CN105789473A - Flexible substrate and preparation method thereof - Google Patents
Flexible substrate and preparation method thereof Download PDFInfo
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- CN105789473A CN105789473A CN201410809460.9A CN201410809460A CN105789473A CN 105789473 A CN105789473 A CN 105789473A CN 201410809460 A CN201410809460 A CN 201410809460A CN 105789473 A CN105789473 A CN 105789473A
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Abstract
The invention relates to a flexible substrate and a preparation method of the flexible substrate. The flexible substrate comprises a first polymer layer, a first silicon protection layer, an atomic layer deposition film, a second silicon protection layer and a second polymer layer which are successively stacked. According to the flexible substrate and the preparation method, the aluminium oxide atomic layer deposition film is arranged between the two polymer layers, the aluminium oxide atomic layer deposition film has good compactness, therefore, the flexible substrate has good waterproof/oxygenproof permeation performance, arrangement of relatively many blocking layers is unnecessary, and the flexible substrate is low in thickness and high in toughness.
Description
Technical field
The present invention relates to display and make field, particularly relate to a kind of flexible substrate and preparation method thereof.
Background technology
The flexible substrate being applied to flexible organic electroluminescent device conventional at present is mainly polymer substrate, the polymer such as such as PC, PI, PET, PES, owing to its water oxygen permeability of structures shape of polymer substrate self is relatively larger, method generally commonly used in the trade is to plate more barrier layers on PI substrate to stop the immersion of water oxygen.But plane SH wave structural manufacturing process is complicated, all can be there is certain impact in the optically and mechanically performance of display device, and the elasticity of inorganic barrier layer is low, be unfavorable for dispersion mechanical stress, however it remains bigger cracking risk, water oxygen easily penetrates into.
The technical scheme of current a kind of solution is: plus layer of metal paillon foil between the first polymeric layer and the second polymer layer.The defect of the program is: plus layer of metal paillon foil between two layers of polymers, there is the adhesion problem between polymer and tinsel and the surface irregularity produced in the process of cutting tinsel and the phenomenon of metal fragment, main reason is that structure that tinsel itself has and what character determined.
Summary of the invention
Based on this, it is necessary to provide a kind of flexible substrate with excellent toughness and waterproof/oxygen permeability.
A kind of flexible substrate, including the first polymeric layer stacked gradually, the first silicon protective layer, atomic layer deposition film, the second silicon protective layer and the second polymer layer.
Wherein in an embodiment, described first polymeric layer and the second polymer layer are polyimide layer, Polycarbonate Layer, polyethylene terephthalate layer, poly-bitter edible plant naphthalate layer or polyethersulfon layer.
Wherein in an embodiment, the thickness of described atomic layer deposition film is 0.5～1 μm, and the thickness of described first polymeric layer and the second polymer layer is 5～10 μm, and the thickness of described first silicon protective layer and the second silicon protective layer is 0.5～1 μm.
Wherein in an embodiment, described first silicon protective layer and the second silicon protective layer are silicon nitride or silicon dioxide layer.
Wherein in an embodiment, described atomic layer deposition film is alumina atom layer deposition film.
The preparation method also providing for a kind of flexible substrate, comprises the following steps:
The first polymeric layer provided forms the first silicon protective layer；
Atomic layer deposition film is formed the second silicon protective layer；
Second silicon protective layer is formed the second polymer layer；
Wherein in an embodiment, wherein atomic layer deposition film and the second silicon protective layer fit.
Wherein in an embodiment, described first silicon protective layer and the second silicon protective layer adopt chemical vapour deposition technique or plasma enhanced chemical vapor deposition method to be formed.
Wherein in an embodiment, described first silicon protective layer and the second silicon protective layer are silicon nitride or silicon dioxide layer.
Wherein in an embodiment, the described step forming the second polymer layer on the second silicon protective layer includes: be coated on by polymer latex on described second silicon protective layer；Baking, by the solvent evaporated away in polymer latex and form the second polymer layer.
Wherein in an embodiment, the preparation method of described flexible substrate is additionally included on the second polymer layer to arrange the step of cushion.
In above-mentioned flexible substrate and preparation method thereof, alumina atom layer deposition film is set between two layers of polymers layer, alumina atom layer deposition film has good compactness, therefore flexible substrate possesses good waterproof/oxygen permeability, therefore need not arranging more barrier layer, thickness is little, good toughness.
Accompanying drawing explanation
Fig. 1 is the constructed profile of flexible substrate；
Fig. 2 is the flow chart of the preparation method of flexible substrate.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives the preferred embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, the purpose providing these embodiments is to make the understanding to the disclosure more thorough comprehensively.
It should be noted that be referred to as " being fixed on " another element when element, it can directly on another element or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly to another element or may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " time, be absent from intermediary element.Term as used herein " vertical ", " level ", "left", "right" and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technology used herein is identical with the implication that the those skilled in the art belonging to the present invention are generally understood that with scientific terminology.The term used in the description of the invention herein is intended merely to the purpose describing specific embodiment, it is not intended that in the restriction present invention.Term as used herein " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
Refer to Fig. 1; the present invention provides a kind of flexible substrate; including the first polymeric layer 110, the first silicon protective layer 120 being arranged on the first polymeric layer 110, the atomic layer deposition film 130 being arranged on the first silicon protective layer 120, the second silicon protective layer 140 of being arranged on atomic layer deposition film 130, and it is arranged on the second polymer layer 150 on the second silicon protective layer 140.In other words, first polymeric layer the 110, first silicon protective layer 120, atomic layer deposition film the 130, second silicon protective layer 140 and the second polymer layer 150 are cascading.
The material of the first polymeric layer 110 and the second polymer layer 150 can be identical or different, it is possible to for polyimide layer, Polycarbonate Layer, polyethylene terephthalate layer, poly-bitter edible plant naphthalate layer or polyethersulfon layer.The thickness range of the first polymeric layer 110 and the second polymer layer 150 is 5～10 μm.
First silicon protective layer 120 and the second silicon protective layer 140 are silicon nitride or silicon dioxide layer, and their thickness range is 0.5～1 μm.
Flexible substrate is provided with atomic layer deposition film 130 between two layers of polymers layer, and wherein atomic layer deposition film 130 is to adopt ald (ALD:AtomicLayerDeposition) technology to be formed.
ALD technique be by material with monatomic form membrane in layer be plated on substrate, owing to it can be plated on substrate with the form of atomic film, it is ensured that the rete being plated to by ALD technique has high compactness, it is possible to the extraneous steam of isolation and oxygen are through polymeric layer well.So that OLED has high resistance to water and corrosion resistance.
Refer to Fig. 1, in the present invention, be first placed on by the first polymer layer 110 (to adopt PI, polyimides is example) on the glass substrate 210 supported, then precipitation forms the first silicon protective layer 120 (to adopt SiO2For example), then adopt ALD technique by aluminium oxide (Al2O3) be plated on the first silicon protective layer 120 with monatomic form membrane and form alumina atom layer deposition film, the compactness utilizing alumina atom layer deposition film good plays the effect of the extraneous steam of good isolation and oxygen.The thickness range of alumina atom layer deposition film is 0.5～1 μm.Certainly, the atomic layer deposition film of formation is not limited to alumina atom layer deposition film.
In conventional art, in order to make the flexible substrate of polymer possess the ability of the extraneous steam of isolation and oxygen, a kind of scheme is to arrange the barrier layer up to 5-6 layer of organic layer-inorganic layer form on polymeric layer, but the elasticity of the flexible substrate of this scheme acquisition is relatively low.And adopt technical scheme, owing to atomic layer deposition film 130 possesses the ability of the extraneous steam of good isolation and oxygen, therefore the scheme of relatively conventional art, flexible substrate need not arrange the barrier layer of plurality of layers can ensure to completely cut off the ability of extraneous steam and oxygen, therefore the thickness of flexible substrate is reduced, possesses good toughness, it is adaptable to flexible display device.The minimizing of barrier layer, also simplify corresponding technological process, improves the performance of OLED.In Fig. 1, except atomic layer deposition film 130, only the first silicon protective layer 120 and the second silicon protective layer 140 two-layer intercept.
Conventional art needs to arrange the barrier layer of the more number of plies, causes that depositing technology is complex, the optically and mechanically performance of display all can be had a certain impact.Further, the elasticity of the inorganic barrier layer in barrier layer is low, is not easy to dispersion mechanical stress, there is bigger cracking risk, and water oxygen easily penetrates into.The solution of the present invention, adopts ELECTRODE WITH BILAYER POLYMERIC thing as substrate, and centre arranges the atomic layer deposition film that compactness is higher, is prevented effectively from the defect of conventional art, and thickness is less, and toughness increases, and too increases the performance of flexible display device.
The present invention adopts ELECTRODE WITH BILAYER POLYMERIC thing as substrate, and atomic layer deposition film 130 is deposited on centre.So, for the first polymeric layer 110 side, the permeability of water oxygen will be much smaller；For the second polymer layer 150 side, when arranging the cushion 160 prepared by inorganic material further on flexible substrates, it is arrange on the second polymer layer 150, and the second polymer layer 150 itself also has frivolous, firm, pliable and tough characteristic, therefore can plate which floor cushion less, all increase thus for the mechanical performance of device, optical property.The purpose arranging the first silicon protective layer 120 and the second silicon protective layer 140 is to have good cohesive force between itself and atomic layer deposition film 130, the second polymer layer 150.
Fig. 2 discloses the method preparing above-mentioned flexible substrate, comprises the following steps.
S110, provide the first polymeric layer on form the first silicon protective layer.First provide one first polymerization layer by layer, it is possible to be first positioned on the glass substrate of support by the first polymer layer, then utilize chemical vapour deposition (CVD) or plasma enhanced chemical vapor deposition method to precipitate formation the first silicon protective layer on a surface of the first polymeric layer.First silicon protective layer can be silicon nitride or silicon dioxide layer.
S120, on the first silicon protective layer ald form atomic layer deposition film.Utilize ALD technique formation of deposits atomic layer deposition film on the first silicon protective layer, as formation of deposits alumina atom layer deposits film.
S130, on atomic layer deposition film, form the second silicon protective layer.Continue with chemical vapour deposition (CVD) or plasma enhanced chemical vapor deposition method on atomic layer deposition film, precipitate formation the second silicon protective layer.Second silicon protective layer can be silicon nitride or silicon dioxide layer.
S140, on the second silicon protective layer formed the second polymer layer.In this step, first polymer latex is coated on described second silicon protective layer；Then toast, by the solvent evaporated away in polymer latex and form the second polymer layer.
In this step, it is also possible to cushion is set further on the second polymer layer.
Utilizing said method can be worth the flexible substrate with the ability of the extraneous steam of good isolation and oxygen, its depositing technology is simple, and display device injury is little.The thickness of flexible substrate is relatively low, toughness better, is favorably improved the performance of flexible device.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a flexible substrate, it is characterised in that the first polymeric layer of including stacking gradually, the first silicon protective layer, atomic layer deposition film, the second silicon protective layer and the second polymer layer.
2. flexible substrate according to claim 1, it is characterised in that described first polymeric layer and the second polymer layer are polyimide layer, Polycarbonate Layer, polyethylene terephthalate layer, poly-bitter edible plant naphthalate layer or polyethersulfon layer.
3. flexible substrate according to claim 1; it is characterized in that; the thickness of described atomic layer deposition film is 0.5～1 μm, and the thickness of described first polymeric layer and the second polymer layer is 5～10 μm, and the thickness of described first silicon protective layer and the second silicon protective layer is 0.5～1 μm.
4. flexible substrate according to claim 1, it is characterised in that described first silicon protective layer and the second silicon protective layer are silicon nitride or silicon dioxide layer.
5. flexible substrate according to claim 1, it is characterised in that described atomic layer deposition film is alumina atom layer deposition film.
6. the preparation method of a flexible substrate, it is characterised in that comprise the following steps:
The first polymeric layer provided forms the first silicon protective layer；
Ald form atomic layer deposition film on described first silicon protective layer；
Atomic layer deposition film is formed the second silicon protective layer；
Second silicon protective layer is formed the second polymer layer.
7. the preparation method of flexible substrate according to claim 6, it is characterised in that described first silicon protective layer and the second silicon protective layer adopt chemical vapour deposition technique or plasma enhanced chemical vapor deposition method to be formed.
8. the preparation method of flexible substrate according to claim 6, it is characterised in that described first silicon protective layer and the second silicon protective layer are silicon nitride or silicon dioxide layer.
9. the preparation method of flexible substrate according to claim 6, it is characterised in that the described step forming the second polymer layer on the second silicon protective layer includes:
Polymer latex is coated on described second silicon protective layer；
Baking, by the solvent evaporated away in polymer latex and form the second polymer layer.
10. the preparation method of flexible substrate according to claim 6, it is characterised in that the preparation method of described flexible substrate is additionally included on the second polymer layer to arrange the step of cushion.
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Cited By (3)
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| WO2019033578A1 (en) * | 2017-08-18 | 2019-02-21 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate of flexible oled display panel and manufacturing method thereof |
| WO2021036023A1 (en) * | 2019-08-26 | 2021-03-04 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel preparation method and flexible display panel |
| CN113662292A (en) * | 2021-07-06 | 2021-11-19 | 上海海关工业品与原材料检测技术中心 | A washable electroluminescent garment |
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| CN113662292A (en) * | 2021-07-06 | 2021-11-19 | 上海海关工业品与原材料检测技术中心 | A washable electroluminescent garment |
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