CN209472831U - A kind of high heat dissipation FR-4 single-side coated copper plate - Google Patents
A kind of high heat dissipation FR-4 single-side coated copper plate Download PDFInfo
- Publication number
- CN209472831U CN209472831U CN201822239800.5U CN201822239800U CN209472831U CN 209472831 U CN209472831 U CN 209472831U CN 201822239800 U CN201822239800 U CN 201822239800U CN 209472831 U CN209472831 U CN 209472831U
- Authority
- CN
- China
- Prior art keywords
- substrate
- copper foil
- epoxy resin
- heat dissipation
- radiating block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 title claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of high heat dissipation FR-4 single-side coated copper plate, including the substrate stacked gradually, epoxy resin layer and copper foil, have on the substrate through the substrate and the epoxy resin layer and supports to the thermal column of the copper foil side, the thermal column is fixed with radiating block far from one end of the copper foil, the radiating block is bonded close to the side of the copper foil with the substrate side surfaces, the substrate is vertically fixed several columnar projections close to the side of the epoxy resin layer, the columnar projections are fixed with chuck far from one end of the substrate, there are several through holes in the epoxy resin, the through hole and the substrate-parallel；Compared with prior art, the utility model is designed reasonably has good heat dissipation performance.
Description
Technical field
The utility model relates to copper-clad plate field more particularly to a kind of high heat dissipation FR-4 single-side coated copper plates.
Background technique
With the high speed development of microelectronics integrated technology, wiring board Highgrade integration becomes inexorable trend, on wiring board
Electronic component, logic circuit volume greatly reduce, but due to the increase of the density of electronic component and logic circuit with
And its increase of frequency of use, cause component working environment to high temperature direction change, if it is desired that when electronic component can be long
Between keep stable work, it is necessary to improve the heat-sinking capability of copper-clad plate.
Utility model content
The utility model is to solve existing technological deficiency, provides a kind of high heat dissipation FR-4 single-side coated copper plate, is designed
Rationally, there is good heat dissipation performance.Its specific technical solution is as follows:
The utility model discloses a kind of high heat dissipation FR-4 single-side coated copper plate, including substrate, the epoxy resin layer stacked gradually
And copper foil, have on the substrate through the substrate and the epoxy resin layer and support to the thermal column of the copper foil side,
The thermal column is fixed with radiating block, side and the base of the radiating block close to the copper foil far from one end of the copper foil
Plate fitting, the substrate are vertically fixed several columnar projections close to the side of the epoxy resin layer, and the columnar projections are remote
One end from the substrate is fixed with chuck, has several through holes, the through hole and the substrate in the epoxy resin
In parallel.
Further, the substrate is equipped with several cooling fins far from the side of the copper foil.
Further, the end face of end face of the cooling fin far from the substrate and the radiating block far from the copper foil is flat
Together.
Further, rectangle is in the through hole cross section and rectangular long side is perpendicular to the substrate.
Further, the thermal column and the radiating block be made of ceramic and the thermal column described in radiating block be one
Body structure.
The utility model has the beneficial effects that the heat generated in copper foil can be rapidly transferred to by the setting of its thermal column
On substrate and radiating block, while the setting of through hole increases the surface area of epoxy resin layer on epoxy resin layer, further plus
The transmitting of heat outwardly in fast copper-clad plate；The setting of columnar projections and chuck strengthens between epoxy resin layer and substrate
Peel strength, and then strengthen the structural strength of copper-clad plate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment.
It is marked in figure: substrate 100, thermal column 110, radiating block 120, columnar projections 130, chuck 140, cooling fin 150, ring
Oxygen resin layer 200, through hole 210, copper foil 300.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
The utility model is described in further detail below by specific embodiment combination attached drawing.Please refer to attached drawing.
The utility model discloses a kind of high heat dissipation FR-4 single-side coated copper plate, including substrate 100, the epoxy resin stacked gradually
Layer 200 and copper foil 300 has through the substrate 100 and the epoxy resin layer 200 and supports to described on the substrate 100
The thermal column 110 of 300 side of copper foil, the thermal column 110 is fixed with radiating block 120 far from one end of the copper foil 300, described
Radiating block 120 is bonded close to the side of the copper foil 300 with the substrate 100, and the substrate 100 is close to the epoxy resin layer
200 side is vertically fixed several columnar projections 130, and the columnar projections 130 are fixed with far from one end of the substrate 100
Chuck 140, the epoxy resin is interior to have several through holes 210, and the through hole 210 is parallel with the substrate 100.
Specifically, the substrate 100 is aluminum substrate, and the columnar projections 130 are structure as a whole with the chuck 140, institute
Columnar projections 130 are stated by being fixedly welded on the substrate 100, aluminum substrate has good thermally conductive, heat dissipation performance, more specifically
Ground, the columnar projections 130 be it is cylindric, the chuck 140 be disk.
The heat generated in the copper foil 300 can be rapidly transferred to the substrate by the setting of the thermal column 110
100 and the radiating block 120 on, while the setting of the through hole 210 increases the epoxy on the epoxy resin layer 200
The surface area of resin layer 200 has further speeded up the transmitting of heat outwardly in the copper-clad plate；The columnar projections 130 and
The setting of the chuck 140 strengthens the peel strength between the epoxy resin layer 200 and the substrate 100, Jin Erjia
The strong structural strength of copper-clad plate.
Further, the substrate 100 is equipped with several cooling fins 150 far from the side of the copper foil 300；Specifically, institute
Stating cooling fin 150 is aluminium flake, increases the surface area of the substrate 100, is conducive to distributing for heat in copper-clad plate.
Further, end face of the cooling fin 150 far from the substrate 100 and the radiating block 120 are far from the copper
The end face of foil 300 is concordant；Reasonable in design, convenient for the installation of copper-clad plate, specifically, several cooling fins 150 are distributed in
100 side of substrate.
Further, rectangle is in 210 cross section of through hole and rectangular long side is perpendicular to the substrate 100；
While strengthening 200 heat dissipation performance of epoxy resin layer, it ensure that the structure of the epoxy resin in the vertical direction is strong
Degree.
Further, the thermal column 110 and the radiating block 120 be made of ceramic and the thermal column 110 described in dissipate
Heat block 120 is structure as a whole；Ceramic material has very excellent thermal conductivity and heat-radiating properties, can significantly improve copper-clad plate
Heat-sinking capability, while ceramic material also has extraordinary high-temperature stability and dimensional stability, can effectively improve copper-clad plate
Stability.
When the utility model is processed, perforation is first processed on the substrate 100, and the columnar projections 130 are fixed
In 100 side of substrate；The thermal column 110 is passed through later and perforates and makes the radiating block 120 close to the copper foil
300 side is bonded with the substrate 100, is laid with epoxy resin in the side of the substrate 100, the copper foil 300 is covered
On the epoxy resin, it is bonded the thermal column 110 with the copper foil 300, and carry out processing and forming by press equipment.
The above content is combine specific embodiment further detailed description of the utility model, and it cannot be said that
The specific implementation of the utility model is only limited to these instructions.For the utility model person of an ordinary skill in the technical field
For, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made.
Claims (5)
1. a kind of high heat dissipation FR-4 single-side coated copper plate, which is characterized in that including substrate (100), the epoxy resin layer stacked gradually
(200) and copper foil (300), have through the substrate (100) and the epoxy resin layer (200) simultaneously on the substrate (100)
To the thermal column (110) to the copper foil (300) side, the thermal column (110) is fixed far from the one end of the copper foil (300)
Have radiating block (120), the radiating block (120) is bonded close to the side of the copper foil (300) with the substrate (100), described
Substrate (100) is vertically fixed several columnar projections (130) close to the side of the epoxy resin layer (200), and the column is convex
It plays (130) to be fixed with chuck (140) far from the one end of the substrate (100), there are several through holes in the epoxy resin
(210), the through hole (210) is parallel with the substrate (100).
2. a kind of high heat dissipation FR-4 single-side coated copper plate as described in claim 1, which is characterized in that the substrate (100) is separate
The side of the copper foil (300) is equipped with several cooling fins (150).
3. a kind of high heat dissipation FR-4 single-side coated copper plate as claimed in claim 2, which is characterized in that the cooling fin (150) is remote
End face from the substrate (100) is concordant far from the end face of the copper foil (300) with the radiating block (120).
4. a kind of high heat dissipation FR-4 single-side coated copper plate as described in claim 1, which is characterized in that the through hole (210) is horizontal
Rectangle is in section and rectangular long side is perpendicular to the substrate (100).
5. a kind of high heat dissipation FR-4 single-side coated copper plate as described in claim 1, which is characterized in that the thermal column (110) and
The radiating block (120) is made of ceramic and the thermal column (110) radiating block (120) is structure as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822239800.5U CN209472831U (en) | 2018-12-28 | 2018-12-28 | A kind of high heat dissipation FR-4 single-side coated copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822239800.5U CN209472831U (en) | 2018-12-28 | 2018-12-28 | A kind of high heat dissipation FR-4 single-side coated copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209472831U true CN209472831U (en) | 2019-10-08 |
Family
ID=68090173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822239800.5U Expired - Fee Related CN209472831U (en) | 2018-12-28 | 2018-12-28 | A kind of high heat dissipation FR-4 single-side coated copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209472831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099604A (en) * | 2021-05-07 | 2021-07-09 | 高德（无锡）电子有限公司 | Interconnected printed circuit board capable of being used for product with ultrahigh heat dissipation requirement and manufacturing method |
-
2018
- 2018-12-28 CN CN201822239800.5U patent/CN209472831U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099604A (en) * | 2021-05-07 | 2021-07-09 | 高德（无锡）电子有限公司 | Interconnected printed circuit board capable of being used for product with ultrahigh heat dissipation requirement and manufacturing method |
| CN113099604B (en) * | 2021-05-07 | 2024-04-23 | 高德(江苏)电子科技股份有限公司 | Interconnection printed circuit board for ultrahigh heat dissipation requirement product and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191008 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |