CN202150085U - Cooling module structure - Google Patents
Cooling module structure Download PDFInfo
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- CN202150085U CN202150085U CN201120267279U CN201120267279U CN202150085U CN 202150085 U CN202150085 U CN 202150085U CN 201120267279 U CN201120267279 U CN 201120267279U CN 201120267279 U CN201120267279 U CN 201120267279U CN 202150085 U CN202150085 U CN 202150085U
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Abstract
Description
技术领域 technical field
本实用新型有关于一种散热模组结构,尤指一种可快速固定热管于基座上以大幅提升组装效率减少工时之散热模组结构。The utility model relates to a heat dissipation module structure, in particular to a heat dissipation module structure that can quickly fix a heat pipe on a base to greatly improve assembly efficiency and reduce man-hours.
背景技术 Background technique
按,由于科技时代的进步,电子元件之运作效能越来越高,以至于对散热单元的功能要求也随之增加,公知之散热单元为了能增加散热功效,都已大幅采用堆迭式的散热鳍片组,且不断于散热鳍片上研发改良,因此高效能之散热单元已经是今天产业界最重要的研发重点之一,又或于该电子元件上方设置有散热单元并通过该散热单元对所述电子元件进行散热,所述散热单元通常为散热器或散热鳍片对应配上一散热风扇进行散热工作,进一步通过热导管串接所述散热单元将热源引导至远处进行散热。By the way, due to the advancement of the technology era, the operating performance of electronic components is getting higher and higher, so that the functional requirements for the heat dissipation unit are also increasing. In order to increase the heat dissipation effect, the known heat dissipation units have largely adopted stacked heat dissipation. Fin group, and constantly develop and improve the heat dissipation fins, so the high-efficiency heat dissipation unit has become one of the most important research and development priorities in the industry today, or a heat dissipation unit is installed above the electronic component and through the heat dissipation unit. The electronic components are used to dissipate heat. The heat dissipation unit is usually a radiator or a heat dissipation fin, and a heat dissipation fan is correspondingly equipped with a heat dissipation fan for heat dissipation. The heat dissipation unit is further connected in series through a heat pipe to guide the heat source to a distant place for heat dissipation.
以电脑主机为例,其内部中央处理单元(CPU)所产生之热量占大部分,此外,中央处理单元当热量逐渐升高会造成执行效能降低,且当热量累积高于其容许限度时,将会迫使电脑当机,严重者更可能会造成毁损现象;并且,为解决电磁波辐射之问题,通常系以机箱壳体来封闭该电脑主机,以致如何将中央处理单元及其它发热零组件(或称元件)之热能快速导出,成为一重要课题。Taking a host computer as an example, the heat generated by its internal central processing unit (CPU) accounts for the majority. In addition, when the heat of the central processing unit gradually increases, the execution performance will decrease, and when the accumulated heat exceeds its allowable limit, it will It will force the computer to crash, and in severe cases, it may cause damage; and, in order to solve the problem of electromagnetic wave radiation, the computer host is usually closed with a chassis shell, so that how to integrate the central processing unit and other heat-generating components (or called The rapid derivation of heat energy of components) has become an important issue.
现行散热装置及散热模组系通过多个散热元件相互搭配组装所组成,所述散热元件系为热管、散热器、散热基座等元件,所述散热元件彼此搭配结合主要系通过焊接加以固定,但针对以铝材质所制成之散热元件若要进行焊接作业,则不仅需要以特种焊接工作之方式进行焊接外,其加工成本亦相对增加。Existing heat dissipation devices and heat dissipation modules are composed of a plurality of heat dissipation elements that are matched and assembled with each other. The heat dissipation elements are heat pipes, radiators, heat dissipation bases and other components. The combination of the heat dissipation elements is mainly fixed by welding. However, if the heat dissipation element made of aluminum is to be welded, it not only needs to be welded in a special welding manner, but also the processing cost is relatively increased.
另者,亦有技术人员以螺丝等固定元件对所述散热元件进行结合固定,但固定元件仅能针对部分散热元件进行螺锁固定(如散热鳍片组与散热基座),针对热管则无法直接通过螺锁之方式进行固定。In addition, there are also technical personnel who combine and fix the heat dissipation elements with screws and other fixing elements, but the fixing elements can only be screwed and fixed for some heat dissipation elements (such as heat dissipation fin groups and heat dissipation bases), but not for heat pipes. Fix directly by means of screw lock.
再者,公知技术系于该散热基座开设一孔洞或一沟槽将该热管穿设于该散热基座之孔洞或该沟槽,令该热管与该散热基座得以结合,此一结合方式虽解决前述焊接及螺锁固定方式之问题,但传统热管与散热基座间之定位方式,系将其热管与散热基座金行焊接组装,或热管紧配于散热基座内,进而造成材料成本与制造及组装成本高,且容易造成热管损坏而不良率提高之问题。Moreover, the known technology is to open a hole or a groove in the heat dissipation base, and the heat pipe is passed through the hole or the groove of the heat dissipation base, so that the heat pipe and the heat dissipation base can be combined. Although the problems of the aforementioned welding and screw lock fixing methods are solved, the traditional positioning method between the heat pipe and the heat dissipation base is to weld and assemble the heat pipe and the heat dissipation base, or the heat pipe is tightly fitted in the heat dissipation base, resulting in material The cost and manufacturing and assembly costs are high, and it is easy to cause damage to the heat pipe and increase the defective rate.
故公知技术具有下列缺点:Therefore known technology has following shortcoming:
1.无法快速定位其热管与散热基座;1. It is impossible to quickly locate its heat pipe and heat dissipation base;
2.焊接材料成本高;2. The cost of welding materials is high;
3.组装效率低且工时增加;3. Low assembly efficiency and increased man-hours;
4.不合格率高。4. The failure rate is high.
实用新型内容 Utility model content
本实用新型之主要目的在提供一种可快速固定热管于基座之散热模组结构。The main purpose of the utility model is to provide a heat dissipation module structure that can quickly fix the heat pipe on the base.
本实用新型之次要目的在提供一种大幅提升组装效率且减少工时之散热模组结构。The secondary objective of the present invention is to provide a heat dissipation module structure that greatly improves assembly efficiency and reduces man-hours.
为达上述目的本实用新型系提供一种散热模组结构,系包含:一基座及至少一定位件;In order to achieve the above purpose, the utility model provides a heat dissipation module structure, which includes: a base and at least one positioning member;
所述基座一侧形成有至少一沟槽,该沟槽具有一封闭侧及一开放侧,且该基座相对应于开放侧位置处形成有至少一第一固定部;所述定位件系设置于该基座之沟槽上,且该定位件一侧具有至少一第二固定部,该第二固定部系相对组设其第一固定部;因此藉由其定位件可快速固定热管于基座上,进而提升组装效率且减少工时。At least one groove is formed on one side of the base, the groove has a closed side and an open side, and at least one first fixing portion is formed on the base corresponding to the open side; the positioning member is It is arranged on the groove of the base, and there is at least one second fixing part on one side of the positioning part, and the second fixing part is opposite to the first fixing part; therefore, the heat pipe can be quickly fixed on the positioning part. on the base, thereby improving assembly efficiency and reducing man-hours.
具体而言,本实用新型提供了一种散热模组结构,包括:Specifically, the utility model provides a heat dissipation module structure, including:
一基座,该基座形成有至少一沟槽,该沟槽具有一封闭侧及一开放侧,且该基座于开放侧位置处形成有至少一第一固定部;及a base, the base is formed with at least one groove, the groove has a closed side and an open side, and the base is formed with at least one first fixing portion at the position of the open side; and
至少一定位件,该定位件设置于该沟槽上,且该定位件具有至少一第二固定部对应该第一固定部。At least one positioning piece is arranged on the groove, and the positioning piece has at least one second fixing portion corresponding to the first fixing portion.
优选的是,所述的散热模组结构,所述基座侧边具有至少一锁固部。Preferably, in the heat dissipation module structure, the side of the base has at least one locking portion.
优选的是,所述的散热模组结构,所述基座与定位件间具有一胶层。Preferably, in the heat dissipation module structure, there is an adhesive layer between the base and the positioning member.
优选的是,所述的散热模组结构,所述沟槽内设置有热管。Preferably, in the heat dissipation module structure, heat pipes are arranged in the grooves.
优选的是,所述的散热模组结构,所述定位件设置于该沟槽与热管上,以固定其热管于沟槽内。Preferably, in the heat dissipation module structure, the positioning member is arranged on the groove and the heat pipe to fix the heat pipe in the groove.
优选的是,所述的散热模组结构,所述开放侧位置处具有至少一凹孔,而该定位件上具有至少一孔洞。Preferably, in the heat dissipation module structure, there is at least one concave hole at the position of the open side, and at least one hole is formed on the positioning member.
优选的是,所述的散热模组结构,所述孔洞内灌注有胶材,其胶材同时灌注至凹孔,且将其胶材灌注至沟槽与热管间。Preferably, in the heat dissipation module structure, glue is poured into the hole, and the glue is poured into the concave hole at the same time, and the glue is poured between the groove and the heat pipe.
优选的是,所述的散热模组结构,所述第一固定部与第二固定间通过至少一固定元件固定。Preferably, in the heat dissipation module structure, the first fixing portion and the second fixing space are fixed by at least one fixing element.
优选的是,所述的散热模组结构,所述定位件相对应于沟槽一侧具有多个抵触端,该孔洞系贯穿所述抵触端。Preferably, in the heat dissipation module structure, the positioning member has a plurality of conflicting ends corresponding to one side of the groove, and the hole runs through the conflicting ends.
优选的是,所述的散热模组结构,所述基座于第一固定部位置处形成有一嵌槽。Preferably, in the heat dissipation module structure, the base forms a slot at the position of the first fixing part.
优选的是,所述的散热模组结构,所述孔洞系贯穿所述第二固定部。Preferably, in the heat dissipation module structure, the hole runs through the second fixing part.
优选的是,所述的散热模组结构,所述基座开放侧位置处直接成型有至少一第二定位件。Preferably, in the heat dissipation module structure, at least one second positioning member is formed directly at the open side of the base.
附图说明 Description of drawings
图1A系为本实用新型之第一较佳实施例之立体分解图;Fig. 1A is the three-dimensional exploded view of the first preferred embodiment of the present utility model;
图1B系为本实用新型之第一较佳实施例之立体图;Fig. 1B is a perspective view of the first preferred embodiment of the present utility model;
图1C系为本实用新型之第一较佳实施例之实施示意图一;Fig. 1C is the implementation schematic diagram 1 of the first preferred embodiment of the present utility model;
图1D系为本实用新型之第一较佳实施例之实施示意图二;Fig. 1D is the implementation schematic diagram 2 of the first preferred embodiment of the present utility model;
图2A系为本实用新型之第二较佳实施例之立体分解图;Fig. 2A is the three-dimensional exploded view of the second preferred embodiment of the present utility model;
图2B系为本实用新型之第二较佳实施例之立体图;Fig. 2B is the perspective view of the second preferred embodiment of the utility model;
图2C系为本实用新型之第二较佳实施例之实施示意图一;Fig. 2C is the implementation schematic diagram 1 of the second preferred embodiment of the present utility model;
图2D系为本实用新型之第二较佳实施例之剖视示意图;Fig. 2D is a schematic cross-sectional view of the second preferred embodiment of the present utility model;
图2E系为本实用新型之第二较佳实施例之实施示意图二;Fig. 2E is the implementation schematic diagram 2 of the second preferred embodiment of the present utility model;
图3A系为本实用新型之第四较佳实施例之立体图;Fig. 3A is a perspective view of a fourth preferred embodiment of the present utility model;
图3B系为本实用新型之第四较佳实施例之实施示意图;Fig. 3B is the implementation schematic diagram of the fourth preferred embodiment of the present utility model;
图4A系为本实用新型之第五较佳实施例之立体分解图;Fig. 4A is the three-dimensional exploded view of the fifth preferred embodiment of the present utility model;
图4B系为本实用新型之第五较佳实施例之立体图;Fig. 4B is a perspective view of the fifth preferred embodiment of the present utility model;
图4C系为本实用新型之第五较佳实施例之实施示意图一。Fig. 4C is a first implementation schematic diagram of the fifth preferred embodiment of the present invention.
【主要元件符号说明】[Description of main component symbols]
基座 1
沟槽 10
封闭侧 101
开放侧 102
凹孔 103Recessed
锁固部 11Locking
第一固定部 12The first
嵌槽 13
定位件 2
第二固定部 21Second
抵触端 22
孔洞 23
热管 3
胶层 4Adhesive layer 4
固定元件 5Fixing
具体实施方式 Detailed ways
本实用新型之上述目的及其结构与功能上的特性,将依据所附图式之较佳实施例予以说明。The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
请参阅图1A、图1B,系为本实用新型之散热模组结构第一较佳实施例之立体分解及立体图,如图所示,所述散热模组结构,系包括:一基座1及至少一定位件2,该基座1一侧边形成有至少一沟槽10与周边形成有至少一锁固部11,所述沟槽10底部及顶部分别具有一封闭侧101及一开放侧102,且该基座1相对应于开放侧102位置处形成有至少一第一固定部12,并该基座1于该第一固定部12位置处形成有一嵌槽13,而该锁固部11系供该基座1锁固固定设置欲散热物件上;Please refer to Fig. 1A and Fig. 1B, which are three-dimensional exploded and three-dimensional views of the first preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the heat dissipation module structure includes: a
而该定位件2系设置于该基座1之嵌槽13且对应组设于该沟槽10上,且该定位件2一侧具有至少一第二固定部21与多个抵触端22,该第二固定部21系对应组设该第一固定部12,而该抵触端22系对应接触其开放侧102;The positioning
请同时参阅图1A、图1C,系为本实用新型之散热模组结构第一较佳实施例之立体分解图及实施示意图一,其中所述散热模组结构系与多个热管3组接,所述热管3系分别设置于所述沟槽10之封闭侧101内,并于热管3设置后,将该定位件2之第二固定部21对应组接第一固定部12而设置于该嵌槽13上,且该抵触端22则对应组接其开放侧102,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时;再者,请参阅第1A、1D图所示,系为本实用新型之散热模组结构第一较佳实施例之实施示意图二,于本实施例中,该基座1系于开放侧102位置处开设两处之嵌槽13,至热管3设置后,将两定位件2分别设置于两嵌槽13上,以使其定位件2得有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时。Please refer to Fig. 1A and Fig. 1C at the same time, which are the three-dimensional exploded view and the implementation schematic diagram 1 of the first preferred embodiment of the heat dissipation module structure of the present invention, wherein the heat dissipation module structure is connected with a plurality of
请参阅图2A、图2B,系为本实用新型之散热模组结构第二较佳实施例之立体分解图及立体图,如图所示,本实施例部分结构系与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例不同处系为本实施例之所述开放侧102位置处具有至少一凹孔103,该凹孔103系可为贯穿或未贯穿之其一,而对应之定位件2上具有至少一孔洞23,所述孔洞23系贯穿所述抵触端22与第二固定部21,其中该定位件2系设置于该基座1之嵌槽13且对应组设于该沟槽10上时,其第二固定部21系对应组设该第一固定部12,而该抵触端22系对应接触其开放侧102,而该凹孔103系对应连通所述孔洞23;Please refer to Fig. 2A and Fig. 2B, which are the three-dimensional exploded view and the three-dimensional view of the second preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment. This will not be repeated here, but the difference between this embodiment and the aforementioned first embodiment is that there is at least one
请同时参阅图2A、图2C、图2D,系为本实用新型之散热模组结构第二较佳实施例之立体分解图、实施示意图一及剖视示意图,其中所述散热模组结构系与多个热管3组接,所述热管3系分别设置于所述沟槽10内,并于热管3设置后,将该定位件2之第二固定部21对应组接第一固定部12而设置于该嵌槽13上,且该抵触端22则对应组接其开放侧102,而该凹孔103系对应连通所述孔洞23,并于该孔洞23内灌注有胶材,并将其胶材灌注至凹孔103位置处,以使其基座1与定位件2间形成有一胶层4,令该定位件2可有效定位且固定热管3于沟槽10内,而定位件2则有效固定于该基座1上,进而提升组装效率且减少工时;再者,请参阅第2A、2E图所示,系为本实用新型之散热模组结构第二较佳实施例之分解立体图及实施示意图二,于本实施例中,该基座1系于开放侧102位置处开设两处之嵌槽13,以于热管3设置后,将两定位件2分别设置于两嵌槽13上,并于该孔洞23内灌注有胶材,并将其胶材灌注至凹孔103位置处,以使其基座1与定位件2间形成有所述胶层4,以使其定位件2可有效定位且固定其热管3于沟槽10内,而定位件2有效固定于该基座1上,进而提升组装效率且减少工时。Please refer to Fig. 2A, Fig. 2C and Fig. 2D at the same time, which are the three-dimensional exploded view, the implementation schematic diagram 1 and the cross-sectional schematic diagram of the second preferred embodiment of the heat dissipation module structure of the present invention, wherein the heat dissipation module structure is the same as A plurality of
请参阅图3A、图3B,系为本实用新型之散热模组结构第四较佳实施例之立体分解图及立体图,如图所示,本实施例部分结构系与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例不同处系为本实施例之所述定位件2设置于该基座1之嵌槽13且对应组设于该沟槽10上时,其第一固定部12与第二固定部21间可通过至少一固定元件5固定,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时;再者,请参阅图4A、图4B图4C所示,系为本实用新型之散热模组结构第五较佳实施例之实施示意图一,于本实施例中,该基座1于开放侧102位置处可开设两处之嵌槽13,以于热管3设置后,将两定位件2分别设置于两嵌槽13上,而其第一固定部12与第二固定部21间可通过所述固定元件5固定,以使其定位件2可有效定位且固定其热管3于沟槽10内,进而提升组装效率且减少工时。Please refer to Fig. 3A and Fig. 3B, which are the three-dimensional exploded view and the three-dimensional view of the fourth preferred embodiment of the heat dissipation module structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment. It will not be described in detail here, but the difference between this embodiment and the aforementioned first embodiment is that the
再一者,本实用新型于基座1开放侧102之一端处直接成型有至少一第二定位件(图中未示出),另一端则设置有一第一固定部12,并该基座1于该第一固定部12位置处形成有一嵌槽13;藉由基座1开放侧102一端直接成型之第二定位件提供热管3一端压制定位,以令热管3便于置入后,将另一活动之定位件2再设置于该嵌槽13上,以使该定位件2可有效固定热管3于沟槽10内,使之得以提升组装效率且减少工时。Furthermore, the utility model has at least one second positioning member (not shown in the figure) directly molded at one end of the
以上所述,本实用新型之散热模组结构具有下列优点:As mentioned above, the cooling module structure of the present invention has the following advantages:
1.可快速定位其热管与基座;1. It can quickly locate its heat pipe and base;
2.可减去焊接材料成本;2. The cost of welding materials can be deducted;
3.提升组装效率且减少工时;3. Improve assembly efficiency and reduce working hours;
4.提高产品良率。4. Improve product yield.
惟以上所述者,仅系本实用新型之较佳可行之实施例而已,凡利用本实用新型上述之方法、形状、构造、装置所为之变化,皆应包含于本案之权利范围内。But what is described above is only a preferred embodiment of the utility model, and all changes made by utilizing the above-mentioned method, shape, structure, and device of the utility model should be included in the scope of rights of the present case.
Claims (12)
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CN201120267279U CN202150085U (en) | 2011-07-26 | 2011-07-26 | Cooling module structure |
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CN201120267279U CN202150085U (en) | 2011-07-26 | 2011-07-26 | Cooling module structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9897390B2 (en) | 2015-03-17 | 2018-02-20 | Asia Vital Components Co., Ltd. | Fixing structure for heat dissipation element |
CN115338499A (en) * | 2022-07-21 | 2022-11-15 | 深圳兴奇宏科技有限公司 | Method for manufacturing heat sink |
-
2011
- 2011-07-26 CN CN201120267279U patent/CN202150085U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9897390B2 (en) | 2015-03-17 | 2018-02-20 | Asia Vital Components Co., Ltd. | Fixing structure for heat dissipation element |
CN115338499A (en) * | 2022-07-21 | 2022-11-15 | 深圳兴奇宏科技有限公司 | Method for manufacturing heat sink |
CN115338499B (en) * | 2022-07-21 | 2024-03-08 | 深圳兴奇宏科技有限公司 | Manufacturing method of heat dissipating device |
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Granted publication date: 20120222 Termination date: 20170726 |