CN216820489U - Cooling device combination - Google Patents

Abstract

The utility model provides a heat dissipation device combination, which comprises an aluminum base, an aluminum fin group and at least one U-shaped copper heat pipe which is arranged in an upright or inverted manner, wherein the aluminum base is provided with at least one combining part, a copper embedding layer is arranged on the combining part, the aluminum fin group is arranged on the aluminum base, the copper heat pipe is provided with a heat dissipation part and a heat absorption part which are respectively combined on the combining part of the aluminum fin group and the aluminum base, and the heat dissipation device can directly carry out welding combination on the aluminum base and the copper heat pipe without nickel treatment by virtue of the arrangement of the copper embedding layer.

Description

Heat sink combination

technical field

The utility model relates to a heat dissipation device combination, in particular to a copper embedded layer arranged on the aluminum base or the position where the aluminum fin group is to be combined, so that the aluminum base is respectively different from the different parts. The metal copper heat pipe or the aluminum fin set of the same material can be directly welded and combined with the heat sink assembly without going through the nickel treatment process.

Background technique

Existing radiators or heat sinks are generally made of a combination of copper and aluminum. Since copper has the characteristics of high heat conduction efficiency, the existing heat sinks or heat sinks are usually made of copper as the heat dissipation base, as a solution to the problem. The heat generated by the execution unit (central processing unit, graphics card chip or other crystal or heat source) is exchanged for heat; however, if the heat sink or heat sink is made of copper, its weight is extremely heavy and the cost is high; The method is to directly contact the heat source and absorb the components (such as conduction units (pieces, bodies, seats), copper plates, heat pipes, temperature equalization plates, etc.) , radiator, heat sink) are made of aluminum material with relatively light weight and low cost, so as to reduce weight and cost.

For example, the current general heat dissipation device usually includes an aluminum base, a plurality of copper heat pipes, a snap-on aluminum fin set and a metal copper plate. The aluminum snap-on fin set consists of a plurality of multi-piece fins. Each fin has two folded edges, each folded edge has a buckle portion that protrudes outward, and the buckle portions of these fins are buckled with each other so that the two folded edges form the aluminum The top surface and the bottom surface of the snap-on fin set, and the aluminum snap-on fin set is arranged on the top surface of the aluminum base, and a heat-absorbing end of the copper heat pipes is accommodated in In a recessed groove on the bottom surface of the aluminum base, a heat dissipation end of the copper heat pipe is connected to the aluminum snap-on fin set, and finally covered with the metal copper plate on the aluminum base The bottom surface is used to contact the heat source.

However, since the aluminum surface of the aluminum base is easily oxidized, and the high melting point oxide (Al ₂ O ₃ ) will be generated during the welding process, it will directly hinder the fusion with the copper metal and bring difficulties to the welding, because if the copper When metal and aluminum metal are directly welded, the part where the two copper and aluminum materials are directly welded will be prone to cracks due to brittleness after welding; The eutectic of CuAl ₂ is easily formed in the weld, and the eutectic such as CuAl ₂ is distributed near the grain boundary, which is prone to fatigue and cracks between the grain boundaries. Moreover, the melting point and eutectic temperature of copper and aluminum are quite different, so when the surface of the aluminum is completely melted in the fusion welding operation, the copper is still in a solid state; on the contrary, when the copper is melted, the aluminum has already melted a lot and It is impossible to coexist in a eutectic or eutectic state, which greatly increases the difficulty of welding copper metal and aluminum metal. In addition, because the welding seam is prone to pores, and the thermal conductivity of copper metal and aluminum metal is very good, the molten pool metal crystallizes quickly during welding, so that the metallurgical reaction gas at high temperature cannot escape, so pores are easily generated. Based on the above problems, it is the reason why the contact surface between the aluminum base and the copper heat pipe and/or the metal copper plate cannot be directly welded.

Therefore, in order to solve the above-mentioned problems that the existing aluminum-copper metal cannot be directly welded and the above-mentioned extension, the method adopted by the industry is to perform surface treatment on the combined surface of the aluminum base, the copper heat pipe and/or the metal copper plate. After modification, it is convenient for dissimilar metal welding, that is, a layer of electroless nickel plating is required to be formed on the bottom surface of the aluminum base and the inner side of the groove or its relative bonding contact surface. Dissimilar metals (the two dissimilar metals are aluminum and copper) are welded. The taxis currently familiar with the art are the use of electroless nickel plating as a technical method of metal surface modification, which provides unique deposit properties, including deposit uniformity in deep depressions, holes and blind holes; among which electroless plating Nickel can also be called chemical nickel plating (Chemical Deposition) or autocatalytic plating method (Autocatalytic Plating) and it is classified into three types according to phosphorus content: low phosphorus, medium phosphorus and high phosphorus. The biggest difference between electroless nickel plating and electroplating is that its working environment is to use a reducing agent in the solution to reduce metal ions under the condition of no current, and the surface of the test piece must be catalyzed before electroless nickel plating.

However, although the above method can solve the welding problem of the aluminum base, the copper heat pipe and the metal copper plate, it also brings about environmental protection and other problems, because a large amount of chemical reaction liquid needs to be used in the electroless nickel plating process, and the After the electroless nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of waste water containing yellow phosphorus and other toxic substances will be produced in the industrial waste liquid. Yellow phosphorus sewage contains yellow phosphorus at a concentration of 50-390 mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and osteonecrosis of the mandible. Therefore, the current environmental awareness in various countries has begun to pay attention to and banned this electroless nickel plating related process, so efforts are made to promote the non-toxic process to protect the environment. In addition, the recent instability and severe shortage of nickel raw materials in electroless nickel plating in the global supply chain will also lead to higher overall costs.

Accordingly, how to weld and combine two dissimilar metals without using surface modification treatment is a problem that needs to be overcome urgently at present.

Utility model content

One object of the present invention is to provide a copper embedded layer on the aluminum base, through which the copper embedded layer can be directly welded with the copper heat pipe of different metals without surface modification, In order to effectively achieve the combination of heat sinks to reduce costs and protect the environment.

Another object of the present invention is to provide a copper embedded layer on the part to be combined of the aluminum base and the aluminum fin group, so that the heat transfer element of dissimilar metal does not need surface modification. It can be directly welded with high quality, so as to effectively achieve a combination of heat sinks that reduce costs and protect the environment.

For achieving the above object, the technical scheme adopted by the present utility model is:

A combination of heat sinks, characterized in that it includes:

an aluminum base with an upper side surface and at least a joint part, the joint part is provided with a copper embedded layer;

At least one set of aluminum fins is composed of a plurality of fins that are buckled with each other, and is located or combined above the aluminum base, each fin is provided with at least one through hole, the through hole penetrates the fin, and each An airflow channel is defined between the two fins, and the airflow channel is perpendicular or parallel to the upper side surface of the aluminum base;

At least one U-shaped upright or upside-down copper heat pipe has at least one heat dissipation portion penetrating the through hole of the at least one aluminum fin group, and also has a a heat absorbing part, the heat absorbing part is combined with the aluminum base through the copper embedded layer.

The heat dissipation device combination, wherein: the aluminum base has a side surface, and the joint is a groove or a through hole, and is selected to be located on the upper side or the lower side of the aluminum base or between the two , and the at least one aluminum fin group has a bottom surface, and the bottom surface corresponds to the upper side surface of the aluminum base.

The heat dissipation device combination, wherein: at least any one of the bottom surface of the at least one aluminum fin set and the upper side surface of the aluminum base is provided with the copper embedded layer, so that the at least one aluminum fin The bottom surface of the chip set is combined with the upper side surface of the aluminum base via the copper embedded layer.

The combination of the heat dissipation device, wherein: the joint part is arranged on the lower side surface of the aluminum base, and the heat absorption part is combined with the copper embedded layer of the joint part.

The heat dissipation device combination, wherein: also includes a copper heat conduction element, which has a heat transfer surface, and the copper embedded layer provided on the lower side of the aluminum base and the copper heat conduction element. The heat transfer surfaces are combined.

The heat dissipation device combination, wherein: the copper embedded layer is formed on the bottom surface of the at least one aluminum fin group and the upper surface of the aluminum base by mechanical processing or surface treatment process or chemical processing method. on the side and the joint.

The heat dissipation device combination, wherein: the copper embedded layer has a deep surface and a contact surface, and the contact surface is combined with the bottom surface of the at least one aluminum fin group and the upper side surface of the aluminum base and on the joint portion, the deep surface is combined with the bottom surface of the at least one aluminum fin group, the upper side surface of the aluminum base, and the joint portion.

The heat sink assembly, wherein: the through hole of each fin has a flange, the flange protrudes from one side of the fin and defines an inner side of the flange, and the inner side of the flange is provided with the copper A substance insertion layer is formed, and the copper substance insertion layer is combined with the heat dissipation part.

By means of the aluminum base and/or the aluminum fin set of the present invention to be combined with the copper embedded layer, the aluminum base can be directly connected to the copper heat pipes and/or copper heat pipes of dissimilar metals. The copper heat conduction element and the aluminum fin group of the same material can be directly welded without nickel treatment, so as to effectively achieve the effects of cost reduction and environmental protection.

Description of drawings

FIG. 1A is a schematic exploded perspective view of the present invention.

FIG. 1B is a schematic diagram of another perspective view of the three-dimensional exploded view of the present invention.

FIG. 2A is a three-dimensional combined schematic diagram of the present invention.

2B is a schematic cross-sectional view of FIG. 2A of the present invention.

FIG. 3 is a three-dimensional combined schematic diagram of another alternative embodiment of the copper heat pipe of the present invention.

Description of reference numerals: heat sink assembly 1; aluminum fin group 11; fins 110; first folded edge 1101; second folded edge 1102; Rim 1131; Flange inner side 1132; Air flow channel 114; Aluminum base 12; Upper side 121; Lower side 122; ; heat absorption part 141; heat pipe contact surface 1411; heat pipe joint surface 1412; heat dissipation part 142; capillary structure 143; heat pipe chamber 144;

Detailed ways

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

The present invention provides a heat dissipation device assembly 1, please refer to 1A, 1B, 2A, 2B, the heat dissipation device assembly 1 includes at least one aluminum fin group 11, an aluminum base 12, at least one copper heat pipe 14 and at least one copper heat conduction element 16; wherein, the aluminum fin set 11 is formed by a plurality of fins 110 interlocking with each other, each fin 110 has a first folded edge 1101 and a second folded edge 1102 convex The first folded edge 1101 and the second folded edge 1102 of the other adjacent fins 110 are stretched and aligned, and the first folded edge 1101 and the second folded edge 1102 are respectively provided with a buckling portion 1103. The buckling portion 1103 is in the Although this figure shows the structure of concave-convex matching, it is not limited to this, and also includes any combination of technical means. Each fin 110 is combined with the buckling portion 1103 and the buckling portion 1103 of the adjacent fins 110 in a buckling (buckling or overlapping) manner to form the aluminum fin of the buckle type. Set of fins 11. The first folding edges 1101 as described above together constitute a top surface 112 of the aluminum fin set 11 , and the second folding edges 1102 together constitute a bottom surface 111 of the aluminum fin set 11 .

Each fin 110 is provided with at least one through hole 113, the through hole 113 penetrates the fin 110, the through holes 113 are aligned with each other, and the through holes 113 are used for the copper heat pipe 14, a heat dissipation part 142 of 14 is connected through and combined, and the through hole 113 has a flange 1131 ringed around an edge of the through hole 113 and protrudes outward from one side of the fin 110 (the fin 110 is shown in the figure). front side) and defines a flanged inner side 1132. Furthermore, an outermost side of the aluminum fin set 11 is provided with an inverted fin 110 to prevent the first and second folding edges 1101 and 1102 from scratching other parts or accidentally injuring the user (as shown in FIG. 1A ). And an airflow channel 114 is defined between every two fins 110, and the airflow channel 114 is used to provide an external airflow to pass through to take away the heat on the fins 110. Of course, in the actual implementation of the present invention, the above mentioned At least one fan (eg, an axial flow fan) can be further disposed on the side of the fins 110 opposite to the airflow channel 114 , and the fan can generate external airflow to forcibly dissipate the heat from the fins 110 .

The aluminum base 12 has an upper side 121, a lower side 122 and at least one joint 123. The upper side 121 of the aluminum base 12 is combined with the bottom surface 111 of the aluminum fin set 11, but not Limited to this, the aluminum fin group 11 can also be located above the upper side surface 121 corresponding to the aluminum base 12 with a heat dissipation gap formed therebetween. And the airflow channel 114 of the aluminum fin set 11 is perpendicular to the upper side 121 of the aluminum base 12 , and the joint 123 can be a groove or a through hole and can be located on the upper side 121 or the lower side 122 or between the two, in this embodiment, the joint 123 is described as a groove disposed on the lower side 122 of the aluminum base 12 , but not limited to this, the joint 123 can also be a through hole running through the aluminum base 12 . The position between the upper and lower side surfaces 121 and 122 of the base 12 is controlled. The coupling portion 123 is used for coupling with a heat absorbing portion 141 of the copper heat pipes 14 . In addition, in the specific implementation, the shape of the joint portion 123 is matched with the shape of the heat absorption portion 141 of the copper heat pipe 14 , such as a flat shape, a circular shape, or a D shape.

1A and 2 , as shown in the figures, the upper and lower sides 121 and 122 of the aluminum base 12 and the joint 123 and the bottom surface 111 of the aluminum fin group 11 are respectively provided with a copper plate. The copper embedding layer 13 is, but not limited thereto, the copper embedding layer 13 may be provided only on the bonding portion 123 and/or the lower side surface 122 of the aluminum base 12 .

The above-mentioned copper insertion layer 13 has a deep surface 131 and a contact surface 132, and the contact surface 132 serves as the exposed surface of the copper insertion layer 13, the bottom surface 111 of the aluminum fin group 11 and the aluminum base The upper and lower side surfaces 121 and 122 of the seat 12 are combined with the joint portion 123 , and the deep surface 131 is combined with the bottom surface 111 of the aluminum fin set 11 and the upper and lower side surfaces of the aluminum base 12 . 121 , 122 and the joint portion 123 . Wherein the copper embedded layer 13 can be copper powder or copper foil or copper sheet or liquid copper through mechanical processing (such as air pressure, hydraulic pressure, stamping or hydraulic extrusion) or surface treatment process (such as spraying, printing) Or chemical processing (such as electroplating, anodizing) is formed on the bottom surface 111 of the aluminum fin group 11 and the upper and lower sides 121, 122 of the aluminum base 12 and the joint 123, and part of the The copper intercalation layer 13 will be directly engaged or embedded or embedded or penetrated into the bottom surface 111 of the aluminum fin group 11 and the upper and lower side surfaces 121 and 122 of the aluminum base 12 and the The deep surface 131 is formed by deposition in the bonding portion 123 . In this way, the copper intercalation layer 13 is not only bonded to the bottom surface 111 , the upper and lower side surfaces 121 , 122 and the joint portion 123 , but also the deep surface 131 is engaged or embedded or embedded or penetrated into the bottom surface 111 . The upper and lower side surfaces 121, 122 and the bonding portion 123 are deposited as the foundation of the copper insertion layer 13 to strengthen the bonding force (bonding strength) of the copper insertion layer 13, thereby preventing the copper insertion layer 13. The embedded layer 13 is peeled off (separated) from the bottom surface 111 of the aluminum fin group 11 , the upper and lower side surfaces 121 , 122 of the aluminum base 12 and the joint portion 123 . With the above arrangement, the upper and lower side surfaces 121 and 122 of the aluminum base 12 are respectively combined with the bottom surface 111 of the aluminum fin set 11 and the copper heat conduction element 16 via the copper intercalation layer 13 . , the heat absorbing part 141 of the copper heat pipe 14 is combined with the copper insert layer 13 of the joint part 123 of the aluminum base 12 (eg, welded joint).

In addition, the copper heat pipe 14 is U-shaped and can be set upright or upside down, and is made of different metal materials from the aluminum base 12 and the aluminum fin group 11 respectively. In this embodiment, the copper heat pipe 14 is made of U-shaped and inverted, each copper heat pipe 14 has a heat pipe chamber 144 filled with a working fluid (such as pure water), and a capillary structure 143 (such as sintered powder, grooves, meshes, fibers, bars, or any combination of the foregoing).

The copper heat pipe 14 has the heat absorption part 141 and at least one heat dissipation part 142 and a middle section 145 connecting the heat absorption part 141 and the heat dissipation part 142 . The heat dissipation part 142 penetrates the through hole 113 of the aluminum fin set 11 . and located above the upper side surface 121 of the aluminum base 12 , the heat absorbing portion 141 is combined with the joint portion 123 of the aluminum base 12 , and the heat absorbing portion 141 transmits the heat absorbed by the heat source to the remote heat dissipation The heat-absorbing portion 142 dissipates heat through the aluminum fin set 11 ; the heat-absorbing portion 141 has a heat-pipe contact surface 1411 and a heat-pipe joint surface 1412 , and the heat-absorbing portion 141 has a heat-pipe contact surface 1411 flush with the aluminum The lower side surface 122 of the base 12 , the heat pipe joint surface 1412 of the heat absorbing portion 141 and the copper insert layer 13 of the joint portion 123 are welded and joined, and the heat dissipation portion 142 passes through the through holes of the fins 110 113 and tightly fit with the inner side surface 1132 of the flange 1131, but not limited to this. In another alternative implementation, the heat dissipation portion 142 of the copper heat pipe 14 and the flange 1131 of the through hole 113 are loosely coupled, and the copper insert layer 13 and the copper material are provided on the inner side surface 1132 of the flange. The heat dissipation portion 142 of the heat pipe 14 is bonded (eg, welded).

In another alternative embodiment of the aforementioned copper heat pipe 14 , please refer to FIG. 3 , with reference to FIG. 1A , the copper heat pipe 14 is U-shaped and upright, and the middle section 145 of the copper heat pipe 14 is used as the heat absorbing part 141 is combined on the joint portion 123 of the aluminum base 12, the front and rear ends of the copper heat pipe 14 are respectively used as the heat dissipation portion 142 to be perpendicular to the aluminum base 12, and the aluminum fin set 11 is passed through, The plurality of fins 110 are perpendicular to the heat dissipation portion 142 of the copper heat pipe 14 , and the airflow channel 114 between each two fins 110 is parallel to the upper side surface 121 of the aluminum base 12 .

Furthermore, although the cross section of the heat dissipation portion 142 of the copper heat pipe 14 is shown as a circle, the heat pipe contact surface 1411 of the heat absorption portion 141 is a plane and is flush with the lower side surface 122 of the aluminum base 12, The cross section of the heat absorbing portion 141 is D-shaped (or flat). However, it is not limited to this, and in other alternative implementations, the cross-sections of the heat absorbing portion 141 and the heat dissipating portion 142 may both be circular, flat or D-shaped.

1B and FIG. 2B, the copper heat conduction element 16 is a copper plate body (such as a copper base plate). In this embodiment, the copper heat conduction element 16 and the aluminum base 12 are made of different metal materials, but the copper heat conduction element 16 is made of different metals. The heating pipes 14 are made of the same metal material. And the copper heat conduction element 16 has a heat transfer surface 161 and a heat absorption surface 162, the heat transfer surface 161 is respectively connected with the copper embedded layer 13 of the lower side surface 122 of the aluminum base 12 and the copper heat pipe The heat pipe contact surfaces 1411 of 14 are joined (eg welded joints).

The heat-absorbing surface 162 of the copper heat-conducting element 16 is attached to a heating element (such as a central processing unit or a graphics processor; not shown in the figure), and the heat-absorbing surface 162 is used to absorb the heat generated by the heating element. Conducted to the heat transfer surface 161, so that the heat pipe contact surface 1411 of the heat absorbing part 141 of the copper heat pipe 14 absorbs the heat of the heat transfer surface 161, and then conducts to the heat dissipation part 142 at the far end, and then uses the aluminum The fin group 11 discharges the heat on the heat dissipation portion 142 to the outside for heat dissipation.

At the same time, part of the heat on the heat transfer surface 161 will be absorbed by the copper embedded layer 13 on the lower side surface 122 of the aluminum base 12 , and the heat exchange will be performed outward through the aluminum base 12 .

Therefore, the copper intercalation layer 13 is provided at the position to be combined with the aluminum base 12 and/or the aluminum fin set 11 of the present invention, so that the aluminum base 12 can be directly connected with the dissimilar metals. The copper heat pipe 14 and/or the copper heat conduction element 16 and the aluminum fin group 11 can be directly welded without nickel treatment, which can not only effectively reduce the cost, but also achieve environmental protection and solve the problem of existing nickel phosphorus shortage of raw materials.

The above description is only illustrative rather than restrictive for the present invention. Those skilled in the art will understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. But all will fall within the protection scope of the present invention.

Claims (8)

1. A heat sink assembly, comprising:

an aluminum base having an upper side and at least a bonding portion, the bonding portion having a copper embedding layer;

at least one aluminum fin group which is formed by mutually buckling a plurality of fins and is positioned or combined above the aluminum base, wherein each fin is provided with at least one through hole which penetrates through the fins, an air flow channel is defined between every two fins, and the air flow channel is vertical to or parallel to the upper side surface of the aluminum base;

the U-shaped copper heat pipe is arranged upright or inverted, is provided with at least one heat dissipation part penetrating through the through hole of the at least one aluminum fin group and is also provided with a heat absorption part arranged at the combination part of the aluminum base, and the heat absorption part is combined with the aluminum base through the copper embedded layer.

2. The heat sink assembly of claim 1, wherein: the aluminum base is provided with a lower side surface, the combining part is a groove or a through hole and is selectively positioned on the upper side surface or the lower side surface or between the upper side surface and the lower side surface of the aluminum base, and the at least one aluminum fin group is provided with a bottom surface which corresponds to the upper side surface of the aluminum base.

3. The heat sink assembly of claim 2, wherein: at least one of the bottom surface of the at least one aluminum fin group and the upper side surface of the aluminum base is provided with the copper embedding layer, so that the bottom surface of the at least one aluminum fin group and the upper side surface of the aluminum base are combined through the copper embedding layer.

4. The heat sink assembly of claim 2, wherein: the combining part is arranged on the lower side surface of the aluminum base, and the heat absorbing part is combined with the copper embedded layer of the combining part.

5. The heat sink assembly of claim 2, wherein: also comprises a copper heat conduction element with a heat transfer surface, and the copper embedded layer arranged on the lower side surface of the aluminum base is combined with the heat transfer surface of the copper heat conduction element.

6. The heat sink assembly of claim 3, wherein: the copper embedded layer is formed on the bottom surface of the at least one aluminum fin set, the upper side surface of the aluminum base and the combining portion by a mechanical processing or surface treatment process or a chemical processing.

7. The heat sink assembly of claim 3, wherein: the copper embedded layer has a deep surface and a contact surface, the contact surface is combined on the bottom surface of the at least one aluminum fin group and the upper side surface and the combining portion of the aluminum base, and the deep surface is combined in the bottom surface of the at least one aluminum fin group and the upper side surface and the combining portion of the aluminum base.

8. The heat sink assembly of claim 1, wherein: the through hole of each fin is provided with a flange which protrudes from one side of the fin and defines a flange inner side surface, the flange inner side surface is provided with the copper embedded layer, and the copper embedded layer is combined with the heat dissipation part.

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