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CN101385402A - 电路基板以及电路基板的制造方法 - Google Patents

电路基板以及电路基板的制造方法 Download PDF

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Publication number
CN101385402A
CN101385402A CNA2007800052184A CN200780005218A CN101385402A CN 101385402 A CN101385402 A CN 101385402A CN A2007800052184 A CNA2007800052184 A CN A2007800052184A CN 200780005218 A CN200780005218 A CN 200780005218A CN 101385402 A CN101385402 A CN 101385402A
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CN
China
Prior art keywords
electronic unit
wiring substrate
circuit substrate
projections
chip
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Granted
Application number
CNA2007800052184A
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English (en)
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CN101385402B (zh
Inventor
西川英信
光明寺大道
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN101385402A publication Critical patent/CN101385402A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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Abstract

本发明包括：只对电子部件的多个凸块赋予含导电性粒子的各向异性导电性树脂的步骤；通过各向异性导电性树脂在柔性的配线基板的主面上配置电子部件的步骤；以及将电子部件按压在配线基板上、使赋予于多个凸块的各向异性导电性树脂固化，将多个凸块接合于配线基板的电极的步骤。由此，可以防止电子部件的安装不良。

Description

电路基板以及电路基板的制造方法
技术领域
本发明涉及在柔性配线基板上安装有电子部件后形成的电路基板及电路基板的制造方法。
背景技术
以往以来，作为在配线基板上安装电子部件、制造电路基板的方法之一，提出了在电子部件的电极上设置凸块(bump，凸点)、将凸块和配线基板上的电极接合的方法。例如，提出了下述方法：用冲压(stamping)法等将导电性粘接剂转印于半导体芯片的电连接接点(凸块)上，将半导体芯片按压在电路基板上、同时加热导电性粘接剂并使之固化(例如，参考专利文献1)。
另一方面，近几年，IC卡(Integrated Circuit Card)逐渐普及，成为取代磁卡的卡片型存储媒介物。作为在IC卡用的基板上安装裸芯片的方法，提出了将具有金凸块的裸芯片通过银膏剂、各向异性导电性膜进行倒装安装的方法(例如，参考专利文献2)。并且还提出了将电子部件的突起电极(凸块)的顶端咬入安装于IC卡用的基板的电极，用热塑性树脂密封基板上的电子部件的技术(例如，参考专利文献3)。
但是，根据专利文献1，随着安装的电子部件小型化，凸块间的距离逐渐变短。因此，如果通过像银膏剂这样填充物含有率高的导电性粘接剂安装电子部件，则导电性粘接剂会扩展到凸块间，从而导致可能会出现电极间短路等安装不良的现象。还有，如果安装中采用非导电性树脂膏剂，就只能在一定限度内提高凸块与电极间电连接的可靠性。
专利文献2、3中的IC卡，为了薄型化和降低成本，一般使用PET(聚对苯二甲酸乙二醇酯)制的配线基板。但是，PET制的配线基板可挠(弯曲)性强，在将电子部件安装于配线基板时，按压凸块的区域附近的配线基板会弯曲变形。因此，在电子部件的边缘附近、凸块间的中央附近，电子部件的下面和配线基板的上面会接近。此时，在例如电子部件和配线基板之间的电连接使用了各向异性导电性树脂的情况下，在电子部件和配线基板接近的部位，各向异性导电性树脂中含有的导电性粒子被夹在电子部件与配线基板之间。结果，电子部件与配线基板电连接，从而产生电子部件安装不良等问题。
专利文献1：日本特公平7-50726号公报
专利文献2：日本特开平11-175682号公报
专利文献3：日本特开2005-111928号公报
发明内容
本发明的电路基板的制造方法，包括：a)只对电子部件的多个凸块赋予含导电性粒子的各向异性导电性树脂的步骤；b)通过各向异性导电性树脂在柔性的配线基板的主面上配置电子部件的步骤；c)以及将电子部件按压在配线基板上、使赋予于多个凸块的各向异性导电性树脂固化，将多个凸块接合于配线基板的配线的步骤。
通过这个方法，由于只对多个凸块赋予各向异性导电性树脂，所以能够制作出防止电子部件安装不良的电路基板。
本发明的电路基板，具备：柔性的配线基板，通过多个凸块安装在配线基板的主面上的电子部件，由含导电性粒子的各向异性导电性树脂形成、分别地覆盖多个凸块的第一树脂层，和固定电子部件和配线基板的第二树脂层。
通过这个构成，将电子部件牢固地固定在配线基板上，能够实现连接可靠性强的电路基板。
附图说明
图1是本发明实施形态所涉及的电路基板的构成的俯视图。
图2是表示本发明实施形态所涉及的电路基板的从图1中2-2线位置处切断的一部分的剖视图。
图3是表示本发明实施形态所涉及的电路基板的制造程序的流程图。
图4A是说明本发明实施形态所涉及的电路基板的制造方法的局部剖视图。
图4B是说明本发明实施形态所涉及的电路基板的制造方法的局部剖视图。
图4C是说明本发明实施形态所涉及的电路基板的制造方法的局部剖视图。
图4D是说明本发明实施形态所涉及的电路基板的制造方法的局部剖视图。
符号说明
1 电路基板
2 配线基板
3IC 芯片(电子部件)
4 第一树脂层
4a，40 各向异性导电性树脂
5 第二树脂层
5a 粘接剂
21 上面
22 天线
23，32 电极
31 芯片本体
33 凸块
42 部材
91 芯片保持部
92 按压工具
311 下面
331 突起部
具体实施方式
(实施形态)
图1是表示本发明实施形态所涉及的电路基板1的构成的俯视图。图2是表示从图1的2-2线处切断电路基板1的一部分的剖视图。
如图1和图2所示，电路基板1，例如是IC卡(Integrated Circuit Card)用的入口。电路基板1，具备例如由PET等形成的柔性配线基板2、安装在该配线基板2的一个主面(图2中的上侧主面，以下记为“上面”)21上的例如IC芯片等电子部件(以下记为“IC芯片”)3、以及接收发送信息和电力的天线22。此时，一般情况下，如图2所示，配线基板2在与IC芯片3接合的接合部附近呈弯曲状态地安装。另外，图2的显示强调了这个弯曲。在此，图1和图2所示的IC芯片3，例如是存储产品履历和管理数据等规定信息的存储元件，例如是FeRAM(Ferroelectric Random AccessMemory)混载的LSI(Large Scale Integration)等。
还有，IC芯片3的芯片本体31，俯视观察大略呈矩形，具有多个凸块33，该凸块33设置在芯片本体31的与配线基板2相对的面(以下记为“下面”)311的电极32上。而且，IC芯片3夹着凸块33安装在配线基板2的上面21上。另外，如图2所示，凸块33是在顶端部有突起部331的例如图钉型的球凸块(ball bump)(即所谓钉头(stud)凸块)。
如图1所示，沿配线基板2外周形成线圈状的无限通信用的天线22，通过两个电极23与IC芯片3电连接，读取IC芯片3中存储的信息，所述两个电极23形成于配线基板2的上面21上、是构成天线22的配线的一部分。另外，在电路基板1中，位于图1中左侧的两个凸块33分别与配线基板2上的两个电极23电连接。位于图1中右侧的凸块33，是为了稳定地安装IC芯片3的例如虚设凸块，这种情况下，不与配线基板2电连接。
如图1和图2所示，电路基板1，在比IC芯片3的芯片本体31的边缘更靠内侧处具有分别(单个、个别)地覆盖多个凸块33的多个第一树脂层4。另外，第一树脂层4由例如含有微小导电性粒子的各向异性导电性树脂等形成。
并且，如图1所示，电路基板1，至少在配线基板2的上面21和IC芯片3的下面311之间，具有覆盖多个第一树脂层4并将IC芯片3粘接于配线基板2的第二树脂层5。另外，第二树脂层5由例如为非导电性树脂的粘接剂等形成。在图1中，为了容易理解，没有图示第二树脂层5。
在这里，配线基板2的厚度最好在5μm以上50μm以下，在本实施形态中大约为12.5μm。并且，IC芯片3的厚度例如约为50μm，凸块33的高度约为25μm。另外，如果配线基板2的厚度不到5μm，则会使处理操作困难，如果超过50μm，则难以实现薄型化且具有柔性的电路基板。
以下，通过图3说明本发明实施形态所涉及的回路基板1的制造方法。图3是表示本发明实施形态所涉及的回路基板1的制造程序的流程图，从图4A到图4D是说明电路基板1的制造方法的局部剖视图。另外，从图4A到图4D是在图1的2-2线位置处切断的局部剖视图。
首先，如图4A所示，通过安装装置(没有图示)的芯片保持部91保持IC芯片3，至少让IC芯片3的多个凸块33顶端部的突起部331，与形成于具有规定平滑面的部材42上的层状各向异性导电性树脂40接触。然后，向上抬起IC芯片3，使凸块33离开层状各向异性导电性树脂40。由此，如图4B所示，含有微小导电性粒子的各向异性导电性树脂4a，至少被赋予(转印)于凸块33顶端部的突起部331上(步骤S11)。
接着，如图4B所示，在配线基板2的上面21上，在预定安装IC芯片3的区域(至少是与IC芯片的下面相对的区域)中的、除预定接合凸块33的区域(多个电极23)以外的区域的部分区域，赋予比如非导电性树脂膏剂等粘接剂5a(步骤S12)。然后，让芯片保持部91向配线基板2的上方相对移动，调整IC芯片3相对于配线基板2的位置(步骤S13)。由此，虚设凸块以外的两个凸块33分别与作为配线基板2配线的一部分的两个电极23相对。
然后，如图4C所示，使IC芯片3与芯片保持部91一起下降，隔着赋予在凸块33顶端部的突起部331上的各向异性导电性树脂4a，将IC芯片3配置在配线基板2的上面21上。此时，由于芯片本体31的自重，粘接剂5a在芯片本体31的下面311上向四周展开，并填充在IC芯片3和配线基板2之间(步骤S14)。
接着，如图4D所示，解除芯片保持部91对IC芯片3的保持，通过按压工具92将IC芯片3按压在配线基板2的上面21上。由此，至少IC芯片3的凸块33的突起部331和配线基板2的电极23被压接从而连接。此时，配线基板2由于受到IC芯片3的压力而弯曲，配线基板2的在凸块33附近的部分例如向下侧变形。而且，电路基板2的与凸块33稍隔一段距离的周围部分，例如向上侧变形，接近IC芯片3的下面311。尤其，在IC芯片3的芯片本体31的边缘附近和凸块33间的中央附近(连接相邻两个凸块33的直线的中央附近)，配线基板2和IC芯片3接近。
还有，在配线基板2上，由于IC芯片3的按压，各向异性导电性树脂4a向凸块33的周围展开，并且粘接剂5a也进一步展开。另外，在步骤S11中，赋予于凸块33顶端部的突起部331的各向异性导电性树脂4a的量比较少。因此，被凸块33挤压而展开的各向异性导电性树脂4a不会扩展到IC芯片3的芯片本体31的边缘的外侧，而是停留在芯片本体31与配线基板2之间的凸块33附近。由此，在凸块33和电极23之间，凸块33和电极23通过压接而被连接、并且由于各向异性导电性树脂4a内的导电性粒子被压碎从而被可靠地电连接。
此时，在IC芯片3按压配线基板2的同时，借助设置于按压工具92的加热器(没有图示)，在IC芯片3按压在配线基板2的状态下通过按压工具92加热。于是，赋予于IC芯片3的多个凸块33的各向异性导电性树脂4a由于受热而固化。由此，如图2所示，在IC芯片3的边缘的内侧处形成了分别地覆盖多个凸块33的多个第一树脂层4。
于是，通过IC芯片3的按压以及加热，IC芯片3隔着凸块33与配线基板2的天线22(参照图1)的电极23电连接，并且IC芯片3接合并安装在配线基板2上。此时，粘接剂5a也由于受热而固化，形成密封IC芯片3与配线基板2之间的空间的第二树脂层5，IC芯片3牢固地固定在配线基板2上(步骤S15)。如上所述，将IC芯片3安装在配线基板2上，制作出电路基板1。
然后，通过例如由聚碳酸酯形成的覆盖片等覆盖电路基板1两侧的主面，制作IC卡。另外，此时，IC卡的厚度，例如大约为0.76mm。
如上所述，本实施形态的电路基板1，至少在IC芯片3的凸块33顶端部的突起部331上赋予少量各向异性导电性树脂4a。由此，能够防止在安装IC芯片3时各向异性导电性树脂4a含有的导电性粒子扩散到IC芯片3的芯片本体31的边缘的外侧、凸块33之间的中央附近。即，可以选择性地让导电性粒子只存在于凸块33与配线基板2的接合部以及接合部的附近。而且，在本实施形态的电路基板1中，可以防止导电性粒子到达配线基板2的上面21与IC芯片3的下面311之间的距离小的部位。结果，防止在该部位处配线基板2与芯片本体31导通、以及凸块33之间导通，从而能够防止IC芯片3出现短路等安装不良，实现连接等的可靠性强的电路基板1。
还有，按照本实施形态的电路基板1的制造方法，通过赋予于多个凸块33的各向异性导电性树脂4a，在IC芯片3的边缘的内侧形成分别地覆盖多个凸块33的多个第一树脂层4。由此防止各向异性导电性树脂4a到达IC芯片3的边缘、凸块33之间的中央。结果，可以更可靠防止导电性粒子到达该部位，进一步可靠防止发生IC芯片3的安装不良。因此，本实施形态的电路基板1的制造方法适合于，例如在厚度5μm以上50μm以下的薄且容易弯曲的配线基板2上安装IC芯片3等电子部件。
另外，在本实施形态中，让IC芯片3的凸块33与层状各向异性导电性树脂40接触，能够容易地向凸块33的突起部331赋予各向异性导电性树脂4a，因此可以提高电路基板1的生产率。同时，由于以顶端部有突起部331的钉头凸块形成IC芯片3的凸块33，从而可以通过凸块33顶端部的凹凸可靠且以密封凸块33所需的量地附着并保持各向异性导电性树脂4a。
还有，在本实施形态中，用第二树脂层5将IC芯片3牢固固定在配线基板2上，并且密封芯片本体31与配线基板2之间的空间，从而更加可靠防止IC芯片3的安装不良，能够更进一步提高电路基板1的可靠性。
另外，本实施形态的电路基板，尤其是，在IC芯片3的芯片本体31上，没有必要例如通过形成绝缘性膜等来进行导通防止处理，因此可以防止由此造成的对IC卡通信特性的影响。所以，尤其适用于使用带天线的配线基板的IC标签的入口等的电路基板等。
以上对本发明实施形态进行了说明，但本发明不仅限于上述实施形态，还能够进行如下述所示的各种变更。
即，在上述实施形态中，说明了让IC芯片3的凸块33与层状各向异性导电性树脂40接触，对其顶端部的突起部331赋予各向异性导电性树脂4a的例子，不过不仅限于此。例如，也可以用分配器等按顺序向各凸块33的顶端部赋予各向异性导电性树脂4a。
还有，在上述实施形态中，说明了向配线基板2的除电极23以外的一部分区域赋予粘接剂5a的例子，不过不仅限于此。例如，也可以在配线基板2的上面21上的安装IC芯片3的区域内，以围绕预定接合多个凸块33的多个区域的周围的方式赋予粘接剂5a。此时，最好在形成于周围的全周的粘接剂5a的一部分中，为了排气而设置未赋予粘接剂的部分。
在上述实施形态中，以IC卡的入口为例进行了说明，不过不仅限于此。例如，也可以适用于IC标签等的入口的制造，也可以适用于利用COF(chip on film)法的显示器等的驱动IC的安装。
在上述实施形态中，作为安装在配线基板2上的电子部件3，以存储元件等的IC芯片3为例进行了说明，不过不仅限于此。例如，还可以是像芯片尺寸封装(CSP)那样具有凸块的模塑型(mold type)IC芯片、属于受动元部件的片状部件，安装的电子部件也可以是多个。
在上述实施形态中，以PET材质的配线基板2为例进行了说明，不过不仅限于此。例如，也可以是由PEEK(聚醚醚酮)、聚酰亚胺等形成的柔性基板。
产业利用的可能性
本发明能够利用在作为IC卡和IC标签的入口等使用的电路基板、或其他各种电路基板上。

Claims (10)

1.一种电路基板的制造方法，其特征在于，包括:
a)只对电子部件的多个凸块赋予含导电性粒子的各向异性导电性树脂的步骤；
b)通过所述各向异性导电性树脂在柔性的配线基板的主面上配置所述电子部件的步骤；以及
c)将所述电子部件按压在所述配线基板上、使赋予于所述多个凸块的所述各向异性导电性树脂固化，将所述多个凸块接合于所述配线基板的配线的步骤。
2.如权利要求1所述的电路基板的制造方法，其特征在于，在所述c)步骤中，通过使所述各向异性导电性树脂固化，在所述电子部件的边缘的内侧形成分别地覆盖所述多个凸块的第一树脂层。
3.如权利要求1所述的电路基板的制造方法，其特征在于，所述a)步骤中的所述各向异性导电性树脂的赋予，通过仅使所述电子部件的所述多个凸块与层状各向异性导电性树脂接触来进行。
4.如权利要求1所述的电路基板的制造方法，其特征在于，还包括:
在所述b)步骤前，在所述配线基板上的预定安装所述电子部件的区域中的、除预定接合所述多个凸块的区域以外的一部分区域，赋予非导电性粘接剂的步骤；以及
与所述c)步骤同时地，使所述粘接剂固化从而形成第二树脂层，将所述电子部件固定在所述配线基板上的步骤。
5.如权利要求1所述的电路基板的制造方法，其特征在于，所述多个凸块是在顶端部具有突起部的球凸块。
6.如权利要求1所述的电路基板的制造方法，其特征在于，
所述电子部件是存储规定信息的存储元件；
所述配线基板具有无线通信用的天线，该天线电连接于所述电子部件、用于读取存储于所述电子部件的所述规定信息。
7.如权利要求1所述的电路基板的制造方法，其特征在于，所述配线基板的厚度在5μm以上且50μm以下。
8.一种电路基板，其特征在于，具有:
柔性的配线基板，
通过多个凸块安装在所述配线基板的主面上的电子部件，
由含导电性粒子的各向异性导电性树脂形成、分别地覆盖所述多个凸块的第一树脂层，和
固定所述电子部件和所述配线基板的第二树脂层。
9.如权利要求8所述的电路基板，其特征在于，所述第一树脂层位于所述电子部件的边缘的内侧。
10.如权利要求8所述的电路基板，其特征在于，
所述电子部件是存储规定信息的存储元件；
所述配线基板具有无线通信用的天线，该天线电连接于所述电子部件、用于读取存储于所述电子部件的所述规定信息。
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