CN203241906U - A low-power consumption cloud computer chassis cooling system - Google Patents

Abstract

The utility model discloses a low-power consumption cloud computer machine case cooling system, which relates to the field of computer cooling and comprises a metal machine case bottom plate, a mainboard, a central processing unit and a chip set, wherein the mainboard is arranged on the metal machine case bottom plate, the central processing unit and the chip set are arranged on the mainboard, the central processing unit and the chip set are arranged on the reverse side of the mainboard, and a central processing unit heat conduction connector and a chip set heat conduction connector are arranged between the reverse side of the mainboard and the metal machine case bottom plate; the heat conducting connector of the central processor is in contact fit with the central processor, and the heat conducting connector of the chipset is in contact fit with the chipset. Adopt the utility model discloses a cooling system for cloud computer machine case is small, and the heat dissipation is good, when adopting 5V's low-power consumption solid state hard drives, can make the complete machine consumption be 20W, and is 90% than ordinary computer energy-conservation.

Description

A low-power consumption cloud computer chassis cooling system

technical field

The utility model relates to the field of computer cooling, in particular to a low-power consumption cloud computer case cooling system.

Background technique

The heat sink of the CPU of the central processing unit of the desktop computer generally adopts air cooling to dissipate heat. The radiator consists of a fan, a metal heat sink, a fastener and a heat conduction medium. When working, the heat of the CPU is conducted and diffused through the heat sink, and the heat is forced into the air through the fan to achieve the purpose of heat dissipation. This heat dissipation method is not ideal. First, after the cold air outside the chassis enters the chassis, it has been preheated or partially preheated by the electronic components before the air flow enters the fan, so that the air source blown by the fan to the heat sink becomes the inside of the chassis. Heated air; secondly, the air with a lot of heat after being blown to the metal heat sink by the fan is not completely discharged from the chassis in time, and part of it is sucked in by the fan again due to turbulent flow. This means that the temperature of the air used to cool the CPU is higher than the temperature of the air outside the chassis, and there is still a part of the turbulent flow that is repeatedly "used" by the fan, which reduces the effect of the fan and makes the CPU cooling effect unsatisfactory. To change this situation, the usual means is to use a larger radiator. But a larger heat sink not only increases the investment but also takes up a larger motherboard space. Therefore, it is necessary to improve the prior art.

Contents of the invention

The purpose of the utility model is to propose a low-power consumption cloud computer case heat dissipation system in order to overcome the large volume and poor heat dissipation effect of the prior art computer case. The device is small in size and has good heat dissipation effect.

In order to achieve the above object, the technical scheme adopted in the utility model is as follows:

A low-power consumption cloud computer case heat dissipation system, including a metal case bottom plate, a main board, a central processing unit and a chipset, the main board is installed on the metal case bottom plate, the central processing unit and the chipset are installed on the main board, the The central processing unit and the chipset are installed on the reverse side of the motherboard, and a central processor heat conduction connecting body and a chipset heat conducting connecting body are arranged between the mainboard reverse side and the metal chassis bottom plate; wherein, the central processing unit heat conducting connecting body is in contact with the central processing unit Cooperating, the chipset heat conduction connecting body contacts and cooperates with the chipset.

Silicone is coated on the contact surface between the heat conduction connecting body of the central processor and the central processing unit; the contact surface between the heat conducting connecting body of the chipset and the chipset is coated with silica gel.

The above-mentioned central processor heat conduction connecting body and chipset heat conducting connecting body are integrally formed metal heat conducting strips.

The above-mentioned central processing unit heat conduction connecting body and chipset heat conducting connecting body are bonded to the bottom plate of the metal case by adhesive respectively.

The above-mentioned main board is fixed on the bottom plate of the case by screws, and the distance between the main board and the bottom plate of the case is 3-5 cm.

The above-mentioned metal case bottom plate is an aluminum alloy case bottom plate.

Beneficial effects of the utility model: the cabinet of the utility model has small volume and good heat dissipation. When a 5V low-power solid-state hard disk is used, the power consumption of the whole machine can be 20W, which is 90% more energy-saving than ordinary computers.

Description of drawings

Fig. 1 is the side view schematic diagram of the utility model low power consumption cloud computer chassis;

Fig. 2 is a schematic side view of the chassis of the low power consumption cloud computer of the present invention.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

A kind of low power consumption cloud computer chassis cooling system as shown in Fig. 1 and Fig. 2, comprises metal chassis bottom plate 1, mainboard 2, central processing unit 3 and chipset 4, and described mainboard 2 is installed on the metal chassis bottom plate 1, The central processing unit 3 and the chipset 4 are installed on the mainboard 2, the central processing unit 3 and the chipset 4 are installed on the back side of the mainboard 2, and the central processing unit heat conduction is arranged between the backside of the mainboard 2 and the metal chassis bottom plate 1. Connecting body 5 and chipset thermally conductive connecting body 5 ; wherein, CPU thermally conductive connecting body 5 is in contact with CPU 3 , and chipset thermally conductive connecting body 5 is in contact with chipset 4 . The contact surface between the heat conduction connector 5 of the CPU and the CPU 3 is coated with silica gel; the contact surface between the heat conduction connector 5 of the chipset and the chipset 4 is coated with silica gel 6 . The heat conduction connection body 5 of the central processing unit and the heat conduction connection body 5 of the chipset are integrally formed metal heat conduction strips. The central processing unit heat conduction connecting body 5 and the chip set heat conducting connecting body 5 are bonded on the metal chassis bottom plate 1 through an adhesive 7 respectively. The main board 2 is fixed to the case bottom plate 1 by screws 8, and the distance between the main board 2 and the case bottom plate 1 is 3-5 cm. The metal case bottom plate 1 is an aluminum alloy case bottom plate.

The above is only a preferred embodiment of the present utility model. It is worth noting that, for those of ordinary skill in the art, on the premise of not departing from the principle of the utility model, some deformations or improvements can also be made to the utility model, so all the structures described in the patent application scope of the utility model Equivalent changes or modifications made in , features and principles, these features all belong to the protection scope of the utility model patent application.

Claims (6)

1. a low-power consumption cloud computer chassis cooling system, comprising a metal chassis base plate, a mainboard, a central processing unit and a chipset, the mainboard is installed on the metal chassis bottom plate, and the central processing unit and the chipset are installed on the mainboard, It is characterized in that: the central processing unit and the chipset are installed on the back of the motherboard, and a central processor heat conduction connector and a chipset heat conduction connector are arranged between the motherboard reverse side and the bottom plate of the metal case; wherein, the central processor heat conduction connector It is in contact with the central processing unit, and the chipset heat conduction connecting body is in contact with the chipset. 2. The low-power consumption cloud computer chassis heat dissipation system as claimed in claim 1, characterized in that: the contact surface of the central processing unit heat conduction connecting body and the central processing unit is coated with silica gel; the chipset heat conducting connecting body and the chipset The contact surfaces are coated with silicone. 3. The heat dissipation system for a low-power cloud computer case as claimed in claim 1, characterized in that: the central processor heat conduction connector and the chipset heat conduction connector are integrally formed metal heat conduction strips. 4. The heat dissipation system for a low-power cloud computer case according to claim 1, wherein the central processing unit heat conduction connector and the chipset heat conduction connector are respectively bonded to the metal case bottom plate by an adhesive. 5 . The cooling system for a low-power cloud computer case according to claim 1 , wherein the main board is fixed to the bottom plate of the case by screws, and the distance between the main board and the bottom plate of the case is 3-5 cm. 6. The heat dissipation system for a low-power cloud computer chassis according to claim 1, wherein the metal chassis bottom plate is an aluminum alloy chassis bottom plate.

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