CN216925253U - Heat radiation module structure - Google Patents

Abstract

The utility model discloses a heat dissipation module structure, comprising: an aluminum base, a plurality of heat pipes and a copper insertion layer, one side of the aluminum base is provided with a heat pipe accommodating groove; the heat dissipation device is composed of a plurality of heat dissipation fins The heat dissipation device has a first heat pipe accommodating portion, the heat dissipation device and the aluminum base are arranged in parallel in a horizontal direction; the copper embedded layer is arranged in the heat pipe container of the aluminum base. On the surface of the first heat pipe accommodating part of the groove and the heat dissipation device; the plurality of heat pipes are made of copper material, one end has a heat absorption section, and the other end extends a condensation section along the horizontal direction, and the heat absorption section is arranged on the aforementioned A heat pipe accommodating groove, the condensing section passes through the first heat pipe accommodating part; thereby, the aluminum base, the plurality of heat pipes and the heat dissipation device can be directly welded and fixedly combined.

Description

Heat dissipation module structure

technical field

The utility model relates to a heat dissipation module structure, in particular to a heat dissipation module structure which can improve heat dissipation or the heat conduction elements are not easily welded together.

Background technique

Copper has the characteristics of high heat conduction efficiency, so the existing heat dissipation module structure often chooses copper as the base that directly contacts with the heat source and absorbs the heat generated by the heat source, and then transfers the absorbed heat from the copper base to the base as an accelerator. Heat pipes with heat conduction and fins that increase the heat dissipation area and have better heat dissipation efficiency, but the base and heat pipes or fins made of copper are heavy in overall weight and expensive in material cost. Replaced with lower aluminum fins and aluminum base.

Although the use of aluminum instead of copper can improve the weight of copper and the high cost of materials, aluminum is not without its shortcomings. For example, the surface of aluminum is easily oxidized, and high-melting oxides are generated during the welding process. It is difficult to fuse completely, which brings difficulties to welding.

If copper and aluminum are welded directly, the parts where the two materials are directly butted are prone to cracks after welding due to their high brittleness, and when copper and aluminum are welded, it is easy to form in the weld near the copper material side. CuAl ₂ and other eutectic structures, while CuAl ₂ and other eutectic structures are only distributed near the grain boundaries of the material, which are prone to fatigue or cracks between the grain boundaries, and because the melting point temperature and eutectic temperature of copper and aluminum are very different. In the fusion welding operation, when the aluminum melts, the copper remains in a solid state. When the copper melts, the aluminum has melted a lot and cannot coexist in a eutectic or eutectic state, which increases the difficulty of welding. The thermal conductivity of copper and aluminum is very good. The molten pool metal crystallizes quickly during welding, and the metallurgical reaction gas at high temperature does not have time to escape, so it is easy to generate pores. Therefore, copper and aluminum cannot be directly welded. After the surface is surface-modified, it can be used for subsequent welding operations with copper or other materials. Therefore, in order to improve the above-mentioned deficiencies that the existing copper or other dissimilar materials cannot be directly welded with aluminum materials, it is necessary to be familiar with this item. Skilled people use electroless nickel plating as a technical method for surface modification. There are three types of electroless nickel plating: low phosphorus, medium phosphorus, and high phosphorus. And electroless deposition (Electroless deposition) can also be called chemical plating (Chemical Deposition) or autocatalytic plating (Autocatalytic Plating), electroless nickel plating solution can be divided into the following three types: (1) activation sensitization + acid bath PH The ones planted between 4 and 6 belong to the acid bath, which is characterized by less loss of components due to evaporation. Although the operating temperature is higher, the bath is safe and easy to control, with high phosphorus content and high plating rate. , often used by industry. (2) Activation sensitization + alkaline plating solution The pH of the alkaline plating bath is between 8 and 10. Because the ammonia water used to adjust the pH is easy to volatilize, it is necessary to supplement the ammonia water in time to maintain the stability of the pH. The amount is less, the plating solution is less stable, and the operating temperature is lower. (3) HPM+Alkaline plating bath HPM is to immerse the silicon wafer in the mixed solution of DI-water:H ₂ O ₂ (aq):HCl(aq)=4:1:1 and utilize the oxide layer formed on the surface of the silicon crystal to Substitution sensitized activation to form an autocatalytic surface on the surface.

However, a large amount of chemical reaction liquid needs to be used in the electroless nickel plating process, and after the electroless nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of toxic substances such as yellow phosphorus will be produced in the industrial waste liquid. The waste water cannot be reused, and the waste water must be recycled and processed by a special unit, and the waste water cannot be directly discharged to avoid environmental pollution. Yellow phosphorus sewage contains yellow phosphorus at a concentration of 50-390 mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and other diseases such as mandibular necrosis. Therefore, countries have begun to ban this process and promote non-toxic processes to protect the environment.

Therefore, how to provide a surface modification method that can reduce the overall weight of the heat dissipation module structure and replace electroless nickel plating as a surface modification method for improving the inability of aluminum materials to be welded with other dissimilar materials, and at the same time, it is beneficial to welding operations without generating additional environmental pollutants. , is the primary goal at this stage.

Utility model content

In this way, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation module structure that can replace chemical nickel plating as an improved heat dissipation module structure that cannot be directly welded between aluminum heat dissipation elements and other dissimilar material heat dissipation elements.

For achieving the above object, the technical scheme adopted by the present utility model is:

A heat dissipation module structure, characterized in that it includes:

an aluminum base with at least one heat pipe accommodating slot on one side;

a heat dissipation device, a heat dissipation fin group composed of a plurality of heat dissipation fins buckled with each other, a first heat pipe accommodating part is provided on one side of the heat dissipation fin group, and the heat dissipation device is arranged in parallel with the aforementioned aluminum base in a horizontal direction;

A copper embedded layer is arranged on the surface of the heat pipe accommodating groove;

A plurality of heat pipes, the plurality of heat pipes are made of copper, one end of the plurality of heat pipes has a heat absorption section connected to the heat pipe accommodating groove, and the other end of the plurality of heat pipes extends a condensation section along the horizontal direction and is connected to the first side of the heat dissipation device at the distal end heat pipe housing;

The aluminum base, the heat dissipation device and the plurality of heat pipes can be directly welded and combined by the arrangement of the copper embedded layer.

The heat dissipation module structure, wherein: the heat dissipation device has a first heat dissipation fin group and a second heat dissipation fin group, the first heat dissipation fin group and the second heat dissipation fin group are made of aluminum, and the first heat dissipation fin group and the second heat dissipation fin group are made of aluminum. A set of heat dissipation fins has a plurality of heat dissipation fins, and each heat dissipation fin has at least a pair of folded edges, the plurality of heat dissipation fins are overlapped with each other through the at least one pair of folded edges, and the second heat dissipation fin set has a plurality of heat dissipation fins and each heat dissipation fin has at least a pair of folded edges, the plurality of heat dissipation fins of the second heat dissipation fin group are overlapped with each other through the at least one pair of folded edges of the second heat dissipation fin set, the first heat dissipation fin The fin group is stacked above the second heat dissipation fin group, and the first heat pipe accommodating portion is formed in a groove corresponding to but not combined with each other between the first heat dissipation fin group and the second heat dissipation fin group The heat pipe has a plurality of first heat pipes, the heat absorbing section of the plurality of first heat pipes is arranged in the heat pipe accommodating groove of the aluminum base, and the condensing section is arranged in the aforementioned first heat pipe accommodating part to be loose In cooperation, the copper embedded layer is provided on the surface of the first heat pipe accommodating portion, so that the condensation section and the first heat pipe accommodating portion can be directly welded and combined.

The heat dissipation module structure, wherein: the condensation section and the first heat pipe accommodating part are combined in a tight fitting manner, and the first heat pipe accommodating part is pressed into the condensation section.

The heat dissipation module structure, wherein: the heat dissipation device further has a third heat dissipation fin group and a fourth heat dissipation fin group, and the third heat dissipation fin group has a plurality of heat dissipation fins and each heat dissipation fin There is at least one pair of folded edges, and the plurality of heat dissipation fins are formed by overlapping with each other through the at least one pair of folded edges. The plurality of heat dissipation fins of the heat dissipation fin group are overlapped and assembled with each other through the at least one pair of folded edges of the fourth heat dissipation fin group, the third heat dissipation fin group is stacked above the fourth heat dissipation fin group, the The third heat dissipation fin group and the fourth heat dissipation fin group are arranged above the first heat dissipation fin group and the second heat dissipation fin group, and the fourth heat dissipation fin group and the first heat dissipation fin group are not in contact with each other, A second heat pipe accommodating portion is formed in a groove space between the third heat dissipation fin group and the fourth heat dissipation fin group, but is not combined with each other. The plurality of heat pipes also have a second heat pipe. The heat-absorbing section of the two heat pipes is arranged in the heat-pipe accommodating groove of the aluminum base, the condensation section is arranged in the second heat-pipe accommodating portion, and the third and fourth heat-dissipating fin groups are Aluminum material, the condensation section is loosely combined with the first heat pipe accommodating part and the second heat pipe accommodating part, and the copper embedded layer is provided on the surface of the first heat pipe accommodating part and the second heat pipe accommodating part , so that the condensation section, the first heat pipe accommodating part and the second heat pipe accommodating part can be directly welded.

The heat dissipation module structure, wherein: the copper embedded layer has an implanted surface and a contact surface on opposite sides of the copper embedded layer, and the implanted surface is embedded in the heat pipe accommodating groove and the first A surface of a heat pipe accommodating portion, and the contact surface is combined with a solder layer as the exposed surface of the copper embedded layer.

The heat dissipation module structure, wherein: there is also a solder layer disposed between the copper embedded layer and the plurality of heat pipes, the aluminum base is fixedly combined with the plurality of heat pipes and the heat dissipation device, and the aluminum base is fixedly combined with the plurality of heat pipes and the heat dissipation device. The mass base and the heat sink are arranged in parallel at the same height or at different heights.

A heat dissipation module structure, characterized in that it includes:

an aluminum base with a heat pipe accommodating slot on one side;

a heat sink having at least one radiator, a first heat pipe accommodating part on one side of the radiator, the heat sink and the aluminum base are arranged in parallel in the horizontal direction;

A copper embedded layer is arranged on the surface of the heat pipe accommodating groove;

A plurality of heat pipes, the plurality of heat pipes are made of copper, one end of the plurality of heat pipes has a heat absorption section connected to the heat pipe accommodating groove, and the other end of the plurality of heat pipes extends a condensation section along the horizontal direction and is connected to the first side of the heat dissipation device at the distal end heat pipe housing;

The aluminum base, the heat dissipation device and the plurality of heat pipes can be directly welded and combined by the arrangement of the copper embedded layer.

The heat dissipation module structure, wherein: the heat dissipation device has a first heat sink and a second heat sink, the first heat sink and the second heat sink are made of aluminum, and the first heat sink has a first base The seat has a plurality of heat dissipation fins extended on one side, the second heat sink has a second base and a plurality of heat dissipation fins extended on one side, and the first heat sink passes through the first base and the second heat sink. The two bases are attached to each other, the first heat pipe accommodating part is set in a groove space where the first base and the second base are not attached to each other, the heat pipe has a plurality of first heat pipes, the The heat absorbing sections of the plurality of first heat pipes are arranged in the heat pipe accommodating grooves of the aluminum base, and the condensing sections are arranged in the aforementioned first heat pipe accommodating parts in a loose fit, and the surface of the first heat pipe accommodating parts is provided with The copper embedded layer enables the condensation section and the first heat pipe accommodating portion to be directly welded and combined.

In the heat dissipation module structure, the condensation section is tightly coupled with the first heat pipe accommodating portion, and the first heat pipe accommodating portion presses against the condensation section.

The heat dissipation module structure, wherein: the heat dissipation device further has a third heat sink and a fourth heat sink, the third heat sink has a third base and a plurality of heat dissipation fins extending from one side, and the fourth heat sink The device has a fourth base with a plurality of heat dissipation fins extending from one side, the third heat sink is attached to each other through the third base and the fourth base of the fourth heat sink, the third heat sink, the fourth heat sink is arranged above the first radiator and the second radiator, the fourth radiator and the first radiator are not in contact with each other, and a second heat pipe accommodating part is arranged between the third base and the fourth base In a groove space not attached to each other, the plurality of heat pipes also have a second heat pipe, the heat absorption section of the second heat pipe is arranged in the heat pipe accommodating groove of the aluminum base, and the condensation section is arranged in the In the aforementioned second heat pipe accommodating portion, the third radiator and the fourth radiator are made of aluminum, and the condensing section is loosely combined with the aforementioned first heat pipe accommodating portion and the second heat pipe accommodating portion. The surface of the heat pipe accommodating part and the second heat pipe accommodating part is provided with the copper embedded layer, so that the condensation section and the first heat pipe accommodating part and the second heat pipe accommodating part can be directly welded.

The heat dissipation module structure, wherein: the copper embedded layer has an implanted surface and a contact surface on opposite sides of the copper embedded layer, and the implanted surface is embedded in the heat pipe accommodating groove and the first A surface of a heat pipe accommodating portion, and the contact surface is combined with a solder layer as the exposed surface of the copper embedded layer.

The heat dissipation module structure, wherein: the aluminum base and the heat dissipation device are arranged in parallel at the same height or different heights.

By replacing the electroless nickel plating with the copper embedded layer of the present invention, when an aluminum heat dissipation element is to be welded with other heat dissipation elements of different materials, it can pass through the surface of the part where the aluminum heat dissipation element is combined with other elements. The provision of the copper insertion layer improves the problem that aluminum heat conduction or heat dissipation elements are not easily welded to each other, and the copper insertion layer replaces the defects caused by the traditional electroless nickel plating layer.

Description of drawings

Fig. 1 is the combination diagram of the first embodiment of the heat dissipation module structure of the present invention;

2a is a cross-sectional view of the first embodiment A-A of the heat dissipation module structure of the present invention;

2b is a cross-sectional view of the first embodiment B-B of the heat dissipation module structure of the present invention;

3 is a combined view of the second embodiment of the heat dissipation module structure of the present invention;

4 is a combined view of the third embodiment of the heat dissipation module structure of the present invention;

FIG. 5 is a combined view of the fourth embodiment of the heat dissipation module structure of the present invention.

Description of reference numerals: aluminum base 1; heat pipe accommodating groove 11; heat dissipation device 2; first heat pipe accommodating portion 2a; first heat dissipation fin group 2b; second heat dissipation fin group 2c; third heat dissipation fin group 2d; fourth heat dissipation fin group 2e; second heat pipe accommodating portion 2f; first heat sink 2g; first base 2ga; heat dissipation fins 2gb; second heat sink 2h; third heat sink 2i; fourth heat sink Heat sink 2j; second base 2ha; heat dissipation fin 2hb; heat dissipation fin 21; hemming 211; copper intercalation layer 3; implant surface 31; contact surface 32; heat pipe 4; section 411; condensation section 412; second heat pipe 42; heat absorption section 421; condensation section 422; solder layer 5.

Detailed ways

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

Please refer to FIG. 1, FIG. 2a, and FIG. 2b, which are the combined view and cross-sectional view of the first embodiment of the heat dissipation module structure of the present invention. As shown in the figures, the heat dissipation module structure of the present invention includes: an aluminum base 1, a heat sink 2, a copper insert layer 3, a plurality of heat pipes 4, a solder layer 5;

One side of the aluminum base 1 has at least a heat pipe accommodating groove 11 , and the side of the aluminum base 1 where the heat pipe accommodating groove 11 is disposed is the heat absorbing side in contact with at least one heat source (not shown in the figure). , and the heat pipe accommodating groove 11 is used as a container and combined with the plurality of heat pipes 4, and the plurality of heat pipes 4 are placed in the heat pipe accommodating groove 11 and can be selected to be flush with the heat absorption side.

The heat dissipation device 2 is composed of a heat dissipation fin group formed by a plurality of heat dissipation fins, and a first heat pipe accommodating part 2a is arranged in the center or below the heat dissipation device 2 and the aluminum base 1. The aluminum base 1 and the heat sink 2 can be arranged in parallel or in parallel at the same height or at different heights.

In order to further increase the manufacturing convenience, the heat dissipation device 2 can be formed by combining a first heat dissipation fin group 2b and a second heat dissipation fin group 2c, and the first heat dissipation fin group 2b has a plurality of heat dissipation fins. fins 21 and each heat dissipation fin 21 has at least a pair of folded edges 211, the plurality of heat dissipation fins 21 are formed by overlapping with each other through the folded edges 211, the second heat dissipation fin groups 2c have a plurality of heat dissipation fins 21 and Each heat dissipation fin 21 has at least a pair of folded edges 211 , the plurality of heat dissipation fins 21 are overlapped and assembled with each other through the folded edges 211 , and the first heat dissipation fin set 2b is stacked on the second heat dissipation fin set Above 2c, and between the first heat dissipation fin set 2b and the second heat dissipation fin set 2c, a first heat pipe accommodating portion 2a for assembling and accommodating the plurality of heat pipes 4 is formed.

The plurality of heat pipes 4 have a heat absorbing section 411, the heat absorbing section 411 is disposed in the aforementioned heat pipe accommodating groove 11, the other end of the plurality of heat pipes 4 extends a condensing section 412 along the horizontal direction and is connected to the first section of the heat dissipation device 2 at the distal end. A heat pipe accommodating portion The first heat pipe accommodating portion 2a.

The copper embedding layer 3 is disposed on the surface of the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a, and the aluminum base 1 and the aluminum base 1 and the The heat dissipation device 2 and the plurality of heat pipes 4 can be directly welded and combined without nickelization treatment.

Disposing the solder layer 5 between the copper embedded layer 3 and the plurality of heat pipes 4 can further increase the bondability of the aluminum base 1 with the plurality of heat pipes 4 and the heat dissipation device 2 .

The two opposite sides of the copper embedded layer 3 respectively have an implanted surface 31 and a contact surface 32 (for welding and bonding), the implanted surface 31 is embedded in the heat pipe accommodating groove 11 and the first The surface of the heat pipe accommodating portion 2a penetrates or penetrates deep into the base body, and the contact surface 32 serves as the exposed surface of the copper insert layer 3 and is welded to the solder layer 5 or directly to another element of the same material or different material.

The condensing sections 412 of the plurality of heat pipes 4 can also be combined (loosely or tightly fitted) through the first heat pipe accommodating portion 2a of the heat dissipation device 2 in series. The copper insert layer 3 must be disposed at the joint of a heat pipe accommodating portion 2a and the condensation sections 412 of the plurality of heat pipes 4, so that the plurality of heat pipes 4 and the heat dissipation device 2 can be directly welded and combined. When the first heat pipe accommodating portion 2a is tightly coupled with the first heat pipe accommodating portion 2a, the first heat pipe accommodating portion 2a presses against the condensation section 412.

The copper embedded layer 3 is disposed on the corresponding joint portion of the aluminum base 1 and the plurality of heat pipes 4 by means of high-speed spraying, printing, electroplating, or machining, and the copper embedded layer 3 is a copper sheet. Or copper foil or copper powder or liquid copper is attached to the surface of the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a through mechanical processing (such as high pressure extrusion) or surface treatment process (spraying, electroplating or printing), And part of the copper embedded layer 3 will directly bite or be implanted or embedded in the surface of the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a during the process of attaching and forming. By inserting the copper insert layer 3 in this way, it is not only attached to the surface of the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a, but also the implant surface 31 is engaged or embedded or embedded in the heat pipe accommodating portion. The groove 11 and the first heat pipe accommodating portion 2a serve as the foundation of the copper embedded layer 3 to strengthen the bonding force between the copper embedded layer 3 and the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a , which can further prevent the copper embedded layer 3 from peeling off from the heat pipe accommodating groove 11 and the first heat pipe accommodating portion 2a.

Please refer to FIG. 3 , which is a combined diagram of the second embodiment of the structure of the heat dissipation module of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here, but this embodiment The difference between the first embodiment and the first embodiment is that this embodiment further has a plurality of second heat pipes 42, a third heat dissipation fin group 2d, and a fourth heat dissipation fin group 2e. The condensation section 412 extends horizontally and is combined with the first and second heat dissipation fin sets 2b and 2c, and the condensation sections 422 of the second heat pipes 42 are slightly higher than the first and second heat dissipation fin sets 2b and 2c. The rear extension is combined with the third heat dissipation fin group 2d and the fourth heat dissipation fin group 2e, that is, the third and fourth heat dissipation fin groups 2d and 2e are disposed higher than the first and second heat dissipation fin groups. 2b, 2c, and the fourth heat dissipation fin group 2e and the first heat dissipation fin group 2b are not in contact with each other, and a second heat pipe accommodating portion 2f is formed between the third and fourth heat dissipation fin groups 2d, 2e Corresponding to a groove space that is not combined with each other, the heat absorbing sections 421 of the second heat pipes 42 are disposed in the heat pipe accommodating grooves 11 of the aluminum base 1, and the condensation sections 422 are disposed in the aforementioned in the second heat pipe accommodating portion 2f.

The third and fourth heat dissipation fin groups 2d and 2e can also be arranged on the left and right sides of the first and second heat dissipation fin groups 2b and 2c and are horizontally juxtaposed with them, and then pass the condensation of part of the second heat pipe 42. Segment 422 is assembled with its connection.

Please refer to FIG. 4 , which is a combination diagram of the third embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here, but this embodiment The difference between this example and the aforementioned first embodiment is that the heat dissipation device 2 of this embodiment is at least one radiator, and a first heat pipe accommodating portion 2a is disposed at the center or the lower part thereof.

And for the convenience of manufacture and assembly, the heat sink 2 is composed of a first heat sink 2g and a second heat sink 2h, and the first heat sink 2g has a first base 2ga with a plurality of heat sinks extending on one side. Fins 2gb, the second heat sink 2h has a second base 2ha and a plurality of heat dissipation fins 2hb extending on one side, and the first heat sink 2g passes through the first base 2ga and the second heat sink 2h. The second bases 2ha are attached to each other, the first heat pipe accommodating portion 2a is disposed between the first and second bases 2ga, 2ha, the heat pipe 4 has a plurality of first heat pipes 41, and the plurality of first heat pipes 41 are The heat absorbing sections 411 are disposed in the heat pipe accommodating groove 11 of the aluminum base 1 , and the condensing sections 412 are disposed in the aforementioned first heat pipe accommodating portion 2 a.

Please refer to FIG. 5 , the first and second heat sinks 2g, 2h are made of aluminum, and the third and fourth heat dissipation fin sets 2d, 2e can also be replaced by a third heat sink 2i and A fourth radiator 2j is connected and joined by the condensing sections 422 of the second heat pipes 42, regardless of the condensing sections of the plurality of heat pipes 4 and the first, second, third and fourth fin sets 2b, 2c, 2d, 2e Or the first, second, third, and fourth heat sinks 2g, 2h, 2i, 2j are connected and assembled, or the first, second, third, and fourth heat dissipation fin sets 2b, 2c, 2d, 2e are connected and assembled correspondingly to each other. Parts and the parts where the first, second, third, and fourth heat sinks 2g, 2h, 2i, 2j are connected to each other correspondingly, must first be provided with the copper intercalation layer 3, and then the solder layer 5 through welding must be used to connect these parts. The first, second, third, and fourth heat sink fins 2b, 2c, 2d, 2e are connected and combined, and the first, second, third, and fourth heat sinks 2g, 2h, 2i, 2j are connected and combined with each other or with the plurality of The heat pipes 4 are combined.

In the above embodiments shown in FIGS. 4 and 5 , the aluminum base 1 and the heat dissipation device 2 are arranged in parallel at the same height or at different heights.

In the above-mentioned embodiments, the combination of the heat dissipation device 2 and the first and second heat pipes 41 and 42 can be a tight fit or a loose fit. The surface of the heat pipe accommodating parts 2a and 2f is provided with the copper inlay layer 3, so that the condensation section and the first and second heat pipe accommodating parts 2a and 2f can be directly welded. When the heat pipe accommodating parts 2a and 2f are combined in a tight fitting manner, the first and second heat pipe accommodating parts 2a and 2f press against the condensation section.

When the traditional heat dissipation module structure is manufactured, an aluminum base and a heat pipe are combined with an aluminum heat dissipation fin group or an aluminum heat sink. When the fins are joined, they must be combined by welding, but the aluminum material cannot be welded directly. The part to be welded of the heat pipe is first deposited with a nickel coating by means of electroless nickel plating, so that the plurality of heat pipes and the aluminum heat dissipation fin group or the aluminum base can be smoothly welded and combined. The environmental pollution has gradually been paid attention to and required to be improved. Therefore, the present invention provides a structural method to replace the traditional electroless nickel plating. By arranging a copper embedded layer in the part to be welded and joined, the plurality of heat pipes are And the aluminum heat dissipation fin group and the aluminum base can be smoothly welded and combined, so the utility model improves various pollution and other defects caused by the traditional heat dissipation module combination that must use chemical nickel plating through the copper embedded layer.

Claims (12)

1. A heat dissipation module structure, comprising:

an aluminum base, one side of which is provided with at least one heat pipe accommodating groove;

a heat sink, a heat-dissipating fin set composed of plural heat-dissipating fins fastened to each other, a first heat pipe containing part is provided on one side of the heat-dissipating fin set, the heat sink is parallel arranged with the aluminum base in the horizontal direction;

a copper embedding layer arranged on the surface of the heat pipe accommodating groove;

the heat pipe comprises a plurality of heat pipes, a plurality of heat pipes and a heat sink, wherein the heat pipes are made of copper materials, one end of each heat pipe is provided with a heat absorption section connected with the heat pipe accommodating groove, and the other end of each heat pipe extends to a condensation section along the horizontal direction and is connected with the first heat pipe accommodating part of the heat sink at the far end;

the aluminum base, the heat dissipation device and the plurality of heat pipes can be directly welded and combined through the arrangement of the copper embedded layer.

2. The heat dissipating module structure of claim 1, wherein: the heat sink has a first and a second heat-dissipating fin groups, the first and the second heat-dissipating fin groups are made of aluminum, the first heat-dissipating fin group has a plurality of heat-dissipating fins and each heat-dissipating fin has at least a pair of folded edges, the plurality of heat-dissipating fins are mutually overlapped and assembled through the at least a pair of folded edges, the second heat-dissipating fin group has a plurality of heat-dissipating fins and each heat-dissipating fin has at least a pair of folded edges, the plurality of heat-dissipating fins of the second heat-dissipating fin group are mutually overlapped and assembled through the at least a pair of folded edges of the second heat-dissipating fin group, the first heat-dissipating fin group is overlapped and assembled above the second heat-dissipating fin group, the first heat pipe accommodating part is formed in a groove space between the first and the second heat-dissipating fin groups, which is corresponding to but not mutually combined, the heat pipe has a plurality of first heat pipes, the heat absorbing section of the plurality of first heat pipes is arranged in the heat pipe accommodating groove of the aluminum base, the condensing section is arranged in the first heat pipe accommodating part in a loose fit manner, and the surface of the first heat pipe accommodating part is provided with the copper embedding layer, so that the condensing section and the first heat pipe accommodating part can be directly welded and combined.

3. The heat dissipating module structure of claim 1, wherein: the condensation section is tightly combined with the first heat pipe containing part, and the first heat pipe containing part is tightly pressed in the condensation section.

4. The heat dissipating module structure of claim 2, wherein: the heat sink also has a third and a fourth heat-dissipating fin groups, and the third heat-dissipating fin group has plural heat-dissipating fins and each heat-dissipating fin has at least one pair of folded edges, the plural heat-dissipating fins are overlapped and assembled with each other through the at least one pair of folded edges, the fourth heat-dissipating fin group has plural heat-dissipating fins and each heat-dissipating fin has at least one pair of folded edges, the plural heat-dissipating fins of the fourth heat-dissipating fin group are overlapped and assembled with each other through the at least one pair of folded edges of the fourth heat-dissipating fin group, the third and the fourth heat-dissipating fin groups are stacked and arranged above the first and the second heat-dissipating fin groups, the fourth heat-dissipating fin group is not contacted with the first heat-dissipating fin group, a second heat-dissipating fin accommodating part is formed on the third heat-dissipating fin group, a second heat-dissipating fin group is formed on the third heat-dissipating fin group, and a second heat-dissipating fin group is formed on the fourth heat-dissipating fin group, The heat pipe comprises a first heat pipe containing part, a second heat pipe containing part, a plurality of heat pipe containing parts and a plurality of heat pipe containing parts, wherein the plurality of heat pipe containing parts are arranged on the aluminum base, the plurality of heat pipe containing parts are correspondingly arranged on the aluminum base, the plurality of heat pipe containing parts are not mutually combined, the heat absorbing section of the second heat pipe is arranged in the heat pipe containing part of the aluminum base, the condensing section is arranged in the second heat pipe containing part, the third heat pipe containing part and the fourth heat pipe containing part are made of aluminum, the condensing section is loosely combined with the first heat pipe containing part and the second heat pipe containing part, the copper containing layers are arranged on the surfaces of the first heat pipe containing part and the second heat pipe containing part, and the condensing section can be directly welded with the first heat pipe containing part and the second heat pipe containing part.

5. The heat dissipating module structure of claim 1, wherein: the copper embedding layer is provided with an implanting surface and a contact surface on two opposite surfaces of the copper embedding layer, the implanting surface is embedded into the surfaces of the heat pipe accommodating groove and the first heat pipe accommodating part, and the contact surface is used as the exposed surface of the copper embedding layer to be combined with a solder layer.

6. The heat dissipating module structure of claim 1, wherein: and a solder layer arranged between the copper embedding layer and the plurality of heat pipes for fixedly combining the aluminum base with the plurality of heat pipes and the heat dissipation device, wherein the aluminum base and the heat dissipation device are arranged in parallel at the same height or different heights.

7. A heat dissipation module structure, comprising:

an aluminum base with a heat pipe accommodating groove on one side;

a heat sink having at least one heat sink, one side of the heat sink having a first heat pipe receiving portion, the heat sink being disposed in parallel with the aluminum base in the horizontal direction;

a copper embedding layer arranged on the surface of the heat pipe accommodating groove;

the heat pipe comprises a plurality of heat pipes, a plurality of heat pipes and a heat sink, wherein the heat pipes are made of copper materials, one end of each heat pipe is provided with a heat absorption section connected with the heat pipe accommodating groove, and the other end of each heat pipe extends to a condensation section along the horizontal direction and is connected with the first heat pipe accommodating part of the heat sink at the far end;

the aluminum base, the heat dissipation device and the plurality of heat pipes can be directly welded and combined through the arrangement of the copper embedded layer.

8. The heat dissipating module structure of claim 7, wherein: the heat dissipation device is provided with a first radiator and a second radiator, the first radiator and the second radiator are made of aluminum materials, the first heat sink has a first base and a plurality of heat dissipation fins extending from one side of the first base, the second heat sink has a second base and a plurality of heat dissipation fins extending from one side of the second base, the first heat radiator is mutually attached to the second base of the second heat radiator through the first base, the first heat pipe accommodating part is arranged in a groove space at the position which is not mutually attached between the first base and the second base, the heat pipe is provided with a plurality of first heat pipes, the heat absorption section of the plurality of first heat pipes is arranged in the heat pipe accommodating groove of the aluminum base, the condensation section is arranged in the first heat pipe accommodating part in a loose fit manner, the copper containing layer is disposed on the surface of the first heat pipe containing part, so that the condensation section and the first heat pipe containing part can be directly welded together.

9. The heat dissipating module structure of claim 7, wherein: the condensation section is tightly combined with the first heat pipe containing part, and the first heat pipe containing part tightly presses the condensation section.

10. The heat dissipating module structure of claim 8, wherein: the heat dissipating device also has a third heat sink and a fourth heat sink, the third heat sink has a third base and a plurality of heat dissipating fins extending from one side, the fourth heat sink has a fourth base and a plurality of heat dissipating fins extending from one side, the third heat sink is attached to the fourth base of the fourth heat sink through the third base, the third heat sink and the fourth heat sink are disposed above the first heat sink and the second heat sink, the fourth heat sink is not contacted with the first heat sink, a second heat pipe accommodating portion is disposed in a groove space between the third base and the fourth base, the plurality of heat pipes also has a second heat pipe, the heat absorbing section of the second heat pipe is disposed in the heat pipe accommodating groove of the aluminum base, the condensing section is disposed in the second heat pipe accommodating portion, the third heat sink and the fourth heat sink are made of aluminum, the condensation section is loosely combined with the first heat pipe accommodating part and the second heat pipe accommodating part, and the copper embedding layer is arranged on the surfaces of the first heat pipe accommodating part and the second heat pipe accommodating part, so that the condensation section can be directly welded with the first heat pipe accommodating part and the second heat pipe accommodating part.

11. The heat dissipating module structure of claim 7, wherein: the copper embedding layer is provided with an implanting surface and a contact surface on two opposite surfaces of the copper embedding layer, the implanting surface is embedded into the surfaces of the heat pipe accommodating groove and the first heat pipe accommodating part, and the contact surface is used as an exposed surface of the copper embedding layer to be combined with a solder layer.

12. The heat dissipating module structure of claim 7, wherein: the aluminum base and the heat sink are parallel arranged in the same height or different heights.

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