CN101192440A - Hard disk heat radiator - Google Patents

Abstract

The present invention discloses a hard disk heat dissipation device, which is suitable for being arranged on a hard disk or in a hard disk slot, and comprises a heat-conducting layer and at least one heat-conducting pad arranged on a surface of the heat-conducting layer opposite to the hard disk. The heat-conducting pad is used to contact the hard disk, so that its waste heat is transferred to the heat-conducting layer through the heat-conducting pad, and then transferred to the hard disk or the outside of the hard disk slot by the heat-conducting layer, so as to reduce the working temperature of the hard disk when operating at high speed, thereby extending the service life of the hard disk.

Description

HDD cooling device

technical field

The present invention relates to a cooling device, and in particular to a hard disk cooling device.

Background technique

In recent years, the storage capacity of the hard disk has been increasing continuously, but the volume of the hard disk is developing toward miniaturization, so it is favored by various portable electronic devices. At the same time, with the requirement of high-speed information transmission, the reading speed of the hard disk and the central processing unit is continuously accelerated. The device will also crash due to the high operating temperature. Therefore, more and more heat dissipation mechanisms for the CPU are proposed to improve the overheating of the CPU and increase the working performance.

Taking a portable computer as an example, a common heat dissipation mechanism is to introduce cold air from the outside into the casing through a fan, and then discharge the hot air inside through the heat dissipation holes in a convection manner. Since the central processing unit, graphics chip and other computing electronic components are the largest heat source inside the portable computer, its operating temperature is strictly controlled. But it is often ignored, so high-speed hard disks often operate at higher operating temperatures. However, the life of the hard disk is inversely proportional to the working temperature of the hard disk. For example, when operating at a working temperature of 40°C, its service life is about 30,000 hours, and when operating at a working temperature of 50°C, its service life is only 30,000 hours. Under about 20000 hours.

In view of this, under the principle of high-speed data reading, how to reduce the operating temperature of the hard disk to prolong the service life of the hard disk has become a subject that cannot be ignored.

Contents of the invention

The purpose of the present invention is to provide a hard disk cooling device for absorbing the waste heat generated by the hard disk and conducting the waste heat to the outside.

The invention provides a hard disk cooling device, which is suitable for being configured on a hard disk. The hard disk cooling device includes a heat conduction layer and at least one heat conduction pad. The heat conduction layer has a surface corresponding to the hard disk, and partly extends out of the hard disk. The heat conduction pad is arranged on the surface corresponding to the hard disk, and is in contact with the hard disk.

The present invention proposes another hard disk cooling device, which is suitable for being arranged in a hard disk slot, and the hard disk slot is used for placing a hard disk. The hard disk cooling device includes a heat conduction layer and at least one heat conduction pad. The heat conduction layer is arranged in the hard disk slot and partly extends out of the hard disk slot, and the heat conduction layer has a surface corresponding to the hard disk. The heat conduction pad is arranged on the surface corresponding to the hard disk, and is in contact with the hard disk.

According to an embodiment of the present invention, the heat conduction layer extends from the lower surface of the hard disk to an adjacent side surface, and then extends out of the hard disk from the side surface.

According to another embodiment of the present invention, the heat conduction layer extends from the lower surface of the hard disk to an adjacent side surface, extends through the side surface to an upper surface of the hard disk, and then extends out of the hard disk from the upper surface.

According to an embodiment of the present invention, the heat conduction layer extends from the lower surface of the hard disk slot to an adjacent side surface, and then extends out of the hard disk slot from this side.

According to another embodiment of the present invention, the heat conduction layer extends from the lower surface of the hard disk slot to an adjacent side surface, extends through this side to an upper surface of the hard disk, and then extends out of the hard disk slot from the upper surface.

According to the embodiments of the present invention, the heat conducting layer is selected from a single material layer or a composite material layer composed of a metal material layer and a graphite layer.

According to an embodiment of the present invention, the heat conducting layer includes a graphite layer.

According to an embodiment of the present invention, the heat conduction layer includes at least one metal material layer.

According to an embodiment of the present invention, the heat conduction layer includes a composite material layer composed of a graphite layer and at least one metal material layer. In addition, the above-mentioned metal material layer includes an aluminum layer or a copper layer.

According to an embodiment of the present invention, the material of the heat conduction pad includes graphite or metal. In addition, the heat conduction pad includes at least one upper heat conduction pad and at least one lower heat conduction pad, the upper heat conduction pad correspondingly contacts the upper surface of the hard disk, and the lower heat conduction pad corresponds to contact the lower surface of the hard disk.

Because the present invention adopts the hard disk cooling device with high thermal conductivity material, the waste heat generated when the hard disk reads data at high speed can be absorbed by the hard disk cooling device and then transferred to the hard disk or the hard disk slot, so as to reduce the working temperature of the hard disk And prolong the service life of the hard disk.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are exemplified below and described in detail with accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a hard disk cooling device according to a first embodiment of the present invention.

2A-2B are schematic configuration diagrams of the hard disk cooling device of the present invention.

3A is a schematic cross-sectional view of a hard disk cooling device according to a second embodiment of the present invention.

FIG. 3B is a schematic configuration diagram of the hard disk cooling device of the present invention.

Detailed ways

Please refer to FIG. 1 , which is a schematic cross-sectional view of a hard disk cooling device according to a first embodiment of the present invention. The hard disk cooling device 100 is suitable for being attached to the hard disk 10 , and includes a heat conduction layer 110 and at least one heat conduction pad 120 . The heat conduction layer 110 has a surface 110a corresponding to the hard disk 10, and is in contact with the hard disk 10 through the heat conduction pad 120 arranged on the surface 110a, so that the waste heat is conducted to the heat conduction layer 110 through the heat conduction pad 120, and then partially extends out of the hard disk 10 The outer heat conduction layer 110 conducts the waste heat to the surrounding area away from the hard disk 10 to reduce the working temperature of the hard disk 10 when it is in operation.

In this embodiment, the contact position of the heat conduction pad 120 and the hard disk 10 is not limited, but it is preferably the metal shell area of the hard disk 10 or the heat concentrated area on the circuit area or various hot spots. Since the hot spots on the hard disk 10 have the highest temperature, the need for heat dissipation is relatively high. Therefore, the thermal pad 120 directly contacts the hot spots to achieve the best heat dissipation effect.

In terms of materials, the heat conduction layer 110 and the heat conduction pad 120 can be made of a metal material with high heat conduction and graphite material with uniform heat conduction. Graphite materials have low thermal resistance and light weight, and graphite materials can be processed with metal materials to form metal-graphite composite materials through powder metallurgy. In this embodiment, the heat conduction layer 110 takes a high heat conduction composite material as an example, which is composed of a first metal layer 112, a graphite layer 114 and a second metal layer 116, such as aluminum-graphite-aluminum, copper-graphite - Changes in different combinations of aluminum, copper-graphite-copper, etc., but two-layer composite materials, such as aluminum-graphite, copper-graphite, copper-aluminum, etc., can also be implemented, so Figure 1 of this embodiment is not used for limit the invention.

The heat conduction layer 110 can also be made of a single material layer, such as a single graphite layer, aluminum layer, aluminum alloy layer, copper layer, copper alloy layer, or other high thermal conductivity metal, in addition to being implemented in a multi-layer composite material. Materials are not listed in detail here.

In terms of softness, the hard disk cooling device 100 adopts a soft, thinned heat-conducting material, which can be flatly attached or wrapped on any flat or curved surface of the hard disk 10, so as to evenly absorb heat from any surface of the hard disk 10. Conducted waste heat. In addition, the thermal conduction layer 110 can extend outward along the gap between the hard disk 10 and surrounding components (not shown), without occupying space.

As shown in FIG. 2A , the heat conduction layer 110 extends from the lower surface 12 of the hard disk 10 to an adjacent side 14 , and then extends out of the hard disk 10 from the side 14 . In this embodiment, the portion 110 b of the heat conduction layer 110 extending beyond the hard disk can be further connected to a heat sink 30 to increase heat dissipation efficiency. The heat sink 30 is, for example, any type of heat dissipation structure composed of heat dissipation fins, heat dissipation fans and/or heat pipes.

As shown in Figure 2B, in another embodiment, the heat conduction layer 110 extends from the lower surface 12 of the hard disk 10 to an adjacent side 14, extends to an upper surface 16 of the hard disk 10 through the side 14, and then extends from the upper surface 120 extending out of the hard disk 10 . In addition, the location and quantity of the heat conduction pad 120 can be adjusted appropriately. For example, as shown in FIG. 2A, the heat conduction pad 120 only contacts the lower surface 12 of the hard disk 10; or as shown in FIG. The lower thermal pad 120b and the upper thermal pad 120b contact the upper surface 16 of the hard disk 10 , while the lower thermal pad 120b contacts the lower surface 12 of the hard disk 10 to increase the thermal contact area.

Since the hard disk cooling device 100 of the present invention does not take up space, the present invention is also suitable for use on portable electronic devices with limited internal space, such as portable computers, hard disks, etc. Walkmans, hard drive enclosures or other electronic devices that use hard drives to access data.

Next, please refer to FIG. 3A , which is a schematic cross-sectional view of a hard disk cooling device according to a second embodiment of the present invention. The hard disk cooling device 200 is suitable for being disposed in a hard disk slot 20 , and includes a heat conduction layer 210 and at least one heat conduction pad 220 . The heat conduction layer 210 is disposed in the hard disk slot 20 and partially extends out of the hard disk slot 20 . In addition, the heat conduction pad 220 is disposed on the heat conduction layer 210 corresponding to a surface 210 a of the hard disk 10 , and is in contact with the hard disk 10 to absorb waste heat. As described in the first embodiment, the heat conduction layer 210 can be a single material layer such as graphite, aluminum, copper, or a composite material layer composed of a graphite layer and at least one metal material layer, and the material of the heat conduction pad 220 can be graphite or Metal.

Different configuration modes are described in detail below with reference to the accompanying drawings. Please refer to FIG. 3A , the heat conduction layer 210 is disposed on the lower surface 22 of the hard disk bay 20 and extends out of the hard disk bay 20 from the adjacent side surface 24 . As described in the first embodiment, since the heat conduction layer 210 is made of a soft conductive material, it can match the shape of the hard disk slot 20 and be smoothly attached to any flat or curved surface of the hard disk slot 20, thus not occupying the hard disk slot 20. original space.

Next, please refer to the arrangement in FIG. 3B , the heat conduction layer 210 is arranged on the lower surface 22 of the hard disk slot 20, extends to the upper surface 16 of the hard disk 10 through the adjacent side 24, and then extends from the upper surface 16 of the hard disk 10 to the hard disk slot. 20 outside. As described in the first embodiment, since the upper surface 16 and the lower surface 12 of the hard disk 10 contact the upper thermal pad 220a and the lower thermal pad 220b respectively, the waste heat from the top and bottom of the hard disk 10 can pass through the upper and lower thermal pads 220a and 220b respectively. Conducted to the heat conduction layer 210 , and then conducted to the outside of the hard disk slot 20 through the heat conduction layer 210 , so as to reduce the operating temperature of the hard disk 10 .

The hard disk cooling device of the present invention can not only dissipate heat quickly, reduce the working temperature of the hard disk and prolong the service life of the hard disk, but also can further protect the hard disk due to the use of soft heat-conducting materials in terms of anti-shock effect, and avoid damage to the magnetic areas in the hard disk. Unable to read data. At the same time, in terms of metal shielding effect, since the conductive layer can cover the entire periphery of the hard disk, as shown in Figure 2B and Figure 3B, it can prevent electromagnetic wave interference, so it can avoid reading and writing data errors caused by electromagnetic wave interference when the hard disk is in operation.

As described in the first embodiment, the hard disk cooling device 200 can also be used in conjunction with other radiators, cooling fins, heat pipes or cooling fans, or use natural convection to remove waste heat. Therefore, any heat dissipation mechanism designed for heat conduction, whether it is a heat dissipation element used in a central processing unit, a graphics chip or other electronic devices, can cooperate with the hard disk heat dissipation device of the present invention to reduce the operating temperature of the entire electronic system. To improve the stability of the system.

On the other hand, under permitted conditions, the hard disk cooling device of the present invention can also be connected to the ground terminal of the metal shell or circuit board, in addition to increasing the metal shielding effect, it can also achieve anti-static discharge (electro-static discharge, ESD) protection function and anti-noise interference, so that the hard disk can read the data in the magnetic field stably.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention, and anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (18)

1. A hard disk cooling device is suitable for being configured on a hard disk, and the hard disk cooling device comprises: A heat conduction layer has a surface corresponding to the hard disk and partially extends out of the hard disk; and At least one heat conduction pad is arranged on the surface of the heat conduction layer corresponding to the hard disk, and is in contact with the hard disk. 2. The hard disk cooling device as claimed in claim 1, wherein the heat conducting layer comprises a graphite layer. 3. The hard disk cooling device according to claim 1, wherein the heat conducting layer comprises at least one metal material layer. 4. The hard disk cooling device according to claim 1, wherein the heat conducting layer comprises a composite material layer composed of a graphite layer and at least one metal material layer. 5. The hard disk cooling device according to claim 3 or 4, wherein the metal material layer comprises an aluminum layer or a copper layer. 6. The hard disk cooling device according to claim 1, wherein the material of the heat conduction pad includes graphite or metal. 7 . The hard disk cooling device according to claim 1 , wherein the heat conduction layer extends from a lower surface of the hard disk to an adjacent side surface, and then extends out of the hard disk from the side surface. 8. The hard disk cooling device according to claim 1, wherein the heat conducting layer extends from the lower surface of the hard disk to an adjacent side surface, extends through the side surface to an upper surface of the hard disk, and then extends from the upper surface extend beyond the hard drive. 9. The hard disk cooling device according to claim 8, wherein the heat conduction pad comprises at least one upper heat conduction pad and at least one lower heat conduction pad, the upper heat conduction pad correspondingly contacts the upper surface of the hard disk, and the lower heat conduction pad The pad correspondingly contacts the lower surface of the hard disk. 10. A hard disk cooling device, suitable for being configured in a hard disk slot, the hard disk slot is used to place a hard disk, and the hard disk cooling device comprises: A thermal conduction layer is disposed in the hard disk slot and partially extends out of the hard drive slot, and the thermal conduction layer has a surface corresponding to the hard disk; and At least one heat conduction pad is arranged on the surface corresponding to the hard disk, and is in contact with the hard disk. 11. The hard disk cooling device as claimed in claim 10, wherein the heat conducting layer comprises a graphite layer. 12. The hard disk cooling device according to claim 10, wherein the heat conducting layer comprises at least one metal material layer. 13. The hard disk cooling device according to claim 10, wherein the heat conducting layer comprises a composite material layer composed of a graphite layer and at least one metal material layer. 14. The hard disk cooling device according to claim 12 or 13, wherein the metal material layer comprises an aluminum layer or a copper layer. 15. The hard disk cooling device as claimed in claim 10, wherein the material of the heat conduction pad includes graphite or metal. 16 . The hard disk cooling device according to claim 10 , wherein the heat conduction layer extends from a lower surface of the hard disk slot to an adjacent side surface, and then extends out of the hard disk slot from the side surface. 17. The hard disk cooling device according to claim 10, wherein the surface of the heat conducting layer extends from the lower surface of the hard disk slot to an adjacent side surface, and extends to an upper surface of the hard disk via the side surface, Then extend out of the hard disk slot from the upper surface. 18. The hard disk heat dissipation device according to claim 17, wherein the heat conduction pad comprises at least one upper heat conduction pad and at least one lower heat conduction pad, the upper heat conduction pad correspondingly contacts the upper surface of the hard disk, and the lower heat conduction pad The pad correspondingly contacts the lower surface of the hard disk.

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