TWM627851U - Heat-dissipation module - Google Patents

Abstract

A heat dissipation module comprises: a copper base, at least one U-shaped aluminum heat pipe, an aluminum heat dissipation fin group, and a copper insertion layer; the copper base has a heat absorption side and a heat conduction side , the heat-absorbing or heat-conducting side is recessed with at least one first heat pipe accommodating groove; the U-shaped aluminum heat pipe has a heat absorbing part in a horizontal section and a condensation part in two vertical sections, and the heat absorbing part is arranged in the first heat pipe accommodating groove Inside; the aluminum heat dissipation fin set has a plurality of heat dissipation fins, and there is a heat dissipation flow channel between the two heat dissipation fins, the heat dissipation flow channel and the heat conduction side of the copper base are parallel, and the condensation parts pass through the heat dissipation fins; the copper embedded layer is disposed on the surface of the heat absorbing part of the U-shaped aluminum heat pipe, so that the copper base and the U-shaped aluminum heat pipe do not need to be disposed through the copper embedded layer The nickel process can be directly welded.

Description

cooling module

A heat-dissipating module, especially a heat-dissipating module that can improve the difficulty of welding and bonding between the heat-dissipating elements in the heat-dissipating module.

Copper has the characteristics of high heat conduction efficiency, so the conventional heat dissipation module structure often chooses copper as the base that directly contacts the heat source and absorbs the heat generated by the heat source, and then transfers the absorbed heat from the copper base to the heat sink. Heat pipes that accelerate heat conduction and fins that increase the heat dissipation area and have better heat dissipation efficiency, but the base and heat pipes or fins made of copper have heavier overall weight and higher material cost. Replaced with lower cost aluminum fins and aluminum base.

Although the use of aluminum instead of copper can improve the weight of copper and the high cost of materials, aluminum is not without its shortcomings. For example, the surface of aluminum is easily oxidized, and high-melting oxides are generated during the welding process. It is difficult to fuse completely, which brings difficulties to welding.

If copper and aluminum are welded directly, the parts where the two materials are directly butted are prone to cracks after welding due to their high brittleness, and when copper and aluminum are welded, it is easy to form in the weld near the copper material side. CuAl2 and other eutectic structures, while CuAl2 and other eutectic structures are only distributed near the grain boundaries of the material, and are prone to fatigue or cracks between grain boundaries. Also, because the melting point temperature and eutectic temperature of copper and aluminum are very different, in fusion welding During the operation, when the aluminum is melted, the copper remains in a solid state. When the copper is melted, the aluminum has melted a lot and cannot coexist in a eutectic or eutectic state, which increases the difficulty of welding. The thermal conductivity with aluminum is very good, the molten pool metal crystallizes quickly during welding, and the metallurgical reaction gas at high temperature is too late Escape, so it is easy to produce pores, so copper and aluminum cannot be directly welded, so the surface of the aluminum must be surface-modified so that the subsequent welding with copper or other materials can be performed. Therefore, in order to improve the aforementioned habit Knowing that the use of aluminum instead of copper cannot be directly welded with copper or other dissimilar materials, those who are familiar with this technique use electroless nickel plating as the technical method of surface modification. There are three types of electroless nickel plating: low phosphorus , medium phosphorus, high phosphorus. And electroless dopostion can also be called chemical plating (Chemical Deposition) or autocatalytic plating (Autocatalytic Plating), electroless nickel plating solution can be divided into the following three types: (1) activation sensitization + acid plating bath PH planting Between 4 and 6 are acidic baths, which are characterized by less loss of components caused by evaporation. Although the operating temperature is higher, the bath is safe and easy to control, with high phosphorus content and high plating rate. Often used by industry. (2) Activation sensitization + alkaline plating solution The pH of the alkaline plating bath is between 8 and 10. Because the ammonia water used to adjust the pH is easy to volatilize, it is necessary to supplement the ammonia water in time to maintain the stability of the pH. The amount is less, the plating solution is less stable, and the operating temperature is lower. (3) HPM+Alkaline plating bath HPM is to immerse the silicon wafer in a mixture of DI-water:H2O2(aq):HCl(aq)=4:1:1 and use the oxide layer formed on the surface of the silicon wafer to replace the sensitization activated, forming an autocatalytic surface on the surface.

However, a large amount of chemical reaction liquid needs to be used in the electroless nickel plating process, and after the electroless nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of toxic substances such as yellow phosphorus will be produced in the industrial waste liquid. The waste water cannot be reused, and the waste water must be recycled and processed by a special unit, and the waste water cannot be directly discharged to avoid environmental pollution. Yellow phosphorus sewage contains yellow phosphorus with a concentration of 50~390mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and osteonecrosis of the mandible. Therefore, countries have begun to ban this process and promote non-toxic processes to protect the environment.

Therefore, how to provide a surface modification method that can reduce the overall weight of the heat dissipation module structure and replace electroless nickel plating as a surface modification method for improving the inability of aluminum materials to be welded with other dissimilar materials, and at the same time, it can be beneficial to welding operations without generating additional environmental pollutants. , is the first priority at this stage.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of this creation is to provide a heat dissipation module that can replace chemical nickel plating as a heat dissipation module that cannot be directly welded between aluminum heat dissipation elements and other heat dissipation elements of different materials.

In order to achieve the above purpose, the present invention provides a heat dissipation module, which includes: a copper base, at least one U-shaped aluminum heat pipe, an aluminum heat dissipation fin group, and a copper insertion layer; the copper base The seat has a heat-absorbing side and a heat-conducting side, and either or both of the heat-absorbing or heat-conducting sides are recessed with at least one first heat pipe accommodating groove; the U-shaped aluminum heat pipe has a heat-absorbing part of a horizontal section and two vertical sections of a condensation part, the heat absorption part is arranged in the first heat pipe accommodating groove; the aluminum heat dissipation fin group has a plurality of heat dissipation fins, and a heat dissipation flow channel is arranged between the two heat dissipation fins, and the heat dissipation flow channel is connected with the copper The heat-conducting side of the base is parallel, and the cooling fins pass through the cooling parts; the copper embedded layer is arranged on the surface of the heat-absorbing part, so that the copper base and the U-shaped aluminum heat pipe can be directly welded By.

By replacing the electroless nickel plating with the copper intercalation layer in this invention, when there is an aluminum heat dissipation element to be welded with other heat dissipation elements of different materials, it can be arranged on the surface of the part where the aluminum heat dissipation element is combined with other elements. The copper embedded layer improves the problem that aluminum heat conduction or heat dissipation components are not easy to be welded to each other. The copper embedded layer replaces the defects caused by the traditional electroless nickel plating layer, and because the aluminum tube is used instead of the copper tube, it can be Significantly reduce the overall weight of the cooling module.

1: Copper base

11: Endothermic side

12: Thermal side

121: The first heat pipe accommodating groove

122: The second heat pipe accommodating groove

2: U-shaped aluminum heat pipe

2a: The first U-shaped aluminum heat pipe

2b: Second U-shaped aluminum heat pipe

21: heat sink

22: Condensing part

3: Aluminum heat dissipation fin group

31: cooling fins

32: Cooling runner

33: Hemming

4: Copper insertion layer

41: Implant surface

42: Contact surface

5: Solder layer

6: heat source

Figure 1 is an exploded perspective view of the first embodiment of the heat dissipation module of the present creation; Figure 2 is a combined cross-sectional view of the first embodiment of the heat dissipation module of the present creation; Figure 3 is another combined cross-sectional view of the first embodiment of the heat dissipation module of the present creation; Figure 4 is the first embodiment of the heat dissipation module of the present creation. Two-dimensional exploded view of the second embodiment.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are three-dimensional exploded and assembled cross-sectional views of the first embodiment of the heat dissipation module of the present creation. As shown in the figures, the heat dissipation module of the present creation includes: a copper base 1, at least one U Type aluminum heat pipe 2, an aluminum heat dissipation fin group 3, a copper embedded layer 4;

The upper and lower sides of the copper base 1 have a heat-conducting side 12 and a heat-absorbing side 11 respectively. The heat-absorbing side 11 is correspondingly assembled with at least one heat source 6 to conduct heat-absorbing heat conduction. The heat-conducting side 12 is disposed on the copper base 1 . The opposite side of the heat-absorbing side 11 of the substrate 1, and either or both of the heat-absorbing side 11 or the heat-conducting side 12 is recessed with at least one first heat pipe accommodating groove 121. In this embodiment, the first heat pipe receiving groove 121 is recessed. The heat pipe accommodating groove 121 is provided on the heat conduction side 12 for illustration and implementation, but not limited thereto.

The U-shaped aluminum heat pipe 2 has a horizontal section and two vertical sections, the vertical section is connected to both ends of the horizontal section, a heat absorption part 21 is arranged in the horizontal section, and a condensation section 22 is arranged in the vertical section, The heat absorbing portion 21 is disposed in the first heat pipe accommodating groove 121 of the copper base 1 .

The aluminum heat dissipation fin set 3 has a plurality of heat dissipation fins 31 , the heat dissipation fins 31 are arranged in parallel, and there is at least one heat dissipation channel 32 between the two heat dissipation fins 31 . The heat-conducting side 12 of the copper base 1 is arranged in parallel, the U-shaped aluminum heat pipe 2 passes through the cooling fins 22 through the cooling fins 31 and is combined with each other, the cooling fins 31 and the U-shaped aluminum heat pipe The condensation part 22 of 2 is combined by tight fitting or welding.

Referring to FIG. 3, it is another extension implementation of the aluminum heat dissipation fin set of this embodiment. The heat dissipation fins 31 of the aluminum heat dissipation fin set 3 have at least a pair of folding edges 33, and the heat dissipation fins 31 pass through The folded edges 33 are overlapped and assembled with each other.

The copper embedded layer 4 is disposed on the surface of the heat absorbing portion 21 of the U-shaped aluminum heat pipe 2 , and the copper embedded layer 4 has an implanted surface 41 and a contact surface 42 respectively disposed on the copper structure On the opposite sides of the embedded layer 4 , the implanted surface 41 is embedded in the surface of the heat absorbing portion 21 of the U-shaped aluminum heat pipe 2 , and the contact surface 42 serves as the exposed surface of the copper embedded layer 4 and is combined with a solder layer 5 , when the copper base 1 is combined with the U-shaped aluminum heat pipe 2, through the setting of the copper embedding layer 4, the copper base 1 and the non-copper U-shaped aluminum heat pipe 2 and The non-copper aluminum heat dissipation fin group 3 can be smoothly combined and fixed directly with the copper base 1 or through the solder layer 5 to increase its welding effect.

Please refer to FIG. 4, which is an exploded perspective view of the second embodiment of the heat dissipation module of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that this embodiment further has a second heat pipe accommodating groove 122 , the first heat pipe accommodating groove 121 extends laterally along the copper base 1 , and the first heat pipe accommodating groove 121 extends laterally along the copper base 1 . Two heat pipe accommodating grooves 122 are longitudinally extended along the copper base 1 , the first heat pipe accommodating groove 121 is disposed below the second heat pipe accommodating groove 122 , and the first and second heat pipe accommodating grooves 121 and 122 Interleaved horizontally and vertically.

And because of the second heat pipe accommodating groove 122, more U-shaped aluminum heat pipes 2 can be provided. The first U-shaped aluminum heat pipe 2a in the first heat pipe accommodating groove 121, the other group is the second U-shaped aluminum heat pipe 2b disposed in the second heat pipe accommodating groove 122, the second U-shaped aluminum heat pipe 2b is arranged above the first U-shaped aluminum heat pipe 2a, and is vertically overlapped and staggered with the first U-shaped aluminum heat pipe 2a, which is responsible for the longitudinal heat conduction corresponding to the copper base 1, and can also provide more heat pipes per unit volume. The space that can be set, the suction of the first and second U-shaped aluminum heat pipes 2a, 2b In addition to the position of the heat portion 21 where the copper insert layer 4 is disposed corresponding to the first and second heat pipe accommodating grooves 121 and 122 and can be directly welded, the first and second U-shaped aluminum heat pipes 2a and 2b are connected to each other. The overlapping parts in the horizontal and vertical directions are also the same, because the copper embedded layer 4 can be directly welded to increase its bonding.

In addition, the copper insertion layer 4 is to attach the copper layer to the outer surface of the material to be welded with the copper material by machining, and a copper sheet can be attached to the material to be welded with the copper material. Outside the non-copper material, the copper sheet penetrates into the outer surface of the non-copper material through external force and is firmly covered on the outer surface of the non-copper material by means of mechanical impact, knock, impact, rolling, and embossing. Of course, the copper embedded layer 4 can also be formed on the outer surface of the non-copper material by means of electroplating or spraying, and then the solderability with the copper material can be improved through the copper embedded layer 4 .

When the traditional heat dissipation module is manufactured, a copper base and copper tube are used to combine with aluminum heat dissipation fins. Although the copper material has better thermal conductivity, the overall weight of the heat dissipation module is quite heavy, and the copper material uses its own material. The cost is also quite high, and the copper tube and the aluminum heat dissipation fin must be combined by welding, but the copper material and the aluminum material cannot be directly welded, and the heat dissipation fin and the copper base must be connected first. Electroless nickel plating is used to deposit a nickel coating on the part of the copper heat pipe, so that the copper heat pipe and the aluminum heat dissipation fin can be smoothly welded and combined, and the environmental pollution caused by the electroless nickel plating method has gradually been paid attention to and has been Improvement is required, so this creation provides a copper heat pipe to replace the aluminum heat pipe to reduce the overall weight of the heat dissipation module, and the surface of the aluminum heat pipe and the aluminum heat dissipation fins and the copper base are placed on the surface of the copper base. The aluminum heat pipe and the aluminum heat dissipation fins can be welded and combined with the copper base. Therefore, this creation improves the weight of the traditional heat dissipation module and replaces the electroless nickel plating with the copper embedded layer. Problems such as the inability to directly weld with aluminum heat dissipation and heat conduction components.

1: Copper base

11: Endothermic side

12: Thermal side

121: The first heat pipe accommodating groove

2: U-shaped aluminum heat pipe

21: heat sink

22: Condensing part

3: Aluminum heat dissipation fin group

31: cooling fins

32: Cooling runner

4: Copper insertion layer

41: Implant surface

42: Contact surface

5: Solder layer

6: heat source

Claims (6)

A heat dissipation module comprises: a copper base with a heat absorption side and a heat conduction side, at least one first heat pipe accommodating groove is recessed on either or both of the heat absorption or heat conduction sides; at least one U-shaped aluminum The heat pipe has a heat absorption part of a horizontal section and a condensation part of two vertical sections. The heat absorption part is arranged in the first heat pipe accommodating groove; an aluminum heat dissipation fin group has a plurality of heat dissipation fins, two heat dissipation fins There is at least one heat dissipation channel between the fins, the heat dissipation channels are arranged in parallel with the heat-conducting side of the copper base, and the cooling fins are passed through the condensation parts to be combined with each other; On the surface of the heat absorbing part of the U-shaped aluminum heat pipe, the copper base and the U-shaped aluminum heat pipe can be directly welded. The heat dissipation module of claim 1, further comprising a second heat pipe accommodating groove, the first heat pipe accommodating groove extending laterally along the copper base, and the second heat pipe accommodating groove Extending longitudinally along the copper base, the first heat pipe accommodating groove is disposed below the second heat pipe accommodating groove, and the first and second heat pipe accommodating grooves are staggered laterally and longitudinally. The cooling module according to claim 1, wherein the cooling fins and the condensing portion of the U-shaped aluminum heat pipe are combined by tight fitting or welding. The heat dissipation module according to claim 1, wherein the heat dissipation fins of the aluminum heat dissipation fin group have at least one pair of folded edges, and the heat dissipation fins are assembled by overlapping with each other through the folded edges . The heat dissipation module of claim 1, wherein the copper embedded layer has an implanted surface and a contact surface on opposite sides of the copper embedded layer, and the implanted surface is embedded in the U The surface of the heat absorbing part of the aluminum heat pipe, and the contact surface is combined with a solder layer as the exposed surface of the copper embedded layer. The heat dissipation module according to claim 1, wherein the first heat pipe accommodating groove is recessed on the heat absorbing side and the heat conducting side at the same time.

Images