CN103258955A - Encapsulation method of organic electronic device - Google Patents

Abstract

Disclosed is a method of encapsulating an organic electronic device, comprising: before manufacturing an electronic device, depositing a multilayer composite film on the back of a substrate material; and after the electronic device is manufactured, depositing a multilayer composite film on the surface of the organic electronic device. The packaging method of the organic electronic device provided by the invention adopts a chip-level packaging method, integrates the packaging process into the device manufacturing process, and replaces the traditional mode of firstly manufacturing the device on a wafer and then independently packaging the device after cutting. The invention adopts organic/inorganic composite multilayer film package to isolate water and oxygen, thus greatly improving the service life of the organic electronic device, realizing flexible package and retaining the folding and bending performance of the organic electronic device to the maximum extent. Finally, the invention can realize film formation at low temperature below 120 ℃, and reduces the heat damage to devices and plastic substrates.

Description

Encapsulation methods for organic electronic devices

technical field

The invention relates to the field of electronic packaging, in particular to a method for packaging organic electronic devices.

Background technique

Organic optoelectronic devices have developed rapidly in the past two decades, especially organic light-emitting diodes (OLEDs), which have a series of advantages such as high luminous efficiency, low operating voltage, thinness and softness, and their related technologies and industries have attracted widespread attention. At present, the annual output value of OLED display exceeds one billion US dollars, and its products involve TV, MP3, mobile phone, car audio and so on. OSRAM, GE, Philips and other traditional global lighting giants have invested heavily in the field of OLED lighting and began to launch related products in 2009. According to the market analysis report of the professional organization NanoMarkets, the OLED display and lighting market will reach 10.9 billion US dollars in 2012. to $15.5 billion. In my country, in 2005, the Ministry of Science and Technology included OLED display technology in the "Tenth Five-Year Plan"; in 2006, the "National Medium and Long-term Science and Technology Development Plan" clearly listed OLED and other semiconductor lighting products as "key areas and priority development themes". "In recent years, my country's Visionox, Sichuan Changhong, SVA, Jilin Huanyu, Shanghai Tianma and other companies have prepared to build OLED production lines.

In terms of organic solar cells (OPV), OPV is considered to be able to realize cheap electricity with reasonable efficiency and low cost, thus becoming a competitive third-generation solar power generation technology. At present, the highest energy conversion efficiency of organic solar cells has exceeded 8%. It is approaching the stage of large-scale industrialization. The European Union and the United States have strongly supported the research and development of organic solar cells. Many companies such as Heliatek, Solarmer, and Plextronics have also begun to produce organic solar cells. . Our country also attaches great importance to the development of organic solar energy technology, and many schools and research institutes are engaged in related research on materials and devices.

OLED, OPV, and printed electronic devices usually contain active metal electrodes, and some functional materials of the device are also sensitive to water and oxygen. Water and oxygen accelerate the aging of the device through electrochemical reactions during the operation of the device, reducing the life of the device. Therefore, packaging the above-mentioned devices to isolate the functional layers of the devices from the water vapor and oxygen components in the atmosphere is very important to improve the stability and working life of the devices.

The traditional rigid OLED and OPV device packaging is generally used in the glove box to cover the device with epoxy resin cured glass and other packaging covers, and combined with the use of dry film packaging, but the rigid packaging cannot meet the packaging requirements of flexible devices, and the flexible plastic substrate itself The water and oxygen permeability is also higher than 10-5g/m ² /day, which requires water and oxygen barrier isolation treatment for flexible substrates.

Contents of the invention

The purpose of the present invention is to provide a packaging method for organic electronic devices with a flexible structure and excellent water and oxygen permeation barrier performance, which can reduce damage to devices and plastic substrates.

A method for encapsulating an organic electronic device provided by the invention includes:

Before making electronic devices, deposit multi-layer composite films on the back of the substrate material;

After the electronic device is fabricated, a multi-layer composite film is deposited on the surface of the organic electronic device.

Further, the multilayer composite film includes:

A stack of several layers of organic layers and inorganic layers alternately;

The organic layer is prepared from an organic polymer and is used to isolate water and oxygen;

The inorganic layer is prepared from inorganic materials and is used to increase flexibility, bendability, and prevent fracture.

Further, the organic polymer includes:

Parylene, polypropylene, polyacrylate or silicone crosslinked polymer SiO _x C _y H _z .

Further, the inorganic substance includes: SiN _x , SiO _y , TiO ₂ , Ta ₂ O ₃ or aluminum.

Further, the deposition of multi-layer composite films on the back of the substrate material and the surface of the organic electronic device is to grow the film by plasma-enhanced chemical vapor deposition to ensure low-temperature film formation and minimize thermal damage to the electronic device and the plastic substrate, while the film Moderate growth rate.

Further, the temperature of the low-temperature film formation is below 120°C.

The packaging method of an organic electronic device provided by the present invention adopts a chip-level packaging method to integrate the packaging process into the device manufacturing process, which replaces the previous method of first manufacturing devices on a wafer and then individually packaging after cutting. The benefit of doing this is that it improves efficiency and reduces costs. At the same time, the invention innovatively adopts organic/inorganic composite multi-layer thin film packaging, which can not only isolate water and oxygen, thereby greatly improving the service life of organic electronic devices, but also realizing flexibility. Encapsulation, which retains the foldable and bendable performance of organic electronic devices to the greatest extent. Finally, the invention can realize low-temperature film formation below 120°C, reducing thermal damage to devices and plastic substrates.

Description of drawings

FIG. 1 is a schematic diagram of a packaging structure of an organic electronic device provided by an embodiment of the present invention.

Detailed ways

As shown in FIG. 1 , the packaging method of an organic electronic device provided by the present invention is divided into two steps, a pre-process and a post-process.

The previous process is to deposit a multi-layer composite thin film 3 on the back of the substrate 1 before making the organic electronic device 2 . A multi-layer composite thin film 3 is deposited by plasma enhanced chemical vapor deposition method (hereinafter referred to as PECVD method). The multilayer composite film 3 is composed of several layers of organic layers and inorganic layers alternately stacked. The organic layer is prepared from organic polymers, including parylene, polypropylene, polyacrylate or silicone crosslinked polymer SiO _x C _y H _z . It is used to isolate water and oxygen; the inorganic layer is inorganic, which is used to increase flexibility, bendability and anti-breakage. The inorganic layer is prepared from inorganic substances, including SiN _x , SiO _y , TiO ₂ , Ta ₂ O ₃ or aluminum. Alternate stacked layers of organic and inorganic layers can be used in combination, such as: polypropylene/aluminum, polyacrylate/aluminum, polypropylene/polyacrylate/aluminum/polypropylene, etc. Experiments have proved that the organic/inorganic composite layer has a coordination effect, which is better than repeated stacking of multiple organic layers to isolate water and oxygen; the top layer of the composite layer uses organic matter to further improve the ability to isolate water and oxygen. This organic-inorganic multilayer film structure can effectively block the penetration of water and oxygen because it contains a dense and pinhole-free inorganic layer. The organic layer of the multilayer composite film 3 generally contains 2-10 such organic layer/inorganic layer repeating units, and the multilayer composite film 3 is generally still flexible. The water and oxygen barrier ability of this packaging film depends on the density of the single-layer inorganic film and the number of repeating units. In addition, the repair effect of the organic layer material on the defects of the inorganic film and the extension of the water and oxygen penetration channel can further increase the water and oxygen barrier. ability. On the other hand, the selection of organic layer and inorganic layer materials will determine the stress and adhesion between the films and other parameters, which will have an important impact on the stability of the packaging structure and the effect of anti-winding.

The PECVD method can realize dense and pinhole-free thin film growth, and the deposition speed can reach hundreds of nanometers per minute. In comparison, _SiOx or _SiNx films grown by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), high vacuum thermal deposition, and magnetron sputtering are either poor in quality or require higher temperatures, generally at 150 Above ℃; the atomic layer deposition (ALD) system can prepare very dense inorganic layers, but the growth rate of the ALD system at low temperature is extremely slow. For example, it takes about 5 minutes to grow an Al ₂ O ₃ film at 80 ℃ for 1 nanometer.

The subsequent process is to deposit a multi-layer composite thin film 3 encapsulation layer on the surface of the organic electronic device 2 after the organic electronic device 2 is fabricated. The structure of the multilayer composite film 3 is the same as above. Afterwards, the wafer is diced into individual chips.

The packaging method of an organic electronic device provided by the present invention adopts a chip-level packaging method to integrate the packaging process into the device manufacturing process, which replaces the previous method of first manufacturing devices on a wafer and then individually packaging after cutting. The benefit of doing this is that it improves efficiency and reduces costs. At the same time, the invention innovatively adopts organic/inorganic composite multi-layer thin film packaging, which can not only isolate water and oxygen, thereby greatly improving the service life of organic electronic devices, but also realizing flexibility. Encapsulation, which retains the foldable and bendable performance of organic electronic devices to the greatest extent. Finally, the invention can realize low-temperature film formation below 120°C, reducing thermal damage to devices and plastic substrates.

The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention.

Claims (6)

1. A packaging method for an organic electronic device, comprising: Before making electronic devices, deposit multi-layer composite films on the back of the substrate material; After the electronic device is fabricated, a multi-layer composite film is deposited on the surface of the organic electronic device. 2. The encapsulation method of organic electronic device as claimed in claim 1, is characterized in that, described multilayer composite film comprises: A stack of several layers of organic layers and inorganic layers alternately; The organic layer is prepared from an organic polymer for increased flexibility, bendability, and anti-breakage; The inorganic layer is prepared from inorganic substances and is used to isolate water and oxygen. 3. The encapsulation method of organic electronic device as claimed in claim 2, is characterized in that, described organic polymer comprises: Parylene, polypropylene, polyacrylate or silicone crosslinked polymer SiO _x C _y H _z . 4. The encapsulation method of organic electronic device as claimed in claim 3, is characterized in that, described inorganic matter comprises: SiN _x , SiO _y , TiO ₂ , Ta ₂ O ₃ or aluminum. 5. The encapsulation method of organic electronic device as claimed in claim 1, is characterized in that: The deposition of multi-layer composite films on the back of the substrate material and the surface of the organic electronic device is to grow the film by plasma-enhanced chemical vapor deposition to ensure low-temperature film formation, minimize thermal damage to the electronic device and the plastic substrate, and at the same time increase the growth rate of the film. Moderate. 6. The encapsulation method of organic electronic device as claimed in claim 5, is characterized in that: The temperature of the low-temperature film-forming is below 120°C.

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