CN201122589Y - Memory heat radiator with increased heat radiating area - Google Patents

Abstract

A memory heat sink with increased heat dissipation area is prepared as forming multiple convex points on heat sink attached to front surface of memory, setting each convex point and heat sink to have at least one cut-off surface and at least one connection part for increasing heat dissipation area of heat sink and utilizing cut-off surface to make heat generated by memory be easily convected out.

Description

Memory cooler with increased cooling area

Technical field:

The utility model relates to a memory heat dissipation device with increased heat dissipation area, in particular to a heat dissipation device in which a plurality of bumps with cut surfaces are punched out on the heat dissipation sheet.

Background technique:

As the computing speed of the computer increases, the memory generates higher heat, which must be eliminated, otherwise it is prone to crashes. Therefore, it is almost standardized to install heat sinks on the front and back of the memory with glue on the outside of the memory.

There are quite a lot of previous patents related to two heat sinks forming a memory cooling device. The main technology of the previous patents is generally how to solve the problem of fastening the two heat sinks, or extend the heat dissipation structure upwards.

Most of the relevant prior proposals use planar metal heat sinks to form heat sinks. Since heat dissipation is only performed by heat conduction, its efficiency needs to be increased. There are also related prior proposals to increase the area of heat sinks.

For example, in the previous case of Taiwan New Patent Announcement No. M279165 "Improved Memory Radiator", it was revealed that the outer surfaces of the two clips were provided with various special lines of concave and convex alternately to increase the heat dissipation area; but the previous case The heat sink still dissipates heat only by conduction.

For example, in the previous case of Taiwan New Patent Announcement No. M292738 "Memory Chip Heat Dissipation Structure", it is disclosed that the other side of the heat dissipation plate contacting the memory chip is provided with at least one protrusion, which can increase the heat dissipation surface area; but the heat sink of the previous case Heat is still dissipated only by conduction.

For example, in the previous case of Taiwan New Patent Announcement No. M298165 "Heat Dissipation Structure of Memory", it is disclosed that the connecting seat (i.e. heat sink) is respectively provided with a plurality of fins on the two outer surfaces corresponding to the bridging part; but the heat sink of the previous case is still only Dissipate heat by conduction.

The only relevant prior application that utilizes heat convection for heat dissipation is Taiwan New Patent Publication No. M303419 "Cooling Device for Memory". Although this design can increase the effect of heat convection, the area of the heat sink is reduced due to the space formed by the heat dissipation holes, and foreign objects such as dust are easy to accumulate on the heat dissipation holes, so there are still many disadvantages in use.

Utility model content:

The technical problem to be solved by the utility model is to provide a memory cooling device with an increased heat dissipation area by punching out a plurality of bumps with a cut-off surface on the heat sink for the above-mentioned deficiencies in the prior art.

In order to solve the above technical problems, the technical solution adopted by the utility model is: a memory cooling device with an increased heat dissipation area, which includes two heat sinks respectively attached to the front and back of a memory, and its characteristics are: at least one heat sink A plurality of outwardly protruding bumps are formed on the side of the sheet away from the memory, and each bump has at least one section and at least one connection with the cooling sheet.

In this way, the heat dissipation area of the heat sink is increased, and the heat generated by the memory is easily convected and sent out by using the cut-off surface. At the same time, since the bump body only extends on the heat sink to increase the heat dissipation area without large gaps, it is naturally not easy to accumulate foreign matter such as dust, and the use effect is good.

Hereinafter, the structure and functions of the present utility model will be described in detail according to the embodiments shown in the drawings.

Description of drawings:

Fig. 1 is an exploded view of the first embodiment of the utility model.

FIG. 2 is a combination diagram of FIG. 1 .

FIG. 3 is an enlarged view of the bump in FIG. 1 .

FIG. 4 is a cross-sectional view of the bump in FIG. 1 .

Fig. 5 is a schematic diagram of the second embodiment of the present invention.

Fig. 6 is an exploded view of the third embodiment of the present invention.

FIG. 7 is a combination diagram of FIG. 6 .

FIG. 8 is an enlarged view of the bump in FIG. 6 .

FIG. 9 is a cross-sectional view of the bump in FIG. 6 .

Fig. 10 is a schematic diagram of a fourth embodiment of the present invention.

Label description:

20...Memory 11...Heat sink

111... tenon 112... card seat

12...Heat sink 121...Catch tenon

122...Deck 13...Bump

14...Cutting surface 15...Connecting part

Detailed ways:

Please refer to Fig. 1 and Fig. 2, which is the first embodiment of the memory cooling device with increased heat dissipation area of the present invention, which mainly includes two heat sinks 11, 12 respectively attached to the front and back of a memory 20, which can be glued The heat sinks 11 , 12 are adhered to the memory 20 . And the main technical feature of the present utility model is, at least on the cooling fin 11 that is attached to the memory front, form the protruding bump 13 of most toward the front, also can form the bump 13 that protruding toward the back of the majority on the heat sink 12 of memory back side .

Referring to FIG. 3 and FIG. 4 , each bump 13 and the heat sink 11 have at least one section 14 and at least one connecting portion 15 . In this embodiment, the cut surface 14 of each bump 13 is arc-shaped, and the connecting portion 15 is arranged vertically (the axial direction of the heat sink is taken as the horizontal direction, the same applies hereinafter), forming a fish scale shape.

Utilizing the bumps 13 increases the heat conduction and heat dissipation area of the entire heat sink 11 , and utilizes the gap generated by the cut surface 14 to provide heat convection heat dissipation, thus having a good heat dissipation effect. At the same time, since the gap between the bumps 13 and the heat sink 11 is small, no accumulation of dust or foreign matter will occur.

Embodiment 2, as shown in FIG. 5 , is similar to the first embodiment, the cut surface 14 of the bump 13 is arc-shaped, and the difference is that the connecting portion 15 is arranged horizontally, forming a fish scale shape.

The bumps 13 of the present invention can also be of other shapes, see Fig. 6 to Fig. 9, which are the third embodiment of the present invention. In this embodiment, two heat sinks 11 and 12 respectively attached to the front and back of a memory 20 constitute the heat dissipation device. The protruding point 13 has two parallel cut surfaces 14 and two symmetrical connecting portions 15, so that the protruding point 13 has a protruding arc shape. In the embodiment in this figure, the two parallel cut surfaces 14 can be arranged horizontally or vertically, which is a simple change of this embodiment and still belongs to the scope of patent protection.

As shown in Figure 10, it is similar to the previous embodiment, but on the basis of the previous embodiment, a tenon 111, 121 and a card seat 112, 122 are oppositely provided on the upper edges of the two heat sinks 11, 12, and the opposite The tenons 111, 121 and the card seats 112, 122 can be engaged with each other.

Claims (7)

1. A memory cooling device with increased heat dissipation area, which comprises two heat sinks respectively attached to the front and back of a memory, characterized in that at least one heat sink forms a plurality of protruding protrusions on the side away from the memory points, and each bump has at least one section and at least one connecting portion with the cooling fin. 2. The memory cooling device with increased heat dissipation area according to claim 1, characterized in that: the cut surface of each bump is arc-shaped, and the connection part is arranged vertically to form fish scales. 3. The memory cooling device with increased heat dissipation area according to claim 1, characterized in that: the cut surface of each bump is arc-shaped, and the connection part is arranged horizontally to form fish scales. 4. The memory cooling device with increased heat dissipation area according to claim 1, wherein each bump has two parallel cut surfaces and two symmetrical connecting parts, so that the bump is a protruding arc shape. 5. The heat dissipation device for memory with increased heat dissipation area according to claim 4, characterized in that: the two parallel cut surfaces are arranged horizontally. 6. The heat dissipation device for memory with increased heat dissipation area according to claim 4, characterized in that: the two parallel cut surfaces are vertically arranged. 7. The memory cooling device with increased cooling area according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that: the upper edges of the two cooling fins are oppositely provided with a tenon and a card seat, And the relative tenon and the card seat are engaged with each other.

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