CN201479462U - Cooling plate printing plate - Google Patents
Cooling plate printing plate Download PDFInfo
- Publication number
- CN201479462U CN201479462U CN2009203030145U CN200920303014U CN201479462U CN 201479462 U CN201479462 U CN 201479462U CN 2009203030145 U CN2009203030145 U CN 2009203030145U CN 200920303014 U CN200920303014 U CN 200920303014U CN 201479462 U CN201479462 U CN 201479462U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- plate
- window
- circuit board
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a cooling plate printing plate, which comprises a printing circuit board (2), wherein a heat dissipation layer (3) adheres with the printing circuit board (2) through an adhesive layer (4) of insulator materials, the heat dissipation layer (3) is provided with a window (5), the inner wall of a via hole of the window (5) is provided with an insulator, the heat dissipation layer (3) is an aluminum plate, the heat which is produced by an electronic component can be directly sent out through the adhesive heat dissipation layer, and the cooling plate printing plate has strong heat dissipation ability, does not occupy extra space, does not deform, and has high stability.
Description
Technical field
The utility model relates to art of printed circuit boards, the cold drawing printed board that especially a kind of heat-sinking capability is strong.
Background technology
Heating problem is the common issue with of electronic equipment, and previous solution is to adopt cooled hardware or the heat radiation of ceramic functional block.The former itself needs big quantity space, and not good (thermal coefficient of expansion of pottery is little a lot of than pcb substrate) that the latter is more mated owing to heat, the solder joint place easily forms crackle or comes off in the temperature change circulation of repeated multiple times, makes the complete machine inefficacy.At present, useful fan of heat dissipating method or radiator that electronic equipment is commonly used, or body structure etc.Yet, in most cases can not adopt above-mentioned heat dissipating method because the product in fields such as Aero-Space is subjected to the spatial limitation of miniature portable terminal.The heat dissipation problem of printed circuit board (PCB) is not effectively solved.
The utility model content
The purpose of this utility model provide a kind of heat-sinking capability by force, additionally do not take up room, indeformable, the high cold drawing printed board of stability.
Cold drawing printed board of the present utility model is achieved by following technical proposals:
The cold drawing printed board comprises printed circuit board (PCB), and heat dissipating layer is bonding by the adhesive layer and the described printed circuit board (PCB) of insulating material, has window on the heat dissipating layer, and the through-hole wall of this window is an insulator.Described heat dissipating layer can be aluminium sheet.
Electronic component is attached to the surface of heat dissipating layer, and the connecting line of electronic component is received on the circuit node of printed circuit board (PCB) by the insulated vias of window.The heat that electronic component produced directly distributes by its accompanying heat dissipating layer.
Cold drawing printed board of the present utility model compared with prior art has following good effect:
Heat-sinking capability by force, additionally do not take up room, indeformable, stability is high.
Description of drawings
The utility model will illustrate by example and with reference to the mode of accompanying drawing, wherein:
Fig. 1 is the structure chart of cold drawing printed board.
Embodiment
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing) is unless special narration all can be replaced by other equivalences or the alternative features with similar purpose.That is, unless special narration, each feature is an example in a series of equivalences or the similar characteristics.
Cold drawing printed board as shown in Figure 1, comprise printed circuit board (PCB) 2, heat dissipating layer 3 is an aluminium sheet, heat dissipating layer 3 is bonding by the adhesive layer 4 and the described printed circuit board (PCB) 2 of insulating material, have window 5 on the heat dissipating layer 3, the through-hole wall of this window 5 is an insulator, and the connecting line of electronic component 1 can not contact with the aluminum material of heat dissipating layer 3.
Electronic component 1 is attached to the surface of heat dissipating layer 3, and the connecting line of electronic component 1 is received on the circuit node of printed circuit board (PCB) 2 by the insulated vias of window 5.The heat that electronic component produced directly distributes by its accompanying heat dissipating layer.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (2)
1. cold drawing printed board, comprise printed circuit board (PCB) (2), it is characterized in that: heat dissipating layer (3) is bonding with described printed circuit board (PCB) (2) by the adhesive layer (4) of insulating material, has window (5) on the heat dissipating layer (3), and the through-hole wall of this window (5) is an insulator.
2. cold drawing printed board according to claim 1 is characterized in that: described heat dissipating layer (3) is an aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203030145U CN201479462U (en) | 2009-05-11 | 2009-05-11 | Cooling plate printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203030145U CN201479462U (en) | 2009-05-11 | 2009-05-11 | Cooling plate printing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201479462U true CN201479462U (en) | 2010-05-19 |
Family
ID=42415717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203030145U Expired - Lifetime CN201479462U (en) | 2009-05-11 | 2009-05-11 | Cooling plate printing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201479462U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN105704905A (en) * | 2014-11-26 | 2016-06-22 | 联想(北京)有限公司 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
-
2009
- 2009-05-11 CN CN2009203030145U patent/CN201479462U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN105704905A (en) * | 2014-11-26 | 2016-06-22 | 联想(北京)有限公司 | Printed circuit board, electronic equipment and method for manufacturing printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100519 |
|
| CX01 | Expiry of patent term |