CN219269413U - Electronic equipment heat radiation assembly - Google Patents
Electronic equipment heat radiation assembly Download PDFInfo
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- CN219269413U CN219269413U CN202223475316.5U CN202223475316U CN219269413U CN 219269413 U CN219269413 U CN 219269413U CN 202223475316 U CN202223475316 U CN 202223475316U CN 219269413 U CN219269413 U CN 219269413U
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- heat radiation
- heat pipe
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- 230000005855 radiation Effects 0.000 title claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation assembly of electronic equipment, which comprises: the heat-conducting device comprises a flat heat pipe, a left heat-radiating fan and a right heat-radiating fan which are arranged at intervals, wherein the left heat-radiating fan and the right heat-radiating fan are respectively provided with an air outlet, a heat-radiating fin group is arranged at the air outlet, two ends of the flat heat pipe are respectively connected with the upper surfaces of the two heat-radiating fin groups, a second mounting piece and a first mounting piece which is contacted with a first heat source are arranged between the left heat-radiating fan and the right heat-radiating fan and connected with the middle section of the flat heat pipe, a first through hole is formed in the central position of the second mounting piece, a heat-conducting pad table is fixedly connected with the inner wall of the first through hole, the upper surface of the heat-conducting pad table is flush with the inner wall surface of the second mounting piece, and the lower surface of the heat-conducting pad table is contacted with the second heat source. The electronic equipment heat radiation assembly improves the use efficiency of the heat pipe and the whole heat radiation area on the basis of ensuring stable heat transfer, thereby improving the whole heat radiation efficiency.
Description
Technical Field
The present utility model relates to the field of heat dissipation of electronic products, and in particular, to a heat dissipation assembly for an electronic device.
Background
At present, a CPU and a GPU are mounted on a motherboard of an electronic product, and a large amount of heat is emitted during operation, and generally, the heat is dissipated by arranging a radiator, the external radiator mainly strengthens the air flow speed of a plastic shell at the bottom to reduce the external temperature, and the internal heat is forced to be carried out by the internal radiator.
In the prior art, a CPU and a GPU are respectively connected with an internal radiator through copper pipes, but in the running process of an electronic product, the working states of the CPU and the GPU are different, for example, the CPU is in a low-power state and the GPU is in a high-power state, at the moment, the heat transferred by a heat pipe connected with the CPU is less, and the heat pipe connected with the GPU is possibly in an overheat state, so that the use efficiency of the heat pipe is not high.
Disclosure of Invention
The utility model aims to provide the electronic equipment heat dissipation assembly, which improves the use efficiency of a heat pipe and the whole heat dissipation area on the basis of ensuring stable heat transfer, thereby improving the whole heat dissipation efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme: an electronic device heat dissipation assembly comprising: the heat pipe comprises a flat heat pipe, a left heat radiation fan and a right heat radiation fan which are arranged at intervals, wherein the left heat radiation fan and the right heat radiation fan are respectively provided with an air outlet, a heat radiation fin group is arranged at the air outlet, and two ends of the flat heat pipe are respectively connected with the upper surfaces of the two heat radiation fin groups;
the heat-conducting heat pipe is characterized in that a second mounting sheet and a first mounting sheet contacted with a first heat source are connected to the middle section of the flat heat pipe and positioned between the left heat-radiating fan and the right heat-radiating fan, a first through hole is formed in the center of the second mounting sheet, a heat-conducting pad table is fixedly connected to the inner wall of the first through hole, the upper surface of the heat-conducting pad table is flush with the inner wall surface of the second mounting sheet, and the lower surface of the heat-conducting pad table is contacted with the second heat source.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the flat heat pipes are provided with at least two.
2. In the above scheme, the flat heat pipes are arranged in parallel.
3. In the above scheme, the upper surfaces of the first mounting piece and the second mounting piece and positioned at two sides of the flat heat pipe are provided with a plurality of spring plate columns, the two ends of one spring plate are provided with first round holes for the stud to be embedded and mounted, a plurality of second round holes are positioned between the two first round holes and are correspondingly matched with the spring plate columns along the length direction of the spring plate.
4. In the scheme, the diameter of the first round hole is 1.2-2.5 times of that of the second round hole.
5. In the above scheme, the heat radiation fin group is formed by splicing a plurality of heat radiation fins in parallel, so that an air outlet flow channel is formed between two adjacent heat radiation fins.
6. In the scheme, the first mounting piece and the second mounting piece are copper sheets or aluminum sheets.
7. In the scheme, the heat conduction pad table is a copper sheet or an aluminum sheet.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
1. the utility model relates to a heat radiation component of electronic equipment, two ends of a flat heat pipe are respectively connected with the upper surfaces of two heat radiation fin groups, a second mounting sheet and a first mounting sheet contacted with a first heat source are connected between a left heat radiation fan and a right heat radiation fan and are positioned at the middle section of the flat heat pipe, a first through hole is formed in the central position of the second mounting sheet, a heat conduction pad table is fixedly connected to the inner wall of the first through hole, the upper surface of the heat conduction pad table is flush with the inner wall surface of the second mounting sheet, the lower surface of the heat conduction pad table is contacted with the second heat source, and the heat conduction gap between the second heat source and the second mounting sheet is greatly reduced by arranging the heat conduction pad table between the second mounting sheet and the second heat source, so that the heat transfer between the second heat source and the second mounting sheet is improved, the stable heat transfer between the second heat source and the second mounting sheet is ensured, the two ends of the flat heat pipe are respectively connected with the left heat radiation fan and the right heat radiation fan, the first mounting sheet and the second mounting sheet connected with the first heat source and the second heat source are arranged at the middle section of the flat heat pipe, thereby the heat transfer efficiency of the whole heat source is improved, the heat radiation efficiency of the heat source is also improved, and the heat radiation efficiency of the whole heat source is improved, and the heat radiation efficiency of the heat source is improved.
2. The heat dissipation component of the electronic equipment is characterized in that a plurality of spring plate columns are arranged on the upper surfaces of the first mounting plate and the second mounting plate and are positioned on two sides of the flat heat pipe, first round holes for inserting and mounting studs are formed in two ends of one spring plate, a plurality of second round holes are formed between the two first round holes and along the length direction of the spring plate, the second round holes are correspondingly matched with the spring plate columns, and the tightness of the contact of the first mounting plate and the second mounting plate with the first heat source and the second heat source is improved by arranging the spring plates on the first mounting plate and the second mounting plate, so that the heat transfer effect is further improved.
Drawings
FIG. 1 is a schematic diagram of the overall front structure of a heat dissipating assembly of an electronic device according to the present utility model;
FIG. 2 is a schematic diagram of the overall back structure of the heat dissipating assembly of the electronic device of the present utility model;
fig. 3 is an enlarged view of fig. 1 at a in accordance with the present utility model.
In the above figures: 1. a flat heat pipe; 21. a left heat radiation fan; 22. a right heat radiation fan; 3. a heat radiation fin group; 4. a first mounting tab; 5. a second mounting plate; 6. a first through hole; 7. a heat conduction pad table; 8. a spring plate column; 9. a spring plate; 10. a first round hole; 11. a second round hole; 12. and a second through hole.
Detailed Description
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: an electronic device heat dissipation assembly comprising: the heat pipe comprises a flat heat pipe 1, a left heat radiation fan 21 and a right heat radiation fan 22 which are arranged at intervals, wherein the left heat radiation fan 21 and the right heat radiation fan 22 are respectively provided with an air outlet, a heat radiation fin group 3 is arranged at the air outlet, and two ends of the flat heat pipe 1 are respectively connected with the upper surfaces of the two heat radiation fin groups 3;
the first mounting plate 4 is positioned between the left cooling fan 21 and the right cooling fan 22, is connected with the second mounting plate 5 and is contacted with the first heat source, and when the first heat source is in a high-power heating state and the second heat source is in a low-power heating state, the heat of the first heat source transferred to the flat heat pipe through the first mounting plate is transferred to the flat heat pipe through the heat conducting gasket and the second mounting plate in sequence;
a first through hole 6 is formed in the center of the second mounting plate 5, the inner wall of the first through hole 6 is fixedly connected with a heat conducting pad table 7, the upper surface of the heat conducting pad table 7 is level with the inner wall surface of the second mounting plate 5, and the lower surface of the heat conducting pad table 7 is in contact with a second heat source;
because the two ends of the flat heat pipe are connected with the radiating fin group, under the working state of the fan, heat moves from the two ends of the flat heat pipe of the middle section box of the flat heat pipe, so that heat is radiated.
Two flat heat pipes 1 are arranged; the flat heat pipes 1 are arranged in parallel.
The first mounting plate 4 and the second mounting plate 5 are provided with a plurality of spring plate columns 8 on the upper surfaces thereof and on two sides of the flat heat pipe 1, the two ends of a spring plate 9 are provided with first round holes 10 for inserting and mounting studs, a plurality of second round holes 11 are arranged between the two first round holes 10 and along the length direction of the spring plate 9, and the second round holes 11 are correspondingly matched with the spring plate columns 8.
The diameter of the first circular hole 10 is 1.5 times that of the second circular hole 11.
The first mounting piece 4 and the second mounting piece 5 are copper sheets.
The heat conduction pad table 7 is an aluminum sheet.
A second through hole 13 is formed on one side of the first mounting piece 4, and the second through hole 13 is located below the end of one of the elastic pieces 9, so that the stud penetrates through the first through hole 10 and the second through hole 13 to be fixedly mounted.
Example 2: a heat dissipating assembly, comprising: the heat pipe comprises a flat heat pipe 1, a left heat radiation fan 21 and a right heat radiation fan 22 which are arranged at intervals, wherein the left heat radiation fan 21 and the right heat radiation fan 22 are respectively provided with an air outlet, a heat radiation fin group 3 is arranged at the air outlet, and two ends of the flat heat pipe 1 are respectively connected with the upper surfaces of the two heat radiation fin groups 3;
the first mounting plate 4 which is positioned between the left heat radiation fan 21 and the right heat radiation fan 22 and is in contact with the first heat source is connected with the second mounting plate 5 and the middle section of the flat heat pipe 1, the two ends of the flat heat pipe are respectively connected with the heat radiation fin groups of the left heat radiation fan and the right heat radiation fan, and the first mounting plate and the second mounting plate which are connected with the first heat source and the second heat source are arranged at the middle section of the flat heat pipe, so that the heat of the first heat source and the second heat source is favorably transferred to the heat radiation fin groups through the flat heat pipe, the service efficiency of the heat pipe is improved, the whole heat radiation area is also increased, and the whole heat radiation efficiency is further improved;
the central position of the second mounting plate 5 is provided with a first through hole 6, the inner wall of the first through hole 6 is fixedly connected with a heat conduction pad table 7, the upper surface of the heat conduction pad table 7 is flush with the inner wall surface of the second mounting plate 5, the lower surface of the heat conduction pad table is contacted with the second heat source, and the heat conduction gap between the second heat source and the second mounting plate is greatly reduced by arranging the heat conduction pad table between the second mounting plate and the second heat source, so that the heat transfer between the second heat source and the second mounting plate is improved.
The flat heat pipe 1 is provided with at least two.
The first mounting plate 4 and the second mounting plate 5 are provided with a plurality of spring plate columns 8 on the upper surfaces thereof and on two sides of the flat heat pipe 1, the two ends of a spring plate 9 are provided with first round holes 10 for inserting and mounting studs, a plurality of second round holes 11 are arranged between the two first round holes 10 and along the length direction of the spring plate 9, and the second round holes 11 are correspondingly matched with the spring plate columns 8.
Through set up the shell fragment on first mounting piece, second mounting piece, improved the compactness of first mounting piece, second mounting piece and first heat source, second heat source contact to further improved thermal transfer effect.
The diameter of the first circular hole 10 is 2 times that of the second circular hole 11.
The heat radiation fin group 3 is formed by splicing a plurality of heat radiation fins 31 in parallel, so that an air outlet flow channel is formed between two adjacent heat radiation fins 31.
The first mounting piece 4 and the second mounting piece 5 are aluminum sheets.
The heat conducting pad table 7 is a copper sheet.
The first heat source is a GPU in the notebook computer, and the second heat source is a CPU in the notebook computer.
The working principle of the utility model is as follows:
when the heat radiator works, when the first heat source is in a high-power heating state and the second heat source is in a low-power heating state, the heat of the first heat source transferred to the flat heat pipe through the first mounting plate and the heat of the second heat source are sequentially transferred to the flat heat pipe through the heat conducting gasket and the second mounting plate, as the two ends of the flat heat pipe are connected with the heat radiating fin group, in the fan working state, the heat moves from the two ends of the flat heat pipe of the middle section box of the flat heat pipe, so that heat is radiated.
When the electronic equipment heat dissipation assembly is adopted, the heat conduction gap between the second heat source and the second mounting sheet is greatly reduced, so that the heat transfer between the second heat source and the second mounting sheet is improved, the stable transfer of heat between the second heat source and the second mounting sheet is ensured, the heat transfer between the first heat source and the second heat source to the heat dissipation fin group through the flat heat pipe is facilitated, the integral heat dissipation area is increased, the use efficiency of the heat pipe is also improved, the overheat condition of a single heat pipe is effectively avoided, and the integral heat dissipation efficiency is improved; in addition, the elastic sheets are arranged on the first mounting sheet and the second mounting sheet, so that the compactness of the contact between the first mounting sheet and the second mounting sheet and the contact between the first heat source and the second heat source are improved, and the heat transfer effect is further improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (8)
1. The utility model provides an electronic equipment cooling module which characterized in that: comprising the following steps: the heat pipe comprises a flat heat pipe (1), a left heat radiation fan (21) and a right heat radiation fan (22) which are arranged at intervals, wherein the left heat radiation fan (21) and the right heat radiation fan (22) are respectively provided with an air outlet, a heat radiation fin group (3) is arranged at the air outlet, and two ends of the flat heat pipe (1) are respectively connected with the upper surfaces of the two heat radiation fin groups (3);
the heat-conducting heat pipe is characterized in that a second mounting sheet (5) and a first mounting sheet (4) in contact with a first heat source are connected to the middle section of the flat heat pipe (1) and located between the left heat-radiating fan (21) and the right heat-radiating fan (22), a first through hole (6) is formed in the central position of the second mounting sheet (5), a heat-conducting pad table (7) is fixedly connected to the inner wall of the first through hole (6), the upper surface of the heat-conducting pad table (7) is flush with the inner wall surface of the second mounting sheet (5), and the lower surface of the heat-conducting pad table is in contact with the second heat source.
2. The electronic device heat dissipation assembly of claim 1, wherein: the flat heat pipes (1) are provided with at least two.
3. The electronic device heat dissipation assembly of claim 2, wherein: the flat heat pipes (1) are arranged in parallel.
4. The electronic device heat dissipation assembly of claim 1 or 2, wherein: the upper surfaces of the first mounting piece (4) and the second mounting piece (5) and two sides of the flat heat pipe (1) are provided with a plurality of spring plate columns (8), two ends of a spring plate (9) are provided with first round holes (10) for stud embedding and mounting, a plurality of second round holes (11) are arranged between the two first round holes (10) and along the length direction of the spring plate (9), and the second round holes (11) are correspondingly matched with the spring plate columns (8).
5. The electronic device heat dissipation assembly of claim 4, wherein: the diameter of the first round hole (10) is 1.2-2.5 times of that of the second round hole (11).
6. The electronic device heat dissipation assembly of claim 1, wherein: the radiating fin group (3) is formed by splicing a plurality of radiating fins (31) in parallel, so that an air outlet flow channel is formed between two adjacent radiating fins (31).
7. The electronic device heat dissipation assembly of claim 1, wherein: the first mounting piece (4) and the second mounting piece (5) are copper sheets or aluminum sheets.
8. The electronic device heat dissipation assembly of claim 1, wherein: the heat conduction pad table (7) is a copper sheet or an aluminum sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223475316.5U CN219269413U (en) | 2022-12-26 | 2022-12-26 | Electronic equipment heat radiation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223475316.5U CN219269413U (en) | 2022-12-26 | 2022-12-26 | Electronic equipment heat radiation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219269413U true CN219269413U (en) | 2023-06-27 |
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ID=86853387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223475316.5U Active CN219269413U (en) | 2022-12-26 | 2022-12-26 | Electronic equipment heat radiation assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219269413U (en) |
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2022
- 2022-12-26 CN CN202223475316.5U patent/CN219269413U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240207 Address after: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Patentee after: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region after: China Address before: No. 388, Sanjia Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou pindai Electronic Technology Co.,Ltd. Country or region before: China |