TWI607302B - Non-fan computer system and main board - Google Patents
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Description
本發明是有關於一種電腦系統及主機板，且特別是有關於一種無風扇電腦系統及適用於無風扇電腦系統的主機板。 The present invention relates to a computer system and a motherboard, and more particularly to a fanless computer system and a motherboard for a fanless computer system.
當今電腦的技術日新月異，市面上已有許多高效能的中央處理單元(Central Processing Unit，CPU)、晶片組、顯示卡能夠滿足使用者用來做3D繪圖、複雜的運算與玩3D遊戲等需求。電腦在運行時上述元件的溫度會提高，目前一般所採取的散熱方式是在上述發熱元件上配置散熱器來散熱，而使得這些元件能夠維持在適當的工作溫度。 Today's computer technology is changing with each passing day. There are many high-performance central processing units (CPUs), chipsets, and display cards on the market that can satisfy users' needs for 3D graphics, complex computing, and 3D games. The temperature of the above components will increase when the computer is running. The current heat dissipation method is to dispose heat on the above-mentioned heat generating components to maintain the proper operating temperature.
一般而言，傳統的散熱器包括了風扇、散熱鰭片、導熱銅管、導熱銅片組合而成一單體。為了達到良好的散熱效果，風扇的轉速往往設計為隨著發熱元件的溫度上升而提高。然而，風扇所產生的噪音，通常跟轉速大小成正比，這些風扇的運轉聲音就是電腦系統主要的噪音來源。當風扇轉速越高，散熱效率越好，相對的噪音也越大。若想讓風扇維持在低轉速來達到低噪音的環 境，相對的散熱效率會較差，可能無法讓發熱元件維持在適當的溫度。 In general, a conventional heat sink includes a fan, a heat sink fin, a heat conductive copper tube, and a heat conductive copper sheet to form a single unit. In order to achieve good heat dissipation, the fan speed is often designed to increase as the temperature of the heating element rises. However, the noise generated by fans is usually proportional to the speed of the fans. The sound of these fans is the main source of noise in computer systems. When the fan speed is higher, the heat dissipation efficiency is better and the relative noise is larger. If you want the fan to maintain a low speed to achieve a low noise ring The relative heat dissipation efficiency will be poor, and the heating element may not be maintained at an appropriate temperature.
本發明提供一種無風扇電腦系統，其無噪音且能夠兼具良好散熱效果。 The invention provides a fanless computer system which is noiseless and can have good heat dissipation effect.
本發明提供一種主機板，其適用於上述的無風扇電腦系統。 The present invention provides a motherboard that is suitable for use in the fanless computer system described above.
本發明的一種無風扇電腦系統，包括一主機板模組、一機殼及一第一導熱媒介。主機板模組包括一主機板及一中央處理單元，其中主機板包括一本體及一連接器，本體具有相對的一第一面與一第二面，中央處理單元與連接器分別設置在第一面與第二面。主機板固定於機殼，且第一面朝向機殼。第一導熱媒介配置在中央處理單元與機殼之間。 A fanless computer system of the present invention includes a motherboard module, a casing and a first heat transfer medium. The motherboard module includes a motherboard and a central processing unit, wherein the motherboard includes a body and a connector, the body has a first surface and a second surface, and the central processing unit and the connector are respectively disposed at the first Face and second side. The motherboard is fixed to the casing with the first side facing the casing. The first heat transfer medium is disposed between the central processing unit and the housing.
在本發明的一實施例中，上述的第一導熱媒介包括導熱片、導熱膠或是熱管。 In an embodiment of the invention, the first heat conduction medium comprises a heat conductive sheet, a thermal conductive adhesive or a heat pipe.
在本發明的一實施例中，上述的無風扇電腦系統更包括一第二導熱媒介，其中主機板更包括一功率元件，功率元件配置在第一面，第二導熱媒介配置在功率元件與機殼之間或是功率元件與第一導熱媒介之間。 In an embodiment of the invention, the fanless computer system further includes a second heat conducting medium, wherein the motherboard further includes a power component, the power component is disposed on the first side, and the second heat conductive medium is disposed in the power component and the machine Between the shells or between the power component and the first heat transfer medium.
在本發明的一實施例中，上述的無風扇電腦系統更包括一第二導熱媒介，其中主機板更包括一功率元件，功率元件配置 在第二面，第二導熱媒介配置在第一面上對應於功率元件的位置。 In an embodiment of the invention, the fanless computer system further includes a second heat transfer medium, wherein the motherboard further includes a power component, and the power component is configured In the second side, the second thermally conductive medium is disposed on the first side corresponding to the position of the power component.
在本發明的一實施例中，上述的第二導熱媒介接觸或是不接觸機殼。 In an embodiment of the invention, the second heat conducting medium contacts or does not contact the casing.
在本發明的一實施例中，上述的機殼包括一第一散熱鰭片，第一散熱鰭片形成在機殼的背對於主機板的表面。 In an embodiment of the invention, the casing includes a first heat dissipation fin, and the first heat dissipation fin is formed on a surface of the casing facing away from the motherboard.
在本發明的一實施例中，上述的無風扇電腦系統更包括一機箱，主機板模組與機殼配置於機箱內，且機殼固定於機箱，機箱包括一第二散熱鰭片。 In an embodiment of the invention, the fanless computer system further includes a chassis, the motherboard module and the casing are disposed in the chassis, and the casing is fixed to the chassis, and the chassis includes a second heat dissipation fin.
在本發明的一實施例中，上述的無風扇電腦系統為一桌上型電腦或是一筆記型電腦。 In an embodiment of the invention, the fanless computer system is a desktop computer or a notebook computer.
本發明的一種主機板，適用於一無風扇電腦系統，主機板包括一本體、一中央處理單元插槽及一連接器。本體具有相對的一第一面與一第二面。中央處理單元插槽位在第一面。連接器位在第二面。 The motherboard of the present invention is suitable for a fanless computer system. The motherboard includes a body, a central processing unit slot and a connector. The body has a first side and a second side opposite to each other. The central processing unit slot is located on the first side. The connector is on the second side.
在本發明的一實施例中，上述的主機板更包括一功率元 件，配置在第一面或第二面。 In an embodiment of the invention, the motherboard further includes a power element. Piece, configured on the first side or the second side.
基於上述，本發明的無風扇電腦系統的主機板透過將中 央處理單元插槽配置在本體上與連接器相反的一面(也就是中央處理單元插槽與連接器分別配置在本體的第一面與第二面)，而讓中央處理單元是安裝在面對機殼的第一面上，且將第一導熱媒介配置在中央處理單元與機殼之間。如此一來，中央處理單元在運算時所產生的熱量能夠透過第一導熱媒介被傳導至大面積的機殼 上，而達到良好的散熱效果。此配置可使得中央處理單元上不需要配置風扇，因此，本發明的無風扇電腦系統在運作時沒有噪音的問題。此外，在一般的電腦系統中，風扇佔據了一定的高度與體積，本發明的無風扇電腦系統省去風扇的設計可使得整體體積降低，而讓出更多空間給使用者運用。 Based on the above, the motherboard of the fanless computer system of the present invention passes through The central processing unit slot is disposed on the opposite side of the body from the connector (that is, the central processing unit slot and the connector are respectively disposed on the first side and the second side of the body), and the central processing unit is installed in the facing The first side of the casing is disposed between the central processing unit and the casing. In this way, the heat generated by the central processing unit during the calculation can be conducted to the large-area casing through the first heat conduction medium. On, while achieving good heat dissipation. This configuration allows the fan to be disposed on the central processing unit, and therefore, the fanless computer system of the present invention operates without noise. In addition, in a general computer system, the fan occupies a certain height and volume. The fanless computer system of the present invention eliminates the design of the fan, which can reduce the overall volume and allow more space for the user to use.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
100、100a、100b、100c‧‧‧無風扇電腦系統 100, 100a, 100b, 100c‧‧‧ fanless computer systems
110‧‧‧主機板模組 110‧‧‧ motherboard module
111‧‧‧主機板 111‧‧‧ motherboard
112‧‧‧本體 112‧‧‧Ontology
113‧‧‧第一面 113‧‧‧ first side
114‧‧‧第二面 114‧‧‧ second side
115‧‧‧中央處理單元插槽 115‧‧‧Central Processing Unit Slot
116‧‧‧連接器 116‧‧‧Connector
117、117b、117c‧‧‧功率元件 117, 117b, 117c‧‧‧ power components
118‧‧‧中央處理單元 118‧‧‧Central Processing Unit
120‧‧‧機殼 120‧‧‧Chassis
122‧‧‧第一散熱鰭片 122‧‧‧First heat sink fin
130‧‧‧第一導熱媒介 130‧‧‧First heat transfer medium
140、140a、140b、140c‧‧‧第二導熱媒介 140, 140a, 140b, 140c‧‧‧second heat transfer medium
150‧‧‧機箱 150‧‧‧Chassis
152‧‧‧第二散熱鰭片 152‧‧‧Second heat sink fins
圖1是依照本發明的一實施例的一種無風扇電腦系統的示意圖。 1 is a schematic diagram of a fanless computer system in accordance with an embodiment of the present invention.
圖2是圖1的無風扇電腦系統的局部爆炸示意圖。 2 is a partial exploded view of the fanless computer system of FIG. 1.
圖3是依照本發明的另一實施例的一種無風扇電腦系統的爆炸示意圖。 3 is a schematic exploded view of a fanless computer system in accordance with another embodiment of the present invention.
圖4是依照本發明的另一實施例的一種無風扇電腦系統的爆炸示意圖。 4 is a schematic exploded view of a fanless computer system in accordance with another embodiment of the present invention.
圖5是依照本發明的另一實施例的一種無風扇電腦系統的爆炸示意圖。 Figure 5 is a schematic exploded view of a fanless computer system in accordance with another embodiment of the present invention.
圖1是依照本發明的一實施例的一種無風扇電腦系統的 示意圖。圖2是圖1的無風扇電腦系統的局部爆炸示意圖。請參閱圖1與圖2，圖2中隱藏機箱150而僅繪示位於機箱150內的元件，並將這些元件分隔開，以更清楚地表示各元件的相對位置關係。在本實施例中，無風扇電腦系統100以一桌上型電腦為例，但在其他實施例中，無風扇電腦系統100也可以是一筆記型電腦，無風扇電腦系統100的種類並不以此為限制。 1 is a fanless computer system in accordance with an embodiment of the present invention schematic diagram. 2 is a partial exploded view of the fanless computer system of FIG. 1. Referring to Figures 1 and 2, the chassis 150 is hidden and only the components located within the chassis 150 are shown and separated from each other to more clearly indicate the relative positional relationship of the components. In the embodiment, the fanless computer system 100 is exemplified by a desktop computer. However, in other embodiments, the fanless computer system 100 can also be a notebook computer. The fanless computer system 100 does not This is a limitation.
本實施例的無風扇電腦系統100包括一主機板模組110、一機殼120及一第一導熱媒介130。詳細地說，主機板模組110包括一主機板111及一中央處理單元118。主機板111包括一本體112、一中央處理單元插槽115、一連接器116及一功率元件117，本體112具有相對的一第一面113與一第二面114。主機板111的本體112的第一面113朝向機殼120，主機板111的本體112的第二面114遠離機殼120。中央處理單元插槽115設置在第一面113，中央處理單元118可安裝在中央處理單元插槽115上，而固定於主機板111的主體112的第一面113。 The fanless computer system 100 of the present embodiment includes a motherboard module 110, a casing 120, and a first heat transfer medium 130. In detail, the motherboard module 110 includes a motherboard 111 and a central processing unit 118. The main board 111 includes a main body 112, a central processing unit slot 115, a connector 116 and a power component 117. The main body 112 has a first surface 113 and a second surface 114 opposite to each other. The first surface 113 of the body 112 of the motherboard 111 faces the casing 120, and the second surface 114 of the body 112 of the motherboard 111 is away from the casing 120. The central processing unit slot 115 is disposed on the first side 113, and the central processing unit 118 can be mounted on the central processing unit slot 115 and secured to the first side 113 of the body 112 of the motherboard 111.
連接器116與功率元件117配置在第二面114。在本實施 例中，連接器116以通用序列匯流排(USB)連接器為例，但也可以是其他介面的連接器，例如是PCI-E連接器、IDE連接器、SATA連接器或是e-SATA連接器等，連接器116的種類並不以此為限制。此外，在本實施例中，功率元件117為南橋晶片或是北橋晶片。另外，雖然在圖示中未繪示出其他元件。但主機板111的主體112的第二面114上還可以配置有電容元件與電感元件等。也 就是說，在本實施例的主機板模組110中，中央處理單元118與其它電子元件分別配置在主機板111的本體112的不同的兩面上。 Connector 116 and power component 117 are disposed on second side 114. In this implementation In the example, the connector 116 is exemplified by a universal serial bus (USB) connector, but may be a connector of another interface, such as a PCI-E connector, an IDE connector, a SATA connector, or an e-SATA connection. The type of the connector 116 is not limited thereto. Further, in the present embodiment, the power element 117 is a south bridge wafer or a north bridge wafer. Additionally, other elements are not shown in the drawings. However, a capacitor element, an inductance element, and the like may be disposed on the second surface 114 of the main body 112 of the motherboard 111. and also That is to say, in the motherboard module 110 of the present embodiment, the central processing unit 118 and other electronic components are respectively disposed on different sides of the body 112 of the motherboard 111.
在本實施例中，第一導熱媒介130配置在中央處理單元 118與機殼120之間。第一導熱媒介130以導熱片為例，但在其他實施例中，第一導熱媒介130也可以是導熱膠或是熱管，第一導熱媒介130的種類並不以此為限制。此外，雖然在圖1與圖2的剖面上未繪示出，但與一般習知的主機板與機殼的固定方式相同，本實施例的主機板111也是鎖固於機殼120上，當然主機板111固定於機殼120的方式並不以此為限制。 In this embodiment, the first heat conduction medium 130 is disposed in the central processing unit Between 118 and the casing 120. The first heat conductive medium 130 is exemplified by a heat conductive sheet. However, in other embodiments, the first heat conductive medium 130 may also be a heat conductive adhesive or a heat pipe. The type of the first heat conductive medium 130 is not limited thereto. In addition, although not shown in the cross-sections of FIG. 1 and FIG. 2, the motherboard 111 of the present embodiment is also locked to the casing 120, of course, in the same manner as the conventional motherboard and the casing. The manner in which the motherboard 111 is fixed to the casing 120 is not limited thereto.
相較於一般的主機板模組把中央處理單元、功率元件、 連接器與電容元件與電感元件等均配置在主機板的本體的第二面，並且在較容易發熱的中央處理單元與功率元件上配置風扇來散熱。本實施例的無風扇電腦系統100透過將在運作時容易升溫的中央處理單元118配置在主機板111的本體112的第一面113上，第一面113面向大面積的機殼120，且第一導熱媒介130分別接觸中央處理單元118與機殼120。如此一來，中央處理單元118在運算時所產生的熱量能夠透過第一導熱媒介130被傳導至大面積的機殼120上，而達到良好的散熱效果。此配置可使得中央處理單元118上不需要配置風扇，因此，運作時沒有噪音的問題，且省去風扇的設計可使得整體體積降低，而讓出更多空間給使用者運用。 Compared with the general motherboard module, the central processing unit, power components, The connector and the capacitive element and the inductive element are disposed on the second side of the body of the motherboard, and a fan is disposed on the central processing unit and the power element that are more likely to generate heat to dissipate heat. The fanless computer system 100 of the present embodiment is disposed on the first surface 113 of the body 112 of the motherboard 111 through a central processing unit 118 that is easy to heat up during operation. The first surface 113 faces the large-area housing 120, and A thermally conductive medium 130 contacts the central processing unit 118 and the housing 120, respectively. In this way, the heat generated by the central processing unit 118 during the calculation can be conducted to the large-area casing 120 through the first heat-conducting medium 130 to achieve a good heat dissipation effect. This configuration makes it unnecessary to configure the fan on the central processing unit 118. Therefore, there is no noise problem during operation, and the design of the fan can be omitted to reduce the overall volume and allow more space for the user to use.
此外，由於主機板模組110在主體112的第二面114上 還有其他的元件(例如是功率元件117)在運作時會發出高溫，在本實施例中，無風扇電腦系統100更包括一第二導熱媒介140。第二導熱媒介140配置在第一面113上對應於功率元件117的位置。 換句話說，第二導熱媒介140投影至本體112的第一面113的範圍會覆蓋至少一部分的功率元件117投影至本體112的第一面113的範圍，而將功率元件117在運作時所產生的熱量透過主機板111傳至第二導熱媒介140。在本實施例中，第二導熱媒介140是散熱鰭片，具有較大的表面積而幫助降溫，但第二導熱媒介140的種類並不以此為限制。另外，如圖1所示，在本實施例中，第二導熱媒介140會接觸機殼120，因此，被傳遞至第二導熱媒介140的熱量可以再被分散至機殼120。當然，在其他實施例中，第二導熱媒介140也可以是不接觸機殼120。 In addition, since the motherboard module 110 is on the second side 114 of the body 112 Still other components (e.g., power component 117) emit high temperatures during operation. In the present embodiment, fanless computer system 100 further includes a second thermally conductive medium 140. The second thermally conductive medium 140 is disposed on the first face 113 at a position corresponding to the power component 117. In other words, the extent to which the second thermally conductive medium 140 is projected onto the first face 113 of the body 112 covers a range in which at least a portion of the power component 117 is projected onto the first face 113 of the body 112, while the power component 117 is generated during operation. The heat is transferred to the second heat transfer medium 140 through the motherboard 111. In this embodiment, the second heat conduction medium 140 is a heat dissipation fin having a large surface area to help cool down, but the type of the second heat conduction medium 140 is not limited thereto. In addition, as shown in FIG. 1, in the present embodiment, the second heat transfer medium 140 contacts the casing 120, and thus the heat transferred to the second heat transfer medium 140 can be dispersed to the casing 120. Of course, in other embodiments, the second heat conduction medium 140 may also not contact the casing 120.
此外，為了更有效地提升散熱效率，在本實施例中，機 殼120包括一第一散熱鰭片122，第一散熱鰭片122形成在機殼120的背對於主機板111的表面。也就是說，機殼120透過形成在遠離主機板111的表面上的第一散熱鰭片122，加大了機殼120的表面積，而能夠更快速地將熱量分散。當然，在其他實施例中，機殼120也可以是沒有第一散熱鰭片122的一般機殼。 In addition, in order to more effectively improve the heat dissipation efficiency, in this embodiment, the machine The case 120 includes a first heat dissipation fin 122 formed on a surface of the casing 120 facing away from the motherboard 111. That is, the casing 120 enlarges the surface area of the casing 120 through the first fins 122 formed on the surface away from the main board 111, and can disperse heat more quickly. Of course, in other embodiments, the casing 120 may also be a general casing without the first heat dissipation fins 122.
在本實施例中，無風扇電腦系統100更包括一機箱150， 主機板模組110與機殼120配置於機箱150內，且機殼120透過例如是鎖固或是卡合的方式固定於機箱150，因此，被傳遞至機殼120的熱量可以再分散至機箱150。由於機箱150的體積與表面積 大，從中央處理單元118與功率元件117在運作時所產生的熱量能夠透過傳導的方式快速地傳遞至大面積的機殼120與機箱150而被有效地降溫。在本實施例中，無風扇電腦系統100的機箱150包括一第二散熱鰭片152，而提供更多的散熱面積。當然，在其他實施例中，機箱150也可以是沒有第二散熱鰭片152的一般機箱。 In this embodiment, the fanless computer system 100 further includes a chassis 150. The motherboard module 110 and the casing 120 are disposed in the casing 150, and the casing 120 is fixed to the casing 150 by, for example, locking or snapping, so that heat transferred to the casing 120 can be redistributed to the chassis. 150. Due to the volume and surface area of the chassis 150 Large, heat generated from the central processing unit 118 and the power component 117 during operation can be quickly transferred to the large-area housing 120 and the chassis 150 by conduction to be effectively cooled. In this embodiment, the chassis 150 of the fanless computer system 100 includes a second heat sink fin 152 to provide more heat dissipation area. Of course, in other embodiments, the chassis 150 may also be a general chassis without the second heat dissipation fins 152.
值得一提的是，在圖式中僅是示意性地繪示出其中一種 第一散熱鰭片122與第二散熱鰭片152的形式，第一散熱鰭片122與第二散熱鰭片152的形狀、數量與配置位置並不以此為限制。 It is worth mentioning that only one of them is schematically illustrated in the drawings. In the form of the first heat dissipation fins 122 and the second heat dissipation fins 152, the shapes, the number, and the arrangement positions of the first heat dissipation fins 122 and the second heat dissipation fins 152 are not limited thereto.
圖3是依照本發明的另一實施例的一種無風扇電腦系統 的爆炸示意圖。需說明的是，在下面的實施例中，與圖1的實施例相同或是相似的元件以同樣的編號表示。此外，在圖3中僅繪示主機板模組、機殼120、第一導熱媒介130與第二導熱媒介140a，而隱藏了機箱150。 3 is a fanless computer system in accordance with another embodiment of the present invention. Schematic diagram of the explosion. It should be noted that in the following embodiments, the same or similar elements as those of the embodiment of FIG. 1 are denoted by the same reference numerals. In addition, only the motherboard module, the chassis 120, the first heat transfer medium 130 and the second heat transfer medium 140a are shown in FIG. 3, and the chassis 150 is hidden.
請參閱圖3，本實施例的無風扇電腦系統100a與圖1的 無風扇電腦系統100的主要差異在於，在本實施例中，第二導熱媒介140a的配置位置是從在第一面113上對應於功率元件117的位置延伸到第一導熱媒介130。因此，功率元件117在運作時所產生的熱量透過本體112傳至第二導熱媒介140a之後，會經過第一導熱媒介130再傳遞至機殼120。在本實施例中，第二導熱媒介140a以熱管為例，但第二導熱媒介140a的種類並不以此為限制。 Referring to FIG. 3, the fanless computer system 100a of the present embodiment is the same as that of FIG. The main difference of the fanless computer system 100 is that in the present embodiment, the second thermally conductive medium 140a is disposed from a position corresponding to the power element 117 on the first side 113 to the first thermally conductive medium 130. Therefore, the heat generated by the power component 117 during operation is transmitted to the second heat transfer medium 140a through the body 112, and then transmitted to the casing 120 through the first heat transfer medium 130. In the embodiment, the second heat transfer medium 140a is exemplified by a heat pipe, but the type of the second heat transfer medium 140a is not limited thereto.
圖4是依照本發明的另一實施例的一種無風扇電腦系統 的爆炸示意圖。請參閱圖4，本實施例的無風扇電腦系統100b與 圖1的無風扇電腦系統100的主要差異在於，在本實施例中，功率元件117b配置在第一面113，且第二導熱媒介140b配置在功率元件117b與機殼120之間。在本實施例中，第二導熱媒介140b的相對兩面會直接接觸功率元件117b與機殼120。因此，從中央處理單元118與功率元件117b所發出的熱量分別經過第一導熱媒介130與第二導熱媒介140b傳遞至機殼120。第二導熱媒介140b為導熱片，但第二導熱媒介140b的種類不以此為限制。 4 is a fanless computer system in accordance with another embodiment of the present invention. Schematic diagram of the explosion. Referring to FIG. 4, the fanless computer system 100b of the embodiment is The main difference of the fanless computer system 100 of FIG. 1 is that in the present embodiment, the power component 117b is disposed on the first face 113 and the second heat transfer media 140b is disposed between the power component 117b and the chassis 120. In this embodiment, the opposite sides of the second heat transfer medium 140b directly contact the power element 117b and the casing 120. Therefore, the heat emitted from the central processing unit 118 and the power element 117b is transmitted to the casing 120 through the first heat transfer medium 130 and the second heat transfer medium 140b, respectively. The second heat transfer medium 140b is a heat conductive sheet, but the type of the second heat conductive medium 140b is not limited thereto.
在本實施例中，無風扇電腦系統100b透過將運作時容易變成高溫的中央處理單元118與功率元件117b一起配置在第一面113，而朝向機殼120，中央處理單元118與功率元件117b所產生的熱量可以不用經過本體112而直接透過第一導熱媒介130與第二導熱媒介140b傳遞至機殼120，而有效地分散熱量而達到降溫的功效。 In the present embodiment, the fanless computer system 100b is disposed on the first surface 113 together with the power component 117b through the central processing unit 118 that easily becomes high temperature during operation, and faces the casing 120, the central processing unit 118 and the power component 117b. The generated heat can be directly transmitted to the casing 120 through the first heat transfer medium 130 and the second heat transfer medium 140b without passing through the body 112, thereby effectively dispersing heat to achieve the effect of cooling.
圖5是依照本發明的另一實施例的一種無風扇電腦系統的爆炸示意圖。請參閱圖5，本實施例的無風扇電腦系統100c與圖4的無風扇電腦系統100b的主要差異在於，在本實施例中，第二導熱媒介140c配置在功率元件117c與第一導熱媒介130之間。 詳細地說，第二導熱媒介140c以熱管為例，第二導熱媒介140c從在第一面113上對應於功率元件117c的位置延伸到第一導熱媒介130，因此，功率元件117c在運作時所產生的熱量傳至第二導熱媒介140c之後，會經過第一導熱媒介130再傳遞至機殼120，而有效地達到散熱的效果。 Figure 5 is a schematic exploded view of a fanless computer system in accordance with another embodiment of the present invention. Referring to FIG. 5, the main difference between the fanless computer system 100c of the present embodiment and the fanless computer system 100b of FIG. 4 is that, in this embodiment, the second heat conductive medium 140c is disposed on the power component 117c and the first heat conductive medium 130. between. In detail, the second heat transfer medium 140c is exemplified by a heat pipe. The second heat transfer medium 140c extends from the position corresponding to the power element 117c on the first surface 113 to the first heat transfer medium 130. Therefore, when the power element 117c is in operation After the generated heat is transferred to the second heat transfer medium 140c, it is transferred to the casing 120 through the first heat transfer medium 130, thereby effectively achieving the heat dissipation effect.
綜上所述，本發明的無風扇電腦系統的主機板透過將中 央處理單元插槽配置在本體上與連接器相反的一面(也就是中央處理單元插槽與連接器分別配置在本體的第一面與第二面)，而讓中央處理單元是安裝在面對機殼的第一面上，且將第一導熱媒介配置在中央處理單元與機殼之間。如此一來，中央處理單元在運算時所產生的熱量能夠透過第一導熱媒介被傳導至大面積的機殼上，而達到良好的散熱效果。此配置可使得中央處理單元上不需要配置風扇，因此，本發明的無風扇電腦系統在運作時沒有噪音的問題。此外，在一般的電腦系統中，風扇佔據了一定的高度與體積，本發明的無風扇電腦系統省去風扇的設計可使得整體體積降低，而讓出更多空間給使用者運用。 In summary, the motherboard of the fanless computer system of the present invention passes through The central processing unit slot is disposed on the opposite side of the body from the connector (that is, the central processing unit slot and the connector are respectively disposed on the first side and the second side of the body), and the central processing unit is installed in the facing The first side of the casing is disposed between the central processing unit and the casing. In this way, the heat generated by the central processing unit during the calculation can be conducted to the large-area casing through the first heat-conducting medium to achieve a good heat dissipation effect. This configuration allows the fan to be disposed on the central processing unit, and therefore, the fanless computer system of the present invention operates without noise. In addition, in a general computer system, the fan occupies a certain height and volume. The fanless computer system of the present invention eliminates the design of the fan, which can reduce the overall volume and allow more space for the user to use.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧無風扇電腦系統 100‧‧‧Fanless computer system
110‧‧‧主機板模組 110‧‧‧ motherboard module
111‧‧‧主機板 111‧‧‧ motherboard
112‧‧‧本體 112‧‧‧Ontology
113‧‧‧第一面 113‧‧‧ first side
114‧‧‧第二面 114‧‧‧ second side
115‧‧‧中央處理單元插槽 115‧‧‧Central Processing Unit Slot
116‧‧‧連接器 116‧‧‧Connector
117‧‧‧功率元件 117‧‧‧Power components
118‧‧‧中央處理單元 118‧‧‧Central Processing Unit
120‧‧‧機殼 120‧‧‧Chassis
122‧‧‧第一散熱鰭片 122‧‧‧First heat sink fin
130‧‧‧第一導熱媒介 130‧‧‧First heat transfer medium
140‧‧‧第二導熱媒介 140‧‧‧Second thermal medium
150‧‧‧機箱 150‧‧‧Chassis
152‧‧‧第二散熱鰭片 152‧‧‧Second heat sink fins
Claims (7)
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| TW104121238A TWI607302B (en) | 2015-07-01 | 2015-07-01 | Non-fan computer system and main board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104121238A TWI607302B (en) | 2015-07-01 | 2015-07-01 | Non-fan computer system and main board |
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| TW201702795A TW201702795A (en) | 2017-01-16 |
| TWI607302B true TWI607302B (en) | 2017-12-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI863688B (en) * | 2023-10-17 | 2024-11-21 | 新加坡商鴻運科股份有限公司 | Server module and server |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201116983A (en) * | 2009-11-06 | 2011-05-16 | Nat Univ Tsing Hua | Heat dissipation structure of electronic apparatus |
| TW201127267A (en) * | 2010-01-22 | 2011-08-01 | Adlink Technology Inc | Elastic thermal conduction structure for multiple heat sources of electronic device without fan |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201116983A (en) * | 2009-11-06 | 2011-05-16 | Nat Univ Tsing Hua | Heat dissipation structure of electronic apparatus |
| TW201127267A (en) * | 2010-01-22 | 2011-08-01 | Adlink Technology Inc | Elastic thermal conduction structure for multiple heat sources of electronic device without fan |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI863688B (en) * | 2023-10-17 | 2024-11-21 | 新加坡商鴻運科股份有限公司 | Server module and server |
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