CN201957336U - High heat dissipation circuit carrier board and related light emitting module - Google Patents
High heat dissipation circuit carrier board and related light emitting module Download PDFInfo
- Publication number
- CN201957336U CN201957336U CN2010206577626U CN201020657762U CN201957336U CN 201957336 U CN201957336 U CN 201957336U CN 2010206577626 U CN2010206577626 U CN 2010206577626U CN 201020657762 U CN201020657762 U CN 201020657762U CN 201957336 U CN201957336 U CN 201957336U
- Authority
- CN
- China
- Prior art keywords
- graphite
- layer
- graphite substrate
- insulating layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 185
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 173
- 239000010439 graphite Substances 0.000 claims abstract description 173
- 239000000758 substrate Substances 0.000 claims abstract description 123
- 229910021382 natural graphite Inorganic materials 0.000 claims abstract description 5
- 229910021383 artificial graphite Inorganic materials 0.000 claims abstract 4
- 238000009760 electrical discharge machining Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000002077 nanosphere Substances 0.000 claims 1
- 230000004888 barrier function Effects 0.000 description 34
- 230000000694 effects Effects 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 238000009413 insulation Methods 0.000 description 8
- 241000446313 Lamella Species 0.000 description 4
- 241000209094 Oryza Species 0.000 description 4
- 235000007164 Oryza sativa Nutrition 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 235000009566 rice Nutrition 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002088 nanocapsule Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
One of the circuit carrier boards proposed in the present application comprises: a graphite substrate having a thickness of 1 mm to 20 mm, the graphite substrate being selected from the group consisting of natural graphite, foamed graphite, artificial graphite, pyrolytic graphite, extruded graphite, cold isostatic graphite, and graphite for electrical discharge machining; an insulating layer covering only a local area of a first surface of the graphite substrate; a heat conducting layer, which is positioned on the first surface, is in direct contact with the graphite substrate and is not covered by the insulating layer; and a circuit layer located above the insulating layer; wherein one or more electronic components can be disposed on the heat conductive layer, and the circuit layer can be electrically connected to the one or more electronic components through wires.
Description
Technical field
The utility model is the structure of relevant circuit support plate, refers to the circuit carrying board structure and the relevant illuminating module of the high heat dissipation characteristics of a kind of tool especially.
Background technology
For many circuit module, the problem of heat radiation is one of principal element that influences circuit design and usefulness for a long time always.Generally speaking, the usefulness of circuit element is stronger, and the total amount of heat that is produced is just higher.Do not have good heat dissipation design, can cause the temperature of circuit element too high, reduce the stability of integrated circuit running and the life-span of shortening circuit element.
In traditional circuit module design, normally adopt metals such as aluminium, copper as the circuit support plate, to serve as the media of circuit element heat radiation.Yet, in some applications,, can't provide enough heat sinking functions with the circuit support plate of metal mades such as aluminium, copper.In addition, with the cost of metal, along with former material price rises steadily and raising day by day as the circuit support plate.In addition, the suitable consumption of processed process of metal, and the emission of processing procedure generation also causes the doubt in the environmental protection easily.
Summary of the invention
In view of this, making the circuit support plate of tool good heat radiating characteristic as other material how, and alleviate the pollution to environment, is that industry has problem to be solved in fact.
This specification provides a kind of embodiment of circuit support plate, it includes: a graphite substrate, thickness is between 1 millimeter (millimeter) is to 20 millimeters, and the material of this graphite substrate is to be selected from the group that is made up of with graphite native graphite, expandable graphite, Delanium, pyrolytic graphite, extruded anisotropic graphite, isostatic cool pressing graphite and spark machined; One insulating barrier only covers the regional area of a first surface of this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier; And a circuit layer, be positioned at this insulating barrier top; Wherein can supply on this heat-conducting layer one or more electronic component is set, and this circuit layer can see through lead and this one or more electronic component electrically connects.
This specification provides a kind of embodiment of circuit support plate in addition, and it includes: a graphite substrate; One insulating barrier only covers the regional area of a first surface of this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier, can be for one or more electronic component is set on this heat-conducting layer; And a circuit layer, be positioned at this insulating barrier top, and this circuit layer can see through one or more electronic component electric connection of lead and this; Wherein this graphite substrate includes one or more radiating area with a three-dimensional shape, is positioned on this first surface of this graphite substrate, and is not coated by this insulating barrier or this heat-conducting layer.
This specification provides a kind of embodiment of circuit support plate in addition, and it includes: a graphite substrate; One insulating barrier only covers the regional area of a first surface of this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier, can be for one or more electronic component is set on this heat-conducting layer; One circuit layer is positioned at this insulating barrier top, and this circuit layer can see through lead and this one or more electronic component electrically connects; And one or more radiating area, be positioned on this first surface of this graphite substrate, and do not coated by this insulating barrier or this heat-conducting layer; Wherein be coated with the monocarbide layer on this one or more radiating area.
This specification provides a kind of embodiment of circuit support plate in addition, and it includes: a graphite substrate; One insulating barrier only covers the regional area of a first surface of this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier, can be for one or more electronic component is set on this heat-conducting layer; And a circuit layer, be positioned at this insulating barrier top, and this circuit layer can see through one or more electronic component electric connection of lead and this; Wherein this graphite substrate includes a second surface in addition, in order to be connected with a heat abstractor or a bogey.
This specification provides a kind of embodiment of circuit support plate in addition, and it includes: a graphite substrate; One insulating barrier only covers the regional area of a first surface of this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier, can be for one or more electronic component is set on this heat-conducting layer; And a circuit layer, be positioned at this insulating barrier top, and this circuit layer can see through one or more electronic component electric connection of lead and this; Wherein this graphite substrate includes a second surface in addition, and is relative with this first surface, and has a three-dimensional shape.
This specification provides a kind of embodiment of circuit support plate in addition, and it includes: a graphite substrate; One insulating barrier only covers the regional area of a first surface of this graphite substrate, and directly contacts with this graphite substrate; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier; And a circuit layer, be positioned at this insulating barrier top; Wherein can supply on this heat-conducting layer one or more electronic component is set, and this circuit layer can see through lead and this one or more electronic component electrically connects.
This specification provides a kind of embodiment of illuminating module in addition, it includes: a graphite substrate, thickness is greater than 1 millimeter (millimeter), and the material of this graphite substrate is to be selected from the group that is made up of with graphite native graphite, expandable graphite, Delanium, pyrolytic graphite, extruded anisotropic graphite, isostatic cool pressing graphite and spark machined; One insulating barrier only covers the regional area of a first surface of this graphite substrate, and directly contacts with this graphite substrate; One circuit layer is positioned at this insulating barrier top; One heat-conducting layer, be positioned on this first surface, directly contact with this graphite substrate, and do not coated by this insulating barrier, the thickness of this heat-conducting layer is greater than 10 microns (micrometer), and the material of this heat-conducting layer is to be selected from the group that is made up of aluminium (Al), silver (Ag), chromium (Cr), gold (Au), palladium (Pd), nickel (Ni), barium sulfate (BaSO4), carborundum (SiliconCarbide), aluminium nitride (AlN) and aluminium oxide (Al2O3); One or more LED crystal grain is arranged on this heat-conducting layer; And plural wires, in order to electrically connect this circuit layer and this one or more LED crystal grain; Wherein include not one or more radiating area that is covered by this insulating barrier or this heat-conducting layer on this first surface of this graphite substrate.
This specification provides a kind of embodiment of illuminating module in addition, it includes: a graphite substrate, thickness is greater than 1 millimeter (millimeter), and the material of this graphite substrate is to be selected from the group that is made up of with graphite native graphite, expandable graphite, Delanium, pyrolytic graphite, extruded anisotropic graphite, isostatic cool pressing graphite and spark machined; One insulating barrier only covers the regional area of a first surface of this graphite substrate, and directly contacts with this graphite substrate; One circuit layer is positioned at this insulating barrier top; One heat-conducting layer is positioned on this first surface, directly contacts with this graphite substrate, and is not coated by this insulating barrier; One or more LED crystal grain is arranged on this heat-conducting layer; Plural wires is in order to electrically connect this circuit layer and this one or more LED crystal grain; And one or more radiating area, be positioned on this first surface of this graphite substrate, and do not covered by this insulating barrier or this heat-conducting layer; Wherein this heat-conducting layer has a three-dimensional shape, can reflect light that this LED crystal grain sends to predetermined direction.
Description of drawings
Fig. 1 is the schematic diagram after an embodiment of circuit module of the present utility model simplifies.
Fig. 2～Fig. 7 is the profile after the different embodiment of the circuit module among Fig. 1 simplify.
Fig. 8 is the schematic diagram after another embodiment of circuit module of the present utility model simplifies.
Fig. 9～Figure 10 is the profile after the different embodiment of the circuit module among Fig. 8 simplify.
[main element symbol description]
100,800 circuit module
102 graphite substrates
104 upper surfaces
106 lower surfaces
110 look edge districts
120 supporting regions
122 electronic components
124 leads
130 cabling districts
140 radiating areas
212 insulating barriers
222 heat-conducting layers
232 circuit layers
234 anti-solder ink layers
342 carbide lamellas
610 bogeys
620,720 cements
710 heat abstractors
712 radiating fins
Embodiment
Below will the arrange in pairs or groups correlative type of the utility model part embodiment illustrates technology contents of the present utility model.In these are graphic, the function that may be denoted by the same reference numerals or similar elements identical with structure.(element) speech of mentioned " element " in the middle of specification in the whole text and follow-up claim has comprised the notion in member (component), layer structure (layer) or zone (region).
Illustrating when graphic, some size of component and relative size can be carried out amplification, so that graphic content can clearly be expressed.In addition, the shape of some element can be simplified conveniently to illustrate.Therefore, shape, size and the relative size of each element that is illustrated in graphic unless the applicant specializes, otherwise should not be used to limit scope of the present utility model.In addition, the utility model can embody with many different forms, when explaining the utility model, does not answer the aspect of limit in the exemplary embodiment that this specification proposed.
In specification and follow-up claim, used some vocabulary to censure specific element.Those skilled in the art should understand, and same element may be called with different nouns.This specification and follow-up claim are not used as distinguishing the mode of element with the difference of title, but the benchmark that is used as distinguishing with the difference of element on function.Be an open term mentioned " comprising " in the middle of specification and the follow-up claim in the whole text, so should be construed to " comprise but be not limited to ... ".This is employed " and/or " describing mode, comprise cited one of them or the combination in any of a plurality of projects.In addition, unless the applicant specializes, otherwise the term of any odd number lattice all comprises the connotation of plural lattice simultaneously at this.
In the middle of specification in the whole text and follow-up claim, if describe first element (on) on second element, above second element (above), connect, engage or be coupled to second element, then can represent first element directly the position on second element, directly connect, directly engage, directly be coupled to second element, also can represent that first element and second interelement have other medium elements existence.Relatively,, then represent first element and second interelement not to have other medium elements to exist as if describing directly position (directly on), the directly connection on second element of first element, directly engage or directly being coupled to second element.
For the convenience on illustrating, may use some narrations relevant at this with the relative position in the space, for example " in ... on ", " in ... top ", " in ... down ", " in ... below ", " being higher than ... ", " being lower than ... ", " making progress ", " downwards " or the like, function or this element and other interelement relative space relations of a certain element in graphic described.Those skilled in the art should understand, the narration that these are relevant with the relative position in the space, not only comprise the points relationship (orientation) of described element in graphic, also comprised the various different points relationships of described element when using, operating or assembling.For example, if turn upside down with graphic, then originally used " in ... on " element described, will become " in ... time ".Therefore, this is employed " in ... on " describing mode, comprised " in ... down " and " in ... on " two kinds of different points relationships.In like manner, at this employed " making progress " speech, " making progress " and " downwards " two kinds of different points relationships have been comprised.
Please refer to Fig. 1, its illustrate is the schematic diagram of the circuit module 100 of the utility model one embodiment after simplifying.Circuit module 100 includes with graphite substrate 102 as a circuit support plate of main body and be arranged at a plurality of electronic components 122 on this circuit support plate.As shown in the figure, graphite substrate 102 comprises a upper surface 104 and a lower surface 106.In the present embodiment, the upper surface 104 of graphite substrate 102 includes an insulation layer (Insulation Region) 110, one supporting region (Supporting Region) 120 and one radiating area (Heat Dissipation Region) 140, and wherein insulation layer 110 is provided with a plurality of cablings district (Wiring Region) 130.
On real the work, graphite substrate 102 can be realized with one of them with graphite (EDMGraphite) of native graphite (Natural Graphite), expandable graphite (Graphite Foam), Delanium, pyrolytic graphite (Pyrolytic Graphite), extruded anisotropic graphite (Squeeze Graphite), isostatic cool pressing graphite (Isostatic Graphite) and spark machined, also can make graphite substrate 102 with the mixing of above-mentioned material.Because the specific area (Specific Surface Region) of expandable graphite is the highest in the above-mentioned graphite material, and its processing is the easiest, so make the complexity that graphite substrate 102 can reduce manufacturing with expandable graphite.
For enough mechanical structure intensity will be arranged, the thickness of graphite substrate 102 should be greater than 1 millimeter (millimeter).In preferred embodiment, the thickness of graphite substrate 102 is between 1～20 millimeter.
In circuit module 100,110 of insulation layers are arranged at the regional area of the upper surface 104 of graphite substrate 102, and can not occupy the entire upper surface 104 of graphite substrate 102.
The Fig. 2 that below will arrange in pairs or groups further specifies the execution mode of circuit module 100 to Fig. 7.
Fig. 2 is that an embodiment of circuit module 100 prolongs the profile after A-A ' direction is simplified.As shown in Figure 2, on the insulation layer 110 of the upper surface 104 of graphite substrate 102, be provided with the insulating barrier 212 that directly contacts with graphite substrate 102.Because 110 of insulation layers are arranged at the regional area of the upper surface 104 of graphite substrate 102, so insulating barrier 212 also only can cover the regional area of upper surface 104.On real the work, insulating barrier 212 can be realized with the macromolecule grafting material.
On the supporting region 120 of the upper surface 104 of graphite substrate 102, be provided with and directly contact and be not insulated layer 212 heat-conducting layer that is coated 222 with graphite substrate 102.On real the work, modes such as heat-conducting layer 222 vacuum available sputters, vacuum evaporation, plating, plated film are formed on the upper surface 104 of graphite substrate 102.Generally speaking, when the thickness of heat-conducting layer 222 during greater than 10 microns (micrometer), the out-of-flatness details that upper surface 104 that can complete covering graphite substrate 102 exists naturally.When assembling, (Chip on Board, mode COB) are arranged at electronic component 122 direct joints on the heat-conducting layer 222, to promote the manufacturing efficient of circuit module 100 can to utilize directly solid brilliant joint of electronic component.
At electronic component 122 is among the embodiment of light-emitting component (for example LED crystal grain), heat-conducting layer 222 can be realized with one of them of the aluminium (Al) of highly reflective, silver (Ag), chromium (Cr), gold (Au), palladium (Pd), nickel (Ni), barium sulfate (BaSO4), carborundum (Silicon Carbide), aluminium nitride (AlN) and aluminium oxide (Al2O3), also can make, to promote the integral brightness of circuit module 100 of the mixing of above-mentioned material.At electronic component 122 is not among the embodiment of light-emitting component, then except above-mentioned material, also available carbon nanotube (Carbon Nanotube), how the combination of rice carbon ball (Carbon Nano Capsule) or the two and above-mentioned material realizes heat-conducting layer 222.
As previously mentioned, cabling district 130 is arranged on the insulation layer 110.In an embodiment, cabling district 130 includes the circuit layer 232 that is formed at insulating barrier 212 tops.Circuit layer 232 in the cabling district 130 can be made of conductive materials such as Copper Foils, and the electronic component 122 that circuit layer 232 can see through on lead 124 and the heat-conducting layer 222 electrically connects.Outside circuit layer 232, then be coated with anti-solder ink layer 234, with the electronic circuit of protective circuit layer 232.
In the embodiment of Fig. 2, be positioned at the radiating area 140 of the upper surface 104 of graphite substrate 102, be not to be insulated layer 212 or the exposed surface that covers of heat-conducting layer 222.Because the upper surface 104 of heat-conducting layer 222 and graphite substrate 102 is directly to contact, not with insulating barrier 212 as intermediate media, so the heat energy that electronic component 122 produces conducts to graphite substrate 102 through heat-conducting layer 222 effectively.Graphite substrate 102 itself has good thermal conductivity (thermal conductivity), so heat that electronic component 122 produces, can be through the radiating area 140 on graphite substrate 102 upper surfaces 104 and the lower surface 106 of graphite substrate 102, promptly diffuse to external environment, reach better heat radiating effect.
Fig. 3 is that another embodiment of circuit module 100 prolongs the profile after A-A ' direction is simplified.As shown in Figure 3; can be on the radiating area 140 of the upper surface 104 of graphite substrate 102, coating one deck carbide lamella 342 is as carbon nanotube, how rice carbon ball and/or carborundum etc.; with protection or the antiwear property of raising, and strengthen radiating effect to the upper surface 104 of graphite substrate 102.
On real the work, also available machining moulding mode, edm molding mode or other molding modes, radiating area 140 among aforementioned each embodiment is designed to the stereochemical structure of epirelief shape or concave shape, to increase the area of dissipation of radiating area 140, further promote the heat dissipation of graphite substrate 102.
Among the embodiment in front, the supporting region 120 of the upper surface 104 of graphite substrate 102 is to be tabular in fact.On real the work, in order to reach specific effect, also available machining moulding mode, edm molding mode, injection molding method or other molding modes are designed to the stereo structure structure with supporting region 120.
For example, Fig. 4 another embodiment of illustrating circuit module 100 prolongs the profile after A-A ' direction is simplified.In the embodiment shown in fig. 4, being positioned at the supporting region 120 of the upper surface 104 of graphite substrate 102, is the stereochemical structure that is concave shape.Because supporting region 120 is the three-dimensional shapes that are recessed, the heat-conducting layer of being located on the supporting region 120 222 also can and then be recessed three-dimensional shape.At electronic component 122 is that light-emitting component (for example LED crystal grain) and heat-conducting layer 222 are among the embodiment with above-mentioned highly reflective material, heat-conducting layer 222 meetings that are recessed stereo structure can further promote the illuminating effect of circuit module 100 with the upwards reflection (shown in the dotted line among Fig. 4) of light that this light-emitting component send.
Among the embodiment in front, the lower surface 106 of graphite substrate 102 is to be tabular in fact.On real the work, in order to reach specific effect, also available machining moulding mode, edm molding mode or other molding modes are designed to the stereo structure structure with the lower surface 106 of graphite substrate 102.
For example, Fig. 5 another embodiment of illustrating circuit module 100 prolongs the profile after A-A ' direction is simplified.In the embodiment shown in fig. 5, the lower surface 106 of graphite substrate 102 is stereochemical structures of concave-convex surface.Such design can increase the area of dissipation of the lower surface 106 of graphite substrate 102, and then promotes the heat dissipation of graphite substrate 102.
Except the lower surface 106 with graphite substrate 102 is designed to the stereo structure structure; also can on the lower surface 106 of graphite substrate 102, be coated with one deck carbide lamella; as carbon nanotube, how rice carbon ball and/or carborundum etc.; with the radiating effect of the lower surface 106 of further increase graphite substrate 102, and improve protection or antiwear property simultaneously to the lower surface 106 of graphite substrate 102.
Another embodiment that Fig. 6 illustrates circuit module 100 prolongs the profile after A-A ' direction is simplified.In the embodiment shown in fig. 6, utilize cement 620 that a bogey (for example, a load bearing seat) 610 is engaged in the lower surface 106 of graphite substrate 102,, and make things convenient for the subsequent installation of this circuit support plate to use with the overall structure rigidity of intensifier circuit support plate.On real the work, bogey 610 available metal materials or engineering plastic are made.
Another embodiment that Fig. 7 illustrates circuit module 100 prolongs the profile after A-A ' direction is simplified.In the embodiment shown in fig. 7, can utilize cement 720 that a heat abstractor 710 is engaged in the lower surface 106 of graphite substrate 102, with the integral heat sink usefulness of intensifier circuit support plate, and the overall structure rigidity of intensifier circuit support plate simultaneously.In the present embodiment, heat abstractor 710 includes a plurality of radiating fins 712, can effectively increase the integral heat sink area of circuit module 100.On real the work, heat abstractor 710 and/or its radiating fin 712, available metal material or above-mentioned graphite material are made.In addition, also can on the surface of heat abstractor 710 and/or its radiating fin 712, be coated with one deck carbide lamella, as carbon nanotube, how rice carbon ball and/or carborundum etc., with the integral heat sink effect of further increase circuit module 100.
Those skilled in the art should understand, and number, shape or the position of aforementioned dielectric district 110, supporting region 120, cabling district 130 and radiating area 140 all can be adjusted according to the needs of side circuit design, are not limited to the aspect that previous embodiment illustrates.For example, the upper surface 104 of graphite substrate 102 can have the insulation layer 110 of a plurality of that separate, difformities and size, and the cabling district 130 of a plurality of that separate, difformities and size also can be arranged.Similarly, the upper surface 104 of graphite substrate 102 can have the supporting region 120 of a plurality of that separate, difformities and size, and the radiating area 140 of a plurality of that separate, difformities and size also can be arranged.For example, Fig. 8 is the schematic diagram after the circuit module 800 of another embodiment of the utility model is simplified.In circuit module 800, the upper surface 104 of graphite substrate 102 includes two supporting regions that separate 120.
Fig. 9 is that an embodiment of circuit module 800 prolongs the profile after A-A ' direction is simplified.In the present embodiment, two supporting regions 120 on the upper surface 104 of graphite substrate 102 all are to be tabular in fact, and are similar with the embodiment of Fig. 2.
Figure 10 is that another embodiment of circuit module 800 prolongs the profile after A-A ' direction is simplified.As shown in figure 10, two supporting regions 120 in the present embodiment all are the stereochemical structures that is concave shape in fact, and are similar with the embodiment of Fig. 4.Therefore, be located at two heat-conducting layers 222 on the supporting region 120 and also can and then be recessed three-dimensional shape.Similar with previous embodiment, at electronic component 122 is that light-emitting component (for example LED crystal grain) and heat-conducting layer 222 are to use among the embodiment of highly reflective material, heat-conducting layer 222 meetings that are recessed stereo structure can further promote the illuminating effect of circuit module 800 with the upwards reflection (shown in the dotted line among Figure 10) of light that this light-emitting component send.
Multinomial technical characterictic among the aforementioned different embodiment can make up mutually, uses lifting based on the circuit support plate of graphite substrate 102 and the integral heat sink effect or the structural rigidity of circuit module.In addition, also the multinomial technical characterictic among the aforementioned different embodiment can be made up mutually, to promote the whole illumination effect of circuit module.
The above only is preferred embodiment of the present utility model, and all equalizations of being done according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206577626U CN201957336U (en) | 2010-12-07 | 2010-12-07 | High heat dissipation circuit carrier board and related light emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206577626U CN201957336U (en) | 2010-12-07 | 2010-12-07 | High heat dissipation circuit carrier board and related light emitting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201957336U true CN201957336U (en) | 2011-08-31 |
Family
ID=44501437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206577626U Expired - Fee Related CN201957336U (en) | 2010-12-07 | 2010-12-07 | High heat dissipation circuit carrier board and related light emitting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201957336U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686019A (en) * | 2012-05-22 | 2012-09-19 | 深圳市华星光电技术有限公司 | Circuit board as well as LED (Light-Emitting Diode) lamp strip and production method thereof |
| CN103855295A (en) * | 2014-03-14 | 2014-06-11 | 苏州晶品光电科技有限公司 | High-thermal-conductive LED lighting assembly |
| CN103872216A (en) * | 2014-03-14 | 2014-06-18 | 苏州晶品光电科技有限公司 | High-power LED (Light Emitting Diode) light source module |
| CN103883907A (en) * | 2014-03-14 | 2014-06-25 | 苏州晶品光电科技有限公司 | High-power LED lighting assembly |
| CN103912807A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | High power light emitting diode (LED) light engine |
| TWI578891B (en) * | 2016-02-03 | 2017-04-11 | 鈺冠科技股份有限公司 | Heat dissipation structure using nanomaterials and method of manufacturing the same |
| CN104135816B (en) * | 2014-06-11 | 2018-01-26 | 广东美的集团芜湖制冷设备有限公司 | Aluminum-based copper-clad plate and preparation method thereof, circuit electronic circuit board |
-
2010
- 2010-12-07 CN CN2010206577626U patent/CN201957336U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686019A (en) * | 2012-05-22 | 2012-09-19 | 深圳市华星光电技术有限公司 | Circuit board as well as LED (Light-Emitting Diode) lamp strip and production method thereof |
| WO2013174033A1 (en) * | 2012-05-22 | 2013-11-28 | 深圳市华星光电技术有限公司 | Circuit board, led lamp strip and manufacturing method thereof |
| CN103855295A (en) * | 2014-03-14 | 2014-06-11 | 苏州晶品光电科技有限公司 | High-thermal-conductive LED lighting assembly |
| CN103872216A (en) * | 2014-03-14 | 2014-06-18 | 苏州晶品光电科技有限公司 | High-power LED (Light Emitting Diode) light source module |
| CN103883907A (en) * | 2014-03-14 | 2014-06-25 | 苏州晶品光电科技有限公司 | High-power LED lighting assembly |
| CN103912807A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | High power light emitting diode (LED) light engine |
| CN103912807B (en) * | 2014-03-14 | 2016-06-15 | 苏州晶品光电科技有限公司 | Great power LED photo engine |
| CN103883907B (en) * | 2014-03-14 | 2016-06-29 | 苏州晶品光电科技有限公司 | High-power LED illumination assembly |
| CN103855295B (en) * | 2014-03-14 | 2016-08-24 | 苏州晶品光电科技有限公司 | High thermally conductive LED light fixture |
| CN104135816B (en) * | 2014-06-11 | 2018-01-26 | 广东美的集团芜湖制冷设备有限公司 | Aluminum-based copper-clad plate and preparation method thereof, circuit electronic circuit board |
| TWI578891B (en) * | 2016-02-03 | 2017-04-11 | 鈺冠科技股份有限公司 | Heat dissipation structure using nanomaterials and method of manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201957336U (en) | High heat dissipation circuit carrier board and related light emitting module | |
| CN102907183B (en) | For the plating systems of LED | |
| CN201187696Y (en) | Flexible circuit board of LED illumination array | |
| CN101335319B (en) | High-power LED ceramic package base and productive technology | |
| CN201827857U (en) | Heat conducting structure of LED light source | |
| CN102983124B (en) | Light emitting diode (LED) light source with cooling device | |
| CN101198216A (en) | Flexible circuit board for LED lighting array | |
| TWM328763U (en) | Structure of heat dissipation substrate | |
| CN202613307U (en) | Light-emitting device and illuminating device | |
| CN101980389A (en) | Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof | |
| JP3128955U (en) | Electric circuit board structure with heat dissipation sheet | |
| CN101765350A (en) | High-power radiating module | |
| CN201796950U (en) | light emitting diode light source structure | |
| KR100865835B1 (en) | Light emitting diode reflective cover molding method, its structure, and light emitting diode stacking device using the reflective cover | |
| CN201149866Y (en) | Ceramic/Metal Composite Structure | |
| CN201487854U (en) | High thermal conductivity LED lamp | |
| CN101841973B (en) | High-thermal conductivity circuit board preparation method based on metal base and circuit board | |
| CN102569224B (en) | High heat dissipation circuit carrier board and related circuit modules | |
| CN202134575U (en) | LED cooling substrate | |
| CN100469217C (en) | Flexible heat dissipation circuit substrate | |
| CN101369617B (en) | High heat dissipation LED device | |
| CN201490177U (en) | Metal-based copper clad laminate for mounting semiconductor power devices | |
| CN109524374B (en) | LED light-emitting module | |
| CN203013789U (en) | Semiconductor chip heat dissipation substrate and semiconductor chip packaging structure | |
| CN100420019C (en) | Packaging method and device for cluster light-emitting diode chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20161207 |