CN110838547A - Vacuum sputtering mixed light-cured resin packaging process for organic electronic device - Google Patents
Vacuum sputtering mixed light-cured resin packaging process for organic electronic device Download PDFInfo
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- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
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- H10K10/88—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
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- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
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- H—ELECTRICITY
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a mixed packaging structure and a process for two ultrathin flexible organic electronic devices, which mainly utilize a preparation process of mixing nano sputtering and organic curing resin, semi-inject a compact nano material with high packaging effect into an organic material resin layer, and then realize photocuring to greatly improve the water oxygen barrier capacity of the organic curing resin in the packaging process, thereby greatly improving the packaging efficiency of UV curing gluing resin, the packaging yield and the reliability while ensuring the packaging curing of the organic devices. The method is suitable for high-performance water-oxygen barrier packaging of various ultrathin and flexible organic electronic devices, and particularly can combine a nano film layer with organic photocuring values to realize efficient packaging of ultrathin organic electronic devices.
Description
The technical field is as follows:
the invention belongs to the technical field of organic electronic device packaging, and particularly relates to a vacuum sputtering mixing photocuring resin packaging process for an organic electronic device.
Background art:
the novel organic electronic device, organic light emitting, organic photoelectric device, organic detector and organic field effect transistor have wide application prospect in the fields of display, solid-state lighting, energy, detector, mobile phone, future wearable, and the like of mobile phones, televisions and the like due to the advantages of being light, thin, efficient, energy-saving, self-luminous and the like. Its excellent photoelectric characteristics will affect the development of next generation display electronic products, and will be the main force of ultra-thin and flexible electronic display.
However, according to long-term research of a large number of organic electronics, water vapor and oxygen molecules in the air have fatal influence on organic electronic devices, and the main reasons are that the water vapor and the oxygen molecules have various material influences and interface reactions on organic and other nano thin film layers, so that photoelectric and electro-optic conversion performances in the devices are damaged, and the service life of the devices is greatly damaged. If the organic photoelectric device can effectively prevent water vapor/oxygen from contacting each organic functional layer, the influence can be greatly reduced, and the service life of the device is greatly prolonged.
With the development and adoption of a plurality of novel packaging coating materials and direct composite packaging structures, the packaging effect and performance of organic electronic devices are gradually improved, and the existing organic electronic display screens with high packaging and long service life are already on the surface. However, the packaging process of the organic electronic device is complex, the cost is high, the water oxygen barrier is yet to be improved, and the like, so that the yield of the organic device is low, the cost is high, the equipment is complicated, particularly, the packaging process is sensitive to water oxygen, and a large space for improving the flexible electronic device with ultrahigh requirements on packaging is still provided, such as packaging of an OLED screen, an organic field effect tube, an organic solar cell and the like. In addition, in the prior art, a high-moisture-barrier multilayer sandwich structure is mostly adopted, and a laminated packaging structure is formed by a compact inorganic nano material layer, an organic polymer, a cured resin and other film layers. Due to the laminated design of the packaging structure, various different materials and nano layers of the packaging structure are very sensitive and fragile, and the problems of damage and poor adhesiveness among the layers and the like are very easily caused by the complex and various processes of the packaging structure, so that the yield is reduced, or the layers of the packaging structure are peeled off, separated and damaged. Therefore, for the production of organic electronic devices, the existing packaging materials and the complex packaging process are extremely difficult to ensure high packaging effect and simultaneously improve and maintain high reliability. The problems of screen film package separation, failure and the like of a plurality of flexible electronic screens put into commercialization are caused by the defects of the packaging structure. In addition, the separate preparation scheme of the multilayer structure inevitably increases the surface treatment process and perfects the communication links of all links. This also increases the cost and risk of product damage.
How to keep the advantages and characteristics of each layer and greatly reduce the damage and adhesion among the layers in the process of realizing the encapsulation of the organic electronic device is the challenge and difficulty of a novel encapsulation layer or technology. Recent developments and developments in corresponding materials and encapsulation layers are improvements and treatments of the nanolayers or photocurable resins, such as the addition of nano-inorganic particles to the curable resin. Certain improvements and advancements have been made, but there is still considerable room for improvement and development. For example, the nano particles are too large to be uniformly dispersed. Compared with the published technology, the mixed packaging design and the process of the mixed sputtering nano layer and the light-cured resin provided by the invention have greatly improved nano particles, compactness and uniformity, and the technical characteristics of the mixed sputtering nano layer and the light-cured resin have the following requirements:
A. the light-cured resin is not easy to volatilize and cure in vacuum.
B. The light-cured resin is still in a fluid state in the growth sputtering of the inorganic thin film.
C. The dense nano layer has a certain speed during molecular growth, and can partially enter the light-cured resin film to form a semi-injection type dense inorganic film on the light-cured resin film.
D. The dense nano layer is an oxide with the molecular diameter less than 1 nanometer, so that water and oxygen molecules can be blocked efficiently.
E. The final mixed layer can still be cured and bonded subsequently under the irradiation of light.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
The invention content is as follows:
the invention aims to provide two packaging process designs and schemes for mixing a compact inorganic nano material and an organic light-cured material into a packaging layer, and solves the problems of low packaging yield, poor durability and poor stability caused by multiple materials and multilayer structures in the conventional packaging structure of an organic electronic device.
In order to realize the aim, the invention provides a vacuum sputtering mixing photocuring resin packaging process for an organic electronic device, which comprises the following steps: coating photo-cured resin/glue on the organic electronic device with the prepared protective layer, semi-injecting nano inorganic material by using a low-temperature sputtering coating technology before curing to form an ultrahigh water oxygen barrier packaging and mixing layer, then covering a packaging substrate on the ultrahigh water oxygen barrier packaging and mixing layer, and then performing illumination curing to finish the final packaging equipment of the flexible organic electronic device.
A vacuum sputtering mixing light-cured resin packaging process for an organic electronic device is carried out according to the following steps: coating photo-curing resin/glue on a packaging substrate, preparing a high-water-oxygen-barrier packaging mixing layer on a substrate film, semi-injecting nano inorganic materials by using a low-temperature sputtering coating technology before curing to form an ultrahigh-water-oxygen-barrier packaging mixing layer, then covering the ultrahigh-water-oxygen-barrier packaging mixing layer on an organic electronic device plated with a protective layer, and performing illumination curing to finish the packaging of the flexible organic electronic device.
The basic principle of the invention is that part of compact nanometer inorganic particles is injected into the middle of organic molecules of organic light-cured resin which is not cured by utilizing the sputtering effect of nanometer ions in the vacuum sputtering technology, and part of the compact nanometer inorganic particles forms a compact packaging barrier layer on the surface, and the mixed packaging protective layer has the barrier property of high water oxygen, and the material interface is compatible and is tightly adhered after being cured. The design of the mixed packaging layer combines the characteristics of high water oxygen barrier property of the compact inorganic nano layer, easy operation and bonding of the light-cured resin, and the like. Meanwhile, the problems of unmatched interfaces and weak firmness caused by respectively preparing two packaging layers are solved. The whole effect of improvement encapsulation that can be very big and the yields of product. The design of the ultra-high hybrid encapsulation layer can be directly applied to the in-situ upper encapsulation process of the organic electronic device, and can also be applied to the preparation of one side of the encapsulation cover plate and the thin film. And then mutually covering, and photocuring to form the integrally bonded packaging device. The patent design provides a new mixed layer preparation and a corresponding packaging process and scheme based on multilayer structure packaging. The packaging protective layer solves the problems of packaging performance, stability and durability caused by multilayer interface problems in the prior art when a multilayer packaging structure is adopted, and improves the yield and the packaging performance.
The invention further defines the technical scheme as follows:
preferably, in the above technical solution, the device and the package substrate are selected from materials which can be inorganic/organic thin layers.
Preferably, in the above technical solution, the organic electronic device is selected from one of an organic light emitting device OLED, a quantum light emitting device GLED, a polymer light emitting device PLED, a small organic molecule, a polymer, a perovskite photoelectric device, a photodetector and a solar cell, and an organic and polymer field effect transistor.
Preferably, in the above technical solution, the material of the light-curable resin/glue is selected from light-curable resin and light-curable polymer.
Preferably, in the above technical solution, the coating process of the photo-curable resin can be completed by liquid coating methods such as spin coating, doctor blade coating, spraying, roll-to-roll, printing, and the like.
Preferably, in the above technical scheme, the half-injection of the nano inorganic material by the low-temperature sputtering coating technology is RF, DC or magnetron sputtering, the temperature is not more than 60 ℃, the coating rate is 1-10 nm/min, and the thickness of the formed coating is 50-300 nm.
Preferably, the technical scheme isThe low temperature sputtering technique is 10-1To 102The preparation is completed in a vacuum environment under the pressure of pascal.
Preferably, in the above technical solution, the nano inorganic material is selected from one of a metal, a metal oxide and an inorganic nano thin film layer.
Preferably, in the above technical solution, the protective layer is selected from an organic inert coating or an inorganic insulating layer or a plurality of composite coatings.
Preferably, in the above technical solution, the light-cured resin layer of the hybrid sputtered nano layer can be irradiated by UV or other wavelength bands at one time to complete curing and bonding.
The invention discloses a hybrid packaging structure and a process for an ultrathin flexible organic electronic device, which are applicable to high-performance water-oxygen barrier packaging of various ultrathin and flexible organic electronic devices, and particularly can combine a nano film layer with an organic photocuring value to realize efficient packaging of the ultrathin organic electronic device. The method is a technical design which is established on a vacuum sputtering nano layer and is combined with the advantages of organic light curing glue or resin, utilizes a preparation process of mixing nano sputtering and organic curing resin, semi-injects a compact nano material with high packaging effect into an organic material resin layer, and then realizes photocuring to greatly improve the water oxygen barrier capability of the organic curing resin in the packaging process, thereby greatly improving the packaging efficiency of UV curing glue resin, the packaging yield and the reliability while ensuring the packaging and curing of organic devices. Due to the high molecular property of the UV curing packaging adhesive, the packaging structure of the UV curing packaging adhesive cannot finish high barrier to water and oxygen molecules. The traditional and existing schemes adopt sandwich laminated structures, and UV curing glue and high-density compact nano layers are mutually laminated to prepare the UV curing glue so as to improve the packaging effect. However, multilayer structures suffer from a number of interface and surface problems, such as: 1. non-uniform coating effect, non-optimal early-formation packaging efficiency, and 2. reduction of yield due to sample transfer in different preparation or packaging processes, defects, contamination, damage and the like in the process. 3 the existing separation process causes the surface to be complex, the adhesion and connection performance between layers is unstable, the layers are easy to separate and crack, and the reliability is poor. For example, the case that the device is damaged due to the fact that the packaging layer falls off, the packaging has defects, stains, damages and the like in the use process is exposed to different degrees in the current commercialized flexible electronic screens. If the device is spun and cured from a material, particularly a UV curable resin, the dense nanolayer is half-injected directly into the UV curable resin and the UV cure is completed. The process of fusing the sputtering/UV curing resin of the invention is necessary to greatly improve the packaging performance of the UV curing resin and the bonding performance in the curing process. The invention uses the mixed packaging process of the light-cured resin and the nano coating as the packaging and curing structure of the upper layer and the lower layer of the organic electronic device, and is combined with the existing preparation process of the organic electronic device. Because the nano sputtering technology is adopted, the nano particles can be effectively injected into the UV curing molecules, and the gaps of the ultra-large molecules in the UV curing resin are greatly reduced and filled. Can finish certain nanometer level water oxygen barrier promotion before UV curing glue, can very big improvement UV curing resin water oxygen barrier property after the solidification. The method is particularly suitable for future automatic, ultrahigh-performance and flexible organic electronic device packaging production. For example, the method can be applied to the ultrahigh packaging requirement of small-area and water-oxygen sensitive organic electronic devices. The invention innovatively provides a novel packaging design and concept, and the nano-layer coating and injection is placed between the coating and curing of the UV curing resin. Although the process is special, the advantages and the characteristics of the two packaging materials and the packaging layer can be integrated, and the packaging performance and the packaging stability can be greatly improved.
Compared with the published technology, the mixed packaging design and the process of the mixed sputtering nano layer and the light-cured resin provided by the invention have greatly improved nano particles, compactness and uniformity, and the technical characteristics of the mixed sputtering nano layer and the light-cured resin have the following requirements:
A. the light-cured resin is not easy to volatilize and cure in vacuum.
B. The light-cured resin is still in a fluid state in the growth sputtering of the inorganic thin film.
C. The dense nano layer has a certain speed during molecular growth, and can partially enter the light-cured resin film to form a semi-injection type dense inorganic film on the light-cured resin film.
D. The dense nano layer is an oxide with the molecular diameter less than 1 nanometer, so that water and oxygen molecules can be blocked efficiently.
E. The final mixed layer can still be cured and bonded subsequently under the irradiation of light.
Description of the drawings:
FIG. 1 is a schematic diagram of a hybrid packaging scheme of vacuum sputtering nano-layer and photo-curing resin (in-situ packaging).
FIG. 2 is a schematic diagram of a hybrid packaging scheme of vacuum sputtering nano-layer and light-cured resin (outer package).
The specific implementation mode is as follows:
the following detailed description of specific embodiments of the invention is provided, but it should be understood that the scope of the invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
The invention discloses a hybrid packaging structure and a process for an ultrathin flexible organic electronic device, which are applicable to high-performance water-oxygen barrier packaging of various ultrathin and flexible organic electronic devices, and particularly can combine a nano film layer with an organic photocuring value to realize efficient packaging of the ultrathin organic electronic device. The method is a technical design which is established on a vacuum sputtering nano layer and is combined with the advantages of organic light curing glue or resin, utilizes a preparation process of mixing nano sputtering and organic curing resin, semi-injects a compact nano material with high packaging effect into an organic material resin layer, and then realizes photocuring to greatly improve the water oxygen barrier capability of the organic curing resin in the packaging process, thereby greatly improving the packaging efficiency of UV curing glue resin, the packaging yield and the reliability while ensuring the packaging and curing of organic devices. Due to the high molecular property of the UV curing packaging adhesive, the packaging structure of the UV curing packaging adhesive cannot finish high barrier to water and oxygen molecules. The traditional and existing schemes adopt sandwich laminated structures, and UV curing glue and high-density compact nano layers are mutually laminated to prepare the UV curing glue so as to improve the packaging effect. However, multilayer structures suffer from a number of interface and surface problems, such as: 1. non-uniform coating effect, non-optimal early-formation packaging efficiency, and 2. reduction of yield due to sample transfer in different preparation or packaging processes, defects, contamination, damage and the like in the process. 3 the existing separation process causes the surface to be complex, the adhesion and connection performance between layers is unstable, the layers are easy to separate and crack, and the reliability is poor. For example, the case that the device is damaged due to the fact that the packaging layer falls off, the packaging has defects, stains, damages and the like in the use process is exposed to different degrees in the current commercialized flexible electronic screens. If the device is spun and cured from a material, particularly a UV curable resin, the dense nanolayer is half-injected directly into the UV curable resin and the UV cure is completed. The process of fusing the sputtering/UV curing resin of the invention is necessary to greatly improve the packaging performance of the UV curing resin and the bonding performance in the curing process. The invention uses the mixed packaging process of the light-cured resin and the nano coating as the packaging and curing structure of the upper layer and the lower layer of the organic electronic device, and is combined with the existing preparation process of the organic electronic device. Because the nano sputtering technology is adopted, the nano particles can be effectively injected into the UV curing molecules, and the gaps of the ultra-large molecules in the UV curing resin are greatly reduced and filled. Can finish certain nanometer level water oxygen barrier promotion before UV curing glue, can very big improvement UV curing resin water oxygen barrier property after the solidification. The method is particularly suitable for future automatic, ultrahigh-performance and flexible organic electronic device packaging production. For example, the method can be applied to the ultrahigh packaging requirement of small-area and water-oxygen sensitive organic electronic devices. The invention innovatively provides a novel packaging design and concept, and the nano-layer coating and injection is placed between the coating and curing of the UV curing resin. Although the process is special, the advantages and the characteristics of the two packaging materials and the packaging layer can be integrated, and the packaging performance and the packaging stability can be greatly improved.
A vacuum sputtering mixing light-cured resin packaging process for an organic electronic device is carried out according to the following steps: coating photo-cured resin/glue on the organic electronic device with the prepared protective layer, semi-injecting nano inorganic material by using a low-temperature sputtering coating technology before curing to form an ultrahigh water oxygen barrier packaging and mixing layer, then covering a packaging substrate on the ultrahigh water oxygen barrier packaging and mixing layer, and then performing illumination curing to finish the final packaging equipment of the flexible organic electronic device.
The second organic electronic device vacuum sputtering mixed light-cured resin packaging process is carried out according to the following steps: coating photo-curing resin/glue on a packaging substrate, preparing a high-water-oxygen-barrier packaging mixing layer on a substrate film, semi-injecting nano inorganic materials by using a low-temperature sputtering coating technology before curing to form an ultrahigh-water-oxygen-barrier packaging mixing layer, then covering the ultrahigh-water-oxygen-barrier packaging mixing layer on an organic electronic device plated with a protective layer, and performing illumination curing to finish the packaging of the flexible organic electronic device.
In the above technical solution, the device substrate and the package substrate are made of hard materials such as metal, quartz, silicon oxide, glass, silicon wafer, and the like, and can also be made of various flexible plastics, polymers, and resin materials with high water oxygen barrier.
In the above technical solution, the organic electronic device and the organic functional layer are selected from one of an organic light emitting device OLED, a quantum light emitting device GLED, a polymer light emitting device PLED, a small organic molecule, a polymer, a perovskite photoelectric device, a photodetector, a solar cell, and an organic and polymer field effect transistor.
In the technical scheme, the materials of the light-cured resin/glue, the resin and the polymer coating are selected from light-cured resin and light-cured polymer, and have high water oxygen barrier performance.
In the above technical scheme, the coating process of the photo-curing resin can be completed by liquid coating methods such as spin coating, blade coating, spraying, roll-to-roll, printing and the like.
In the technical scheme, the low-temperature sputtering coating technology is used for half-injecting the nano inorganic material, the nano inorganic material is RF, DC or magnetron sputtering, the temperature is not more than 60 ℃, the coating speed is 1-10 nm/min, and the thickness of the formed coating is 50-300 nm.
In the technical scheme, the low-temperature sputtering technology is 10-1To 102The preparation is completed in a vacuum environment under the pressure of pascal.
In the above technical scheme, the nano inorganic material is selected from one of metal, metal oxide and inorganic nano film layer.
In the technical scheme, the protective layer is selected from an organic inert coating or an inorganic insulating layer or a plurality of composite coatings.
In the technical scheme, the light-cured resin layer of the mixed sputtering nano layer can be irradiated by UV or other wave bands at one time to finish curing and bonding.
Two sets of preferred process parameters are provided below:
example 1
According to the design and process of the invention, the hybrid packaging structure and the steps of fusing vacuum sputtering and light-cured resin are as follows:
according to the design and the process of the invention, the packaging scheme is very simple and practical, and the following steps are adopted:
in a first step, a flexible substrate to be glazed or high barrier is prepared and the surface may be cleaned. And put into a vacuum drying oven to remove more water vapor and oxygen. And putting the glass or the high-barrier flexible substrate into organic electronic device equipment to finish the preparation of the organic device OLED.
Thirdly, preparing 100nm LiF or Al on the prepared OLED device2O3And (5) a thin film protective layer.
And fourthly, introducing the sample into a nitrogen glove box with the temperature of 20 ℃, and the water and oxygen content of less than 1 ppm. The coating process is applied by spin coating with a layer of UV curable resin, approximately 5-50 microns thick. Or the upper package cover and film are spin and hang coated with a UV curable resin, approximately 5-50 microns thick.
Fifthly, transferring the sample coated with the UV-cured resin into a vacuum sputtering cavity, and extracting the sample to 1.0X10 in vacuum degree-3Pascal or less.
And sixthly, growing a 100nm ITO nano sputtering layer under 100W RF sputtering.
And step seven, conveying the sputtered sample back to a nitrogen glove box. And covering the upper packaging glass and the film.
And step eight, performing UV irradiation curing for 3 minutes to finish the final curing and bonding of the sample.
Example 2
According to the design and process of the invention, the hybrid packaging structure and the steps of fusing vacuum sputtering and light-cured resin are as follows:
according to the design and the process of the invention, the packaging scheme is very simple and practical, and the following steps are adopted:
in a first step, a flexible substrate to be glazed or high barrier is prepared and the surface may be cleaned. And put into a vacuum drying oven to remove more water vapor and oxygen. And putting the glass or the high-barrier flexible substrate into organic electronic device equipment to finish the preparation of the organic device OLED.
Thirdly, preparing 100nm LiF and Al on the prepared OLED device2O3And (5) a thin film protective layer.
And fourthly, simultaneously introducing the upper-layer packaging glass or the film into a nitrogen glove box with the temperature of 20 ℃, water and oxygen of less than 1 ppm. The coating process is applied by spin coating with a layer of UV curable resin, approximately 5-50 microns thick.
Fifthly, transferring the sample coated with the UV-cured resin into a vacuum sputtering cavity, and extracting the sample to 1.0X10 in vacuum degree-3Pascal or less.
And sixthly, growing a 100nm ITO nano sputtering layer under 100W RF sputtering.
And step seven, conveying the sputtered sample back to a nitrogen glove box. Coated on OLED samples with protective film, compacted and UV cured for 3 minutes. Final curing and bonding of the sample was completed.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. A vacuum sputtering mixed light-cured resin packaging process for an organic electronic device is characterized by comprising the following steps: coating photo-cured resin/glue on the organic electronic device with the prepared protective layer, semi-injecting nano inorganic material by using a low-temperature sputtering coating technology before curing to form an ultrahigh water oxygen barrier packaging and mixing layer, then covering a packaging substrate on the ultrahigh water oxygen barrier packaging and mixing layer, and then performing illumination curing to finish the packaging of the flexible organic electronic device.
2. A vacuum sputtering mixed light-cured resin packaging process for an organic electronic device is characterized by comprising the following steps: coating photo-curing resin/glue on a packaging substrate, preparing a high-water-oxygen-barrier packaging mixing layer on a substrate film, semi-injecting nano inorganic materials by using a low-temperature sputtering coating technology before curing to form an ultrahigh-water-oxygen-barrier packaging mixing layer, then covering the ultrahigh-water-oxygen-barrier packaging mixing layer on an organic electronic device plated with a protective layer, and performing illumination curing to finish the packaging of the flexible organic electronic device.
3. The organic electronic device vacuum sputtering hybrid light-cured resin encapsulation process according to claim 1 or 2, characterized in that the device and the encapsulation substrate are selected from inorganic/organic thin layer materials.
4. The organic electronic device vacuum sputtering hybrid photocurable resin encapsulation process according to claim 1 or 2, wherein the organic electronic device layer is selected from one of organic light emitting device OLED, quantum light emitting device GLED, polymer light emitting device PLED, organic small molecule, polymer, perovskite photoelectric device, photodetector and solar cell, and organic, polymer field effect transistor.
5. The organic electronic device vacuum sputtering mixing light-cured resin packaging process according to claim 1 or 2, wherein the light-cured resin/glue is a light-cured resin or a light-cured polymer.
6. The process for encapsulating vacuum sputtering hybrid photocurable resin for organic electronic device as defined in claim 5, wherein the coating process of the photocurable resin can be performed by liquid coating methods such as spin coating, doctor blade coating, spraying, roll-to-roll, printing, etc.
7. The encapsulation process of the organic electronic device vacuum sputtering mixing light-cured resin according to claim 1 or 2, characterized in that the low temperature sputtering coating technique is to half inject nano inorganic material, is RF, DC or magnetron sputtering, the temperature is not more than 60 ℃, the coating rate is 1-100 nm/min, and the thickness of the formed coating is 50-300 nm.
8. The process of claim 7, wherein the low temperature sputtering technique is at 10%-1To 10-4The preparation is completed in a vacuum environment under the pressure of pascal.
9. The organic electronic device vacuum sputtering hybrid photocurable resin encapsulation process according to claim 1 or 2, wherein the nano inorganic material is selected from one of a metal, a metal oxide and an inorganic nano thin film layer.
10. The encapsulation process of vacuum sputtering mixed light-cured resin for organic electronic device as claimed in claim 1 or 2, wherein the light-cured resin layer mixed with the sputtered nano-layer can be cured and bonded by one-time UV or other wave band illumination.
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| CN111477751A (en) * | 2020-05-18 | 2020-07-31 | 中国华能集团有限公司 | Flexible solar cell and preparation method thereof |
| CN114410258A (en) * | 2020-10-28 | 2022-04-29 | 武汉国创科光电装备有限公司 | Packaging adhesive, preparation method thereof and semiconductor photoelectric device |
| CN114447259A (en) * | 2021-07-29 | 2022-05-06 | 四川省维奇新材料股份有限公司 | Nano multilayer water-oxygen barrier film and preparation method and application thereof |
| CN115074089A (en) * | 2022-07-13 | 2022-09-20 | 青岛索迷尔能源科技有限公司 | Preparation method of high-heat-conductivity modular phase-change heat storage unit |
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| CN111477751A (en) * | 2020-05-18 | 2020-07-31 | 中国华能集团有限公司 | Flexible solar cell and preparation method thereof |
| CN114410258A (en) * | 2020-10-28 | 2022-04-29 | 武汉国创科光电装备有限公司 | Packaging adhesive, preparation method thereof and semiconductor photoelectric device |
| CN114447259A (en) * | 2021-07-29 | 2022-05-06 | 四川省维奇新材料股份有限公司 | Nano multilayer water-oxygen barrier film and preparation method and application thereof |
| CN115074089A (en) * | 2022-07-13 | 2022-09-20 | 青岛索迷尔能源科技有限公司 | Preparation method of high-heat-conductivity modular phase-change heat storage unit |
| CN115074089B (en) * | 2022-07-13 | 2023-11-17 | 青岛索迷尔能源科技有限公司 | Preparation method of high-heat-conductivity modularized phase-change heat storage unit |
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