[go: up one dir, main page]

US7916484B2 - Heat sink having enhanced heat dissipation capacity - Google Patents

Heat sink having enhanced heat dissipation capacity Download PDF

Info

Publication number
US7916484B2
US7916484B2 US11/939,579 US93957907A US7916484B2 US 7916484 B2 US7916484 B2 US 7916484B2 US 93957907 A US93957907 A US 93957907A US 7916484 B2 US7916484 B2 US 7916484B2
Authority
US
United States
Prior art keywords
metallic
layer
heatsink
heat
heat conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/939,579
Other versions
US20090122490A1 (en
Inventor
Wen-Long Chyn
Te-Ching Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US11/939,579 priority Critical patent/US7916484B2/en
Publication of US20090122490A1 publication Critical patent/US20090122490A1/en
Application granted granted Critical
Publication of US7916484B2 publication Critical patent/US7916484B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Definitions

  • the present invention relates to a heat sink and, more particularly, to a heat sink for an electronic device, such as a CPU (central processing unit), LED (light emitting diode), IC (integrated circuit), rectifier, resistor, capacitor, inductor, and the like.
  • a CPU central processing unit
  • LED light emitting diode
  • IC integrated circuit
  • rectifier rectifier
  • resistor capacitor
  • inductor inductor
  • An electronic device or element such as the CPU (central processing unit), LED (light emitting diode), IC (integrated circuit), rectifier, resistor, capacitor, inductor, and the like, is a heat source and easily produces a high temperature during operation, so that it is necessary to provide a heat sink to carry away the heat produced by the electronic device or element so as to achieve a heat dissipation effect.
  • a conventional heat sink generally comprises a heatsink element, such as a metallic heatsink fin, a heat conductive tube, a chill enabling chip, a heat dissipation board, a cooling fan and the like, so as to achieve a heat dissipation effect.
  • the conventional heat sink cannot dissipate the heat from the heat source exactly and quickly, thereby greatly decreasing the heat dissipation efficiency.
  • the conventional heat sink has a very complicated construction, thereby increasing the costs of fabrication.
  • a heat sink comprising a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer.
  • the primary objective of the present invention is to provide a heat sink having an enhanced heat dissipation capacity to dissipate a heat from a heat source quickly.
  • Another objective of the present invention is to provide a heat sink, wherein the heat produced by the heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.
  • FIG. 1 is a front cross-sectional assembly view of a heat sink in accordance with the preferred embodiment of the present invention.
  • FIG. 2 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 3 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 4 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 5 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 6 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 7 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 8 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 9 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 10 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 11 is a locally enlarged view of the heat sink as shown in FIG. 10 .
  • FIG. 12 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 13 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 14 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 15 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • FIG. 16 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
  • a heat sink in accordance with the preferred embodiment of the present invention comprises a metallic heat conducting layer 1 , a non-metallic heatsink layer 2 combined with the metallic heat conducting layer 1 , and a hollow receiving space 4 defined between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2 .
  • the metallic heat conducting layer 1 is made of a metal having greater heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the non-metallic heatsink layer 2 is made of non-metallic powder having greater heat conductivity, such as Al 2 O 3 , Zr 2 O, AlN, SiN, BN, WC, SiC, C, ReSiC and the like.
  • the non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect.
  • the hollow receiving space 4 is formed by the metallic heat conducting layer 1 .
  • the metallic heat conducting layer 1 has a hollow inside to define the hollow receiving space 4 and has an open end for mounting the non-metallic heatsink layer 2 .
  • the hollow receiving space 4 has an open end sealed by the non-metallic heatsink layer 2 .
  • a heat source (A) When in use, a heat source (A) is mounted on the metallic heat conducting layer 1 .
  • the heat produced by the heat source (A) is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect.
  • the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source (A) is dissipated quickly by provision of the metallic heat conducting layer 1 , the hollow receiving space 4 and the non-metallic heatsink layer 2 .
  • the hollow receiving space 4 is formed by the non-metallic heatsink layer 2 .
  • the non-metallic heatsink layer 2 has a hollow inside to define the hollow receiving space 4 and has an open end for mounting the metallic heat conducting layer 1 .
  • the hollow receiving space 4 has an open end sealed by the metallic heat conducting layer 1 .
  • the heat sink further comprises a packing layer 5 mounted between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2 , wherein the hollow receiving space 4 is formed by the packing layer 5 .
  • the packing layer 5 has a hollow inside to define the hollow receiving space 4 and has an open first end for mounting the metallic heat conducting layer 1 and an open second end for mounting the non-metallic heatsink layer 2 .
  • the hollow receiving space 4 has two open ends sealed by the metallic heat conducting layer 1 and the non-metallic heatsink layer 2 respectively.
  • the non-metallic heatsink layer 2 is made by the steps of: preparing material, rolling press kneading, extruding, elongating and drying.
  • non-metallic powders such as Al 2 O 3 , Zr 2 O, AlN, SiN, BN, WC, SiC, C, ReSiC and the like
  • the non-metallic powders have different diameters ranged between 20 ⁇ m and 200 ⁇ m.
  • a binder such as silicon colloid, aluminum colloid, zirconium colloid, and the like
  • a plasticizer such as starch, lignin, sodium lignosulfonate lignin, calcium lignosulfonate lignin, methyl cellulose and the like
  • metallic powders such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like
  • heat conductivity can be added into the non-metallic powders according to the requirement.
  • the metallic powders and the non-metallic powders are mixed to form composite powders having different diameters ranged between 50 ⁇ m and 500 ⁇ m to enhance the heat dissipation capacity.
  • the binder and the plasticizer are treated by a rolling press kneading process so that the surface of each of the powders has a layer of evenly distributed binder and plasticizer.
  • the powders are treated by a vacuum extruding process so that the powders are extruded to form a blank having a sheet shape.
  • the blank is treated by an elongating process so that the blank has a uniform density.
  • the blank is dried to form the non-metallic heatsink layer 2 .
  • the non-metallic heatsink layer 2 has a high porous structure and contains non-metallic powders having greater heat conductivity, wherein the non-metallic heatsink layer 2 has a porosity ranged between 20% and 80%, and the non-metallic powders have different diameters ranged between 20 ⁇ m and 200 ⁇ m.
  • the step of extruding and the step of elongating are replaced by a step of die press molding (such as stamping molding, uniform pressure molding, vibration press molding and the like).
  • the powders are pressed to form a blank having a predetermined shape, such as a sheet shape or a matrix shape, and the blank is directly formed with the hollow receiving space 4 .
  • the blank is dried to form the non-metallic heatsink layer 2 having a porous structure.
  • the non-metallic heatsink layer 2 has a three-dimensional heat dissipation face 20 which has a predetermined shape and has a matrix arrangement.
  • the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional heat dissipation face 20 to enhance the heat dissipation effect.
  • the heat sink further comprises a three-dimensional dot-matrix heatsink layer 21 mounted on a surface of the non-metallic heatsink layer 2 and arranged in an irregular manner.
  • the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional dot-matrix heatsink layer 21 to enhance the heat dissipation effect.
  • the non-metallic heatsink layer 2 is further made by the steps of: preparing slurry, heating, spraying and sintering.
  • the step of preparing slurry includes preparing materials the same as that of the non-metallic heatsink layer 2 and mixing and stirring the materials to form a slurry.
  • the step of heating the non-metallic heatsink layer 2 (has been sintered) is pre-heated.
  • the step of spraying the slurry is sprayed evenly onto the surface of the non-metallic heatsink layer 2 .
  • the non-metallic heatsink layer 2 and the slurry are sintered, so that the non-metallic heatsink layer 2 and the slurry are combined together.
  • the particles contained in the slurry is attached to the non-metallic heatsink layer 2 so that the surface of the non-metallic heatsink layer 2 is provided with the three-dimensional dot-matrix heatsink layer 21 which has a particle shape.
  • the particles of the three-dimensional dot-matrix heatsink layer 21 have different sizes and are arranged in an irregular manner.
  • the heat sink further comprises a three-dimensional dot-matrix heatsink layer 22 mounted on a surface of the non-metallic heatsink layer 2 and arranged in a regular manner.
  • the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional dot-matrix heatsink layer 22 to enhance the heat dissipation effect.
  • the step of spraying is replaced by a step of printing or stamping.
  • the step of sintering the non-metallic heatsink layer 2 and the slurry are sintered, so that the non-metallic heatsink layer 2 and the slurry are combined together.
  • the particles contained in the slurry is attached to the non-metallic heatsink layer 2 so that the surface of the non-metallic heatsink layer 2 is provided with the three-dimensional dot-matrix heatsink layer 22 .
  • the particles of the three-dimensional dot-matrix heatsink layer 22 have similar sizes and are arranged in a regular manner.
  • the heat sink further comprises a secondary non-metallic heatsink layer 3 mounted in the hollow receiving space 4 and located between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2 .
  • the non-metallic heatsink layer 2 is located at a bottom of the secondary non-metallic heatsink layer 3 .
  • the secondary non-metallic heatsink layer 3 has a three-dimensional heatsink structure and includes a plurality of skeletons 30 each having a greater heat conductivity and each having an inside provided with a conduit 31 .
  • the conduits 31 of the skeletons 30 of the secondary non-metallic heatsink layer 3 are connected to each other to increase the surface area of the secondary non-metallic heatsink layer 3 so as to enhance the heat dissipation effect.
  • the conduits 31 of the skeletons 30 of the secondary non-metallic heatsink layer 3 have a greater heat convection effect so as to enhance the heat dissipation effect.
  • the secondary non-metallic heatsink layer 3 is made by the steps of: preparing slurry, attaching and sintering.
  • the step of preparing slurry includes preparing materials the same as that of the non-metallic heatsink layer 2 and mixing and stirring the materials to form a slurry.
  • the slurry is attached onto a molding carrier evenly.
  • the molding carrier is made of organic material and includes a plurality of skeletons (such as sponges) and a plurality of conduits connected to each other.
  • the molding carrier and the slurry are sintered, so that the molding carrier and the slurry are combined together to form the secondary non-metallic heatsink layer 3 .
  • the heat sink further comprises an insulating layer 6 mounted on a surface of the metallic heat conducting layer 1 , a circuit 61 mounted on the insulating layer 6 , a plurality of LED (light emitting diode) crystals 60 mounted on the insulating layer 6 , a plurality of conducting wires 62 connected between the circuit 61 and the LED crystals 60 , and a reflective layer 63 mounted on the insulating layer 6 and located between the circuit 61 and the LED crystals 60 .
  • the non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect.
  • the heat produced by the LED crystals 60 is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect.
  • the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the LED crystals 60 is dissipated quickly by provision of the metallic heat conducting layer 1 , the hollow receiving space 4 and the non-metallic heatsink layer 2 .
  • the light produced by the LED crystals 60 is reflected by the reflective layer 63 to enhance the heat dissipation efficiency.
  • the heat sink further comprises an LED module 7 mounted on a surface of the metallic heat conducting layer 1 .
  • the LED module 7 includes a substrate 70 mounted on the surface of the metallic heat conducting layer 1 , an insulating layer 71 mounted on the substrate 70 , a circuit 73 mounted on the insulating layer 71 , a plurality of LED crystals 72 mounted on the insulating layer 71 , a plurality of conducting wires 74 connected between the circuit 73 and the LED crystals 72 , and a reflective layer 75 mounted on the insulating layer 71 and located between the circuit 73 and the LED crystals 72 .
  • the non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect.
  • the heat produced by the LED crystals 72 is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect.
  • the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the LED crystals 72 is dissipated quickly by provision of the metallic heat conducting layer 1 , the hollow receiving space 4 and the non-metallic heatsink layer 2 .
  • the light produced by the LED crystals 72 is reflected by the reflective layer 75 to enhance the heat dissipation efficiency.
  • the metallic heat conducting layer 1 has a side provided with a connecting hole 10 connected to the substrate 70 of the LED module 7 to connect the hollow receiving space 4 to the substrate 70 of the LED module 7 to enhance the heat dissipation efficiency.
  • the heat produced by the heat source (A) is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect, while the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source (A) is dissipated quickly by provision of the metallic heat conducting layer 1 , the hollow receiving space 4 and the non-metallic heatsink layer 2 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink and, more particularly, to a heat sink for an electronic device, such as a CPU (central processing unit), LED (light emitting diode), IC (integrated circuit), rectifier, resistor, capacitor, inductor, and the like.
2. Description of the Related Art
An electronic device or element, such as the CPU (central processing unit), LED (light emitting diode), IC (integrated circuit), rectifier, resistor, capacitor, inductor, and the like, is a heat source and easily produces a high temperature during operation, so that it is necessary to provide a heat sink to carry away the heat produced by the electronic device or element so as to achieve a heat dissipation effect. A conventional heat sink generally comprises a heatsink element, such as a metallic heatsink fin, a heat conductive tube, a chill enabling chip, a heat dissipation board, a cooling fan and the like, so as to achieve a heat dissipation effect. However, the conventional heat sink cannot dissipate the heat from the heat source exactly and quickly, thereby greatly decreasing the heat dissipation efficiency. In addition, the conventional heat sink has a very complicated construction, thereby increasing the costs of fabrication.
BRIEF SUMMARY OF THE INVENTION
In accordance with the present invention, there is provided a heat sink, comprising a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer.
The primary objective of the present invention is to provide a heat sink having an enhanced heat dissipation capacity to dissipate a heat from a heat source quickly.
Another objective of the present invention is to provide a heat sink, wherein the heat produced by the heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.
Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
FIG. 1 is a front cross-sectional assembly view of a heat sink in accordance with the preferred embodiment of the present invention.
FIG. 2 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 3 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 4 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 5 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 6 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 7 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 8 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 9 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 10 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 11 is a locally enlarged view of the heat sink as shown in FIG. 10.
FIG. 12 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 13 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 14 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 15 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
FIG. 16 is a front cross-sectional assembly view of a heat sink in accordance with another preferred embodiment of the present invention.
 DETAILED DESCRIPTION OF THE INVENTION
Referring to the drawings and initially to FIG. 1, a heat sink in accordance with the preferred embodiment of the present invention comprises a metallic heat conducting layer 1, a non-metallic heatsink layer 2 combined with the metallic heat conducting layer 1, and a hollow receiving space 4 defined between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2.
The metallic heat conducting layer 1 is made of a metal having greater heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like. The non-metallic heatsink layer 2 is made of non-metallic powder having greater heat conductivity, such as Al2O3, Zr2O, AlN, SiN, BN, WC, SiC, C, ReSiC and the like. The non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect.
As shown in FIG. 1, the hollow receiving space 4 is formed by the metallic heat conducting layer 1. The metallic heat conducting layer 1 has a hollow inside to define the hollow receiving space 4 and has an open end for mounting the non-metallic heatsink layer 2. Thus, the hollow receiving space 4 has an open end sealed by the non-metallic heatsink layer 2.
When in use, a heat source (A) is mounted on the metallic heat conducting layer 1. Thus, the heat produced by the heat source (A) is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect. At the same time, the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source (A) is dissipated quickly by provision of the metallic heat conducting layer 1, the hollow receiving space 4 and the non-metallic heatsink layer 2.
As shown in FIG. 2, the hollow receiving space 4 is formed by the non-metallic heatsink layer 2. The non-metallic heatsink layer 2 has a hollow inside to define the hollow receiving space 4 and has an open end for mounting the metallic heat conducting layer 1. Thus, the hollow receiving space 4 has an open end sealed by the metallic heat conducting layer 1.
Referring to FIG. 3, the heat sink further comprises a packing layer 5 mounted between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2, wherein the hollow receiving space 4 is formed by the packing layer 5. The packing layer 5 has a hollow inside to define the hollow receiving space 4 and has an open first end for mounting the metallic heat conducting layer 1 and an open second end for mounting the non-metallic heatsink layer 2. Thus, the hollow receiving space 4 has two open ends sealed by the metallic heat conducting layer 1 and the non-metallic heatsink layer 2 respectively.
In fabrication, the non-metallic heatsink layer 2 is made by the steps of: preparing material, rolling press kneading, extruding, elongating and drying. In the step of preparing material, non-metallic powders (such as Al2O3, Zr2O, AlN, SiN, BN, WC, SiC, C, ReSiC and the like) having greater heat conductivity are prepared. The non-metallic powders have different diameters ranged between 20 μm and 200 μm. A binder (such as silicon colloid, aluminum colloid, zirconium colloid, and the like) having a determined proportion, and a plasticizer (such as starch, lignin, sodium lignosulfonate lignin, calcium lignosulfonate lignin, methyl cellulose and the like) having a determined proportion are added into the non-metallic powders. In addition, metallic powders (such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like) having greater heat conductivity can be added into the non-metallic powders according to the requirement. Thus, the metallic powders and the non-metallic powders are mixed to form composite powders having different diameters ranged between 50 μm and 500 μm to enhance the heat dissipation capacity. In the step of rolling press kneading, the non-metallic powders (or the composite powders of the non-metallic powders and the metallic powders) having greater heat conductivity, the binder and the plasticizer are treated by a rolling press kneading process so that the surface of each of the powders has a layer of evenly distributed binder and plasticizer. In the step of extruding, the powders are treated by a vacuum extruding process so that the powders are extruded to form a blank having a sheet shape. In the step of elongating, the blank is treated by an elongating process so that the blank has a uniform density. In the step of drying, the blank is dried to form the non-metallic heatsink layer 2. Thus, the non-metallic heatsink layer 2 has a high porous structure and contains non-metallic powders having greater heat conductivity, wherein the non-metallic heatsink layer 2 has a porosity ranged between 20% and 80%, and the non-metallic powders have different diameters ranged between 20 μm and 200 μm.
Alternatively, the step of extruding and the step of elongating are replaced by a step of die press molding (such as stamping molding, uniform pressure molding, vibration press molding and the like). In the step of die press molding, the powders are pressed to form a blank having a predetermined shape, such as a sheet shape or a matrix shape, and the blank is directly formed with the hollow receiving space 4. Then, the blank is dried to form the non-metallic heatsink layer 2 having a porous structure.
As shown in FIGS. 4 and 5, the non-metallic heatsink layer 2 has a three-dimensional heat dissipation face 20 which has a predetermined shape and has a matrix arrangement. Thus, the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional heat dissipation face 20 to enhance the heat dissipation effect.
Referring to FIGS. 6 and 7, the heat sink further comprises a three-dimensional dot-matrix heatsink layer 21 mounted on a surface of the non-metallic heatsink layer 2 and arranged in an irregular manner. Thus, the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional dot-matrix heatsink layer 21 to enhance the heat dissipation effect.
In fabrication, the non-metallic heatsink layer 2 is further made by the steps of: preparing slurry, heating, spraying and sintering. The step of preparing slurry includes preparing materials the same as that of the non-metallic heatsink layer 2 and mixing and stirring the materials to form a slurry. In the step of heating, the non-metallic heatsink layer 2 (has been sintered) is pre-heated. In the step of spraying, the slurry is sprayed evenly onto the surface of the non-metallic heatsink layer 2. In the step of sintering, the non-metallic heatsink layer 2 and the slurry are sintered, so that the non-metallic heatsink layer 2 and the slurry are combined together. Thus, the particles contained in the slurry is attached to the non-metallic heatsink layer 2 so that the surface of the non-metallic heatsink layer 2 is provided with the three-dimensional dot-matrix heatsink layer 21 which has a particle shape. In such a manner, the particles of the three-dimensional dot-matrix heatsink layer 21 have different sizes and are arranged in an irregular manner.
Referring to FIGS. 8 and 9, the heat sink further comprises a three-dimensional dot-matrix heatsink layer 22 mounted on a surface of the non-metallic heatsink layer 2 and arranged in a regular manner. Thus, the non-metallic heatsink layer 2 has a larger surface area by provision of the three-dimensional dot-matrix heatsink layer 22 to enhance the heat dissipation effect.
In fabrication, the step of spraying is replaced by a step of printing or stamping. Then, in the step of sintering, the non-metallic heatsink layer 2 and the slurry are sintered, so that the non-metallic heatsink layer 2 and the slurry are combined together. Thus, the particles contained in the slurry is attached to the non-metallic heatsink layer 2 so that the surface of the non-metallic heatsink layer 2 is provided with the three-dimensional dot-matrix heatsink layer 22. In such a manner, the particles of the three-dimensional dot-matrix heatsink layer 22 have similar sizes and are arranged in a regular manner.
Referring to FIGS. 10 and 11, the heat sink further comprises a secondary non-metallic heatsink layer 3 mounted in the hollow receiving space 4 and located between the metallic heat conducting layer 1 and the non-metallic heatsink layer 2. The non-metallic heatsink layer 2 is located at a bottom of the secondary non-metallic heatsink layer 3. The secondary non-metallic heatsink layer 3 has a three-dimensional heatsink structure and includes a plurality of skeletons 30 each having a greater heat conductivity and each having an inside provided with a conduit 31. The conduits 31 of the skeletons 30 of the secondary non-metallic heatsink layer 3 are connected to each other to increase the surface area of the secondary non-metallic heatsink layer 3 so as to enhance the heat dissipation effect. Thus, when the secondary non-metallic heatsink layer 3 is mounted in the hollow receiving space 4, the conduits 31 of the skeletons 30 of the secondary non-metallic heatsink layer 3 have a greater heat convection effect so as to enhance the heat dissipation effect.
In fabrication, the secondary non-metallic heatsink layer 3 is made by the steps of: preparing slurry, attaching and sintering. The step of preparing slurry includes preparing materials the same as that of the non-metallic heatsink layer 2 and mixing and stirring the materials to form a slurry. In the step of attaching, the slurry is attached onto a molding carrier evenly. The molding carrier is made of organic material and includes a plurality of skeletons (such as sponges) and a plurality of conduits connected to each other. In the step of sintering, the molding carrier and the slurry are sintered, so that the molding carrier and the slurry are combined together to form the secondary non-metallic heatsink layer 3.
Referring to FIGS. 12-14, the heat sink further comprises an insulating layer 6 mounted on a surface of the metallic heat conducting layer 1, a circuit 61 mounted on the insulating layer 6, a plurality of LED (light emitting diode) crystals 60 mounted on the insulating layer 6, a plurality of conducting wires 62 connected between the circuit 61 and the LED crystals 60, and a reflective layer 63 mounted on the insulating layer 6 and located between the circuit 61 and the LED crystals 60. In such a manner, the non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect. Thus, the heat produced by the LED crystals 60 is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect. At the same time, the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the LED crystals 60 is dissipated quickly by provision of the metallic heat conducting layer 1, the hollow receiving space 4 and the non-metallic heatsink layer 2. In addition, the light produced by the LED crystals 60 is reflected by the reflective layer 63 to enhance the heat dissipation efficiency.
Referring to FIG. 15, the heat sink further comprises an LED module 7 mounted on a surface of the metallic heat conducting layer 1. The LED module 7 includes a substrate 70 mounted on the surface of the metallic heat conducting layer 1, an insulating layer 71 mounted on the substrate 70, a circuit 73 mounted on the insulating layer 71, a plurality of LED crystals 72 mounted on the insulating layer 71, a plurality of conducting wires 74 connected between the circuit 73 and the LED crystals 72, and a reflective layer 75 mounted on the insulating layer 71 and located between the circuit 73 and the LED crystals 72. In such a manner, the non-metallic heatsink layer 2 has a porous structure so that the air contained in the hollow receiving space 4 can pass through the non-metallic heatsink layer 2 to produce a heat convection effect. Thus, the heat produced by the LED crystals 72 is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect. At the same time, the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the LED crystals 72 is dissipated quickly by provision of the metallic heat conducting layer 1, the hollow receiving space 4 and the non-metallic heatsink layer 2. In addition, the light produced by the LED crystals 72 is reflected by the reflective layer 75 to enhance the heat dissipation efficiency.
Referring to FIG. 16, the metallic heat conducting layer 1 has a side provided with a connecting hole 10 connected to the substrate 70 of the LED module 7 to connect the hollow receiving space 4 to the substrate 70 of the LED module 7 to enhance the heat dissipation efficiency.
Accordingly, the heat produced by the heat source (A) is conducted quickly and distributed evenly on the metallic heat conducting layer 1 to form an evenly heat conducting effect, while the hollow receiving space 4 has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer 1 to the non-metallic heatsink layer 2 which produces a heatsink effect to dissipate the heat so that the heat produced by the heat source (A) is dissipated quickly by provision of the metallic heat conducting layer 1, the hollow receiving space 4 and the non-metallic heatsink layer 2.
Although the invention has been explained in relation to its preferred embodiment(s) as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the present invention. It is, therefore, contemplated that the appended claim or claims will cover such modifications and variations that fall within the true scope of the invention.

Claims (18)

1. A heat sink, comprising:
a metallic heat conducting layer;
a non-metallic heatsink layer combined with the metallic heat conducting layer;
a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer;
wherein the non-metallic heatsink layer is primarily made of non-metallic material;
the non-metallic heatsink layer has a porous structure connected to the hollow receiving space;
the hollow receiving space is formed by the metallic heat conducting layer;
the metallic heat conducting layer has a hollow inside defining the hollow receiving space and has open end for mounting the non-metallic heatsink layer;
the hollow receiving space has an open end sealed by the non-metallic heatsink layer;
the non-metallic heatsink layer is fully hidden in the hollow receiving space;
the non-metallic heatsink layer is fully hidden in and flush with the open end of the metallic heat conducting layer.
2. The heat sink in accordance with claim 1, wherein
the hollow receiving space is formed by the non-metallic heatsink layer;
the non-metallic heatsink layer has a hollow inside defining the hollow receiving space and has an open end for mounting the metallic heat conducting layer;
the hollow receiving space has an open end sealed by the metallic heat conducting layer;
the hollow receiving space is sealed completely by the metallic heat conducting layer and the non-metallic heatsink layer.
3. A heat sink, comprising:
a metallic heat conducting layer;
a non-metallic heatsink layer combined with the metallic heat conducting layer;
a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer;
wherein the non-metallic heatsink layer is primarily made of non-metallic material;
the non-metallic heatsink layer has a porous structure connected to the hollow receiving space;
the heat sink further comprises a packing layer mounted between the metallic heat conducting layer and the non-metallic heatsink layer;
the metallic heat conducting layer is spaced from the non-metallic heatsink layer by the packing layer;
the hollow receiving space is formed by the packing layer;
the packing layer has a hollow inside defining the hollow receiving space and has an open first end for mounting the metallic heat conducting layer and an open second end for mounting the non-metallic heatsink layer;
the metallic heat conducting layer is fully hidden in and flush with the open first end of the packing layer;
the non-metallic heatsink layer is fully hidden in and flush with the open second end of the packing layer;
the hollow receiving space has two open ends sealed by the metallic heat conducting layer and the non-metallic heatsink layer respectively.
4. The heat sink in accordance with claim 1, wherein
the non-metallic heatsink layer has a high porous structure and contains non-metallic powders having greater heat conductivity;
the non-metallic heatsink layer has a porosity ranged between 20% and 80%;
the non-metallic powders have different diameters ranged between 20 μm and 200 μm.
5. The heat sink in accordance with claim 4, wherein the non-metallic powders are mixed with metallic powders having greater heat conductivity to form composite powders having different diameters ranged between 50 μm and 500 μm.
6. The heat sink in accordance with claim 1, wherein the non-metallic heatsink layer has a three-dimensional heat dissipation face which has a predetermined shape and has a matrix arrangement.
7. The heat sink in accordance with claim 1, further comprising a three-dimensional dot-matrix heatsink layer mounted on a surface of the non-metallic heatsink layer and arranged in an irregular manner.
8. The heat sink in accordance with claim 1, further comprising a three-dimensional dot-matrix heatsink layer mounted on a surface of the non-metallic heatsink layer and arranged in a regular manner.
9. The heat sink in accordance with claim 1, further comprising a secondary non-metallic heatsink layer mounted in the hollow receiving space and located between the metallic heat conducting layer and the non-metallic heatsink layer.
10. The heat sink in accordance with claim 9, wherein
the secondary non-metallic heatsink layer has a three-dimensional heatsink structure and includes a plurality of skeletons each having a greater heat conductivity and each having an inside provided with a conduit;
the conduits of the skeletons of the secondary non-metallic heatsink layer are connected to each other.
11. The heat sink in accordance with claim 9, wherein the non-metallic heatsink layer is located at a bottom of the secondary non-metallic heatsink layer.
12. The heat sink in accordance with claim 1, further comprising
an insulating layer mounted on a surface of the metallic heat conducting layer;
a circuit mounted on the insulating layer;
a plurality of LED (light emitting diode) crystals mounted on the insulating layer;
a plurality of conducting wires connected between the circuit and the LED crystals.
13. The heat sink in accordance with claim 12, further comprising
a reflective layer mounted on the insulating layer and located between the circuit and the LED crystals.
14. The heat sink in accordance with claim 1, further comprising an LED module mounted on a surface of the metallic heat conducting layer, wherein the LED module includes
a substrate mounted on the surface of the metallic heat conducting layer;
an insulating layer mounted on the substrate;
a circuit mounted on the insulating layer;
a plurality of LED crystals mounted on the insulating layer;
a plurality of conducting wires connected between the circuit and the LED crystals.
15. The heat sink in accordance with claim 14, wherein the LED module further includes
a reflective layer mounted on the insulating layer and located between the circuit and the LED crystals.
16. The heat sink in accordance with claim 14, wherein the metallic heat conducting layer has a side provided with a connecting hole connected to the substrate of the LED module to connect the hollow receiving space to the substrate of the LED module.
17. The heat sink in accordance with claim 7, wherein the three-dimensional dot-matrix heatsink layer and the non-metallic heatsink layer are made of the same material.
18. The heat sink in accordance with claim 8, wherein the three-dimensional dot-matrix heatsink layer and the non-metallic heatsink layer are made of the same material.
US11/939,579 2007-11-14 2007-11-14 Heat sink having enhanced heat dissipation capacity Expired - Fee Related US7916484B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/939,579 US7916484B2 (en) 2007-11-14 2007-11-14 Heat sink having enhanced heat dissipation capacity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/939,579 US7916484B2 (en) 2007-11-14 2007-11-14 Heat sink having enhanced heat dissipation capacity

Publications (2)

Publication Number Publication Date
US20090122490A1 US20090122490A1 (en) 2009-05-14
US7916484B2 true US7916484B2 (en) 2011-03-29

Family

ID=40623495

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/939,579 Expired - Fee Related US7916484B2 (en) 2007-11-14 2007-11-14 Heat sink having enhanced heat dissipation capacity

Country Status (1)

Country Link
US (1) US7916484B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100163210A1 (en) * 2007-04-26 2010-07-01 Claus Peter Kluge Cooling box for components or circuits
US20120127666A1 (en) * 2010-11-23 2012-05-24 Samsung Electro-Mechanics Co., Ltd. Heat-Radiating Substrate and Method Of Manufacturing The Same
US20120281167A1 (en) * 2011-05-06 2012-11-08 Funai Electric Co., Ltd. Radiator Plate
CN103533806A (en) * 2012-07-05 2014-01-22 苏州沛德导热材料有限公司 Graphite heat conducting foam
CN103906418A (en) * 2014-04-16 2014-07-02 曾芳勤 Cooling fin and manufacturing method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102980159B (en) * 2012-11-14 2016-05-18 深圳大学 The manufacture method of heat abstractor, heat abstractor and there is the LED light source of this heat abstractor
US9089074B2 (en) 2012-11-16 2015-07-21 International Business Machines Corporation Heat sink structure with radio frequency absorption
CN111102865B (en) * 2020-01-08 2024-05-17 安徽工业大学 Metal-nonmetal composite capillary core applied to loop heat pipe system and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001299A (en) * 1989-04-17 1991-03-19 Explosive Fabricators, Inc. Explosively formed electronic packages
US5402004A (en) * 1990-08-14 1995-03-28 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
US5986885A (en) * 1997-04-08 1999-11-16 Integrated Device Technology, Inc. Semiconductor package with internal heatsink and assembly method
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
US7447029B2 (en) * 2006-03-14 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber for dissipation heat generated by electronic component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001299A (en) * 1989-04-17 1991-03-19 Explosive Fabricators, Inc. Explosively formed electronic packages
US5402004A (en) * 1990-08-14 1995-03-28 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
US5986885A (en) * 1997-04-08 1999-11-16 Integrated Device Technology, Inc. Semiconductor package with internal heatsink and assembly method
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
US7447029B2 (en) * 2006-03-14 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber for dissipation heat generated by electronic component

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100163210A1 (en) * 2007-04-26 2010-07-01 Claus Peter Kluge Cooling box for components or circuits
US8630092B2 (en) * 2007-04-26 2014-01-14 Ceramtec Gmbh Cooling box for components or circuits
US20120127666A1 (en) * 2010-11-23 2012-05-24 Samsung Electro-Mechanics Co., Ltd. Heat-Radiating Substrate and Method Of Manufacturing The Same
US8553417B2 (en) * 2010-11-23 2013-10-08 Samsung Electro-Mechanics Co., Ltd. Heat-radiating substrate and method of manufacturing the same
US20120281167A1 (en) * 2011-05-06 2012-11-08 Funai Electric Co., Ltd. Radiator Plate
CN103533806A (en) * 2012-07-05 2014-01-22 苏州沛德导热材料有限公司 Graphite heat conducting foam
CN103906418A (en) * 2014-04-16 2014-07-02 曾芳勤 Cooling fin and manufacturing method thereof

Also Published As

Publication number Publication date
US20090122490A1 (en) 2009-05-14

Similar Documents

Publication Publication Date Title
US7916484B2 (en) Heat sink having enhanced heat dissipation capacity
EP2071620A1 (en) Heat sink having enhanced heat dissipation capacity
CN101048056B (en) Heat sink and electronic equipment with heat sink
CN101980389B (en) Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof
CN201827857U (en) Heat conducting structure of LED light source
KR20150015900A (en) Led chip-on-board type rigid flexible pcb and rigid flexible heat spreader sheet pad and heat-sink structure using the same
US20170358515A1 (en) Substrate with integrated heat spreader
JPWO2013015073A1 (en) Wiring board and electronic device
TW200532158A (en) Heat-dissipating module
TWI539627B (en) Light-emitting diode lighting device
TW200909736A (en) LED base with heat fins
CN201957336U (en) High heat dissipation circuit carrier board and related light emitting module
CN201100973Y (en) Cooling module
JP2012231061A (en) Electronic component module and manufacturing method of the same
CN201796950U (en) light emitting diode light source structure
US10082256B2 (en) Method of making LED light bulb with thermal radiation filaments
WO2019141155A1 (en) Method of making led light bulb with thermal radiation filaments
US20070131448A1 (en) Circuit board structure with heat radiating layer
JP3139454U (en) Heat dissipation module
CN106463487A (en) Electronics module comprising a device for dissipating heat generated by a semiconductor unit in a plastic housing, and method for the production of an electronics module
CN203167505U (en) Electronic device with cooling function and cooling module thereof
CN209472831U (en) A kind of high heat dissipation FR-4 single-side coated copper plate
CN102569224B (en) High heat dissipation circuit carrier board and related circuit modules
TWI299975B (en)
CN202695550U (en) Ceramic Heat Dissipation Substrate Structure for Light Emitting Diodes

Legal Events

Date Code Title Description
STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20190329