CN201796950U - light emitting diode light source structure - Google Patents

Abstract

The utility model relates to a light emitting diode light source structure, it combines easy processing by emitting diode, easy equipment and low material cost's glass fiber substrate or metal substrate circuit board and the good ceramic substrate circuit board of one or several heat conduction efficiency and form a novel composite circuit board, wherein the ceramic substrate circuit board can satisfy the heat dissipation requirement of high power emitting diode light source, and glass fiber substrate or metal substrate circuit board can improve the processing of ceramic substrate circuit board again, the difficult problem of equipment, the restricted problem of ceramic substrate circuit board size can also be overcome to glass fiber substrate or metal substrate circuit board simultaneously.

Description

light emitting diode light source structure

technical field

The utility model relates to a light emitting diode light source structure.

Background technique

Light-emitting diode (LED) is a light source with high luminous efficiency. Recently, high-power light-emitting diode light sources have been widely used to assemble light-emitting diode lighting with the concept of environmental protection and carbon reduction. However, light-emitting diode lighting must have a good heat dissipation design. When the light-emitting diode is illuminated, the heat energy generated from the high-power light-emitting diode chip must pass through the circuit board to the heat dissipation module, and then conduct the heat energy to the surrounding air through the heat dissipation fins on the heat dissipation module. To take away the heat energy, the performance of each heat transfer interface is very important. Otherwise, the heat energy generated by the LED chip will gradually accumulate because it cannot be effectively dissipated. The accumulated heat energy will cause the temperature of the LED chip to rise rapidly. The service life of light-emitting diodes is reduced, and high temperature is the main cause of the decline in luminous efficiency of light-emitting diodes.

The heat energy generated by the high-power LED chip must be effectively transmitted to the heat dissipation module through the circuit board, and then the heat energy can be transmitted to the air through the heat dissipation fins of the heat dissipation module. The heat energy generated by the LED chip Therefore, a high-power LED light source requires a circuit board with good thermal conductivity.

For a long time, light-emitting diode light sources have used glass fiber copper foil (such as FR4) as their circuit board material. Because glass fiber copper foil is widely used, the technology is mature and cheap, and the heat generated by the light-emitting diode chip is not high. , the problem of poor heat conduction of glass fiber copper foil board is not important; with the improvement of light-emitting diode chip materials, the brightness of new light-emitting diodes has been improved, and its power has been increased. Higher power requires better heat conduction. Diode light source circuit board, so higher power light-emitting diode light sources mostly use metal substrate circuit board (MCPCB), in which the metal substrate circuit board is an electrical insulation material coated with a layer of polymer film on the surface of the metal substrate, polymer film A conductive circuit is formed on the surface. Since the metal substrate is used instead of the glass fiber material, the rigorous metal substrate circuit board can improve the heat dissipation problem of the general high-power LED light source.

As the luminous efficiency of LED materials continues to increase, the brightness of new applications of LED light sources is also required to be further improved, such as being used in lighting purposes, resulting in the need for higher power LED light sources. The development results in high-power LEDs The light source requires a new circuit board thermal design.

The heat dissipation design of the circuit board of the above-mentioned high-power light-emitting diodes, such as using glass fiber copper foil board, because of the poor thermal conductivity of the glass fiber board, it is necessary to form enough through holes on the board and then fill it with heat-conducting glue to reduce the heat generated by the light-emitting diodes. The heat energy is transferred to the back of the circuit board; if a metal substrate circuit board is used, because the heat is blocked on the polymer film layer, it is necessary to improve the heat conduction of the electrical insulating material of the polymer film. The former needs to drill enough through holes in the glass fiber board and fill it with heat-conducting glue. The processing process is cumbersome, and the heat conduction effect is limited; There has been no breakthrough development. Therefore, the problem of poor heat dissipation will occur when the existing circuit board is used for high-power light-emitting diodes.

In the recent development of high-power light-emitting diodes, ceramic substrate circuit boards are used as circuit boards for high-power light-emitting diodes in order to overcome their heat dissipation problems. The heat dissipation effect of ceramic substrate circuit boards is very good, and its thermal conductivity is several times that of existing metals. The substrate circuit board and glass fiber copper foil board can meet the heat dissipation requirements of high-power light-emitting diode light sources; however, the ceramic material of the ceramic substrate circuit board has high hardness and brittle characteristics, and there are problems in processing and assembly, such as drilling , screw locks, etc. Moreover, since the production method of the ceramic substrate involves a high-temperature sintering process of ceramic materials, it is very difficult to obtain a large-area ceramic substrate circuit board.

To develop the application of high-power light-emitting diode light sources, especially in lighting applications, circuit boards with sufficient heat conduction performance must be adopted, and the circuit boards must be easy to process and assemble, otherwise, poor heat dissipation performance will cause high-power light-emitting diodes. The luminous efficiency of the light-emitting diode decreases, and even the service life of the light-emitting diode is reduced, and the manufacturing cost of the high-power light-emitting diode light source cannot be reduced if it is not easy to process or assemble, and it will also limit its application range.

Utility model content

The main purpose of the utility model is to provide a light-emitting diode light source structure with low manufacturing cost and high heat dissipation efficiency, wherein the circuit board of the utility model is combined with a glass fiber substrate or A composite circuit board formed of a metal base circuit board and one or several ceramic base circuit boards with good heat transfer performance.

Another object of the present utility model is to provide a light-emitting diode light source structure that is easy to assemble. Although the light-emitting diodes in the light-emitting diode light source structure are fixed on the ceramic substrate circuit board with high heat dissipation efficiency, the characteristics of the ceramic material make the processing Difficult, not easy to combine with the heat dissipation module, but the integrated glass fiber substrate or metal substrate circuit board is used, so the LED light source structure of the utility model is very easy to assemble on the heat dissipation module.

Another purpose of this utility model is to provide a light-emitting diode light source structure that can be easily assembled into a large-area light source. Although the light-emitting diode is fixed on the ceramic substrate circuit board and has extremely high heat dissipation efficiency, the characteristics of the ceramic material make processing difficult. It is not easy to obtain large-area ceramic-based circuit boards. However, glass fiber-based or metal-based circuit boards are used as large-area structural circuit boards, and smaller-area ceramic-based circuit boards are dispersedly installed on the structural circuit boards. Among them, a large-area light-emitting diode light source can be effectively formed without sacrificing its heat dissipation performance.

The technical solution adopted by the utility model is: a light emitting diode light source structure, which includes: a first circuit board, which is provided with one or several through openings; a second circuit board, which is a ceramic substrate, and the surface of the substrate is There is a circuit formed by conductive metal; and the LED light source is fixed on the second circuit board; wherein, the second circuit board is correspondingly fixed on the through opening of the first circuit board, and the first circuit board and the second circuit board An electrical connection is formed between the two circuit boards.

Wherein the second circuit board can be directly bonded to the copper substrate by the aluminum oxide substrate or directly bonded to the copper substrate by the aluminum nitride substrate.

The beneficial technical effects of the utility model are: the light-emitting diode light source of the utility model is combined with a glass fiber substrate or a metal substrate circuit board which is easy to process, easy to assemble and low material cost and one or several circuit boards with good heat transfer performance. A novel composite circuit board is made of a ceramic substrate circuit board, in which the ceramic substrate circuit board can meet the heat dissipation requirements of high-power light-emitting diode light sources, and the glass fiber substrate or metal substrate circuit board can improve the processing of the ceramic substrate circuit board , Difficulty in assembly, and at the same time, the glass fiber substrate or metal substrate circuit board can also overcome the problem of limited size of the ceramic substrate circuit board.

Description of drawings

Fig. 1 is an exploded three-dimensional schematic diagram of the structure of the light emitting diode light source of the present invention.

Fig. 2 is a schematic cross-sectional view of the light emitting diode light source structure of the utility model.

FIG. 3 is a schematic cross-sectional view of another LED light source structure of the present invention.

FIG. 4 is a schematic cross-sectional view of another LED light source structure of the present invention.

FIG. 5 is a schematic cross-sectional view of another LED light source structure of the present invention.

Fig. 6 is a schematic diagram of the combination of the light emitting diode light source structure and the heat dissipation element of the present invention.

[Description of main component symbols]

1 first circuit board 11 first circuit board circuit 12 through hole

13 Electrical connection components 14 Power supply welding points 15 Screw-lock through holes

2 second circuit board 21 ceramic substrate 22 second circuit board circuit

23 circuit board interface 3 LED light source 31 chips

32 lead frame 33 thermal block 34 package

35 heat conduction material 4 directly package light-emitting diode light source 41 first circuit board

411 First circuit board circuit 413 Electrical connection element 415 Screw-lock through hole

42 Second circuit board 421 Ceramic substrate 422 Second circuit board circuit

43 light-emitting diode light source 431 chip 432 package

5 superimposed structure LED light source 51 first circuit board

511 First circuit board circuit 52 Through hole 53 Second circuit board

54 Second circuit board circuit 55 LED light source 56 Heat conduction material

57 Welding surface 6 LED light source module 61 The first circuit board

611 Electrical connection element 62 Second circuit board 63 Light-emitting diode light source

65 screw lock 64 cooling element 641 cooling fin 642 cooling paste

Detailed ways

The utility model relates to a light emitting diode light source structure, combining high power light emitting diodes with the light emitting diode light source structure on a composite circuit board with easy processing, easy assembly, low material cost and high heat transfer efficiency, which can meet the needs of high power light emitting diode light sources The heat dissipation requirements can also improve the processing and assembly difficulties of the circuit board, and at the same time overcome the problem of the limited size of the circuit board.

Fig. 1 is the disassembled three-dimensional schematic diagram of the light emitting diode light source structure of the present invention, and Fig. 2 shows the cross-sectional schematic diagram of the light emitting diode light source structure, wherein the first circuit board 1 has a first circuit board circuit 11 on the surface of the circuit board, A through 12 is provided to connect the electrical connection element 13 and the power welding point 14 of the first circuit board circuit 11. In addition, one or several screw lock through holes 15 can also be established if necessary. The first circuit board is easy to process, easy to assemble and A circuit board with low material cost, such as a glass fiber copper foil circuit board, a urea copper foil circuit board or a metal substrate circuit board, wherein the first circuit board is a single-sided circuit board or a double-sided circuit board. Wherein the second circuit board 2 is made up of the second circuit board circuit 22 formed by the conductive metal on the ceramic substrate 21 and its surface, wherein the second circuit board 2 is selected from direct bonded copper substrate (DBC), direct copper plated substrate ( DPC) or low temperature co-fired multilayer ceramic substrate (LTCC), etc., and the ceramic substrate 21 can be selected from alumina substrate or aluminum nitride substrate. The second circuit board 2 is embedded in the through opening 12 of the first circuit board 1, and a circuit board interface 23 is formed between the first circuit board and the second circuit board, and an adhesive can be applied to this interface to fix the first circuit Board and the second circuit board to make a heterogeneous composite circuit board, and the second circuit board 2 is arranged in a coplanar manner and embedded in the through hole 12 of the first circuit board 1 to form a coplanar composite circuit board structure. A circuit board circuit 11 and the second circuit board circuit 22 are connected by an electrical connection element 13, and the electrical connection element 13 can be welded between the first circuit board circuit 11 and the second circuit board circuit 22 by using a zero-ohm resistance element, and It has the effect of fixing the first circuit board and the second circuit board, wherein the light emitting diode light source 3 includes a light emitting diode chip 31, a lead frame 32, a heat conduction block 33 and a package 34, and is fixed on the second circuit board 2, and the light emitting diode chip 31 is electrically connected to the second circuit board circuit 22 by the lead frame 32, and a heat conduction material 35 is provided between the heat conduction block 33 and the second circuit board 2, and materials with good heat transfer characteristics such as solder or heat conduction paste can be selected. The generated heat energy is transferred to the second circuit board 2 by the heat conduction block 33 and the heat conduction material 35 , wherein the LED light source can be a single packaged LED light source or a polycrystalline packaged LED light source.

In the light-emitting diode light source structure of the present utility model, the second circuit board is fixedly connected to the through opening corresponding to the first circuit board, and an electrical connection is provided between the first circuit board and the second circuit board. If the first circuit board If several through-holes are provided, several second circuit boards are respectively embedded in the several through-holes to form a composite circuit board, wherein the first circuit board which is easy to process, easy to assemble and has low material cost can obtain a circuit with a larger area. boards, which can be easily processed into different sizes, shapes or processing holes, and can also be securely screwed and fixed on the heat sink, wherein the several second circuit boards can be circuit boards with a smaller area, and do not need to be directly fixed to the heat sink components, but the second circuit board is a circuit board with good heat transfer performance, which can still effectively transfer the heat energy generated by the LED light source to the heat dissipation element.

3 is a schematic cross-sectional view of another light-emitting diode light source structure of the present invention, which is a light-emitting diode light source 4 directly packaged (COB, chip-on-board), wherein the first circuit board 41 is provided with a first circuit board circuit 411 , a through opening (filled by the second circuit board in the figure) and a screw lock through hole 415, wherein the second circuit board 42 is composed of a ceramic substrate 421 and a second circuit board circuit 422, wherein the light emitting diode light source 43 directly encapsulates the light emitting diode , the chip 431 is directly fixed on the second circuit board circuit 422, and is isolated and protected from the outside by the package 432, and then electrically connected to the first circuit board by the electrical connection element 413, wherein the directly packaged light-emitting diode light source can also be used The LED light source with polycrystalline packaging structure, that is, a plurality of chips 431 are fixed on the second circuit board circuit 422 and then packaged into an LED light source.

Fig. 4 is a schematic cross-sectional view of another light-emitting diode light source structure of the present invention, which is a light-emitting diode light source 5 with a superimposed structure, wherein the first circuit board 51 is provided with a first circuit board circuit 511 and a through opening 52, and the second The circuit board 53 is provided with a second circuit board circuit 54, wherein the second circuit board 53 is fixedly connected to the periphery of the through opening 52 of the first circuit board 51 in a superimposed manner, and forms a welding surface 57, the welding surface 57 has both the function of electrically connecting and fixedly connecting the first circuit board 51 and the second circuit board 53, and a superimposed structure relationship is formed between the first circuit board 51 and the second circuit board 53, wherein the LED light source 55 is fixed on the On the second circuit board 53 , the LED light source 55 is exposed through the opening 52 of the first circuit board 51 , and the heat energy generated by the LED is transferred to the second circuit board 53 through the heat conducting material 56 therebetween.

Fig. 5 is a schematic cross-sectional view of another light emitting diode light source structure of the present invention, which is a light emitting diode light source structure composed of several light emitting diode light sources, wherein the first circuit board 61 is provided with several through openings (in the figure by Second circuit board filling), several second circuit boards 62 are respectively embedded in the several through openings to form a composite circuit board, the first circuit board 61 and the second circuit board 62 are formed by electrical connection elements 611 to form a composite circuit board. Several LED light sources 63 are respectively fixed on several second circuit boards 62 . The structure of the light-emitting diode light source discloses that a large-area light-emitting diode light source can be easily produced by using the second circuit board 62 with a small area combined with the first circuit board 61 with a large area, and at the same time overcomes the difficulty in obtaining a large-area ceramic substrate of the second circuit board 62 puzzle.

Fig. 6 is a schematic diagram of the combination of the light emitting diode light source structure and the cooling element of the present invention, which is the light emitting diode light source module 6 combined with the light emitting diode light source structure shown in Fig. 5 and the cooling element 64, wherein the first circuit board 61 utilizes a The lock 65 is fixedly connected to the heat dissipation element 64, and the circuit board and the heat dissipation element 64 are provided with a heat dissipation paste 642. The heat energy generated by the LED light source 63 is transferred to the heat dissipation element 64 through the second circuit board 62 and the heat dissipation paste 642, and then the heat dissipation fins Sheet 641 dissipates thermal energy to the surrounding environment.

Claims (19)

1. A light-emitting diode light source structure, characterized in that it comprises: a first circuit board, the circuit board is provided with one or several through openings; The second circuit board is a ceramic substrate with a circuit formed of conductive metal on the surface of the substrate; and a light emitting diode light source, fixed on the second circuit board; Wherein, the second circuit board is correspondingly fixed to the through opening of the first circuit board, and an electrical connection is formed between the first circuit board and the second circuit board. 2. The LED light source structure according to claim 1, wherein the first circuit board is selected from a glass fiber copper foil board, a urea copper foil board or a metal substrate. 3 . The LED light source structure according to claim 1 , wherein the second circuit board is selected from direct bonding copper substrates, direct copper plating substrates or low temperature co-fired multilayer ceramic substrates. 4 . 4. The LED light source structure as claimed in claim 1, wherein the first circuit board is a glass fiber substrate, and the second circuit board is a direct bonded copper substrate. 5 . The LED light source structure as claimed in claim 1 , wherein the first circuit board is a metal substrate, and the second circuit board is a direct bonded copper substrate. 6. The LED light source structure according to claim 1, wherein the first circuit board is a single-sided circuit board. 7. The LED light source structure as claimed in claim 1, wherein the first circuit board is a double-sided circuit board. 8. The LED light source structure as claimed in claim 1, wherein the ceramic substrate of the second circuit board is selected from an alumina substrate or an aluminum nitride substrate. 9. The LED light source structure as claimed in claim 1, wherein the second circuit board is an aluminum oxide substrate directly bonded to a copper substrate. 10. The LED light source structure according to claim 1, wherein the second circuit board is an aluminum nitride substrate directly bonded to a copper substrate. 11. The LED light source structure as claimed in claim 1, wherein the first circuit board is provided with a plurality of through openings. 12. The LED light source structure as claimed in claim 1, wherein the first circuit board is provided with a plurality of screw holes. 13. The light emitting diode light source structure according to claim 1, wherein the first circuit board is provided with power welding points. 14. The LED light source structure as claimed in claim 1, wherein the second circuit board is arranged in a coplanar manner and embedded in the through opening of the first circuit board. 15. The LED light source structure as claimed in claim 1, wherein the second circuit board is fixedly connected to the periphery of the through opening of the first circuit board in a superimposed manner. 16. The LED light source structure according to claim 1, wherein the LED light source is a single packaged light source. 17. The LED light source structure according to claim 16, wherein the single packaged light source is a polycrystalline packaged LED light source. 18. The light emitting diode light source structure according to claim 1, wherein the light emitting diode light source is a directly packaged light emitting diode light source. 19. The LED light source structure according to claim 18, wherein the directly packaged LED light source is a polycrystalline packaged LED light source.

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