can't effectively utilize louvre H and shed.And if notebook computer 1 is as industrial computer, and hole H can't reach the effect of water proof and dust proof because heat is loose, and therefore, notebook computer 1 can't reach the specification requirement of industrial computer.
With regard to the dustproof and waterproof standard of industrial computer, closure casing is preferable case design scheme.But closure casing also causes poor heat radiation and rising enclosure interior temperature easily, and then causes the total system instability.The heats that internal electronic element produced such as central processing unit, north bridge chips, internal memory and hard disk accumulate on enclosure interior easily.
Summary of the invention
Because above-mentioned problem, purpose of the present invention can improve radiating effect for providing a kind of, and can meet the industrial computer of industrial specification requirement.
For reaching above-mentioned purpose, comprise first housing, second housing, storage element and heat-sink unit according to a kind of industrial computer of the present invention.Second housing and first housing form closure casing, and the outside of second housing has the disposal area.Storage element is arranged in the closure casing, and contacts second housing and corresponding disposal area, and heat-sink unit is arranged at the disposal area.
In one embodiment of this invention, heat-sink unit can comprise heat radiator, radiating fin, heat sink, heat pipe or radiator fan.
In sum, utilize heat-sink unit to be provided with, and heat-sink unit for example can include heat radiator, radiating fin, heat sink, heat pipe or radiator fan or its combination etc. corresponding to storage element according to industrial computer of the present invention.Therefore, utilize heat dissipation elements such as radiating fin or radiator fan not only can improve the radiating effect of storage element significantly, and can avoid utilizing the radiator structure design of perforates such as louvre, make industrial computer of the present invention can have the effect of water proof and dust proof, to reach industrial specification requirement.
Description of drawings
Fig. 1 is a kind of synoptic diagram of known notebook computer;
Fig. 2 A is the synoptic diagram of the industrial computer of preferred embodiment of the present invention;
Fig. 2 B is the diagrammatic cross-section of the industrial computer of preferred embodiment of the present invention along Fig. 2 A; And
Fig. 3 A and Fig. 3 B change the synoptic diagram of aspect for the difference of the industrial computer of preferred embodiment of the present invention.
Embodiment
Hereinafter with reference to correlative type, the industrial computer according to preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical symbol.
Please refer to shown in Fig. 2 A and Fig. 2 B, wherein Fig. 2 A is the synoptic diagram of the industrial computer 2 of preferred embodiment of the present invention, and Fig. 2 B is the diagrammatic cross-section of the industrial computer 2 of preferred embodiment of the present invention along Fig. 2 A.Be noted that,, only show second housing 222, storage element 223 and heat-sink unit 224 among Fig. 2 B for clearly demonstrating.
Industrial computer 2 comprises first housing 221, second housing 222, storage element 223 and heat-sink unit 224.In addition, industrial computer 2 for example can be divided into display part 21 and main frame portion 22, and both for example utilize pivotally connected.Display part 21 for example comprises the display panel (not shown), in order to as display interface.First housing 221, second housing 222, storage element 223 and heat-sink unit 224 then are positioned at main frame portion 22.
The material of first housing 221 and second housing 222 for example can be metal, alloy or high molecular polymer, and second housing 222 and first housing 221 form closure casing, and the outside of second housing 222 has disposal area S.
Heat-sink unit 224 is arranged at disposal area S.Heat-sink unit 224 for example can comprise heat radiator, radiating fin, heat sink, heat pipe (heat pipe) or radiator fan.In present embodiment, comprise that with heat-sink unit 224 radiator fan explains, it is non-limiting.
In addition, in present embodiment, main frame portion 22 also can comprise main computer unit 225 and heat conductive pad (thermal pad) 226.
Heat conductive pad 226 connects storage element 223 and heat-sink unit 224.Certainly, but the position perforate of corresponding storage element 223 on second housing 222, heat conductive pad 226 corresponding perforates are arranged at 224 of storage element 223 and heat-sink units.Thus, can utilize heat conductive pad 226 to increase pyroconductivity to improve radiating efficiency.
Therefore, utilize heat-sink unit 224 to be arranged at second housing, 222 opposite sides corresponding to storage element 223, the heat that storage element 223 is produced can conduct to the radiator fan that heat-sink unit 224 has via heat conductive pad 226, with the radiator fan via heat-sink unit 224 heat is shed.Thus, not only can improve the radiating effect of 224 pairs of storage elements 223 of heat-sink unit significantly, and can avoid utilizing the radiator structure design of perforates such as louvre, make the industrial computer 2 of present embodiment can have the effect of water proof and dust proof, to reach industrial specification requirement.
Again, industrial computer 2 also can comprise a plurality of waterproof cases 227, is arranged at second housing 222, and perhaps second housing 222 and heat-sink unit are 224.The material of waterproof case 227 for example can be rubber or other macromolecule polymer material.Therefore, utilization is provided with the perforate (for example allow use so that lead that the radiator fan of heat-sink unit 224 and main computer unit 225 electrically connect pass through) of those waterproof cases 227 in second housing 222, perhaps gap of 224 of second housing 222 and heat-sink units etc., can further improve the water proof and dust proof effect of main frame portion 22, so that industrial computer 2 reaches industrial specification requirement.
Please refer to shown in Fig. 3 A and Fig. 3 B, it changes the synoptic diagram of aspect for the difference of industrial computer 2a, the 2b of preferred embodiment of the present invention.Heat-sink unit 224a, the 224b of industrial computer 2a, 2b also can comprise the first heat dissipation element H1 and the second heat dissipation element H2, and both all are arranged at the second housing 222a, 222b opposite side with respect to storage element 223, and is positioned at disposal area S.Wherein, the first heat dissipation element H1 and the second heat dissipation element H2 can be heat radiator, radiating fin, heat sink, heat pipe or radiator fan respectively.In present embodiment, with the first heat dissipation element H1 and the second heat dissipation element H2 is respectively radiating fin and radiator fan explains, it is non-limiting.
The first heat dissipation element H1 and the second heat dissipation element H2 can be arranged side by side (as shown in Figure 3A) or stacked setting (shown in Fig. 3 B) on the second housing 222a, 222b.Therefore, utilize and the first heat dissipation element H1 to be set and the second heat dissipation element H2 can more improve heat-sink unit 224a, the 224b radiating effect to storage element 223.
Moreover for asking attractive in appearance, industrial computer 2a, 2b can comprise that also appearance component 228 is arranged on heat-sink unit 224a, the 224b.Therefore, utilize appearance component 228 can hide heat- sink unit 224a, 224b, increasing the aesthetics of industrial computer 2a, 2b, and utilize the appearance component 228 of high thermal conductivity coefficient material (for example can be metal or alloy etc.), can utilize heat conduction effectively the heat of storage element 223 to be shed equally.Again, also a plurality of louvres can be set on the appearance component 228, further to improve radiating effect.
In sum, utilize heat-sink unit to be provided with, and heat-sink unit for example can include heat radiator, radiating fin, heat sink, heat pipe or radiator fan or its combination etc. corresponding to storage element according to industrial computer of the present invention.Therefore, utilize heat dissipation elements such as radiating fin or radiator fan not only can improve the radiating effect of storage element significantly, and can avoid utilizing the radiator structure design of perforates such as louvre, make industrial computer of the present invention can have the effect of water proof and dust proof, to reach industrial specification requirement.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in claims its equivalent modifications of carrying out or change.
Claims (10)
1. an industrial computer is characterized in that, comprising:
First housing;
Second housing forms closure casing with said first shell, and the outside of above-mentioned second housing has the disposal area;
Storage element is arranged in the above-mentioned closure casing, and contacts above-mentioned second housing and corresponding above-mentioned disposal area; And
Heat-sink unit is arranged at above-mentioned disposal area.
2. industrial computer according to claim 1 is characterized in that above-mentioned heat-sink unit comprises heat radiator, radiating fin, heat sink, heat pipe or radiator fan.
3. industrial computer according to claim 1 is characterized in that, above-mentioned heat-sink unit comprises first heat dissipation element and second heat dissipation element, and both all are arranged at above-mentioned disposal area.
4. industrial computer according to claim 3 is characterized in that, above-mentioned first heat dissipation element and above-mentioned second heat dissipation element are arranged side by side or stacked setting.
5. industrial computer according to claim 3 is characterized in that, wherein above-mentioned first heat dissipation element and above-mentioned second heat dissipation element are respectively heat radiator, radiating fin, heat sink, heat pipe or radiator fan.
6. industrial computer according to claim 1 is characterized in that, above-mentioned industrial computer also comprises:
Heat conductive pad connects above-mentioned storage element and above-mentioned heat-sink unit.
7. industrial computer according to claim 1 is characterized in that, above-mentioned industrial computer also comprises:
A plurality of waterproof cases are arranged at above-mentioned second housing.
8. industrial computer according to claim 1 is characterized in that, above-mentioned industrial computer also comprises:
A plurality of waterproof cases are arranged between above-mentioned second housing and above-mentioned heat-sink unit.
9. industrial computer according to claim 1 is characterized in that, above-mentioned industrial computer also comprises:
Main computer unit is arranged in the above-mentioned closure casing.
10. industrial computer according to claim 1 is characterized in that, above-mentioned industrial computer also comprises:
Appearance component is installed on above-mentioned second housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101426405A CN101907903A (en) | 2009-06-04 | 2009-06-04 | Industrial computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101426405A CN101907903A (en) | 2009-06-04 | 2009-06-04 | Industrial computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101907903A true CN101907903A (en) | 2010-12-08 |
Family
ID=43263381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101426405A Pending CN101907903A (en) | 2009-06-04 | 2009-06-04 | Industrial computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101907903A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677181A (en) * | 2012-09-05 | 2014-03-26 | 蓝鸟株式会社 | Portable computer having heat dissipation structure |
| CN104144589A (en) * | 2013-05-07 | 2014-11-12 | 华为终端有限公司 | Vehicle-mounted wireless internet device |
| CN113407005A (en) * | 2021-08-18 | 2021-09-17 | 深圳市嘉合劲威电子科技有限公司 | High-efficiency heat dissipation memory system for notebook computer |
-
2009
- 2009-06-04 CN CN2009101426405A patent/CN101907903A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677181A (en) * | 2012-09-05 | 2014-03-26 | 蓝鸟株式会社 | Portable computer having heat dissipation structure |
| CN104144589A (en) * | 2013-05-07 | 2014-11-12 | 华为终端有限公司 | Vehicle-mounted wireless internet device |
| WO2014180181A1 (en) * | 2013-05-07 | 2014-11-13 | 华为终端有限公司 | Vehicle-mounted wireless network access device |
| CN104144589B (en) * | 2013-05-07 | 2017-11-17 | 华为终端有限公司 | A kind of onboard wireless equipment for surfing the net |
| CN113407005A (en) * | 2021-08-18 | 2021-09-17 | 深圳市嘉合劲威电子科技有限公司 | High-efficiency heat dissipation memory system for notebook computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8897012B2 (en) | Electronic device and heat dissipation module thereof | |
| US9459669B2 (en) | Multi-component shared cooling system | |
| TW201044148A (en) | Industrial computer | |
| TWM279164U (en) | Electronic device with heat-dissipating casing | |
| US10613598B2 (en) | Externally mounted component cooling system | |
| CN101907903A (en) | Industrial computer | |
| US10133325B2 (en) | Enhanced convective cooling system | |
| CN209657233U (en) | Memory device with cooling module | |
| CN102314196A (en) | Notebook computer with easy-replacement thermal module | |
| US8208251B2 (en) | Electronic device and heat dissipation apparatus of the same | |
| TWM325532U (en) | System module without fan for heat dissipation | |
| CN101907904A (en) | Industrial computer | |
| US20090056925A1 (en) | Heat dissipation module | |
| CN2898908Y (en) | Structure improvement of military-industry rule notebook computer | |
| CN101312629A (en) | Apparatus for simultaneously cooling multiple electronic components with uneven surface | |
| US8027160B2 (en) | Heat sink including extended surfaces | |
| CN201489410U (en) | Heat dissipation module and computer device | |
| CN209879406U (en) | Fixing structure of cooling module | |
| CN104159434A (en) | Heat dissipation structure and electronic device using the heat dissipation structure | |
| TWI357556B (en) | Industrial computer | |
| CN201017271Y (en) | Waterproof display with fan-free computer host | |
| CN203405764U (en) | Fanless Chassis for Small Form Factor Boards | |
| CN102073358A (en) | Cooling device and its electronic computing system | |
| CN205375350U (en) | Combined heat radiator | |
| TWI607302B (en) | Non-fan computer system and main board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101208 |