CN209563078U - Cooling fins for servers with interchangeable cooling fins - Google Patents

Abstract

The utility model discloses the server cooling fins of interchangeable radiating fin, including radiating bottom plate, radiating fin, the lower part of the radiating bottom plate is contacted with interface material, interface material lower part is contacted with chip layer, chip layer lower part contacts directly with basal layer, several fin mounting grooves are equipped in radiating bottom plate upper surface, the radiating fin for the pyroconductivity that matches is installed in fin mounting groove, the lower end of radiating fin and fin mounting groove use detachable mating connection structure.The utility model is by being equipped with several fin mounting grooves in radiating bottom plate upper surface, the radiating fin for the pyroconductivity that matches is installed in fin mounting groove, the lower end of radiating fin and fin mounting groove use detachable mating connection structure, it can be adjusted for specific cooling requirements, it can go to deploy according to heat sinking function needed for system, guarantee heat dissipation effect, reduce manufacturing cost and use cost, raising heat dissipation is effectively reduced cost, and improves the competitiveness of design requirement.

Description

Cooling fins for servers with interchangeable cooling fins

technical field

The utility model relates to the technical field of heat dissipation of computer equipment, in particular to a heat sink for a server with replaceable heat dissipation fins.

Background technique

There will be a chip processor in the server system. With the improvement of chip performance, the heat dissipated per unit volume (heating density) is getting higher and higher, so the problem of electronic heat dissipation is becoming more and more serious and difficult. The radiator is made of fins. (HeatSink), fan (FAN), base (Base), heat pipe (Heat Pipe) and other parts, use convection and heat conduction to dissipate heat to avoid overheating the chip. Any electronic component or device is composed of many transistors. The transistors will inevitably generate heat during operation. The heat must be dissipated to the surrounding environment through other channels such as heat conduction, heat convection or heat radiation. It will not cause the temperature of electronic components to be too high and affect the stability and reliability of the product. Therefore, the higher the thermal conductivity of the heat sink material and the larger the heat dissipation area, the better the heat dissipation efficiency.

There is a high power consumption chip processor in the server, and it must be equipped with a heat sink (Heat Sink), which is a material fixed on the surface of the electronic component, and is used to conduct the heat generated by the electronic component to the surroundings.

The heat sink is usually composed of a base plate (Base Plate) and many fins (Fins). The base plate is in direct contact with the electronic components and is responsible for quickly conducting and spreading the heat out to avoid excessive heat concentration; the fins are used to increase The heat dissipation area of the heat sink is used to further transfer the heat diffused from the bottom plate, and to dissipate the heat to the surrounding environment through the heat convection between the surface of the fin and the environment. Therefore, the higher the thermal conductivity of the heat sink material and the larger the heat dissipation area, the better the heat dissipation efficiency.

The heat sink structures of computers and servers in the prior art are all fixed structures, and the materials of the heat dissipation structures are fixed. The existing problem is that, on the one hand, it cannot be adjusted according to the specific heat dissipation requirements, and it cannot be adjusted according to the heat dissipation function required by the system. De-allocation will result in unbalanced heat dissipation effect and poor heat dissipation effect. On the other hand, in order to ensure the heat dissipation effect, the manufacturing cost and material cost of the heat dissipation structure are relatively high, which is not conducive to saving manufacturing and use costs.

Utility model content

In order to overcome the above-mentioned shortcomings existing in the prior art, the purpose of this utility model is to propose a heat sink for servers with replaceable cooling fins; Install the heat dissipation fins with matching thermal conductivity in the fin installation grooves. The lower end of the heat dissipation fins and the fin installation grooves adopt a detachable joint connection structure, which can be adjusted according to the specific heat dissipation requirements and can be adjusted according to the needs of the system. The heat dissipation function is adjusted to ensure the heat dissipation effect, reduce the manufacturing cost and the use cost, effectively reduce the cost, improve the heat dissipation performance, and improve the competitiveness of the design requirements.

The technical scheme that the utility model solves its technical problem to take is:

A heat sink for servers with replaceable heat dissipation fins, comprising a heat dissipation bottom plate and heat dissipation fins, the lower part of the heat dissipation bottom plate is in contact with an interface material layer, the lower part of the interface material layer is in contact with a chip layer, and the lower part of the chip layer is in direct contact with a base layer A plurality of fin installation grooves are arranged on the upper surface of the heat dissipation base plate, and heat dissipation fins with matching thermal conductivity are installed in the fin installation grooves, and the lower ends of the heat dissipation fins and the fin installation grooves adopt a detachable matching connection structure.

The fin installation groove adopts a standardized and generalized modular structure design, and several cooling fins with different thermal conductivities adopt a standardized and generalized modular structure design.

The heat dissipation fins are made of materials with different thermal conductivity.

The cooling fins made of materials with relatively high thermal conductivity are arranged in the middle of the radiator, and the cooling fins made of materials with relatively low thermal conductivity and low cost are arranged near the periphery of the radiator.

The lower end of the heat dissipation fin is provided with a fin fixing block, and the fin fixing block is matched with the fin installation groove.

The heat dissipation fins cooperate with the fin installation grooves by a plug-in mechanism.

The heat dissipation fins are made of aluminum or copper, or an alloy of aluminum and copper.

The heat dissipation fins are extruded aluminum heat sinks, and the material model is 6063.

The beneficial effects of the utility model are:

1. The heat sink structure of the present utility model is to be provided with several fin installation grooves on the upper surface of the heat dissipation base plate, and heat dissipation fins with matching thermal conductivity are installed in the fin installation grooves, and the lower ends of the heat dissipation fins are connected with the fin installation grooves. The detachable matching connection structure is adopted, and the heat dissipation fins are made of materials with different thermal conductivity, which can be adjusted according to the specific heat dissipation requirements, and can be allocated according to the heat dissipation function required by the system to ensure the heat dissipation effect and reduce the manufacturing cost and usage. cost. By applying the high-efficiency processing chip heat dissipation module to the system architecture of the computing board, the cost can be effectively reduced, the heat dissipation performance can be improved, and the competitiveness of design requirements can be improved.

2. Since the fin installation groove adopts a standardized and generalized modular structure design, several cooling fins with different thermal conductivity adopt a standardized and generalized modular structure design, which can be suitable for mass production and reduce manufacturing and use costs.

Since the cooling fins and the fin installation grooves are matched by a plug-in mechanism, it is convenient for large-scale production and manufacturing, the production cost is low, and it is convenient for assembly and disassembly. The lower end of the heat dissipation fin is provided with a fin fixing block, which cooperates with the fin installation groove, and is positioned through the cooperation of the fin fixing block and the fin installation groove. The fin fixing block ensures reliable installation and good heat dissipation effect.

4. Since the cooling fins made of materials with relatively high thermal conductivity are arranged in the middle of the radiator, the cooling fins made of materials with relatively low thermal conductivity and low cost are arranged near the periphery of the radiator, for example According to heat dissipation requirements, the heat sink can be made of aluminum or copper, or an alloy of aluminum and copper, which can be adjusted according to the heat dissipation function required by the system to ensure the heat dissipation effect and reduce the manufacturing cost and use cost.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is described further:

Fig. 1 is a schematic diagram of the installation structure of the utility model;

Fig. 2 is a structural schematic diagram of a heat sink of the utility model.

FIG. 3 is a schematic diagram of the connection structure between the fin fixing block 14 and the cooling fins 12 .

Detailed ways

In order to enable those skilled in the art to better understand the technical solution in the utility model, the technical solution in the utility model embodiment will be clearly and completely described below in conjunction with the accompanying drawings in the utility model embodiment. Obviously, The described embodiments are only some of the embodiments of the present utility model, but not all of them.

As shown in Figures 1-3, a heat sink for servers with replaceable heat dissipation fins. The heat sink 1 includes a heat dissipation bottom plate 11 and heat dissipation fins 12. The lower part of the bottom plate 11 is in contact with the interface material layer 3, and the interface material layer 3 The lower part is in contact with the chip layer 4, and the lower part of the chip layer 4 is in direct contact with the base layer 5, which is responsible for quickly conducting and diffusing the heat to avoid excessive heat concentration; the heat dissipation fins are used to increase the heat dissipation area of the heat sink for further transmission The heat dissipated from the bottom plate, and through the heat convection between the surface of the heat dissipation fins and the environment, the heat is spilled into the surrounding environment. According to the heat dissipation requirements of the surface of the electronic components, the structure of the heat dissipation bottom plate is determined. A plurality of fin installation grooves 13, fins with matching thermal conductivity are installed in the fin installation grooves, the lower ends of the heat dissipation fins and the fin installation grooves adopt a detachable matching connection structure, and several heat dissipation fins are required according to specific heat dissipation and installation The mounting slot adopts a standardized and generalized modular structure design, and several fins with different thermal conductivities adopt a standardized and generalized modular structure design. A fin fixing block 14 is provided at the lower end of the heat dissipation fin, and the fin fixing block 14 cooperates with the fin installation groove 13 .

The heat dissipation fins 12 are made of materials with different thermal conductivity, and the fins 12 made of materials with relatively high thermal conductivity are arranged in the middle of the radiator, so as to improve the heat dissipation performance as a whole, and the relatively low thermal conductivity and low cost are used. The fins 12 made of material are arranged near the outer edge of the heat sink to improve the heat dissipation performance as a whole, and can also be adjusted according to the heat dissipation function required by the system, so that the heat sink can save manufacturing and use costs under the condition of reliable heat dissipation.

The heat dissipation fins are extruded aluminum heat sinks, the material type is 6063, and have good thermal conductivity (160-180W/m.K). Certainly also can use aluminum, copper material or their alloy material system.

According to the heat dissipation needs of electronic components in different positions in the server, by making matching fin installation grooves on the upper surface of the heat dissipation base plate, install fins with matching thermal conductivity in the fin installation grooves, for example, according to the needs of the server, make contact Processing chips, design and manufacture optimized heat dissipation modules for processing chips that require heat dissipation, that is, heat dissipation baseplates and heat dissipation fins, and can also use replacement methods to replace media with higher thermal conductivity, so as to improve heat dissipation without replacing modules. Effective According to the experimental results, the rapid heat dissipation strain is made, so that the heat dissipation modules of the same shape and structure have different heat dissipation capabilities, so as to adapt to and meet the needs of surface heat dissipation of electronic components of different sizes and types, and ensure the safe and reliable operation of the server. The utility model is particularly suitable for the high-efficiency and complicated processing chips in the prior art server design, which require a good heat dissipation module for the heat sink. By applying the high-efficiency processing chip heat dissipation module to the system architecture of the computing board, the cost can be effectively reduced, the heat dissipation performance can be improved, and the competitiveness of design requirements can be improved.

Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

Claims (8)

1. a kind of server cooling fin of interchangeable radiating fin, including radiating bottom plate, radiating fin, characterized in that described The lower part of radiating bottom plate is contacted with interface material, and interface material lower part is contacted with chip layer, chip layer lower part and basal layer Contact directly, in radiating bottom plate upper surface is equipped with several fin mounting grooves, and the pyroconductivity that matches is installed in fin mounting groove Radiating fin, the lower end of radiating fin and fin mounting groove use detachable mating connection structure.

2. the server cooling fin of interchangeable radiating fin as described in claim 1, characterized in that the fin mounting groove Using standardization and unitized model structural design, several radiating fins of different pyroconductivities are using standardization and generalization Model structural design.

3. the server cooling fin of interchangeable radiating fin as described in claim 1, characterized in that the radiating fin is adopted It is made of the material of different pyroconductivities.

4. the server cooling fin of interchangeable radiating fin as claimed in claim 3, characterized in that utilize relatively high fever The radiating fin of the material production of conductivity is arranged in the centre of radiator, utilizes relatively low pyroconductivity and material at low cost The radiating fin of matter production is arranged in the position close to periphery of radiator.

5. the server cooling fin of interchangeable radiating fin as described in claim 1, characterized in that the radiating fin with Fin mounting groove is cooperated using plug-in mechanism.

6. the server cooling fin of interchangeable radiating fin as claimed in claim 5, characterized in that the lower end of radiating fin Equipped with fin fixed block, the fin fixed block and fin mounting groove cooperate.

7. the server cooling fin of interchangeable radiating fin as described in claim 1, characterized in that the radiating fin is adopted With aluminium, perhaps copper material is manufactured or the alloy material of aluminium, copper is made.

8. the server cooling fin of interchangeable radiating fin as described in claim 1, characterized in that the radiating fin is adopted With aluminium extruded type cooling fin, material model 6063.