CN114269136A - Combination structure of cooling module - Google Patents
Combination structure of cooling module Download PDFInfo
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- CN114269136A CN114269136A CN202210103911.1A CN202210103911A CN114269136A CN 114269136 A CN114269136 A CN 114269136A CN 202210103911 A CN202210103911 A CN 202210103911A CN 114269136 A CN114269136 A CN 114269136A
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Abstract
The invention provides a heat radiation module combination structure, comprising: an aluminum base; the aluminum base is provided with a heat absorption side, a heat conduction side and a combination part, the combination part is selectively arranged on the heat absorption side or the heat conduction side or is embedded in the aluminum base (between the heat absorption side and the heat conduction side), the combination part is correspondingly combined with at least one copper heat pipe, a copper embedding layer is arranged at the contact and combination part of the combination part and the copper heat pipe, the aluminum base is fixedly combined with the copper heat pipe by arranging a solder layer between the copper embedding layer and the copper heat pipe, and the copper embedding layer replaces the existing chemical nickel plating so as to solve the problems of environmental pollution and the like.
Description
Technical Field
The present invention relates to a heat dissipation module assembly, and more particularly, to a heat dissipation module assembly with improved solder joints between heat dissipation elements.
Background
Copper has a characteristic of high heat conduction efficiency, so the existing heat dissipation module assembly structure usually selects copper as a base which is directly contacted with a heat source and absorbs heat generated by the heat source, and the copper base transfers the absorbed heat to a heat pipe for accelerating heat conduction and a fin which increases heat dissipation area and has better heat dissipation efficiency.
Although the problems of heavy weight of copper, high material cost and the like can be solved by selecting aluminum materials to replace copper materials, the aluminum materials are not free of defects, for example, the surface of aluminum is easy to oxidize, and high-melting-point oxides are generated in the welding process, so that the weld metal is difficult to completely fuse, and welding is difficult.
If the copper and the aluminum are directly welded, the part where the two materials are directly butted is easy to generate cracks due to high brittleness after welding, and during fusion welding of the copper and the aluminum, eutectic such as CuAl2 is easily formed in the welding seam close to the side of the copper material, the eutectic structure such as CuAl2 is only distributed near the grain boundary of the materials, so that fatigue or cracks between the grain boundaries are easily generated, and because the difference between the melting point temperature and the eutectic temperature of the copper and the aluminum is very large, during fusion welding operation, when the aluminum is melted, the copper is kept in a solid state, when the copper is melted, much aluminum is melted, so that the aluminum cannot coexist in a co-melting or eutectic state, so that the welding difficulty is increased, furthermore, the welding seam is easy to generate pores, because the heat conductivity of the copper and the aluminum is very good, the molten pool metal is quickly crystallized during welding, and the gold reaction gas at high temperature cannot escape too soon, so that the pores are easily generated, so that the copper and the aluminum materials cannot be directly welded, the surface of the aluminum material must be modified to perform the subsequent welding operation with the copper material or other materials, so in order to improve the above-mentioned drawback that the conventional modified aluminum material instead of the copper material cannot be directly welded with the copper or other dissimilar materials, people skilled in the art use electroless nickel plating as the surface modification technique, and there are three methods for electroless nickel plating: low phosphorus, medium phosphorus, high phosphorus. And Electroless Deposition (Electroless Deposition) can be called Chemical Deposition (Electroless Plating) or Autocatalytic Plating (Autocatalytic Plating), and Electroless Plating solutions can be classified into the following three types: (1) the activated sensitization and acid plating bath has a pH value of 4-6, belongs to an acid plating solution, and is characterized in that the loss of component amount caused by evaporation amount is less, although the operation temperature is higher, the plating solution is safer and easy to control, has high phosphorus content and high plating rate, and is commonly used in the industry. (2) The pH value of the alkaline plating bath of the activation sensitization and alkaline plating solution is between 8 and 10, and ammonia water for adjusting the pH value is easy to volatilize, so that the ammonia water is supplemented timely during operation to maintain the stability of the pH value, the phosphorus content is low, the plating solution is unstable, and the operation temperature is low. (3) HPM + alkaline plating bath HPM is prepared by soaking silicon wafer in DI-water H2O2(aq) HCl (aq) 4:1:1 mixturesThe liquid is activated by the sensitization of the oxide layer formed on the surface of the silicon crystal to form a self-catalytic surface on the surface.
The electroless nickel plating process needs a large amount of chemical reaction liquid, and a large amount of industrial waste liquid containing heavy metals or chemical substances is generated after the electroless nickel plating process, and the industrial waste liquid generates a large amount of waste water containing toxic substances such as yellow phosphorus and the like, and the waste water cannot be reused, and the waste water also needs to be recycled by a special responsible unit, so that the waste water cannot be directly discharged to avoid environmental pollution. The yellow phosphorus sewage contains yellow phosphorus with the concentration of 50-390 mg/L, and the yellow phosphorus is a highly toxic substance and has great harm to organs such as liver and the like when entering a human body. If drinking the water containing phosphorus for a long time, people can have osteoporosis and pathological changes such as mandibular necrosis. Therefore, the current countries have been prohibited from this process and promoted non-toxic processes to protect the environment.
Therefore, how to provide a method for reducing the overall weight of the heat dissipation module combination structure, replacing chemical nickel plating as a surface modification method for improving the problem that aluminum materials cannot be welded with other dissimilar materials, and being beneficial to welding operation without additionally generating environmental pollutants is the first important objective in the present stage.
Disclosure of Invention
Therefore, to effectively solve the above problems, the main objective of the present invention is to provide a heat dissipation module assembly structure that can replace electroless nickel plating to improve the problem that the aluminum heat dissipation element and other heat dissipation elements made of different materials cannot be directly welded.
To achieve the above object, the present invention provides a heat dissipation module assembly structure, comprising:
an aluminum base with a heat absorption side and a heat conduction side and a combination part, the combination part is selectively arranged on the heat absorption side or the heat conduction side, the combination part is correspondingly combined with at least one copper heat pipe, and a copper embedding layer is arranged at the contact combination part of the combination part and the copper heat pipe, so that the aluminum base and the copper heat pipe can be directly welded.
The heat dissipation module integrated configuration, wherein: the copper heat pipe is provided with a heat absorption part and a condensation part, the aluminum base is provided with a combination part, the heat absorption part is correspondingly assembled with the combination part of the heat conduction base, the condensation part is arranged at one end far away from the heat absorption part and can be selectively combined with other heat dissipation or heat conduction elements, and heat is conducted to the other heat dissipation or heat conduction elements in a far-end heat dissipation mode.
The heat dissipation module integrated configuration, wherein: the combining part is a groove which is selectively arranged on the heat absorption side or the heat conduction side in a concave mode.
The heat dissipation module integrated configuration, wherein: the copper embedding layer is provided with an embedding surface and a contact surface, the embedding surface and the contact surface are positioned on two opposite surfaces of the copper embedding layer, the embedding surface is embedded and deeply inserted into the combining part, the contact surface is used as the exposed surface of the copper embedding layer to be combined with the solder layer, and a solder layer is arranged between the copper embedding layer and the copper heat pipe to fixedly combine the aluminum base and the copper heat pipe.
To achieve the above object, the present invention further provides a heat dissipation module assembly structure, which includes:
an aluminum base with a heat absorption side, a heat conduction side and a combination part, wherein the combination part is arranged between the heat absorption side and the heat conduction side, the combination part is correspondingly combined with at least one copper heat pipe, and a copper embedding layer is arranged at the contact combination part of the combination part and the copper heat pipe, so that the aluminum base and the copper heat pipe can be directly welded.
The heat dissipation module integrated configuration, wherein: the joint part forms a through hole and penetrates through the aluminum base along the horizontal direction of the aluminum base.
The heat dissipation module integrated configuration, wherein: the copper embedding layer is provided with an embedding surface and a contact surface, the embedding surface and the contact surface are positioned on two opposite surfaces of the copper embedding layer, the embedding surface is embedded and deeply inserted into the combining part, the contact surface is used as the exposed surface of the copper embedding layer to be combined with the solder layer, and a solder layer is arranged between the copper embedding layer and the copper heat pipe to fixedly combine the aluminum base and the copper heat pipe.
By replacing chemical nickel plating with the copper embedded layer, when an aluminum radiating element is to be welded with other radiating elements made of different materials, the problem that the aluminum radiating element is not easy to weld can be solved by arranging the copper embedded layer on the surface of the part where the aluminum radiating element is combined with other elements, and the defects derived from the traditional chemical nickel plating layer are replaced by the copper embedded layer.
Drawings
Fig. 1 is an exploded cross-sectional view of a first embodiment of a heat dissipation module assembly structure of the present invention;
fig. 2 is a combined cross-sectional view of a first embodiment of the heat dissipation module assembly structure of the present invention;
fig. 3 is an assembled cross-sectional view of a second embodiment of the heat dissipation module assembly of the present invention;
fig. 4 is an assembled cross-sectional view of a third embodiment of the heat dissipation module assembly of the present invention;
description of reference numerals: an aluminum base 1; a heat absorption side 11; a thermally conductive side 12; a bonding portion 13; a copper heat pipe 2; a copper embedded layer 3; an implantation surface 31; a contact surface 32; a solder layer 4; and a heat radiation fin group 5.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and 2, which are exploded and assembled cross-sectional views of a first embodiment of a heat dissipation module assembly structure of the present invention, the heat dissipation module assembly structure of the present invention includes an aluminum base 1;
the aluminum base 1 has a heat absorbing side 11, a heat conducting side 12 and a combining portion 13, the combining portion 13 is selectively disposed on the heat absorbing side 11 or the heat conducting side 12 or embedded (embedded) in the aluminum base 1 (between the heat absorbing side 11 and the heat conducting side 12), the combining portion 13 is correspondingly combined with at least one copper heat pipe 2, and a copper embedding layer (3) is disposed at a contact combining portion of the combining portion 13 and the copper heat pipe 2, so that the aluminum base 1 and the copper heat pipe 2 can be directly welded, or a solder layer 4 is additionally disposed between the copper embedding layer 3 and the copper heat pipe 2 to fixedly combine the aluminum base 1 and the copper heat pipe 2, thereby further increasing the combining strength.
The opposite surfaces of the copper embedded layer 3 respectively have an implantation surface 31 and a contact surface 32 (for soldering), the implantation surface 31 is embedded deeply into the bonding portion 13 (i.e. the implantation surface 31 and the bonding portion 13 are tightly joined or engaged with each other), and the contact surface 32 is used as the exposed surface of the copper embedded layer 3 to bond with the solder layer 4.
In this embodiment, the combining portion 13 is configured as a groove, the groove is disposed on the heat absorbing side 11, the copper embedded layer 3 is disposed at the positions of the copper heat pipe 2 and the groove corresponding to the copper heat pipe 2, the welding combining property between the copper heat pipe 2 and the aluminum base 1 is enhanced by the copper embedded layer 3, and the copper heat pipe 2 can directly contact with a heat source (not shown) correspondingly to absorb heat generated by the heat source.
The copper embedded layer 3 is disposed at a corresponding combining portion of the aluminum base 1 and the copper heat pipe 2 by high-speed spraying, printing, electroplating, or machining, the copper embedded layer 3 is a copper sheet or a copper foil or copper powder or liquid copper adhered to the combining portion 13 by machining (such as high-pressure extrusion) or surface treatment (spraying, electroplating, or printing), and a portion of the copper embedded layer 3 is directly engaged with or implanted into or embedded into the combining portion 13 to form the implanted surface 31 during the adhering formation process. By means of the way, the embedded layer 3 embedded with the copper is not only attached to the combining part 13, the embedded surface 31 is more engaged with or embedded into the combining part 13 as the base of the embedded layer 3 with the copper, so as to enhance the combining force between the embedded layer 3 embedded with the copper and the combining part 13, and further prevent the embedded layer 3 with the copper from peeling off and falling off from the combining part 13.
The copper heat pipe 2 is provided with a heat absorption part and a condensation part, the heat absorption part is correspondingly assembled with the combination part of the aluminum base 1, the condensation part is arranged at one end far away from the heat absorption part and can be selectively combined with other heat dissipation or heat conduction elements, and the heat is conducted to other heat dissipation or heat conduction elements in a far-end heat dissipation mode.
Please refer to fig. 3, which is a combined cross-sectional view of a second embodiment of the heat dissipation module combination structure of the present invention, as shown in the drawing, and referring to fig. 2 together, the present embodiment has a part of the same structure as the first embodiment, and therefore will not be described herein, but the difference between the present embodiment and the first embodiment lies in that the combining portion 13 of the aluminum base 1 is a through hole, the through hole penetrates through two sides of the aluminum base 1 along the horizontal direction of the aluminum base 1, i.e. the through hole is deeply embedded (embedded) in the aluminum base 1, the through hole is disposed between the heat absorption side 11 and the heat conduction side 12, and the copper heat pipe 2 is capable of penetrating through the through hole to be combined with the aluminum base 1, and similarly, the aluminum base 1 and the copper heat pipe 2 are correspondingly combined to be the combining portion 13, i.e. the surface of the through hole is also provided with the copper embedding layer 3, and the solder layer 4 is arranged between the copper embedded layer 3 and the copper heat pipe 2 to ensure that the two layers are fixedly combined.
Please refer to fig. 4, which is a combined cross-sectional view of a third embodiment of a heat dissipation module combination structure of the present invention, as shown in the figure, this embodiment has the same structure as the first embodiment and will not be described herein again, but the difference between this embodiment and the first embodiment is that the combining portion 13 of this embodiment is a groove and is concavely disposed on the heat conducting side 12, the surface of the combining portion 13 is also similarly disposed with the copper embedding layer 3, the copper heat pipe 2 is correspondingly disposed in the combining portion 13, and the aluminum base 1 and the copper heat pipe 2 are combined and fixed by the arrangement of the solder layer 4, this embodiment further has a heat dissipation fin set 5, the heat dissipation fin set 5 is correspondingly disposed on the heat conducting side 12 of the aluminum base 1, the heat dissipation fin set 5 is made of aluminum, the portion where the heat dissipation fin set 5 and the copper heat pipe 2 are correspondingly combined, the portion where the heat conducting side 12 and the heat dissipation fin set 5 are correspondingly combined, and the combining portion 13 of the aluminum base 1 and the combining portion 13 of the heat dissipation fin set 5 are correspondingly combined with the aluminum base 1 The copper embedded layer 3 is disposed at the corresponding position of the heat pipe 2, and the solder layer 4 is disposed to weld the heat sink fin set 5, the copper heat pipe 2 and the aluminum base 1.
The invention can improve the traditional chemical nickel plating structure method by the structure combination, and the copper heat pipe, the aluminum heat dissipation fin and the aluminum base can be smoothly welded and combined by a copper embedding layer, so that the invention improves various pollutions and other defects which are caused by chemical nickel plating which is used for the traditional heat dissipation module combination by the copper embedding layer.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210103911.1A CN114269136A (en) | 2022-01-28 | 2022-01-28 | Combination structure of cooling module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210103911.1A CN114269136A (en) | 2022-01-28 | 2022-01-28 | Combination structure of cooling module |
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| CN114269136A true CN114269136A (en) | 2022-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210103911.1A Pending CN114269136A (en) | 2022-01-28 | 2022-01-28 | Combination structure of cooling module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390874A (en) * | 2022-01-28 | 2022-04-22 | 奇鋐科技股份有限公司 | Manufacturing method of heat dissipation module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332475A (en) * | 2000-06-26 | 2002-01-23 | 智翎股份有限公司 | Heat sink and manufacturing method thereof |
| TWM245465U (en) * | 2003-08-01 | 2004-10-01 | Cpumate Inc | Assembling structure of heat dissipating fin and heat pipe |
| CN101896049A (en) * | 2009-05-19 | 2010-11-24 | 晟铭电子科技股份有限公司 | Heat radiating module and production method thereof |
| CN217037775U (en) * | 2022-01-28 | 2022-07-22 | 奇鋐科技股份有限公司 | Combination structure of cooling module |
-
2022
- 2022-01-28 CN CN202210103911.1A patent/CN114269136A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332475A (en) * | 2000-06-26 | 2002-01-23 | 智翎股份有限公司 | Heat sink and manufacturing method thereof |
| TWM245465U (en) * | 2003-08-01 | 2004-10-01 | Cpumate Inc | Assembling structure of heat dissipating fin and heat pipe |
| CN101896049A (en) * | 2009-05-19 | 2010-11-24 | 晟铭电子科技股份有限公司 | Heat radiating module and production method thereof |
| CN217037775U (en) * | 2022-01-28 | 2022-07-22 | 奇鋐科技股份有限公司 | Combination structure of cooling module |
Non-Patent Citations (1)
| Title |
|---|
| 潘继民: "实用表面工程手册", vol. 2018, 30 September 2018, 机械工业出版社, pages: 838 - 840 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390874A (en) * | 2022-01-28 | 2022-04-22 | 奇鋐科技股份有限公司 | Manufacturing method of heat dissipation module |
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