CN206851221U - A cooling metal frame - Google Patents

Abstract

The utility model relates to an electronic components technical field especially relates to a heat dissipation metal frame, including metal base and first fin, metal base is equipped with chip holding portion, and first fin is installed in chip holding portion, is provided with the limit structure of mutually supporting between the two, and metal base is provided with a plurality of horizontal recesses and a plurality of vertical recesses, and a plurality of horizontal recesses and a plurality of vertical recess intercrossing set up below metal base, and first fin is the heat dissipation graphite flake, makes the utility model discloses have good heat conduction heat dispersion, and the heat dissipation is comparatively even, therefore the utility model discloses a radiating effect is more stable, and horizontal recess and vertical recess intercrossing set up below metal base, increase metal base's heat radiating area, thereby make the utility model discloses a radiating effect is better, and structural design is more reasonable.

Description

A cooling metal frame

technical field

The utility model relates to the technical field of electronic accessories, in particular to a heat dissipation metal frame.

Background technique

At present, with the continuous development of electronic technology and the continuous upgrading of electronic products, the size of integrated chips used in them is getting smaller and smaller, and the speed and efficiency of work are getting higher and higher, but the heat generation is also increasing. In the prior art, heat dissipation metal frames are usually used as the preferred material for heat conduction and heat dissipation of integrated chips of electronic products. The heat dissipation effect of heat dissipation metal frames directly affects the heat dissipation effect of integrated chips, and then affects the service life of integrated chips. However, existing The heat dissipation metal frame in the technology does not have a good heat dissipation effect, resulting in a shortened service life of the integrated chip.

Utility model content

In order to solve the above problems, the utility model provides a heat dissipation metal frame, which has reasonable design and good heat dissipation effect.

In order to solve the above object, the utility model adopts the following technical solutions.

A heat-dissipating metal frame, comprising a metal base and a first heat sink, the metal base is provided with a chip accommodating portion, the first heat sink is installed in the chip accommodating portion, and a limiting structure that cooperates with each other is arranged between the two, The metal base is provided with several transverse grooves and several longitudinal grooves, the several transverse grooves and the several longitudinal grooves are intersected and arranged under the metal base, and the first heat sink is a heat radiation graphite sheet.

Preferably, the limiting structure includes a fixing column and a slot corresponding to the fixing column, the fixing column is arranged on the inner surface of the chip housing part, the slot is arranged under the first heat sink, and the first heat sink is installed on the chip container. When the part is placed, the fixed post snaps into the slot.

Preferably, a first wave-shaped structure is provided under the first heat sink, and a second wave-shaped structure matching the wave-shaped structure is provided in the chip accommodating portion.

Preferably, the metal base is provided with several second heat sinks, and the several second heat sinks are distributed around the chip accommodating portion and embedded in the metal base.

Preferably, the number of the second cooling fins is four, and the four second cooling fins are evenly distributed around the chip accommodating portion.

Preferably, the second heat dissipation sheet is a heat dissipation graphite sheet.

Preferably, several heat dissipation through holes are provided under the chip accommodating portion.

The beneficial effects of the utility model are as follows:

The first heat sink of the heat dissipation metal frame is installed in the chip accommodating part, and is in contact with the integrated chip fixed in the chip accommodating part, to carry out the heat dissipation of the integrated chip, and the first heat sink is a heat dissipation graphite sheet, so that the heat dissipation metal frame It has good heat conduction and heat dissipation performance, and the heat dissipation is relatively uniform, so the heat dissipation effect of the heat dissipation metal frame is more stable, and the transverse grooves and longitudinal grooves are arranged under the metal base to increase the heat dissipation area of the metal base, thereby The heat dissipation effect of the heat dissipation metal frame is better, and the structural design is more reasonable.

Description of drawings

Fig. 1 is the front view of the heat dissipation metal frame of the present utility model;

Fig. 2 is the top view of the heat dissipation metal frame of the present utility model;

Fig. 3 is the exploded schematic view of the three-dimensional structure of the heat dissipation metal frame of the present invention;

FIG. 4 is an exploded perspective view of the three-dimensional structure of the heat dissipation metal frame of the present invention.

Drawings: 1. Metal base, 2. Chip accommodation part, 3. Heat dissipation through hole, 4. Fixing column, 5. Second wave-shaped structure, 6. Transverse groove, 7. Longitudinal groove, 8. The second heat sink, 9. the first heat sink, 10. the card slot, and 11. the first wave-shaped structure.

detailed description

The utility model will be further described below in conjunction with the accompanying drawings.

Referring to FIGS. 1 to 4 , a heat dissipation metal frame includes a metal base 1 and a first heat sink 9 , the metal base 1 is provided with a chip accommodating portion 2 , and the first heat sink 9 is installed in the chip accommodating portion 2 , between the two is provided with a limit structure that cooperates with each other, the metal base 1 is provided with several transverse grooves 6 and several longitudinal grooves 7, and several transverse grooves 6 and several longitudinal grooves 7 are arranged to cross each other Under the metal base 1, the first heat sink 9 is a heat-dissipating graphite sheet. In this way, the first heat sink 9 of this embodiment is installed in the chip accommodation portion 2 and contacts the integrated chip fixed in the chip accommodation portion 2. , in order to dissipate the heat of the integrated chip, the first heat sink 9 is a heat dissipation graphite sheet, so that the heat dissipation metal frame has good heat conduction and heat dissipation performance, and the heat dissipation is relatively uniform, so the heat dissipation effect of the heat dissipation metal frame is more stable, and the transverse groove 6 and the longitudinal groove 7 are intersected and arranged under the metal base 1 to increase the heat dissipation area of the metal base 1, so that the heat dissipation effect of the heat dissipation metal frame is better, and the structural design is more reasonable.

Figures 3 and 4 show that the position-limiting structure includes a fixing column 4 and a slot 10 corresponding to the fixing column 4, the fixing column 4 is arranged on the inner surface of the chip accommodating part 2, and the locking groove 10 is arranged on the first Below the heat sink 9, when the first heat sink 9 is installed in the chip accommodating part 2, the fixing column 4 is snapped into the said slot 10, and the fixing column 4 of this embodiment is arranged at the four corners of the inner surface of the chip accommodating part 2, the second A cooling fin 9 is provided with the locking slot 10 at a position corresponding to the fixing column 4 , and the fixing column 4 is engaged with the locking slot 10 , so that the first cooling fin 9 is limited in the chip receiving portion 2 .

Referring to Fig. 3 and Fig. 4, a first wave-shaped structure 11 is provided under the first heat sink 9, and a second wave-shaped structure 5 matching the wave-shaped structure is provided in the chip accommodation part 2, so that the first heat sink 9 and the chip accommodating portion 2 are tightly fitted through the first corrugated structure 11 and the second corrugated structure 5, thereby increasing the contact area between the first heat sink 9 and the chip accommodating portion 2, so the first The heat conduction speed between the heat sink 9 and the chip accommodating portion 2 is faster, so the heat dissipation effect is better.

Referring to Figure 1 and Figure 3, the metal base 1 is provided with a number of second heat sinks 8, and the number of second heat sinks 8 are distributed around the chip accommodating part 2 and embedded in the metal base 1, the first heat sink 8 in this embodiment The second heat sink 8 is a heat dissipation graphite sheet, so the setting of the second heat sink 8 further accelerates the heat dissipation speed, so that the heat dissipation effect of this embodiment is better. The number of the second heat sink 8 in the present embodiment is four, four The number of second heat sinks 8 is evenly distributed around the chip accommodating portion 2, but the number is not limited thereto, it can be selected according to the type of integrated chip, and will not be repeated here.

Figures 2 and 4 show that a number of heat dissipation through holes 3 are provided below the chip accommodation portion 2, so that the first heat sink 9 can conduct heat conduction with the air through the heat dissipation through holes 3 of the chip accommodation portion 2, so that it can communicate with the second cooling fin 9. The integrated chip contacted by a heat sink 9 can effectively dissipate heat during use.

The above-mentioned embodiments only express several implementations of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (7)

1. A heat dissipation metal frame, characterized in that it comprises a metal base and a first heat sink, the metal base is provided with a chip accommodation portion, the first heat sink is installed in the chip accommodation portion, and mutual Coordinated limit structure, the metal base is provided with several transverse grooves and several longitudinal grooves, several transverse grooves and several longitudinal grooves are intersected under the metal base, the first heat sink is heat-dissipating graphite piece. 2. A heat dissipation metal frame according to claim 1, characterized in that, the limiting structure comprises a fixing post and a slot corresponding to the fixing post, the fixing post is arranged on the inner surface of the chip accommodating part, and the slot is provided Below the first heat sink, when the first heat sink is installed in the chip accommodating portion, the fixing column is snapped into the slot. 3. A heat dissipation metal frame according to claim 1, characterized in that a first wave-shaped structure is provided under the first heat sink, and a second wave-shaped structure matching the wave-shaped structure is provided in the chip accommodating part . 4. A heat dissipation metal frame according to claim 1, characterized in that, the metal base is provided with several second heat sinks, and the several second heat sinks are distributed around the chip accommodation part and embedded in the metal base . 5 . The heat dissipation metal frame according to claim 4 , wherein the number of the second heat dissipation fins is four, and the four second heat dissipation fins are evenly distributed around the chip accommodating portion. 6 . The heat dissipation metal frame according to claim 4 , wherein the second heat dissipation sheet is a heat dissipation graphite sheet. 7 . The heat dissipation metal frame according to claim 1 , wherein a plurality of heat dissipation through holes are provided under the chip accommodating portion. 7 .