CN108027553A - 用于在金属表面上产生抗蚀刻图案的方法 - Google Patents
用于在金属表面上产生抗蚀刻图案的方法 Download PDFInfo
- Publication number
- CN108027553A CN108027553A CN201680048035.XA CN201680048035A CN108027553A CN 108027553 A CN108027553 A CN 108027553A CN 201680048035 A CN201680048035 A CN 201680048035A CN 108027553 A CN108027553 A CN 108027553A
- Authority
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- Prior art keywords
- etch
- metal
- ink
- method described
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title description 8
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000000126 substance Substances 0.000 claims abstract description 26
- 230000004913 activation Effects 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- 238000007639 printing Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000012190 activator Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims description 19
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 7
- 238000007641 inkjet printing Methods 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- 125000000129 anionic group Chemical group 0.000 claims description 5
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 4
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 claims description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 3
- 229960002218 sodium chlorite Drugs 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- -1 sulphonic acid ester Chemical class 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 36
- 239000010949 copper Substances 0.000 description 36
- 239000000976 ink Substances 0.000 description 28
- 239000000243 solution Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 150000001879 copper Chemical class 0.000 description 5
- 230000003213 activating effect Effects 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000003839 salts Chemical group 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 229920006318 anionic polymer Polymers 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 159000000014 iron salts Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229920005792 styrene-acrylic resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920005692 JONCRYL® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/92—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared from printing surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
提供了在衬底上形成金属图案的方法。该方法包括向金属表面上施加具有使金属表面化学地活化的活化剂的化学表面活化溶液;在活化的表面上非击打式印刷抗蚀刻油墨以根据预定图案产生抗蚀刻掩模,其中抗蚀刻油墨内的至少一种油墨组分与活化的金属表面经历化学反应以当击中活化的表面时固定抗蚀刻油墨的液滴;进行蚀刻工艺以除去未被抗蚀刻掩模覆盖的未掩蔽的金属部分;和除去抗蚀刻掩模。
Description
发明领域
本发明的实施方案涉及通过使用非击打式定向(nonimpact orienting)例如喷墨印刷施加抗蚀刻掩模来制造印刷电路板。
背景
印刷电路板(PCB)在大多数电子产品中被广泛使用。PCB的制造被认为比使用其他布线方法例如点对点构造更便宜、更快速且更准确。但是,仍然在持续寻找更简单和更具成本效益的制造工艺,该制造工艺将保持高品质并且将能够根据特定需求生产PCB,所述需求包括制造成本效益较小的批次,具有高生产量的较大批次、按需电路板、电路较密集的电路板、线较薄的电路板以及其他。
在PCB的制造过程中,铜线的图案化通常通过在层压到绝缘材料板的铜层上施加抗蚀刻光掩模并且通过蚀刻工艺除去暴露的铜部分来完成,仅留下期望的铜线(也被称为图像图案化)作为导电路径。抗蚀刻图案可以通过叠加法(additive method)施加在铜层的顶部上,例如通过在铜层的顶部上的非击打式印刷(例如,喷墨印刷)。常规的喷墨材料具有相对低的粘度,并且因此当油墨液滴将击中非吸收表面例如铜表面时,液滴的不受控制的扩散和其他现象例如聚集、聚结和广泛的网点增益通常会发生。因此,由喷墨印刷技术形成的印刷图案可能表现出差的品质或铜线,包括例如细节缺陷、线宽不一致、线边缘光滑度差、相邻线之间短路以及图案线断开。
附图简述
被视为本发明的主题被特别地指出并且在说明书的结论部分中被明确地要求保护。然而,当与附图一起阅读时,关于组织和操作的方法两者,本发明与其目的、特征和优点一起可以通过参考以下详细描述被最好地理解,在附图中:
图1是根据本发明的一些实施方案的用于生产抗蚀刻掩模的方法的流程图;和
图2A示出了印制在未活化的铜上的示例性抗蚀刻掩模的照片;和
图2B示出了根据本发明的实施方案的印刷在活化的铜表面上的示例性抗蚀刻掩模的照片。
将理解,为了简单且清楚阐明,在附图中示出的元件不一定按比例绘制。例如,为了清楚,元件中的一些的尺寸可以相对于其他元件被放大。进一步地,在认为合适的情况下,参考数字可以在附图中被重复以指示相应的或类似的元件。
概述
本发明的实施方案包括在衬底上形成金属图案的方法。该方法可以包括向联接到衬底的金属表面上施加具有使金属表面化学地活化的活化剂的化学表面活化溶液;在活化的表面上非击打式印刷抗蚀刻油墨以根据预定图案产生抗蚀刻掩模,其中抗蚀刻油墨内的至少一种油墨组分与活化的金属表面经历化学反应以当击中活化的表面时固定抗蚀刻油墨的液滴;进行蚀刻工艺以除去未被所述抗蚀刻掩模覆盖的未掩蔽的金属部分;和除去抗蚀刻掩模。
在一些实施方案中,根据本发明的实施方案形成的金属图案包括具有小于50微米的宽度的图案线。在一些实施方案中,根据本发明的实施方案产生的抗蚀刻掩模包括具有小于50微米的宽度的线。在一些实施方案中,根据本发明的实施方案形成的金属图案包括具有小于30微米的宽度的图案线。在一些实施方案中,根据本发明的实施方案产生的抗蚀刻掩模包括具有小于30微米的宽度的线。
在一些实施方案中,该方法可以包括在印刷之前使用溶剂从表面除去化学表面活化溶液。在一些实施方案中,经历化学反应的油墨组分是阴离子组分。在一些实施方案中,与活化的表面经历化学反应的油墨组分是选自丙烯酸酯、磷酸酯、磺酸酯或其混合物的聚合物组分。在一些实施方案中,活化剂可以包括以下中的至少一种:铜盐、铁盐、铬-硫酸、过硫酸盐、亚氯酸钠和过氧化氢中或其混合物。
在一些实施方案中,施加化学表面活化溶液包括将金属表面浸入包含化学表面活化溶液的浴中持续约10-60秒。在一些实施方案中,施加化学表面活化溶液包括将化学表面活化溶液喷洒到金属上。在一些实施方案中,在活化的表面上非击打式印刷抗蚀刻油墨包括喷墨印刷。
详细描述
在以下的详细描述中,大量具体的细节被陈述以便提供本发明的完全的理解。然而,本领域技术人员将理解,本发明可以在没有这些具体细节的情况下被实践。在其他例子中,熟知的方法、程序和组分未被详细地描述,以便不使本发明模糊。
本发明的实施方案涉及例如在制造印刷电路板(PCB)期间通过非击打式印刷在金属层上形成或施加抗蚀刻掩模的方法。根据本发明的实施方案的在金属表面上施加抗蚀刻掩模的方法可以包括在金属表面的顶部上施加化学表面活化溶液以使金属表面化学地活化,接着从表面除去/洗去化学活化溶液并且在活化的表面的顶部上印刷(例如,喷墨印刷)抗蚀刻油墨。根据本发明的实施方案,抗蚀刻油墨的反应性组分与活化的表面经历化学反应以当击中表面时固定液体组合物的液滴。化学反应可能会在击中活化的表面时瞬间引起油墨液滴粘度的显著增加(例如,增加了一个或两个数量级)。
在一些实施方案中,抗蚀刻油墨(油墨组分)中的反应性组分可以是抗蚀刻组分,并且在其他实施方案中,反应性组分可以不同于抗蚀刻组分。根据一些实施方案,抗蚀刻油墨的多于一种反应性组分可以与活化的表面上的组分经历化学反应。
金属层可以是层压到绝缘非导电衬底上的铜层。为了便于解释,下面的描述涉及铜表面。应该认识到,其他金属表面例如铝表面、不锈钢表面、金表面以及其他同样适用于本发明的实施方案。
参照图1,图1是根据本发明的一些实施方案的生产抗蚀刻掩模的方法的流程图。根据本发明的实施方案,如框110所示,该方法可以包括向金属表面上施加化学表面活化溶液,在该金属表面上将要印刷抗蚀刻图案。在一些实施方案中,化学表面活化溶液可以是或可以包括能够使表面化学地活化的任何蚀刻溶液。化学活化的表面可以被定义为在表面活化之前不会与抗蚀刻油墨材料反应,而在表面活化后发生反应以引起抗蚀刻油墨液滴的固定的表面。表面活化溶液可以包括例如铜盐、铁盐、铬-硫酸、过硫酸盐、亚氯酸钠和过氧化氢。在一些实施方案中,施加化学活化溶液可以包括将表面浸入包含化学表面活化溶液的浴中,将化学表面活化溶液喷洒在该表面上以及任何其他合适的方法。在一些实施方案中,该方法可以包括使金属表面经历化学活化溶液(例如,通过浸入、喷洒或类似的)持续预定的时间量,例如持续10秒、20秒、30秒、60秒或者更多。
如框115所示,在一些实施方案中,该方法可以任选地包括使用例如醇溶液除去化学表面活化溶液。例如,该方法可以包括使用乙醇从表面除去化学表面活化溶液的残余物。在一些实施方案中,可以使用除醇溶液之外的液体从表面除去化学活化溶液,醇溶液例如丙醇;异丙醇;丙酮。
如框120所示,在一些实施方案中,该方法可以包括根据预定图案将抗蚀刻油墨非击打式印刷(例如,通过喷墨印刷)到活化的表面上以产生抗蚀刻掩模。抗蚀刻油墨可以包含抗蚀刻聚合物组分,该抗蚀刻聚合物组分与活化的表面经历化学反应以在击中活化的表面时固定抗蚀刻油墨的液滴。在一些实施方案中,与抗蚀刻组分不同的另一油墨组分与活化的表面经历化学反应,以在击中活化的表面时固定抗蚀刻油墨的液滴。
抗蚀刻聚合物反应性组分的非限制性实例可以是丙烯酸酯、苯乙烯丙烯酸酯、磷酸酯和磺酸酯聚合物,获得从1000-17,000的分子量(Mw)。
在一些实施方案中,抗蚀刻反应性聚合物组分可以是水溶性的并且可以包括反应性阴离子组分。阴离子抗蚀刻反应性组分的非限制性实例可以包括pH高于7.0的至少一种阴离子聚合物(以碱形式)。阴离子聚合物可以选自以其溶解的盐形式的丙烯酸树脂和苯乙烯-丙烯酸树脂,以其溶解的盐形式的磺酸树脂,例如钠、铵或胺中和的形式以及类似物。不希望受到任何特定理论机制的束缚,上述树脂可以与反应性(活化的)表面经历反应。例如,铜金属表面被活化以在铜的顶部上形成铜阳离子,并且当丙烯酸聚合物(存在于抗蚀刻油墨中)将击中表面时,阴离子丙烯酸酯可以与铜离子反应以在液滴中形成聚合物基质,这将显著增加液滴粘度。
在一些实施方案中,与表面活化的组分经历化学反应以在击中活化的表面时固定抗蚀刻油墨的液滴的油墨组分可以不同于抗蚀刻组分。
如框130所示,可以通过金属蚀刻(例如,酸性铜蚀刻)溶液来进一步蚀刻掩蔽的铜板,以除去金属层的暴露的、未掩蔽的部分。如框140所示,然后可以除去抗蚀刻掩模以暴露衬底,即绝缘板上的线图案。
实施例
使用Epson Stylus 4900喷墨打印机,将示例性液体组合物(如本文所述的抗蚀刻油墨组合物)印刷在具有18微米的铜厚度的FR4覆铜板上。在一些测试中,首先通过施加化学表面活化溶液以使铜表面活化来使铜化学地活化。使用喷墨印刷技术将抗蚀刻油墨的液体组合物根据预定的图案选择性地印刷在活化的或未活化的铜表面的顶部上。在下面的描述中,%(w/w)是相对于组合物的重量的以重量百分比表示的物质浓度的量度。使用含有由Amza(PERMIX166)提供的强度42°波美的氯化铁蚀刻剂溶液的蚀刻剂浴将铜从未掩蔽的暴露区域蚀刻掉。蚀刻在由Walter Lemmen GMBH提供的Spray Developer S31中在35℃的温度进行3分钟。通过在25℃的温度将蚀刻的板浸入1%(w/w)的NaOH水溶液中,然后用水洗涤FR4铜板并且在25℃通过空气干燥来剥落抗蚀刻掩模。
实施例1-将在室温为液体组合物形式的抗蚀刻油墨印刷在未处理(未活化)的FR4铜板的顶部上。液体组合物用10%丙二醇(作为保湿剂)和1%(w/w)2-氨基-2-甲基丙醇、0.3%(w/w)由BYK提供的BYK 348和2%(w/w)Bayscript BA青色制备。将这些材料溶于含有24%Joncryl 8085苯乙烯丙烯酸树脂溶液的水中。使用Epson Stylus 4900喷墨打印机,将抗蚀刻组合物印刷在具有18微米的铜厚度的FR4覆铜板的顶部上,以产生抗蚀刻掩模。
目视检查抗蚀刻掩模。如图2A可见,印刷图案表现出非常差的印刷品质,边缘定义极差,并且线条之间严重短路。
实施例2-如实施例1中详述地制备液体组合物。通过将覆铜板浸渍(例如,浸入)0.5%(w/w)的CuCl2水溶液中持续30秒,然后用技术乙醇清洗铜板,使FR4覆铜板表面活化。
使用Epson stylus 4900喷墨打印机,将液体组合物印刷在经处理的铜板的顶部上,并且在80℃干燥以产生不溶性抗蚀刻掩模。如图2B可见,抗蚀刻图案表现出界限清楚的高打印品质以及低至50微米的细线宽度,包含锐利的边缘并且没有断线。如实施例1中详述地进行暴露的铜的蚀刻和抗蚀刻掩模的除去。板上的布线图案表现出具有低至50微米的宽度的界限清楚的细线,包含锐利的边缘且没有断线。
实施例3-如实施例1中详述地制备液体组合物。通过将FR4覆铜板浸渍到含有20%(w/w)FeCl3水溶液的浴中持续10秒、随后用技术乙醇洗涤铜板,使铜表面活化。
与实施例2类似,将液体组合物喷墨印刷在涂覆的铜板上,并且在80℃干燥以产生不溶性抗蚀刻掩模。抗蚀刻图案表现出界限清楚的高打印品质以及低至50微米的细线,包含锐利的边缘且没有断线。如实施例1中详述地进行暴露的铜的蚀刻和抗蚀刻掩模的除去。板上的布线图案表现出界限清楚的图案,其中细线具有低至30微米的宽度,锐利的边缘且没有断线。
实施例4-如实施例1中详述地制备液体组合物。通过将FR4覆铜板浸渍到1%(w/w)的Na2S2S8水溶液中持续30秒,然后用技术乙醇清洗铜板,使铜表面活化。
使用Epson Stylus 4900喷墨打印机,将抗蚀刻液体组合物印刷在经处理的铜板上,并且在80℃干燥以产生不溶性抗蚀刻掩模。抗蚀刻图案表现出界限清楚的高打印品质和低至50微米的细线,包含锐利的边缘且没有断线。未掩蔽的铜的蚀刻和抗蚀刻掩模的除去如实施例1中详述地进行。通过蚀刻和剥离工艺产生的布线图案表现出界限清楚的图案,其中细线具有低至30微米的宽度、锐利的边缘且没有断线。
下表1根据本发明的一些实施方案列出了本发明的实施方案中使用的化学表面活化组分的一些非限制性实例,它们在表面活化溶液中的相对重量浓度以及建议的浸入时间。
表1
活化剂 | 浓度(w/w%) | 浸入时间(秒) |
CuCl2(或任何二价铜盐) | 0.5-1 | 30 |
Na2S2S8(或任何过硫酸盐) | 0.5-1 | 30 |
H2O2 | 10 | 30 |
FeCl3 | 20 | 10 |
HCrO4/H2SO4 | 5 | 30 |
NaClO2 | 5 | 60 |
下表2列出了抗蚀刻油墨的一些非限制性实例。
尽管本发明的某些特征已经在本文中被图示且描述,但是许多修改、替换、变化和等同物现在将由本领域普通技术人员想到。因此,将被理解的是,所附权利要求意图覆盖全部这样的修改和变化,全部这样的修改和变化落在本发明的真实精神内。
Claims (12)
1.一种在衬底上形成金属图案的方法,所述方法包括:
向联接到所述衬底的金属表面上施加具有使所述金属表面化学地活化的活化剂的化学表面活化溶液;
在活化的表面上非击打式印刷抗蚀刻油墨以根据预定图案产生抗蚀刻掩模,其中所述抗蚀刻油墨内的至少一种油墨组分与所述活化的金属表面经历化学反应以当击中所述活化的表面时固定所述抗蚀刻油墨的液滴;
进行蚀刻工艺以除去未被所述抗蚀刻掩模覆盖的未掩蔽的金属部分;和
除去所述抗蚀刻掩模。
2.根据权利要求1所述的方法,其中所述金属图案包括具有小于50微米的宽度的金属线。
3.根据权利要求1所述的方法,其中所述抗蚀刻掩模包括具有小于50微米的宽度的线。
4.根据权利要求1所述的方法,其中所述金属图案包括具有小于30微米的宽度的金属线。
5.根据权利要求1所述的方法,其中所述抗蚀刻掩模包括具有小于30微米的宽度的线。
6.根据权利要求1所述的方法,其中在印刷之前,使用溶剂从所述表面除去所述化学表面活化溶液。
7.根据权利要求1所述的方法,其中经历所述化学反应的所述油墨组分是阴离子组分。
8.根据权利要求1所述的方法,其中与所述活化的表面经历所述化学反应的所述油墨组分是选自丙烯酸酯、磷酸酯、磺酸酯或其混合物的聚合物组分。
9.根据权利要求1所述的方法,其中所述活化剂包括以下中的至少一种:铜盐、铁盐、铬-硫酸、过硫酸盐、亚氯酸钠和过氧化氢或其混合物。
10.根据权利要求1所述的方法,其中施加所述化学表面活化溶液包括将所述金属表面浸入包含所述化学表面活化溶液的浴中持续约10-60秒。
11.根据权利要求1所述的方法,其中施加所述化学表面活化溶液包括将所述化学表面活化溶液喷洒到所述金属上。
12.根据权利要求1所述的方法,其中在所述活化的表面上非击打式印刷所述抗蚀刻油墨包括喷墨印刷。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110468413A (zh) * | 2019-09-10 | 2019-11-19 | 四会富仕电子科技股份有限公司 | 一种金属基表面粗化的方法 |
CN113646279A (zh) * | 2019-03-29 | 2021-11-12 | 皮尔斯协议有限公司 | 玻璃蚀刻制备方法和系统 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016193978A2 (en) * | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
EP3335079B1 (en) * | 2015-08-13 | 2021-05-12 | Kateeva, Inc. | Methods for producing an etch resist pattern on a metallic surface |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
WO2019082681A1 (ja) * | 2017-10-23 | 2019-05-02 | メック株式会社 | 膜形成基材の製造方法、膜形成基材及び表面処理剤 |
EP3985144A4 (en) * | 2019-06-11 | 2022-08-03 | Mitsubishi Gas Chemical Company, Inc. | AQUEOUS COMPOSITION, METHOD OF RUGGING A STAINLESS STEEL SURFACE USING THE SAME, RUBBED STAINLESS STEEL AND METHOD OF PRODUCTION THEREOF |
CA3191956A1 (en) * | 2022-03-07 | 2023-09-07 | CatMarks Manufacturing, LLC | Automotive part identification marking system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1440466A (zh) * | 2000-07-07 | 2003-09-03 | 埃托特克德国有限公司 | 酸性处理液和处理铜表面的方法 |
US6858352B1 (en) * | 1999-07-08 | 2005-02-22 | Isis Innovation Limited | Printed circuit fabrication |
CN1659310A (zh) * | 2002-06-04 | 2005-08-24 | 新加坡科技研究局 | 聚合物基质的无电金属喷镀的方法 |
CN1925724A (zh) * | 2005-09-02 | 2007-03-07 | 三星电机株式会社 | 在印刷电路板上形成电路图案的方法 |
CN101023395A (zh) * | 2004-09-17 | 2007-08-22 | Lg化学株式会社 | 用于防蚀涂层的油墨组合物、使用该油墨组合物形成防蚀涂层图案的方法、以及使用该油墨组合物形成微通道的方法 |
JP2013162007A (ja) * | 2012-02-07 | 2013-08-19 | Toppan Printing Co Ltd | 微細配線パターンの製造方法 |
CN104011265A (zh) * | 2011-12-20 | 2014-08-27 | 苹果公司 | 金属表面以及处理金属表面的工艺 |
US20140290520A1 (en) * | 2011-08-24 | 2014-10-02 | Digiflex Ltd. | Process for dry-coating flexographic surfaces |
Family Cites Families (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US4127438A (en) | 1977-11-07 | 1978-11-28 | International Business Machines Corporation | Adhesion promoter for additively plated printed circuit boards |
DE3402883A1 (de) | 1984-01-27 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Leiterplatten aus schichtpressstoffen |
EP0206030B1 (en) | 1985-06-07 | 1992-01-02 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Photocurable composition |
US4946711A (en) | 1987-10-14 | 1990-08-07 | Desoto, Inc. | Masking compositions and method for applying the same |
JP2585070B2 (ja) | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
JPH06504628A (ja) | 1990-12-20 | 1994-05-26 | エクソン・ケミカル・パテンツ・インク | リソグラフィー及び腐食防止コーティング用途向けのuv/eb硬化性ブチルコポリマー |
GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
DE69635203T2 (de) | 1995-07-11 | 2006-06-29 | Delphi Technologies, Inc., Troy | Beschichtungen und Verfahren, insbesondere für Leiterplatten |
EP0860742B1 (en) | 1997-02-25 | 2001-04-04 | E.I. Du Pont De Nemours And Company | Flexible, flame-retardant, photoimageable composition for coating printing circuits |
US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
IL129307A0 (en) * | 1999-04-04 | 2000-02-17 | Scitex Corp Ltd | Process for direct digital printing of circuit boards |
JP3622910B2 (ja) | 1999-07-30 | 2005-02-23 | セイコーエプソン株式会社 | 記録媒体に二液を用いて印刷する記録方法 |
WO2001013179A1 (en) | 1999-08-13 | 2001-02-22 | Board Of Regents, University Of Texas System | Water-processable photoresist compositions |
DE60103529T2 (de) | 2000-03-29 | 2005-06-02 | Kanagawa University, Yokohama | Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit |
JP3754303B2 (ja) | 2001-02-16 | 2006-03-08 | 株式会社日立インフォメーションテクノロジー | Sdramリフレッシュ回路 |
JP2003012971A (ja) | 2001-06-28 | 2003-01-15 | Konica Corp | インクジェット記録方法 |
JP2006517004A (ja) | 2001-08-31 | 2006-07-13 | セミトゥール・インコーポレイテッド | 電気泳動エマルジョン付着装置及び方法 |
US6709962B2 (en) | 2002-03-19 | 2004-03-23 | N. Edward Berg | Process for manufacturing printed circuit boards |
US20030177639A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
GB0221891D0 (en) | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
TWI291726B (en) | 2002-10-25 | 2007-12-21 | Nanya Technology Corp | Process for etching metal layer |
US7005241B2 (en) | 2003-06-09 | 2006-02-28 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
JP2005033049A (ja) * | 2003-07-08 | 2005-02-03 | Nec Toppan Circuit Solutions Inc | プリント配線板の配線パターン形成方法及びプリント配線板の製造方法 |
JP2005079479A (ja) * | 2003-09-02 | 2005-03-24 | Asahi Kasei Electronics Co Ltd | レジスト直描用レジストインク |
US7477627B2 (en) | 2003-09-10 | 2009-01-13 | Intel Corporation | Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks |
US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
CN1894442B (zh) | 2003-10-22 | 2012-01-04 | 内克斯系统公司 | 用于对工件进行流体处理的方法和设备 |
GB0324947D0 (en) | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
DE602005019835D1 (de) * | 2004-01-15 | 2010-04-22 | Panasonic Corp | Struktur und prozess zu ihrer herstellung |
CN1899003B (zh) | 2004-03-03 | 2010-12-29 | 揖斐电株式会社 | 蚀刻液、蚀刻方法以及印刷电路板 |
KR100585138B1 (ko) | 2004-04-08 | 2006-05-30 | 삼성전자주식회사 | 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법 |
US20050250052A1 (en) | 2004-05-10 | 2005-11-10 | Nguyen Khe C | Maskless lithography using UV absorbing nano particle |
GB0414840D0 (en) | 2004-07-02 | 2004-08-04 | Ncr Int Inc | Self-service terminal |
US20090163615A1 (en) | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
US7686986B2 (en) | 2006-01-05 | 2010-03-30 | Headwaters Technology Innovation, Llc | Magnesium hydroxide nanoparticles, methods of making same and compositions incorporating same |
JP2007250884A (ja) * | 2006-03-16 | 2007-09-27 | Shirai Denshi Kogyo Kk | フレキシブルプリント基板およびその製造方法 |
US20070237899A1 (en) * | 2006-04-05 | 2007-10-11 | David Sawoska | Process for creating a pattern on a copper surface |
US20080308003A1 (en) | 2007-06-13 | 2008-12-18 | Krol Andrew M | UV inkjet resist |
JP5454834B2 (ja) | 2007-08-30 | 2014-03-26 | 日立化成株式会社 | 粗化処理装置 |
JP2009158593A (ja) | 2007-12-25 | 2009-07-16 | Tessera Interconnect Materials Inc | バンプ構造およびその製造方法 |
WO2009116401A1 (ja) | 2008-03-17 | 2009-09-24 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板 |
KR100986287B1 (ko) | 2008-05-09 | 2010-10-07 | 삼성전기주식회사 | 잉크젯 토출장치 |
US9513551B2 (en) * | 2009-01-29 | 2016-12-06 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
JP2011171323A (ja) * | 2010-02-16 | 2011-09-01 | Mitsubishi Paper Mills Ltd | 銅又は銅合金のエッチング方法 |
JP2011243256A (ja) | 2010-05-19 | 2011-12-01 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
US20130298398A1 (en) | 2010-11-17 | 2013-11-14 | Masahiro Miyasaka | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
US20120288683A1 (en) | 2011-05-10 | 2012-11-15 | Chin-Te Kuo | Protuberant structure and method for making the same |
KR101842320B1 (ko) * | 2011-07-07 | 2018-03-26 | 아토테크더치랜드게엠베하 | 구리 또는 구리 합금 표면에 유기 레지스트 접착을 제공하는 방법 |
WO2013030931A1 (ja) | 2011-08-29 | 2013-03-07 | 日本碍子株式会社 | 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ |
CN104066590B (zh) | 2012-01-31 | 2015-11-25 | 爱克发-格法特公司 | 可辐射固化的耐蚀刻喷墨油墨印刷 |
JP5935163B2 (ja) | 2012-03-30 | 2016-06-15 | ナガセケムテックス株式会社 | レジスト密着性向上剤及び銅配線製造方法 |
US20140252571A1 (en) | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
JP6164614B2 (ja) | 2013-12-06 | 2017-07-19 | メック株式会社 | エッチング液、補給液及び銅配線の形成方法 |
EP3077129B1 (en) | 2013-12-06 | 2020-11-11 | FujiFilm Electronic Materials USA, Inc. | Cleaning formulation for removing residues on surfaces |
TWI500806B (zh) | 2014-03-10 | 2015-09-21 | Nat Univ Tsing Hua | 碳化矽薄膜的製造方法 |
KR20150109932A (ko) | 2014-03-21 | 2015-10-02 | 삼성전기주식회사 | 에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법 |
US10498101B2 (en) | 2014-09-08 | 2019-12-03 | Kyushu University, National University Corporation | Method for producing organic microdisk structure |
GB2538522B (en) | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
WO2016193978A2 (en) | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
EP3335079B1 (en) | 2015-08-13 | 2021-05-12 | Kateeva, Inc. | Methods for producing an etch resist pattern on a metallic surface |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
-
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- 2016-07-27 EP EP16834759.9A patent/EP3335079B1/en active Active
- 2016-07-27 CN CN201680048035.XA patent/CN108027553B/zh active Active
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- 2023-05-21 JP JP2023083553A patent/JP7602278B2/ja active Active
- 2023-10-10 US US18/483,673 patent/US20240035167A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6858352B1 (en) * | 1999-07-08 | 2005-02-22 | Isis Innovation Limited | Printed circuit fabrication |
CN1440466A (zh) * | 2000-07-07 | 2003-09-03 | 埃托特克德国有限公司 | 酸性处理液和处理铜表面的方法 |
CN1659310A (zh) * | 2002-06-04 | 2005-08-24 | 新加坡科技研究局 | 聚合物基质的无电金属喷镀的方法 |
CN101023395A (zh) * | 2004-09-17 | 2007-08-22 | Lg化学株式会社 | 用于防蚀涂层的油墨组合物、使用该油墨组合物形成防蚀涂层图案的方法、以及使用该油墨组合物形成微通道的方法 |
CN1925724A (zh) * | 2005-09-02 | 2007-03-07 | 三星电机株式会社 | 在印刷电路板上形成电路图案的方法 |
US20140290520A1 (en) * | 2011-08-24 | 2014-10-02 | Digiflex Ltd. | Process for dry-coating flexographic surfaces |
CN104011265A (zh) * | 2011-12-20 | 2014-08-27 | 苹果公司 | 金属表面以及处理金属表面的工艺 |
JP2013162007A (ja) * | 2012-02-07 | 2013-08-19 | Toppan Printing Co Ltd | 微細配線パターンの製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113646279A (zh) * | 2019-03-29 | 2021-11-12 | 皮尔斯协议有限公司 | 玻璃蚀刻制备方法和系统 |
CN113646279B (zh) * | 2019-03-29 | 2023-04-11 | 皮尔斯协议有限公司 | 玻璃蚀刻制备方法和系统 |
CN110468413A (zh) * | 2019-09-10 | 2019-11-19 | 四会富仕电子科技股份有限公司 | 一种金属基表面粗化的方法 |
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JP7602278B2 (ja) | 2024-12-18 |
KR102748690B1 (ko) | 2024-12-30 |
CN114397795A (zh) | 2022-04-26 |
KR20180074666A (ko) | 2018-07-03 |
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