CN201867723U - memory cooler - Google Patents

Abstract

The utility model relates to a be applied to no fan computer's memory heat abstractor contains opening, conductor double-screw bolt, fin and the conducting strip that sets up on printed circuit board. The opening is located below the memory module. The conductor stud is arranged on the bottom surface of the lower shell metal and corresponds to the opening. The heat sink is arranged below the memory module and comprises a conductor bolt, and the conductor bolt penetrates through the opening and is locked with the conductor stud. The heat conducting fin is arranged on the surface of the radiating fin, and the memory module is contacted with the heat conducting fin.

Description

memory cooler

technical field

The utility model relates to a heat dissipation device, in particular to a memory heat dissipation device.

Background technique

Memory is a very important component in a computer device. As computer microprocessors become faster and faster, the amount of data calculations performed by computer software is also increasing, and the demand for memory in computer devices is also increasing. In addition to being a very important component in a computer, the memory is also one of the main heat sources in the computer.

Nowadays, one of people's requirements for computers is lightness and small size, so thin clients have been developed. A thin computer is characterized by not having any moving parts, in other words, a thin computer does not contain a fan. Therefore, how to ensure smooth heat dissipation of the memory in the thin computer has become an important issue.

Utility model content

Therefore, the purpose of the present invention is to provide a memory cooling device for dissipating the heat generated by the memory module.

According to an embodiment of the present invention, a memory cooling device is proposed, which is applied to a computer with a fanless architecture. The computer with a fanless architecture includes a metal bottom surface of a lower case, a printed circuit board, and a memory module. The printed circuit board has an opening. The memory cooling device includes conductive studs, heat sinks and heat conduction fins. The opening is located under the memory module. The conductor stud is arranged on the metal bottom surface of the lower case and corresponds to the opening. The heat sink is arranged under the memory module, the heat sink includes conductor bolts, and the conductor bolts pass through the openings and are locked with the conductor studs. The heat conduction sheet is arranged on the surface of the heat dissipation sheet, and the memory module is in contact with the heat conduction sheet.

The outer diameter of the conductor stud is preferably larger than the outer diameter of the conductor stud. The printed circuit board is fixed between the conductor stud and the conductor bolt. The heat sink can be parallel to the metal bottom surface of the lower case. The printed circuit board can be parallel to the metal bottom surface of the lower case. The memory cooling unit also contains thermal paste that connects the heat spreader and the heat sink.

The heat generated by the memory module can be transferred to the metal bottom of the lower shell through the heat conduction sheet, heat sink, conductor studs and conductor bolts for dissipation. In addition, the printed circuit board can be locked directly through the conductor stud and the conductor stud without additional positioning components.

Description of drawings

In order to make the above and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the detailed description of the accompanying drawings is as follows:

1 is a cross-sectional view illustrating an embodiment of a memory cooling device of the present invention;

FIG. 2 is a cross-sectional view illustrating another embodiment of the memory cooling device of the present invention.

[Description of main component symbols]

100: Fanless computer 210: Upper case

110: Upper shell 220: Lower shell

120: Lower shell 222: Lower shell metal bottom

122: Metal bottom surface of the lower shell 224: Plastic side wall

130: Printed circuit board 230: Printed circuit board

140: Memory module 240: Memory module

142: Memory 250: Opening

150: opening 260: conductor stud

160: Conductor stud 270: Heat sink

170: heat sink 272: conductor bolt

172: Conductor bolts 280: Heat conduction sheet

180: heat conduction sheet d ₁ : outer diameter

190: thermal paste d ₂ : outer diameter

200: Fanless Computers

Detailed ways

The following will clearly illustrate the spirit of the utility model with the accompanying drawings and detailed descriptions. After any person with ordinary knowledge in the technical field understands the preferred embodiments of the utility model, he or she can change and modify the technology taught by the utility model. modifications without departing from the spirit and scope of the present invention.

Referring to FIG. 1 , it shows a cross-sectional view of an embodiment of a memory cooling device of the present invention. The memory cooling device is applied in the fanless computer 100 . The fanless computer 100 includes an upper case 110 , a lower case 120 , a printed circuit board 130 and a memory module 140 . The lower shell 120 can be a metal shell, and the metal lower shell 120 can be regarded as a metal shield. The printed circuit board 130 is disposed between the memory module 140 and the metal bottom surface 122 of the lower case 120 . The printed circuit board 130 has an opening 150 located under the memory module 140 .

The memory cooling device includes a conductor stud 160, a heat sink (Heat Plate) 170, and a thermal pad (Thermal Pad) 180, wherein the conductor stud 160 is arranged on the metal bottom surface 122 of the lower case, and the conductor stud 160 is arranged corresponding to the opening 150 . Conductor bolts 172 are disposed on the heat sink 170 , and the conductor bolts 172 pass through the openings 150 and are locked with the conductor studs 160 . The heat conduction sheet 180 is disposed on the other surface of the heat sink 170 opposite to the conductive bolt 172 , and the memory module 140 is in contact with the heat conduction sheet 180 .

The heat generated by the memory module 140 can be transferred to the heat conduction sheet 180 in contact with it, and then the heat is transferred to the heat sink 170 through the heat conduction sheet 180, and the heat is further transferred to the metal lower case 120 through the conductor bolt 172 and the conductor stud 160. Then it is dissipated by the lower metal shell 120 . In other words, the heat generated by the memory module 140 can be conducted and dissipated through the paths of the heat conduction fin 180 , the heat sink 170 , the conductor bolt 172 , the conductor stud 160 , and the lower metal case 120 to complete the heat dissipation effect of the memory module 140 .

The outer diameter d ₁ of the conductor stud 160 is preferably greater than the outer diameter d ₂ of the conductor stud 172, and the opening 150 on the printed circuit board 130 is between the two, so that the conductor stud 172 passes through the opening 150 and connects to the conductor. The studs 160 are locked, and the printed circuit board 130 can be fixed between the conductor studs 160 and the conductor studs 172 and supported by the conductor studs 160 . The printed circuit board 130 can be directly locked to the conductor stud 160 via the conductor bolt 172 , omitting an additional positioning component.

The heat conducting sheet 180 is in contact with the memory module 140 and the heat sink 170 respectively. The memory cooling device further includes thermal grease 190 to connect the heat conducting sheet 180 and the cooling sheet 170 . The heat conduction sheet 180 can be fixed on the heat sink 170 through the heat dissipation paste 190 so as to reliably transfer the heat generated by the memory module 140 to the heat sink 170 . The material of the conductor stud 160 , the heat sink 170 and the conductor stud 172 can be a metal with good thermal conductivity, such as copper or aluminum. The memory 142 in the memory module 140 can be DDR, DDR2, DDR3.

When the assembly is completed, the printed circuit board 130 is parallel to the lower metal bottom surface 122 of the lower case 120, and the heat sink 170 is parallel to the lower metal bottom surface 122 of the lower case 120, so that the printed circuit board 130 and the heat sink 170 are connected to the bottom surface of the lower case 120. The memory module 140 can maintain a level under normal use.

Referring to FIG. 2 , it is a cross-sectional view illustrating another embodiment of the memory cooling device of the present invention. The memory cooling device is applied in the fanless computer 200 . The fanless computer 200 includes an upper case 210 , a lower case 220 , a printed circuit board 230 , and a memory module 240 . The lower case 220 includes a metal bottom surface 222 and a plastic side wall 224 , and the metal bottom surface 222 of the lower case can be used as a metal shield. The printed circuit board 230 is disposed between the memory module 240 and the metal bottom surface 222 of the lower case. There is an opening 250 on the printed circuit board 230, and the opening 250 is located under the memory module 240

The memory cooling device includes a conductor stud 260 , a heat sink 270 , and a heat conduction plate 280 . The conductor stud 260 is disposed on the metal bottom surface 222 of the lower case, and the conductor stud 260 is disposed corresponding to the opening 250 . Conductor bolts 272 are disposed on the heat sink 270 , and the conductor bolts 272 pass through the openings 250 and are locked with the conductor studs 260 . The heat conduction sheet 280 is disposed on the other surface of the heat sink 270 opposite to the conductive bolt 272 , and the memory module 240 is in contact with the heat conduction sheet 280 . The heat conducting sheet 280 is in contact with the memory module 240 and the heat sink 270 respectively. The memory heat dissipation device further includes heat dissipation paste 290 to connect the heat conduction sheet 280 and the heat dissipation sheet 270 so that the heat generated by the memory module 240 can be reliably transferred to the heat dissipation sheet 270 .

It can be seen from the preferred embodiments of the utility model described above that the application of the utility model has the following advantages. The heat generated by the memory module can be transferred to the metal bottom of the lower shell through the heat conduction sheet, heat sink, conductor studs and conductor bolts for dissipation. In addition, the printed circuit board can be locked directly through the conductor stud and the conductor stud without additional positioning components.

Although the utility model has been disclosed as above with a preferred embodiment, it is not intended to limit the utility model, and anyone familiar with the art can make various changes without departing from the spirit and scope of the utility model and retouching, so the scope of protection of the present utility model should be determined by the scope defined in the appended claims.

Claims (10)

1. A memory cooling device, characterized in that it is applied to a fanless computer, the fanless computer includes a metal bottom surface of the lower casing, a printed circuit board, and a memory module, the printed circuit board is configured on the There is an opening between the metal bottom of the lower case and the memory module, and the opening is located under the memory module, and the memory cooling device includes: a conductor stud, arranged on the metal bottom surface of the lower case and corresponding to the opening; a heat sink, arranged under the memory module, the heat sink includes a conductor bolt, and the conductor bolt passes through the opening and is locked with the conductor stud; and A heat conduction sheet is arranged on the surface of the heat dissipation sheet, and the memory module is in contact with the heat conduction sheet. 2. The memory cooling device according to claim 1, wherein the outer diameter of the conductor stud is larger than the outer diameter of the conductor stud. 3. The memory cooling device according to claim 2, wherein the printed circuit board is fixed between the conductor stud and the conductor bolt. 4. The memory cooling device according to claim 3, wherein the heat sink is parallel to the metal bottom surface of the lower case. 5. The memory cooling device according to claim 4, wherein the printed circuit board is parallel to the metal bottom surface of the lower case. 6 . The memory cooling device according to claim 5 , further comprising a heat dissipation paste connecting the heat conduction sheet and the heat dissipation sheet. 7 . The memory cooling device according to claim 1 , further comprising a heat dissipation paste connecting the heat conduction sheet and the heat dissipation sheet. 8. The memory cooling device according to claim 7, wherein the printed circuit board is fixed between the conductor stud and the conductor bolt. 9. The memory cooling device according to claim 1, wherein the printed circuit board is parallel to the metal bottom surface of the lower case. 10 . The memory cooling device according to claim 9 , wherein the cooling fins are parallel to the metal bottom surface of the lower case. 11 .

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