CN216820486U - heat sink - Google Patents

Abstract

The utility model provides a heat dissipation device, which comprises an aluminum base and at least one or both of a copper two-phase flow element or a copper heat conduction element. The aluminum base has an upper side and a lower side. , and a bonding area is formed on the lower side for setting a copper embedded layer. Either or both of the copper two-phase flow element or the copper heat conduction element are arranged in the bonding area, which can be combined with the copper embedded layer. In this invention, through the arrangement of the copper embedded layer, the aluminum base and the copper two-phase flow element and/or copper heat conduction element of different metals can be directly Welding is performed.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a device that provides a copper embedded layer on the bonding area of the aluminum base to be combined, so that the aluminum base and the copper two-phase flow of the dissimilar metal can flow. The components and/or the copper heat-conducting components can be directly soldered and combined with the heat sink without going through the nickel treatment process.

Background technique

Existing heat sinks or heat dissipation modules are generally made of copper or aluminum material. Due to the high heat conduction efficiency of copper, the existing heat sinks or heat dissipation modules are usually made of copper material as the heat dissipation base and as the conduction execution unit. (CPU, graphics card chip, or other transistors or heat sources) generate heat for heat exchange; but if the heat sink or heat dissipation module is made of copper, its weight is extremely heavy and the cost is high; therefore, the current method adopted The components that are in direct contact with the heat source and will be absorbed into the heat source (such as heat conduction units (pieces, bodies, seats), copper plates, two-phase flow elements (such as heat pipes, temperature equalization plates, etc.)) are made of copper materials, and other Components (combined fins, fins, heat sinks, heat sinks) are made of relatively light-weight, low-cost aluminum material to reduce weight and cost.

For example, in order to provide a good heat transfer effect, the current general aluminum extruded radiator is often directly combined or recessed at the bottom of the heat sink to facilitate the installation of at least one copper heat pipe with better heat conduction or temperature uniformity. A metal copper plate is used to cover the plate or a metal copper plate is used to contact the heat source.

However, since the aluminum surface of the aluminum extrusion radiator is easily oxidized, and the high melting point oxide (Al ₂ O ₃ ) generated during the welding process will directly hinder the fusion with copper metal and bring difficulties to welding, because if When copper metal and aluminum metal are directly welded, the part where the two copper and aluminum materials are directly welded will be prone to cracks due to brittleness after welding; and when copper metal and aluminum metal are welded, the side close to the copper metal It is easy to form eutectic such as cuAl ₂ in the welded seam, and the eutectic structure such as cuAl ₂ will be distributed near the grain boundaries of the material, and it is easy to cause fatigue or cracks between the grain boundaries. Moreover, the melting point and eutectic temperature of copper and aluminum are very different, so when the surface of the aluminum metal is completely melted in the fusion welding operation, the copper metal is still in a solid state; on the contrary, when the copper metal is melted, the aluminum metal has long been. It melts a lot and cannot coexist in a eutectic or eutectic state, which greatly increases the difficulty of welding copper and aluminum. In addition, because the welding seam is prone to pores, and the thermal conductivity of copper metal and aluminum metal is very good, the molten pool metal crystallizes quickly during welding, so that the metallurgical reaction gas at high temperature cannot escape, so pores are easily generated. Based on the above-mentioned problems, it is the reason why the contact surface between the extruded aluminum heat sink and the copper heat pipe and/or the metal copper plate cannot be directly welded.

Therefore, in order to solve the above-mentioned problems that the existing aluminum and copper dissimilar metal materials cannot be directly welded and the above-mentioned extension problems, the method adopted by the industry is to place the aluminum extrusion radiator on the surface of the copper heat pipe and/or the metal copper plate in contact with After surface treatment and modification, it is convenient for welding of two dissimilar metals; that is, a layer of electroless nickel plating should be formed in advance on the bottom of the aluminum extruded heat sink and the inner surface of the groove or its opposite bonding contact surface. Electroless nickel plating allows two dissimilar metals (the two dissimilar metals are aluminum and copper) to be welded. The taxis currently familiar with the art are the use of electroless nickel plating as a technical method of metal surface modification, which provides unique deposit properties, including deposit uniformity in deep depressions, holes and blind holes; among which electroless plating Nickel can also be called chemical nickel plating (Chemical Deposition) or autocatalytic plating method (Autocatalytic Plating) and it is classified into three types according to phosphorus content: low phosphorus, medium phosphorus and high phosphorus. The biggest difference between electroless nickel plating and electroplating is that the working environment is in the absence of current, the metal ions are reduced by the reducing agent in the solution, and the surface of the test piece must be catalyzed before electroless nickel plating.

However, although the above-mentioned method can solve the welding problem between the aluminum base and the copper heat transfer member, it also brings about environmental protection and other problems. After the electroless nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of waste water containing yellow phosphorus and other toxic substances will be produced in the industrial waste liquid. Yellow phosphorus sewage contains yellow phosphorus at a concentration of 50-390 mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and other diseases such as mandibular necrosis. Therefore, the current environmental awareness in various countries has begun to pay attention to and banned this electroless nickel plating related process, so efforts are made to promote non-toxic processes to protect the environment. In addition, the recent instability and severe shortage of nickel and phosphorus raw materials in electroless nickel plating in the global supply chain will also lead to higher overall costs.

Accordingly, how to weld and combine two dissimilar metals without using surface modification treatment is a problem that needs to be overcome urgently at present.

Utility model content

The main purpose of the present invention is to provide a copper embedded layer disposed on an aluminum base to form a bonding area, so that the copper two-phase flow element and/or the copper heat conduction element of dissimilar metals can make the It can be directly welded without surface modification, so as to effectively achieve a cooling device that reduces costs and protects the environment.

In order to achieve the above purpose, the present utility model provides a heat dissipation device, which is characterized in that it includes:

an aluminum base with an upper side and a lower side, wherein the lower side forms a bonding area, and the bonding area is provided with a copper intercalation layer; and

At least one copper two-phase flow element is disposed in the bonding area, so that the copper two-phase flow element can be combined with the copper intercalation layer.

The heat dissipation device, wherein: the lower side has at least one accommodating groove, the bonding area is arranged in the accommodating groove, the copper two-phase flow element is a heat pipe buried in the accommodating groove, the The copper two-phase flow element is combined with the copper embedded layer in the accommodating groove.

The heat dissipation device further comprises a copper heat conduction element, a heat transfer surface of the copper heat conduction element is combined with the copper embedded layer on the lower side and a side surface of the two-phase flow element.

The heat dissipation device, wherein: the copper intercalation layer is formed on the bonding area by mechanical processing, surface treatment process or chemical processing method.

The heat dissipation device, wherein: the copper embedded layer has a deep surface and a surface contact surface, the surface contact surface is combined on the bonding area, and the deep surface is combined in the bonding area.

The heat dissipation device, wherein: the upper side of the aluminum base is provided with a plurality of heat dissipation fins.

The heat dissipation device, wherein: the copper two-phase flow element is a temperature equalizing plate, and the temperature equalizing plate is arranged on the lower side.

A heat dissipation device, characterized in that it includes:

an aluminum base with an upper side and a lower side, wherein a bonding area is formed on the lower side;

a copper intercalation layer disposed on the bonding area; and

At least one copper heat conduction element is disposed in the bonding area, so that the copper heat conduction element can be combined with the copper intercalation layer.

The heat dissipation device, wherein: the copper heat conduction element is a copper base plate.

In the present invention, the copper embedded layer is mainly arranged on the joint area to be combined on the aluminum base, so that the copper two-phase flow element and/or the copper heat conduction element of dissimilar metals can be directly connected to the copper without going through the chemical The nickel treatment process can be directly welded, which can not only effectively reduce costs, but also achieve environmental protection and solve the problem of shortage of existing nickel and phosphorus raw materials.

Description of drawings

FIG. 1 is a three-dimensional exploded schematic diagram of the utility model.

Fig. 2 is a three-dimensional combined schematic diagram of the present invention.

FIG. 3 is a schematic cross-sectional view of FIG. 2 of the present invention.

Reference numeral description: heat sink 1; aluminum base 11; upper side 111; lower side 112; accommodating groove 1121; bonding area 1124; Surface 122; copper two-phase flow element 13; two-phase flow contact surface 131; two-phase flow joint surface 132; capillary structure 133; chamber 135; copper heat conduction element 15;

Detailed ways

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

The present invention provides a heat dissipation device 1 , please refer to FIG. 1 , FIG. 2 , and FIG. 3 , the heat dissipation device 1 includes an aluminum base 11 , at least one copper two-phase flow element 13 and a copper heat conduction element 15 , The aluminum base 11 is made of aluminum material or aluminum alloy material and other materials containing aluminum. In this embodiment, the aluminum base 11 is made of aluminum material, and has an upper side 111 and a lower side 112 . The side surface 111 protrudes outward with a plurality of heat dissipation fins 114 (or a set of heat dissipation fins) formed of aluminum material arranged at intervals, and the heat dissipation fins 114 and the aluminum base 11 form a heat sink ( Such as aluminum extrusion radiator).

The lower side 112 of the above-mentioned aluminum base 11 has at least one accommodating groove 1121 , and a bonding area 1124 can be arranged only in the accommodating groove 1121 of the lower side 112 or can be arranged on the entire surface of the lower side 112 at the same time. and inside the accommodating groove 1121 . In this embodiment, the bonding area 1124 is selected to be disposed on the lower side surface 112 and the accommodating groove 1121 at the same time. The accommodating groove 1121 is radially (horizontally) from a side adjacent to the aluminum base 11 . The lower side surface 112 is bent and extended toward the other side of the aluminum base 11 for accommodating the copper two-phase flow element 13 . In addition, during the specific implementation, the aforementioned accommodating grooves 1121 can be plural, and the shape thereof can be, for example, an S shape, a U shape, an L shape, a figure 8 shape, a rectangle, or any combination of shapes.

A copper embedding layer 12 is disposed on the bonding area 1124 . In this embodiment, the copper embedding layer 12 is disposed on the lower side surface 112 of the aluminum base 11 and the accommodating groove 1121 , the copper insertion layer 12 has a deep surface 121 and a surface contact surface 122 (for welding and bonding), and the surface contact surface 122 of the copper insertion layer 12 serves as the copper insertion layer 12 The exposed surface of the copper insert layer 12 is flush with the surface of the lower side 112 and the accommodating groove 1121, and the deep surface 121 of the copper intercalation layer 12 is combined (for example, engaged or embedded) in the lower side 112 and the accommodating groove 1121 ( That is, the in-depth surface 121, the lower side surface 112 and the accommodating groove 1121 are in close contact or engagement with each other). Wherein, the copper embedded layer 12 can be copper powder or copper foil or copper sheet or liquid copper through mechanical processing (such as air pressure, hydraulic pressure, stamping or hydraulic extrusion) or surface treatment process (such as spraying, printing) Or chemical processing (such as electroplating, anodizing) is combined on the lower side 112 and the accommodating groove 1121, and part of the copper intercalation layer 12 will directly bite or embed into the lower side during the process of bonding and forming. 112 and the accommodating groove 1121 are deposited to form the deep surface 121 to strengthen the bonding force (bonding strength) of the copper insertion layer 12, thereby preventing the copper insertion layer 12 from passing from the lower side 112 and the accommodating surface. The groove 1121 is peeled off (separated).

When the copper two-phase flow element 13 is combined with the aluminum base 11 , the whole is embedded in the accommodating groove 1121 , and the copper two-phase flow element 13 and the copper of the accommodating groove 1121 are placed together. Into the layer 12 is combined (such as welding), wherein the shape of the copper two-phase flow element 13 is matched with the shape of the accommodating groove 1121. In the specific implementation, the number and shape of the copper two-phase flow element 13 The number and shape of the accommodating grooves 1121 can be matched, and the copper two-phase flow element 13 and the aluminum base 11 are made of different metal materials.

In addition, the copper two-phase flow element 13 can be, for example, a heat pipe or a temperature equalizing plate. In this embodiment, the copper two-phase flow element 13 is described as a heat pipe embedded in the accommodating groove 1121, but it is not limited to this. The copper two-phase flow element 13 can also be a temperature equalizing plate disposed on the lower side surface 112 or in the accommodating groove 1121 . And the copper two-phase flow element 13 has a chamber 135, the chamber 135 is filled with a working fluid (such as pure water), and the inner wall of the chamber 135 is provided with a capillary structure 133 (such as sintered powder body, groove, mesh) The copper two-phase flow element 13 has a two-phase flow contact surface 131 and a two-phase flow joint surface 132, and the two-phase flow joint surface 132 is connected to the two-phase flow joint surface 132. The copper embedded layer 12 in the accommodating groove 1121 is combined (eg, welded), and the two-phase flow contact surface 131 is flush with the lower side 112 of the aluminum base 11 (the lower side 112 can also be protruded or recessed). ), the two-phase flow contact surface 131 will receive a heat and then conduct it to the whole copper two-phase flow element 13 , so that the heat can be quickly and evenly conducted to the aluminum base 11 by the copper two-phase flow element 13 superior. 1 and 3, the copper heat conduction element 15 is a copper plate body (such as a copper base plate). In this embodiment, the copper heat conduction element 15 and the copper embedded layer 12 are made of the same metal material, and the copper heat conduction The element 15 and the aluminum base 11 are made of different metal materials (ie, different metal materials). And the copper heat conduction element 15 has a heat absorbing surface 151 and a heat transfer surface 152, the heat transfer surface 152 is connected to the copper embedded layer 12 and the copper on the lower side surface 112 of the aluminum base 11. The two-phase flow contact surfaces 131 of the phase flow element 13 are welded together.

The heat-absorbing surface 151 of the copper heat-conducting element 15 is attached to a heating element (such as a central processing unit or a graphics processor or other heat source); the heat-absorbing surface 151 of the copper heat-conducting element 15 is used to adsorb the heat The heat generated by the heating element is conducted to the heat transfer surface 152 , and then conducted to the aluminum base 11 through the copper intercalation layer 12 . Heat is quickly dissipated outwards.

In an alternative embodiment, the bonding region 1124 is selected to be disposed on any one of the lower side surface 112 and the accommodating groove 1121 , and the copper intercalation layer 12 can be disposed on any one of the lower side surface 112 and the accommodating groove 1121 . one on.

In the present invention, the copper embedded layer 12 is provided on the bonding area 1124 of the aluminum base 11 to be bonded, so that the copper two-phase flow element 13 and/or the copper heat conduction element of dissimilar metals can be directly connected to each other. 15 It can be directly welded without going through the nickel treatment process, which can not only effectively reduce the cost, but also achieve environmental protection and solve the problem of the shortage of existing nickel and phosphorus raw materials.

The above description is only illustrative rather than restrictive for the present invention. Those skilled in the art will understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. But all will fall within the protection scope of the present invention.

Claims (9)

1. A heat dissipating device, comprising:

an aluminum base having an upper side and a lower side, wherein the lower side has a bonding region, and the bonding region has a copper embedding layer; and

at least one copper two-phase flow element disposed in the bonding region such that the copper two-phase flow element is capable of bonding with the copper inlay.

2. The heat dissipating device of claim 1, wherein: the lower side surface is provided with at least one containing groove, the combining area is arranged in the containing groove, the copper two-phase flow element is a heat pipe and is embedded in the containing groove, and the copper two-phase flow element is combined with the copper embedding layer in the containing groove.

3. The heat dissipating device of claim 2, wherein: and a copper heat conduction element, wherein a heat transfer surface of the copper heat conduction element is combined with the copper embedding layer on the lower side surface and one side surface of the two-phase flow element.

4. The heat dissipating device of claim 1, wherein: the copper embedded layer is formed on the bonding region by mechanical processing or surface treatment process or chemical processing.

5. The heat dissipating device of claim 1, wherein: the copper embedding layer has a deep surface and a surface contact surface, the surface contact surface is combined on the combination area, and the deep surface is combined in the combination area.

6. The heat dissipating device of claim 1, wherein: the upper side surface of the aluminum base is provided with a plurality of radiating fins.

7. The heat dissipating device of claim 1, wherein: the copper two-phase flow element is a temperature-equalizing plate disposed on the lower side.

8. A heat dissipating device, comprising:

an aluminum base having an upper side and a lower side, wherein the lower side is formed with a bonding area;

a copper embedding layer disposed on the bonding region; and

at least one copper heat conduction element is disposed in the bonding region, so that the copper heat conduction element can be bonded with the copper embedding layer.

9. The heat dissipating device of claim 8, wherein: the copper heat conduction element is a copper base plate.

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