[go: up one dir, main page]

CN202150085U - Cooling module structure - Google Patents

Cooling module structure Download PDF

Info

Publication number
CN202150085U
CN202150085U CN201120267279U CN201120267279U CN202150085U CN 202150085 U CN202150085 U CN 202150085U CN 201120267279 U CN201120267279 U CN 201120267279U CN 201120267279 U CN201120267279 U CN 201120267279U CN 202150085 U CN202150085 U CN 202150085U
Authority
CN
China
Prior art keywords
heat dissipation
module structure
base
groove
dissipation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120267279U
Other languages
Chinese (zh)
Inventor
巫俊铭
余明翰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to CN201120267279U priority Critical patent/CN202150085U/en
Application granted granted Critical
Publication of CN202150085U publication Critical patent/CN202150085U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation module structure comprises: the heat pipe.

Description

散热模组结构Cooling module structure

技术领域 technical field

本实用新型有关于一种散热模组结构,尤指一种可快速固定热管于基座上以大幅提升组装效率减少工时之散热模组结构。The utility model relates to a heat dissipation module structure, in particular to a heat dissipation module structure that can quickly fix a heat pipe on a base to greatly improve assembly efficiency and reduce man-hours.

背景技术 Background technique

按,由于科技时代的进步,电子元件之运作效能越来越高,以至于对散热单元的功能要求也随之增加,公知之散热单元为了能增加散热功效,都已大幅采用堆迭式的散热鳍片组,且不断于散热鳍片上研发改良,因此高效能之散热单元已经是今天产业界最重要的研发重点之一,又或于该电子元件上方设置有散热单元并通过该散热单元对所述电子元件进行散热,所述散热单元通常为散热器或散热鳍片对应配上一散热风扇进行散热工作,进一步通过热导管串接所述散热单元将热源引导至远处进行散热。By the way, due to the advancement of the technology era, the operating performance of electronic components is getting higher and higher, so that the functional requirements for the heat dissipation unit are also increasing. In order to increase the heat dissipation effect, the known heat dissipation units have largely adopted stacked heat dissipation. Fin group, and constantly develop and improve the heat dissipation fins, so the high-efficiency heat dissipation unit has become one of the most important research and development priorities in the industry today, or a heat dissipation unit is installed above the electronic component and through the heat dissipation unit. The electronic components are used to dissipate heat. The heat dissipation unit is usually a radiator or a heat dissipation fin, and a heat dissipation fan is correspondingly equipped with a heat dissipation fan for heat dissipation. The heat dissipation unit is further connected in series through a heat pipe to guide the heat source to a distant place for heat dissipation.

以电脑主机为例,其内部中央处理单元(CPU)所产生之热量占大部分,此外,中央处理单元当热量逐渐升高会造成执行效能降低,且当热量累积高于其容许限度时,将会迫使电脑当机,严重者更可能会造成毁损现象;并且,为解决电磁波辐射之问题,通常系以机箱壳体来封闭该电脑主机,以致如何将中央处理单元及其它发热零组件(或称元件)之热能快速导出,成为一重要课题。Taking a host computer as an example, the heat generated by its internal central processing unit (CPU) accounts for the majority. In addition, when the heat of the central processing unit gradually increases, the execution performance will decrease, and when the accumulated heat exceeds its allowable limit, it will It will force the computer to crash, and in severe cases, it may cause damage; and, in order to solve the problem of electromagnetic wave radiation, the computer host is usually closed with a chassis shell, so that how to integrate the central processing unit and other heat-generating components (or called The rapid derivation of heat energy of components) has become an important issue.

现行散热装置及散热模组系通过多个散热元件相互搭配组装所组成,所述散热元件系为热管、散热器、散热基座等元件,所述散热元件彼此搭配结合主要系通过焊接加以固定,但针对以铝材质所制成之散热元件若要进行焊接作业,则不仅需要以特种焊接工作之方式进行焊接外,其加工成本亦相对增加。Existing heat dissipation devices and heat dissipation modules are composed of a plurality of heat dissipation elements that are matched and assembled with each other. The heat dissipation elements are heat pipes, radiators, heat dissipation bases and other components. The combination of the heat dissipation elements is mainly fixed by welding. However, if the heat dissipation element made of aluminum is to be welded, it not only needs to be welded in a special welding manner, but also the processing cost is relatively increased.

另者,亦有技术人员以螺丝等固定元件对所述散热元件进行结合固定,但固定元件仅能针对部分散热元件进行螺锁固定(如散热鳍片组与散热基座),针对热管则无法直接通过螺锁之方式进行固定。In addition, there are also technical personnel who combine and fix the heat dissipation elements with screws and other fixing elements, but the fixing elements can only be screwed and fixed for some heat dissipation elements (such as heat dissipation fin groups and heat dissipation bases), but not for heat pipes. Fix directly by means of screw lock.

再者,公知技术系于该散热基座开设一孔洞或一沟槽将该热管穿设于该散热基座之孔洞或该沟槽,令该热管与该散热基座得以结合,此一结合方式虽解决前述焊接及螺锁固定方式之问题,但传统热管与散热基座间之定位方式,系将其热管与散热基座金行焊接组装,或热管紧配于散热基座内,进而造成材料成本与制造及组装成本高,且容易造成热管损坏而不良率提高之问题。Moreover, the known technology is to open a hole or a groove in the heat dissipation base, and the heat pipe is passed through the hole or the groove of the heat dissipation base, so that the heat pipe and the heat dissipation base can be combined. Although the problems of the aforementioned welding and screw lock fixing methods are solved, the traditional positioning method between the heat pipe and the heat dissipation base is to weld and assemble the heat pipe and the heat dissipation base, or the heat pipe is tightly fitted in the heat dissipation base, resulting in material The cost and manufacturing and assembly costs are high, and it is easy to cause damage to the heat pipe and increase the defective rate.

故公知技术具有下列缺点:Therefore known technology has following shortcoming:

1.无法快速定位其热管与散热基座;1. It is impossible to quickly locate its heat pipe and heat dissipation base;

2.焊接材料成本高;2. The cost of welding materials is high;

3.组装效率低且工时增加;3. Low assembly efficiency and increased man-hours;

4.不合格率高。4. The failure rate is high.

实用新型内容 Utility model content

本实用新型之主要目的在提供一种可快速固定热管于基座之散热模组结构。The main purpose of the utility model is to provide a heat dissipation module structure that can quickly fix the heat pipe on the base.

本实用新型之次要目的在提供一种大幅提升组装效率且减少工时之散热模组结构。The secondary objective of the present invention is to provide a heat dissipation module structure that greatly improves assembly efficiency and reduces man-hours.

为达上述目的本实用新型系提供一种散热模组结构,系包含:一基座及至少一定位件;In order to achieve the above purpose, the utility model provides a heat dissipation module structure, which includes: a base and at least one positioning member;

所述基座一侧形成有至少一沟槽,该沟槽具有一封闭侧及一开放侧,且该基座相对应于开放侧位置处形成有至少一第一固定部;所述定位件系设置于该基座之沟槽上,且该定位件一侧具有至少一第二固定部,该第二固定部系相对组设其第一固定部;因此藉由其定位件可快速固定热管于基座上,进而提升组装效率且减少工时。At least one groove is formed on one side of the base, the groove has a closed side and an open side, and at least one first fixing portion is formed on the base corresponding to the open side; the positioning member is It is arranged on the groove of the base, and there is at least one second fixing part on one side of the positioning part, and the second fixing part is opposite to the first fixing part; therefore, the heat pipe can be quickly fixed on the positioning part. on the base, thereby improving assembly efficiency and reducing man-hours.

具体而言,本实用新型提供了一种散热模组结构,包括:Specifically, the utility model provides a heat dissipation module structure, including:

一基座,该基座形成有至少一沟槽,该沟槽具有一封闭侧及一开放侧,且该基座于开放侧位置处形成有至少一第一固定部;及a base, the base is formed with at least one groove, the groove has a closed side and an open side, and the base is formed with at least one first fixing portion at the position of the open side; and

至少一定位件,该定位件设置于该沟槽上,且该定位件具有至少一第二固定部对应该第一固定部。At least one positioning piece is arranged on the groove, and the positioning piece has at least one second fixing portion corresponding to the first fixing portion.

优选的是,所述的散热模组结构,所述基座侧边具有至少一锁固部。Preferably, in the heat dissipation module structure, the side of the base has at least one locking portion.

优选的是,所述的散热模组结构,所述基座与定位件间具有一胶层。Preferably, in the heat dissipation module structure, there is an adhesive layer between the base and the positioning member.

优选的是,所述的散热模组结构,所述沟槽内设置有热管。Preferably, in the heat dissipation module structure, heat pipes are arranged in the grooves.

优选的是,所述的散热模组结构,所述定位件设置于该沟槽与热管上,以固定其热管于沟槽内。Preferably, in the heat dissipation module structure, the positioning member is arranged on the groove and the heat pipe to fix the heat pipe in the groove.

优选的是,所述的散热模组结构,所述开放侧位置处具有至少一凹孔,而该定位件上具有至少一孔洞。Preferably, in the heat dissipation module structure, there is at least one concave hole at the position of the open side, and at least one hole is formed on the positioning member.

优选的是,所述的散热模组结构,所述孔洞内灌注有胶材,其胶材同时灌注至凹孔,且将其胶材灌注至沟槽与热管间。Preferably, in the heat dissipation module structure, glue is poured into the hole, and the glue is poured into the concave hole at the same time, and the glue is poured between the groove and the heat pipe.

优选的是,所述的散热模组结构,所述第一固定部与第二固定间通过至少一固定元件固定。Preferably, in the heat dissipation module structure, the first fixing portion and the second fixing space are fixed by at least one fixing element.

优选的是,所述的散热模组结构,所述定位件相对应于沟槽一侧具有多个抵触端,该孔洞系贯穿所述抵触端。Preferably, in the heat dissipation module structure, the positioning member has a plurality of conflicting ends corresponding to one side of the groove, and the hole runs through the conflicting ends.

优选的是,所述的散热模组结构,所述基座于第一固定部位置处形成有一嵌槽。Preferably, in the heat dissipation module structure, the base forms a slot at the position of the first fixing part.

优选的是,所述的散热模组结构,所述孔洞系贯穿所述第二固定部。Preferably, in the heat dissipation module structure, the hole runs through the second fixing part.

优选的是,所述的散热模组结构,所述基座开放侧位置处直接成型有至少一第二定位件。Preferably, in the heat dissipation module structure, at least one second positioning member is formed directly at the open side of the base.

附图说明 Description of drawings

图1A系为本实用新型之第一较佳实施例之立体分解图;Fig. 1A is the three-dimensional exploded view of the first preferred embodiment of the present utility model;

图1B系为本实用新型之第一较佳实施例之立体图;Fig. 1B is a perspective view of the first preferred embodiment of the present utility model;

图1C系为本实用新型之第一较佳实施例之实施示意图一;Fig. 1C is the implementation schematic diagram 1 of the first preferred embodiment of the present utility model;

图1D系为本实用新型之第一较佳实施例之实施示意图二;Fig. 1D is the implementation schematic diagram 2 of the first preferred embodiment of the present utility model;

图2A系为本实用新型之第二较佳实施例之立体分解图;Fig. 2A is the three-dimensional exploded view of the second preferred embodiment of the present utility model;

图2B系为本实用新型之第二较佳实施例之立体图;Fig. 2B is the perspective view of the second preferred embodiment of the utility model;

图2C系为本实用新型之第二较佳实施例之实施示意图一;Fig. 2C is the implementation schematic diagram 1 of the second preferred embodiment of the present utility model;

图2D系为本实用新型之第二较佳实施例之剖视示意图;Fig. 2D is a schematic cross-sectional view of the second preferred embodiment of the present utility model;

图2E系为本实用新型之第二较佳实施例之实施示意图二;Fig. 2E is the implementation schematic diagram 2 of the second preferred embodiment of the present utility model;

图3A系为本实用新型之第四较佳实施例之立体图;Fig. 3A is a perspective view of a fourth preferred embodiment of the present utility model;

图3B系为本实用新型之第四较佳实施例之实施示意图;Fig. 3B is the implementation schematic diagram of the fourth preferred embodiment of the present utility model;

图4A系为本实用新型之第五较佳实施例之立体分解图;Fig. 4A is the three-dimensional exploded view of the fifth preferred embodiment of the present utility model;

图4B系为本实用新型之第五较佳实施例之立体图;Fig. 4B is a perspective view of the fifth preferred embodiment of the present utility model;

图4C系为本实用新型之第五较佳实施例之实施示意图一。Fig. 4C is a first implementation schematic diagram of the fifth preferred embodiment of the present invention.

【主要元件符号说明】[Description of main component symbols]

基座 1Base 1

沟槽 10Groove 10

封闭侧 101closed side 101

开放侧 102open side 102

凹孔 103Recessed hole 103

锁固部 11Locking part 11

第一固定部 12The first fixed part 12

嵌槽 13Bezel 13

定位件 2Positioner 2

第二固定部 21Second fixed part 21

抵触端 22Conflict 22

孔洞 23hole 23

热管 3heat pipe 3

胶层 4Adhesive layer 4

固定元件 5Fixing element 5

具体实施方式 Detailed ways

本实用新型之上述目的及其结构与功能上的特性,将依据所附图式之较佳实施例予以说明。The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

请参阅图1A、图1B,系为本实用新型之散热模组结构第一较佳实施例之立体分解及立体图,如图所示,所述散热模组结构,系包括:一基座1及至少一定位件2,该基座1一侧边形成有至少一沟槽10与周边形成有至少一锁固部11,所述沟槽10底部及顶部分别具有一封闭侧101及一开放侧102,且该基座1相对应于开放侧102位置处形成有至少一第一固定部12,并该基座1于该第一固定部12位置处形成有一嵌槽13,而该锁固部11系供该基座1锁固固定设置欲散热物件上;Please refer to Fig. 1A and Fig. 1B, which are three-dimensional exploded and three-dimensional views of the first preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the heat dissipation module structure includes: a base 1 and At least one positioning member 2, at least one groove 10 is formed on one side of the base 1 and at least one locking portion 11 is formed on the periphery, and the bottom and top of the groove 10 have a closed side 101 and an open side 102 respectively , and the base 1 is formed with at least one first fixing portion 12 corresponding to the position of the open side 102, and the base 1 is formed with a slot 13 at the position of the first fixing portion 12, and the locking portion 11 It is for the base 1 to be locked and fixed on the object to be dissipated;

而该定位件2系设置于该基座1之嵌槽13且对应组设于该沟槽10上,且该定位件2一侧具有至少一第二固定部21与多个抵触端22,该第二固定部21系对应组设该第一固定部12,而该抵触端22系对应接触其开放侧102;The positioning member 2 is arranged in the slot 13 of the base 1 and correspondingly assembled on the groove 10, and one side of the positioning member 2 has at least one second fixing portion 21 and a plurality of conflicting ends 22. The second fixing part 21 is correspondingly assembled with the first fixing part 12, and the conflicting end 22 is correspondingly in contact with its open side 102;

请同时参阅图1A、图1C,系为本实用新型之散热模组结构第一较佳实施例之立体分解图及实施示意图一,其中所述散热模组结构系与多个热管3组接,所述热管3系分别设置于所述沟槽10之封闭侧101内,并于热管3设置后,将该定位件2之第二固定部21对应组接第一固定部12而设置于该嵌槽13上,且该抵触端22则对应组接其开放侧102,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时;再者,请参阅第1A、1D图所示,系为本实用新型之散热模组结构第一较佳实施例之实施示意图二,于本实施例中,该基座1系于开放侧102位置处开设两处之嵌槽13,至热管3设置后,将两定位件2分别设置于两嵌槽13上,以使其定位件2得有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时。Please refer to Fig. 1A and Fig. 1C at the same time, which are the three-dimensional exploded view and the implementation schematic diagram 1 of the first preferred embodiment of the heat dissipation module structure of the present invention, wherein the heat dissipation module structure is connected with a plurality of heat pipes 3, The heat pipes 3 are respectively arranged in the closed side 101 of the groove 10, and after the heat pipes 3 are arranged, the second fixing part 21 of the positioning member 2 is correspondingly assembled with the first fixing part 12 and arranged on the embedded side. groove 13, and the conflicting end 22 is correspondingly assembled with its open side 102, so that its positioning part 2 can effectively locate and fix its heat pipe 3 in the groove 10, thereby improving assembly efficiency and reducing man-hours; moreover, please Referring to Figures 1A and 1D, it is the implementation schematic diagram 2 of the first preferred embodiment of the heat dissipation module structure of the present invention. In this embodiment, the base 1 is provided with two positions at the open side 102. After the heat pipe 3 is installed in the slot 13, the two positioning parts 2 are respectively arranged on the two slots 13, so that the positioning part 2 can be effectively positioned and the heat pipe 3 is fixed in the groove 10, thereby improving the assembly efficiency and Reduce working hours.

请参阅图2A、图2B,系为本实用新型之散热模组结构第二较佳实施例之立体分解图及立体图,如图所示,本实施例部分结构系与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例不同处系为本实施例之所述开放侧102位置处具有至少一凹孔103,该凹孔103系可为贯穿或未贯穿之其一,而对应之定位件2上具有至少一孔洞23,所述孔洞23系贯穿所述抵触端22与第二固定部21,其中该定位件2系设置于该基座1之嵌槽13且对应组设于该沟槽10上时,其第二固定部21系对应组设该第一固定部12,而该抵触端22系对应接触其开放侧102,而该凹孔103系对应连通所述孔洞23;Please refer to Fig. 2A and Fig. 2B, which are the three-dimensional exploded view and the three-dimensional view of the second preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment. This will not be repeated here, but the difference between this embodiment and the aforementioned first embodiment is that there is at least one concave hole 103 at the position of the open side 102 of this embodiment, and the concave hole 103 can be penetrated or not penetrated One of them, and the corresponding positioning piece 2 has at least one hole 23, the hole 23 is through the said conflicting end 22 and the second fixing part 21, wherein the positioning piece 2 is set in the slot of the base 1 13 and correspondingly assembled on the groove 10, the second fixing part 21 is correspondingly assembled with the first fixing part 12, and the conflicting end 22 is in contact with its open side 102 correspondingly, and the concave hole 103 is correspondingly communicate with the hole 23;

请同时参阅图2A、图2C、图2D,系为本实用新型之散热模组结构第二较佳实施例之立体分解图、实施示意图一及剖视示意图,其中所述散热模组结构系与多个热管3组接,所述热管3系分别设置于所述沟槽10内,并于热管3设置后,将该定位件2之第二固定部21对应组接第一固定部12而设置于该嵌槽13上,且该抵触端22则对应组接其开放侧102,而该凹孔103系对应连通所述孔洞23,并于该孔洞23内灌注有胶材,并将其胶材灌注至凹孔103位置处,以使其基座1与定位件2间形成有一胶层4,令该定位件2可有效定位且固定热管3于沟槽10内,而定位件2则有效固定于该基座1上,进而提升组装效率且减少工时;再者,请参阅第2A、2E图所示,系为本实用新型之散热模组结构第二较佳实施例之分解立体图及实施示意图二,于本实施例中,该基座1系于开放侧102位置处开设两处之嵌槽13,以于热管3设置后,将两定位件2分别设置于两嵌槽13上,并于该孔洞23内灌注有胶材,并将其胶材灌注至凹孔103位置处,以使其基座1与定位件2间形成有所述胶层4,以使其定位件2可有效定位且固定其热管3于沟槽10内,而定位件2有效固定于该基座1上,进而提升组装效率且减少工时。Please refer to Fig. 2A, Fig. 2C and Fig. 2D at the same time, which are the three-dimensional exploded view, the implementation schematic diagram 1 and the cross-sectional schematic diagram of the second preferred embodiment of the heat dissipation module structure of the present invention, wherein the heat dissipation module structure is the same as A plurality of heat pipes 3 are assembled, and the heat pipes 3 are respectively arranged in the grooves 10, and after the heat pipes 3 are arranged, the second fixing part 21 of the positioning member 2 is correspondingly assembled with the first fixing part 12 and arranged. On the embedding groove 13, and the conflicting end 22 is correspondingly assembled with its open side 102, and the concave hole 103 is correspondingly connected to the hole 23, and the hole 23 is filled with glue material, and the glue material Pouring to the position of the concave hole 103, so that a glue layer 4 is formed between the base 1 and the positioning part 2, so that the positioning part 2 can effectively position and fix the heat pipe 3 in the groove 10, and the positioning part 2 is effectively fixed On the base 1, the assembly efficiency is further improved and man-hours are reduced; moreover, please refer to Figures 2A and 2E, which are the exploded perspective view and implementation schematic diagram of the second preferred embodiment of the heat dissipation module structure of the present invention 2. In this embodiment, the base 1 is provided with two slots 13 at the position of the open side 102, so that after the heat pipe 3 is installed, the two positioning parts 2 are respectively arranged on the two slots 13, and the The hole 23 is filled with glue, and the glue is poured to the position of the concave hole 103, so that the glue layer 4 is formed between the base 1 and the positioning part 2, so that the positioning part 2 can be effectively positioned. And the heat pipe 3 is fixed in the groove 10, and the positioning member 2 is effectively fixed on the base 1, thereby improving assembly efficiency and reducing man-hours.

请参阅图3A、图3B,系为本实用新型之散热模组结构第四较佳实施例之立体分解图及立体图,如图所示,本实施例部分结构系与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例不同处系为本实施例之所述定位件2设置于该基座1之嵌槽13且对应组设于该沟槽10上时,其第一固定部12与第二固定部21间可通过至少一固定元件5固定,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时;再者,请参阅图4A、图4B图4C所示,系为本实用新型之散热模组结构第五较佳实施例之实施示意图一,于本实施例中,该基座1于开放侧102位置处可开设两处之嵌槽13,以于热管3设置后,将两定位件2分别设置于两嵌槽13上,而其第一固定部12与第二固定部21间可通过所述固定元件5固定,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时。Please refer to Fig. 3A and Fig. 3B, which are the three-dimensional exploded view and the three-dimensional view of the fourth preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment. It will not be described in detail here, but the difference between this embodiment and the aforementioned first embodiment is that the positioning member 2 of this embodiment is set in the slot 13 of the base 1 and correspondingly assembled on the groove 10 At this time, the first fixing part 12 and the second fixing part 21 can be fixed by at least one fixing element 5, so that the positioning part 2 can be effectively positioned and the heat pipe 3 can be fixed in the groove 10, thereby improving the assembly efficiency and reducing Working hours; Furthermore, please refer to Fig. 4A, Fig. 4B shown in Fig. 4C, which is the implementation schematic diagram of the fifth preferred embodiment of the heat dissipation module structure of the present utility model. In this embodiment, the base 1 is opened Two slots 13 can be provided at the position of the side 102, so that after the heat pipe 3 is installed, the two positioning parts 2 are respectively arranged on the two slots 13, and the first fixing part 12 and the second fixing part 21 can pass through. The fixing element 5 is fixed so that the positioning member 2 can be effectively positioned and the heat pipe 3 is fixed in the groove 10 , thereby improving assembly efficiency and reducing man-hours.

再一者,本实用新型于基座1开放侧102之一端处直接成型有至少一第二定位件(图中未示出),另一端则设置有一第一固定部12,并该基座1于该第一固定部12位置处形成有一嵌槽13;藉由基座1开放侧102一端直接成型之第二定位件提供热管3一端压制定位,以令热管3便于置入后,将另一活动之定位件2再设置于该嵌槽13上,以使该定位件2可有效固定热管3于沟槽10内,使之得以提升组装效率且减少工时。Furthermore, the utility model has at least one second positioning member (not shown in the figure) directly molded at one end of the open side 102 of the base 1, and the other end is provided with a first fixing portion 12, and the base 1 A slot 13 is formed at the position of the first fixing part 12; the second positioning piece formed directly by one end of the open side 102 of the base 1 provides one end of the heat pipe 3 for pressing and positioning, so that after the heat pipe 3 is conveniently placed, the other The movable positioning part 2 is arranged on the slot 13, so that the positioning part 2 can effectively fix the heat pipe 3 in the groove 10, so as to improve assembly efficiency and reduce man-hours.

以上所述,本实用新型之散热模组结构具有下列优点:As mentioned above, the cooling module structure of the present invention has the following advantages:

1.可快速定位其热管与基座;1. It can quickly locate its heat pipe and base;

2.可减去焊接材料成本;2. The cost of welding materials can be deducted;

3.提升组装效率且减少工时;3. Improve assembly efficiency and reduce working hours;

4.提高产品良率。4. Improve product yield.

惟以上所述者,仅系本实用新型之较佳可行之实施例而已,凡利用本实用新型上述之方法、形状、构造、装置所为之变化,皆应包含于本案之权利范围内。But what is described above is only a preferred embodiment of the utility model, and all changes made by utilizing the above-mentioned method, shape, structure, and device of the utility model should be included in the scope of rights of the present case.

Claims (12)

1.一种散热模组结构,其特征在于,包括:1. A cooling module structure, characterized in that it comprises: 一基座,该基座形成有至少一沟槽,该沟槽具有一封闭侧及一开放侧,且该基座于开放侧位置处形成有至少一第一固定部;及a base, the base is formed with at least one groove, the groove has a closed side and an open side, and the base is formed with at least one first fixing portion at the position of the open side; and 至少一定位件,该定位件设置于该沟槽上,且该定位件具有至少一第二固定部对应该第一固定部。At least one positioning piece is arranged on the groove, and the positioning piece has at least one second fixing portion corresponding to the first fixing portion. 2.如权利要求1所述的散热模组结构,其特征在于,所述基座侧边具有至少一锁固部。2. The heat dissipation module structure according to claim 1, wherein the side of the base has at least one locking portion. 3.如权利要求1所述的散热模组结构,其特征在于,所述基座与定位件之间具有一胶层。3. The heat dissipation module structure according to claim 1, wherein there is an adhesive layer between the base and the positioning member. 4.如权利要求1所述的散热模组结构,其特征在于,所述沟槽内设置有热管。4. The heat dissipation module structure according to claim 1, wherein a heat pipe is arranged in the groove. 5.如权利要求4所述的散热模组结构,其特征在于,所述定位件设置于该沟槽与热管上,以固定其热管于沟槽内。5 . The heat dissipation module structure according to claim 4 , wherein the positioning member is disposed on the groove and the heat pipe to fix the heat pipe in the groove. 5 . 6.如权利要求5所述的散热模组结构,其特征在于,所述开放侧位置处具有至少一凹孔,而该定位件上具有至少一孔洞。6 . The heat dissipation module structure according to claim 5 , wherein there is at least one concave hole at the position of the open side, and at least one hole is formed on the positioning member. 7 . 7.如权利要求6所述的散热模组结构,其特征在于,所述孔洞内灌注有胶材,其胶材同时灌注至凹孔,且将其胶材灌注至沟槽与热管间。7 . The heat dissipation module structure according to claim 6 , wherein glue is poured into the hole, and the glue is poured into the concave hole at the same time, and the glue is poured between the groove and the heat pipe. 8 . 8.如权利要求1所述的散热模组结构,其特征在于,所述第一固定部与第二固定部之间通过至少一固定元件固定。8 . The heat dissipation module structure according to claim 1 , wherein the first fixing portion and the second fixing portion are fixed by at least one fixing element. 9.如权利要求6所述的散热模组结构,其特征在于,所述定位件相对应于沟槽一侧具有多个抵触端,该孔洞贯穿所述抵触端。9 . The heat dissipation module structure according to claim 6 , wherein the positioning member has a plurality of conflicting ends corresponding to one side of the groove, and the hole passes through the conflicting ends. 10 . 10.如权利要求1所述的散热模组结构,其特征在于,所述基座于第一固定部位置处形成有一嵌槽。10 . The heat dissipation module structure according to claim 1 , wherein a slot is formed on the base at the position of the first fixing portion. 11 . 11.如权利要求6所述的散热模组结构,其特征在于,所述孔洞贯穿所述第二固定部。11. The heat dissipation module structure according to claim 6, wherein the hole penetrates through the second fixing portion. 12.如权利要求1所述的散热模组结构,其特征在于,所述基座开放侧位置处直接成型有至少一第二定位件。12 . The heat dissipation module structure according to claim 1 , wherein at least one second positioning member is formed directly on the open side of the base. 13 .
CN201120267279U 2011-07-26 2011-07-26 Cooling module structure Expired - Fee Related CN202150085U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120267279U CN202150085U (en) 2011-07-26 2011-07-26 Cooling module structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120267279U CN202150085U (en) 2011-07-26 2011-07-26 Cooling module structure

Publications (1)

Publication Number Publication Date
CN202150085U true CN202150085U (en) 2012-02-22

Family

ID=45591138

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120267279U Expired - Fee Related CN202150085U (en) 2011-07-26 2011-07-26 Cooling module structure

Country Status (1)

Country Link
CN (1) CN202150085U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9897390B2 (en) 2015-03-17 2018-02-20 Asia Vital Components Co., Ltd. Fixing structure for heat dissipation element
CN115338499A (en) * 2022-07-21 2022-11-15 深圳兴奇宏科技有限公司 Method for manufacturing heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9897390B2 (en) 2015-03-17 2018-02-20 Asia Vital Components Co., Ltd. Fixing structure for heat dissipation element
CN115338499A (en) * 2022-07-21 2022-11-15 深圳兴奇宏科技有限公司 Method for manufacturing heat sink
CN115338499B (en) * 2022-07-21 2024-03-08 深圳兴奇宏科技有限公司 Manufacturing method of heat dissipating device

Similar Documents

Publication Publication Date Title
CN206341544U (en) A kind of shielding heat radiating device
US20120261095A1 (en) Thermal module structure and manufacturing method thereof
CN202150085U (en) Cooling module structure
CN211019739U (en) heat sink
TWM416796U (en) Heat dissipation module structure
CN205491628U (en) a radiator
CN201207386Y (en) Heat radiation structure of memory
US20120043057A1 (en) Heat-dissipating module
CN103391702B (en) Heat sink and manufacturing method thereof
CN210119749U (en) Heat dissipation device and notebook computer
CN201726637U (en) Fanless cooling structure for electronic equipment
CN205721590U (en) Memory Heating Auxiliary Structure
CN102693950A (en) Heat dissipation module structure and manufacturing method thereof
TWM594853U (en) Heat dissipation apparatus
CN202472530U (en) Dustproof and radiating device of computer memory bank
JP3168842U (en) Heat dissipation module structure
CN203457480U (en) Heat radiation fan
CN201741681U (en) Snap-in radiator modules
CN204206693U (en) Cooling systems for electronic components
CN202582297U (en) Heat dissipation structure
CN201690724U (en) Heat radiation module structure
CN221653013U (en) Electronic device and heat dissipation module thereof
CN204616265U (en) heat sink
CN201726636U (en) Cooling module
CN102738097B (en) Combination structure of cooling device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120222

Termination date: 20170726