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TWI769373B - 切割裝置 - Google Patents

切割裝置 Download PDF

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TWI769373B
TWI769373B TW108109041A TW108109041A TWI769373B TW I769373 B TWI769373 B TW I769373B TW 108109041 A TW108109041 A TW 108109041A TW 108109041 A TW108109041 A TW 108109041A TW I769373 B TWI769373 B TW I769373B
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Taiwan
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unit
frame unit
frame
cutting
workpiece
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TW108109041A
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TW201941282A (zh
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荒木田久志
平賀洋行
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
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    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
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  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sawing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

[課題] 提供一種作為紫外線照射裝置可起作用的切割裝置。[解決手段] 一種切割裝置，其具備：切割單元，其切割框架單元所含的工件；清洗單元，其清洗該框架單元；紫外線照射單元，其對該框架單元照射紫外線；搬送單元，其搬送該框架單元；以及控制單元；該控制單元具有處理模式登錄部，其登錄有：在可對該框架單元實施的多種處理的各處理中，該控制單元輸出到該各構成要素的指令；該處理模式登錄部中登錄有以下指令：切割裝置模式的指令，其係使切割單元切割該工件；以及紫外線照射裝置模式的指令，其係不使該切割單元切割該工件，而使紫外線照射單元對該框架單元照射紫外線；該控制單元具備輸出該指令到該各構成要素的功能。

Description

切割裝置
本發明係關於一種具備以切割刀片切割工件的切割單元之切割裝置。
在行動電話或個人電腦等電子機器所使用的元件晶片的製程中，首先，在由半導體等材料構成的晶圓正面上設定多條交叉的分割預定線。然後，在以該分割預定線劃分的各區域上形成IC（Integrated Circuit，積體電路）、LSI（Large Scale Integration，大型積體電路）等元件。
其後，將貼在環狀框架上的稱為切割膠膜的黏著膠膜黏貼在該晶圓的背面上，形成晶圓、黏著膠膜以及環狀框架成為一體的框架單元。然後，將框架單元所含的晶圓沿著該分割預定線（切割道）加工、分割。如此一來，在該黏著膠膜上形成個別的元件晶片。
分割晶圓，使用例如切割裝置。切割裝置具備例如經由黏著膠膜而保持晶圓等工件的卡盤台、切割工件的切割單元、以及清洗包含切割過的工件的框架單元之清洗單元等。再者，切割裝置具有載置容納多個框架單元的卡匣的卡匣載置部、搬送框架單元的搬送單元、以及控制切割裝置各構造的控制單元。
框架單元所使用的黏著膠膜包含例如含有紫外線硬化型樹脂的黏著層。該黏著層對晶圓等工件發揮強力的黏著力，另一方面，一照射紫外線，就會硬化而黏著力降低。然後，切割完畢，剝離貼在工件上的黏著膠膜時，對黏著膠膜照射紫外線，使黏著層的黏著力降低。對黏著膠膜照射紫外線，係使用例如具備發出紫外線的紫外線光源的紫外線照射裝置。
為了省略搬運包含切割後的工件的框架單元到紫外線照射裝置的工夫，更有效地形成元件晶片，開發了組裝有紫外線照射單元的切割裝置（參照專利文獻1以及專利文獻2）。
組裝有紫外線照射單元的切割裝置，係例如從載置於卡匣載置部上的卡匣利用搬送單元，將框架單元搬送到卡盤台上，以切割單元切割該框架單元所含的工件。然後，利用搬送單元從卡盤台搬送框架單元到清洗單元，以清洗單元清洗該框架單元。其次，搬送框架單元到紫外線照射單元，對黏著膠膜照射紫外線，其後，將該框架單元容納於卡匣內。 [習知技術文獻] [專利文獻]
[專利文獻1]日本特開2003－204887號公報 [專利文獻2]日本特開2006－295050號公報
[發明所欲解決的課題] 元件晶片的製造工廠內，依各種用途設置有多個切割裝置。搭載有紫外線照射單元的切割裝置比較昂貴，設置於製造工廠的所有切割裝置不一定都是搭載有紫外線照射單元的切割裝置。以未搭載有紫外線照射單元的切割裝置切割工件時，在該製造工廠內必須有對黏著膠膜照射紫外線的紫外線照射裝置。
然而，在該製造工廠內設置紫外線照射裝置，會因該紫外線照射裝置而消耗掉製造工廠內部有限的空間。此外，紫外線照射裝置本身也需要成本。因此，該製造工廠的生產性會降低。
本發明係鑑於這種問題點而完成的，作為其目的之處，係提供一種作為紫外線照射裝置可起作用的切割裝置
[解決課題的技術手段] 根據本發明之一個態樣，提供一種切割裝置，其具備：卡盤台，其保持框架單元，該框架單元包含環狀框架、黏貼於該環狀框架上且黏著力藉由照射紫外線而降低的黏著膠膜、以及該黏著膠膜黏貼的工件；切割單元，其以切割刀片切割保持於該卡盤台的該框架單元所含的該工件；清洗單元，其清洗包含以該切割單元切割過的該工件的該框架單元；紫外線照射單元，其對該框架單元的該黏著膠膜照射紫外線；卡匣載置部，其載置可容納該框架單元的卡匣；搬送單元，其在載置於該卡匣載置部上的該卡匣、該卡盤台、該清洗單元、以及該紫外線照射裝置之間搬送該框架單元；以及控制單元，其控制包含該切割單元、該清洗單元、該紫外線照射單元、以及搬送單元的各構成要素；其特徵在於：該控制單元具有處理模式登錄部，其登錄有：在可對該框架單元實施的多種處理的各處理中，該控制單元輸出到該各構成要素的指令；該處理模式登錄部中登錄有以下指令：切割裝置模式的指令，其係使該切割單元切割從該卡匣搬出並保持於該卡盤台的該框架單元所含的工件，使搬送單元搬送包含切割過的工件的該框架單元，使其搬入該卡匣內；以及紫外線照射裝置模式的指令，其係不使該切割單元切割從該卡匣搬出的該框架單元所含的工件，而使該紫外線照射單元對該框架單元照射該紫外線，使搬送單元搬送照射過紫外線的該框架單元，使其搬入該卡匣內；該控制單元具備下述功能：從處理模式登錄部取得與對該框架單元實施的處理對應的指令，輸出該指令到該各構成要素。
較佳為，該處理模式登錄部中進一步登錄有：清洗裝置模式的指令，其係不使該切割單元切割從該卡匣搬出的該框架單元，而使該清洗單元清洗該框架單元，使搬送單元搬送清洗過的該框架單元，使其搬入該卡匣內。
[發明功效] 關於本發明一個態樣的切割裝置，具備：切割單元，其可切割框架單元所含的工件；清洗單元，其可清洗框架單元；以及紫外線照射單元，其可對框架單元照射紫外線。進一步，該切割裝置具備控制各構成要素的控制單元，該控制單元具備處理模式登錄部，其登錄有與在切割裝置實施的各種處理對應的指令。
處理模式登錄部中登錄有：切割裝置模式的指令，其係切割工件；以及紫外線照射裝置模式的指令，其係對框架單元照射紫外線。控制單元從處理模式登錄部取得與在該切割裝置實施的預定處理對應的指令，輸出該指令到各構成要素，而使切割裝置實施各種處理。
例如，在切割裝置實施工件的切割時，控制單元從處理模式登錄部取得切割裝置模式的指令，輸出該指令到各構成要素，而使切割裝置實施工件的切割加工。此外，在切割裝置實施對框架單元的紫外線照射時，控制單元從處理模式登錄部取得紫外線照射裝置模式的指令，輸出該指令到各構成要素，而使切割裝置實施對該框架單元的紫外線照射。
在該紫外線照射裝置模式，不實施對工件的切割加工，而只對框架單元照射紫外線。即，以紫外線照射裝置模式控制切割裝置，該切割裝置就會作為紫外線照射裝置起作用，所以在元件晶片的製造工廠內配設有該切割裝置，就可削減紫外線照射裝置。
切割裝置是為了實施工件的切割而製作的裝置，以往切割裝置並未製作成可適當實施工件切割以外的處理。對此，在關於本發明一個態樣的切割裝置，處理模式登錄部中登錄有與各種處理對應的指令，控制單元輸出該指令到各構成要素，所以可適當實施切割以外的處理。
因此，根據本發明的一個態樣，可提供一種可作為紫外線照射裝置起作用的切割裝置。
茲參照附圖，就關於本發明一態樣的實施形態進行說明。首先，利用關於本實施形態的切割裝置實施各種處理的框架單元，進行說明。圖1為示意性表示關於本實施形態的切割裝置、卡匣、以及框架單元的立體圖。
框架單元7包含環狀框架5、黏貼於環狀框架5上的黏著膠膜3、以及黏著膠膜3黏貼的工件1。黏著膠膜3為稱為切割膠膜的膠膜，加工前以及加工後的工件1為該黏著膠膜3所支撐。
工件1為例如以矽、SiC（碳化矽）、或其他半導體等材料構成的晶圓、或者由藍寶石、玻璃、石英等材料構成的圓板狀的基板。如圖1所示，在該工件1的正面上設定有互相交叉的多條稱為切割道的分割預定線。
在由分割預定線所劃分的各區域上分別形成有IC（Integrated circuit，積體電路）或LED（Light emitting diode，發光二極體）等元件。沿著該分割預定線分割工件1，就可形成元件晶片。所形成的各個元件晶片為黏著膠膜3所支撐。然後，元件晶片從黏著膠膜3被剝離，最後被安裝於預定的安裝對象上。
黏著膠膜3包含例如由環氧樹脂、丙烯樹脂、合成橡膠、聚醯亞胺等構成的基材（未圖示）、以及該基材上的含有紫外線硬化型樹脂的黏著層（未圖示）。該黏著層對工件1發揮強力的黏著力，另一方面，一照射紫外線，就會硬化而黏著力降低。然後，剝離貼在工件1上的黏著膠膜3時，對黏著膠膜3照射紫外線，而使黏著層的黏著力降低。
黏著膠膜3的外周部黏貼有以金屬等形成的環狀框架5。在框架單元7的環狀框架5的貫穿孔的內部，工件1為黏著膠膜3所黏貼、支撐。工件1在黏著膠膜3與框架5成為一體的框架單元7的狀態被搬入切割裝置2，為安裝於切割裝置2上的切割刀片24所切割。其後，從由切割所形成的元件晶片的背面側使黏著膠膜3剝離。
其次，就切割裝置2的各構成要素，進行說明。如圖1所示，在切割裝置2的裝置基台4的角部配設有卡匣載置部6，該卡匣載置部6係載置容納多個框架單元7的卡匣9。卡匣載置部6具備支撐卡匣9的卡匣載置台6a。卡匣載置台6a利用後述的昇降機構48（參照圖2），可在上下方向（Z軸方向）昇降。
卡匣9具有箱型的殼體，該箱型的殼體在前面形成有將框架單元7搬出搬入的搬出搬入口11。在該箱型的殼體的兩側面，安裝有卡匣9的搬運者搬運卡匣9時抓持的把手13。
在卡匣9的殼體的兩側面側的內壁，形成有從各該內壁突出該殼體內部的多個支架（未圖示）。該多個支架形成於與卡匣9的兩側面分別對應的高度位置。框架單元7載置於該兩側面側所形成的對應的一對支架上，容納於卡匣9內。
在切割裝置2的裝置基台4上配設有搬出搬入手段8，該搬出搬入手段8係搬出搬入容納於卡匣載置台6a所支撐的卡匣9的內部的框架單元7。搬出搬入手段8具備例如可在Y軸方向移動的移動部、以及從該移動部突出於卡匣載置台6a的方向的抓持部。
將框架單元7搬入切割裝置2時，使卡匣9昇降，使對象的框架單元7的高度符合搬出搬入手段8的高度，使搬出搬入手段8在Y軸方向移動，使其進入卡匣9的內部。然後，使抓持部抓持框架單元7，使搬出搬入手段8在Y軸方向的反方向移動，搬送框架單元7到裝置基台4上的暫置區域10，解除該抓持部的抓持。
裝置基台4上配設有夾著暫置區域10的一對棒狀對位手段12。該對位手段12可沿著Y軸方向伸長，沿著X軸方向移動成互相接近，藉由夾住載置在暫置區域10上的框架單元7，將框架單元7定位於預定的位置。
裝置基台4上的暫置區域10與後述的卡盤台16之間配設有搬送手段14。搬送手段14具備連接於裝置基台4的軸部、從該軸部的上部伸長於水平方向的腕部、以及腕部前端的抓持部。搬送手段14以該抓持部抓持載置在暫置區域10上的框架單元7，藉由使軸部旋轉而使腕部旋轉，使框架單元7在卡盤台16上移動。
裝置基台4的上面配設有卡盤台16，該卡盤台16係保持包含將被切割加工的工件1的框架單元7。卡盤台16具備露出於上表面的多孔質構件、通到該多孔質構件的吸引路徑（未圖示）、以及連接於該吸引路徑基端側的吸引源（未圖示）。
使該吸引源作動，負壓就會作用於載置在卡盤台16上的框架單元7，將框架單元7吸引保持於卡盤台16上。即，卡盤台16的上表面成為保持面16a。卡盤台16的保持面16a的外周側配設有夾具18，該夾具18係抓持框架單元7所含的框架5。卡盤台16可繞沿著垂直於保持面16a的方向的軸旋轉。
切割裝置2具備使卡盤台16沿著X軸方向移動的X軸移動機構（未圖示）。卡盤台16在保持框架單元7的狀態下，在X軸方向移動，搬送框架單元7到加工區域，該加工區域係實施對框架單元7所含的工件1的切割的加工區域。
前進到該加工區域的路徑的上方配設有攝影機20。該攝影機20係拍攝放在通過下方的卡盤台16上的工件1。切割裝置2將工件1的方向與後述的切割單元22的位置調整（alignment）成可沿著工件1的分割預定線切割工件1。
該加工區域的上方配設有切割單元22，該切割單元22係切割載置在卡盤台16上的工件1。該切割單元22具備沿著Y軸方向伸長的主軸26、以及安裝於主軸26前端的環狀切割刀片24。主軸26利用馬達等旋轉手段（未圖示），可繞Y軸方向旋轉。藉由使主軸26旋轉，可使切割刀片24旋轉。
此外，切割單元22利用未圖示的昇降機構，可沿著Z軸方向昇降，利用未圖示的進退機構，可沿著Y軸方向進退。切割工件1時，使切割單元22下降成切割刀片24下端的高度位置低於工件1下端的高度位置，一面使切割刀片24旋轉，一面使卡盤台16在X軸方向移動。如此一來，切割刀片24切入工件1，可切割工件1。
裝置基台4的上表面配設有清洗單元30，該清洗單元30係清洗包含切割過的工件1的框架單元7。切割裝置2具備搬送手段28，該搬送手段28係從卡盤台16搬送框架單元7到清洗單元30。清洗單元30具備：清洗台32，其係載置該框架單元7；以及清洗噴嘴34，其係供應清洗液給載置在清洗台32上的框架單元7，清洗框架單元7。
清洗噴嘴34為管狀的構件，具備在清洗台32的外周側伸長於Z軸方向的軸部、從該軸部上端以相當於清洗台32中央部的長度伸長的腕部、以及配設於該腕部前端的噴出口。在清洗台32上放置框架單元7，一面從該噴出口使清洗液噴出，一面使軸部旋轉，就可清洗框架單元7。
再者，搬出搬入手段8、搬送手段14以及搬送手段28作為與框架單元7搬送有關的搬送單元而起作用。如圖2所示，卡匣載置台6a的下部配設有紫外線照射單元40。圖2為示意性表示紫外線照射單元40的立體圖。以清洗單元30清洗過的框架單元7為藉由該搬送單元所搬送到紫外線照射單元40。
如圖2所示，裝置基台4的內部配設有昇降機構48，該昇降機構48係使卡匣載置台6a以及紫外線照射單元40昇降。將框架單元7搬出搬入紫外線照射單元40時，紫外線照射單元40為藉由昇降機構48露出於裝置基台4的上方。
紫外線照射單元40具備：箱狀殼體44，其形成有沿著Y軸方向將框架單元7搬出搬入的搬出搬入口44a；以及一對支架46a，其從殼體44側壁的中央附近在內側突出，沿著Y軸方向伸長。殼體44的底壁與側壁連接的角部配設有與支架46a平行的一對支架46b。殼體44內部的一對支架46a以及一對支架46b之間的高度位置配設有多個紫外線光源42。
藉由紫外線照射單元40所照射紫外線的框架單元7被搬入一對支架46a上、或者一對支架46b上。將框架單元7搬入一對支架46a上，就可對框架單元7從背面側照射紫外線。此外，將框架單元7搬入一對支架46b上，就可從框架單元7的正面側照射紫外線。
從框架單元7的背面側照射紫外線，就可使框架單元7所含的黏著膠膜3硬化，減低對工件1的黏貼力，容易從工件1剝離黏著膠膜3。此外，從框架單元7的正面側照射紫外線，就可使工件1的正面側變質，例如可使正面親水性化。
紫外線照射單元40的殼體44的背面側配設有移動板56，該移動板56係被昇降機構48所可滑動地支撐著。紫外線照射單元40與卡匣載置部6經由移動板56而為昇降機構48所支撐著。該昇降機構48具備：一對導軌50，其係沿著Z軸方向而伸長；滾珠螺桿52，其係配設於該一對導軌50之間；以及脈衝馬達54，其係連接於該滾珠螺桿52的下端側，使滾珠螺桿52旋轉。
茲就藉由昇降機構48使紫外線照射單元40等昇降，進行說明。圖3為示意表示卡匣載置部6、以及紫外線照射單元40的剖面圖。移動板56的背面下部配設有與滾珠螺桿52螺合的螺母部。使脈衝馬達54旋轉，並使滾珠螺桿52旋轉，支撐紫外線照射單元40以及卡匣載置部6的移動板56就會沿著Z軸方向而在上下方向移動。
圖3表示將框架單元7搬入殼體44的支架46a上時的紫外線照射單元40與搬出搬入手段8的高度位置的關係。對框架單元7從背面側照射紫外線時，如圖3所示，利用昇降機構48，使紫外線照射單元40的支架46a的高度符合搬出搬入手段8的高度。
為紫外線照射單元40所照射過紫外線的框架單元7為搬出搬入手段8所拉出到殼體44的外側。其後，利用昇降機構48，使卡匣9的預定的容納位置符合搬出搬入手段8的高度，利用搬出搬入手段8從卡匣9的搬出搬入口11將框架單元7搬入該預定的容納位置。
茲就切割裝置2，使用圖1進一步進行說明。切割裝置2的裝置基台4上面的一端配設有輸入手段36，該輸入手段36係對切割裝置2輸入各種指示等。此外，裝置基台4的上部配設有顯示螢幕38，該顯示螢幕38係藉由顯示切割裝置2的處理的進行狀況或處理的內容、警告、操作畫面等。操作切割裝置2的作業者一面確認映在顯示螢幕38上的畫面，一面利用輸入手段36，操作切割裝置2。
切割裝置2進一步具備控制單元4a，該控制單元4a係控制包含切割裝置2的該切割單元22、該清洗單元30、該紫外線照射單元40、以及搬送單元的各構成要素。控制單元4a對卡匣載置部6、搬送單元、切割單元22、清洗單元30、紫外線照射單元40、昇降機構48等輸出指令而進行控制。
控制單元4a具有處理模式登錄部4b，該處理模式登錄部4b係登錄有：在切割裝置2可對框架單元7實施的多種處理的各處理中，控制單元4a輸出到該各構成要素的指令。控制單元4a從處理模式登錄部4b取得與對框架單元7實施的處理對應的指令，輸出該指令到該各構成要素。
處理模式登錄部4b中不僅登錄有關於以切割單元22切割框架單元7所含的工件1的處理的指令，而且還登錄有關於其他處理的指令。例如，登錄有關於不切割工件1，而對框架單元7照射紫外線的處理的指令、或者關於不切割工件1，而清洗框架單元7的處理的指令等。
習知的切割裝置是以切割工件為目的而設計的，搭載於切割裝置上的紫外線照射單元係處理包含為藉由切割單元所切割過的工件的框架單元。即，非意圖為對不是該切割裝置的其他切割裝置所切割過的工件、或者未實施切割的工件等實施紫外線照射的用途之設計。
因此，要使搭載有紫外線照射單元的習知的切割裝置只對框架單元適當實施紫外線照射並不容易，強制實施這種紫外線照射，可能會在切割裝置產生無法預期的問題等。
對此，關於本實施形態的切割裝置2在控制單元4a備有處理模式登錄部4b，該處理模式登錄部4b中登錄有只實施紫外線照射的紫外線照射裝置模式等的指令內容。然後，控制單元4a從處理模式登錄部4b取得該指令，輸出該指令到各構成要素。因此，切割裝置2可作為紫外線照射裝置起作用，可適當實施對框架單元7的紫外線照射，該框架單元7係包含不以該切割裝置2切割的工件1。
茲就登錄於處理模式登錄部4b的指令的一例，進行說明。圖4（A）為說明切割裝置模式的流程圖，圖4（B）為示意表示紫外線照射裝置模式的流程圖，圖4（C）為示意表示清洗裝置模式的流程圖。
首先，使用圖4（A），就切割裝置模式的指令，進行說明。所謂切割裝置模式，係使切割裝置2作為切割裝置起作用的模式，實施藉由切割單元22的切割、藉由清洗單元30的清洗、以及藉由紫外線照射單元40的紫外線照射。
在切割裝置模式，控制單元4a首先控制昇降機構48與搬出搬入手段8，從卡匣9搬出框架單元7。然後，控制對位手段12以及搬送手段14，將框架單元7載置在卡盤台16的保持面16a上，使卡盤台16保持框架單元7。其次，控制X軸移動機構與切割單元22，使該切割單元22切割該框架單元7所含的工件1。
其後，控制搬送手段28，從卡盤台16搬送框架單元7到清洗台32，控制清洗單元30，使工件1清洗。再控制昇降手段48、搬送手段14、以及搬出搬入手段8，將框架單元7搬入紫外線照射單元40，控制紫外線照射單元40，使紫外線照射於框架單元7。然後，控制昇降手段48與搬出搬入手段8，使包含切割過的工件1的框架單元7搬入卡匣9。
使切割裝置2作為切割裝置起作用時，控制單元4a從處理模式登錄部4b取得與切割裝置模式對應的指令，輸出該指令到各構成要素。
再者，在切割裝置模式，也可以在將框架單元7載置在卡盤台16的保持面16a上之前，對框架單元7的正面側照射紫外線，使工件1親水性化。此情況，控制昇降機構48與搬出搬入手段8，使框架單元7搬入紫外線照射單元40的一對支架46b上，藉此可對該正面側照射紫外線。
使紫外線照射於工件1的正面，使工件1切割、清洗後，將框架單元7再搬入紫外線照射單元40時，使其搬入支架46a上，從背面側使紫外線照射於框架單元7。處理模式登錄部4b中也可以作為與切割裝置模式對應的指令，登錄有切割工件1之前，對工件1的正面側照射紫外線的指令。
使用圖4（B），就紫外線照射裝置模式的指令，進行說明。所謂紫外線照射裝置模式，係使切割裝置2作為紫外線照射裝置起作用的模式，實施紫外線照射單元40的紫外線照射。
在紫外線照射裝置模式，控制單元4a首先控制昇降機構48與搬出搬入手段8，從卡匣9使框架單元7搬出。然後，控制昇降機構48，使紫外線照射單元40上升，控制搬出搬入手段8，使框架單元7搬入殼體44，控制紫外線照射單元40，使紫外線照射於框架單元7。
其後，控制搬出搬入手段8，從紫外線照射單元40使框架單元7搬出，控制昇降機構48，使紫外線照射單元40下降，控制搬出搬入手段8，使照射過紫外線的框架單元7搬入卡匣9。
使切割裝置2作為紫外線照射裝置起作用時，控制單元4a從處理模式登錄部4b取得與紫外線照射裝置模式對應的指令，輸出該指令到各構成要素。再者，在紫外線照射裝置模式，框架單元7所含的工件1未被藉由切割單元22切割。
此處，在紫外線照射裝置模式，將框架單元7搬入紫外線照射單元40時，可以使框架單元7搬入一對支架46a上，也可以使框架單元7搬入一對支架46b上。若使框架單元7搬入一對支架46a上，則可對框架單元7從背面側照射紫外線，若使框架單元7搬入一對支架46b上，則可對框架單元7從正面側照射紫外線。
處理模式登錄部4b中作為與紫外線照射裝置模式對應的指令，登錄有下述指令：使框架單元7搬入一對支架46a與一對支架46b的至少一方上，使紫外線照射於框架單元7。
再者，切割裝置2也可以作為只實施清洗單元30的清洗的清洗裝置而起作用。使用圖4（C），就清洗裝置模式的指令，進行說明。在清洗裝置模式，實施清洗單元30的清洗。
在清洗裝置模式，控制單元4a首先控制昇降機構48與搬出搬入手段8，從卡匣9使框架單元7搬出。然後，控制搬送單元，使框架單元7搬送到清洗單元30。其後，控制清洗單元30，清洗框架單元7，控制搬送單元，使清洗過的框架單元7從清洗單元30搬送到卡匣9。
使切割裝置2作為清洗裝置起作用時，控制單元4a從處理模式登錄部4b取得與清洗裝置模式對應的指令，輸出該指令到各構成要素。再者，在清洗裝置模式，框架單元7所含的工件1未被藉由切割單元22切割。
如以上說明，關於本實施形態的切割裝置2在處理模式登錄部4b登錄有與各種處理對應的指令，控制單元4a輸出該指令到各構成要素，所以可以適當實施切割以外的處理。因此，根據本實施形態，可以提供一種可作為紫外線照射裝置以及清洗而起作用的切割裝置2。
再者，本發明不受上述實施形態的記載限定，可以各種變更而實施。例如，在上述實施形態中，雖然就控制單元4a控制各構成要素而使各模式個別實施的情況，進行了說明，但本發明的一個態樣不受此限定。例如，控制單元4a也可以將各構成要素控制成同時實施兩個以上的模式。
例如，切割裝置2也可以在對第1工件以切割裝置模式實施處理之間，對第2工件以紫外線照射裝置模式實施處理。更具體而言，控制單元4a也可以在使第1工件以切割單元22切割之間，使第2工件搬入紫外線照射單元40，使紫外線照射於第2工件。此情況，利用切割裝置2，處理的效率變得極高。
其他，關於上述實施形態的構造、方法等，只要不脫離本發明目的的範圍，就可以適當變更而實施。
1‧‧‧工件 3‧‧‧黏著膠膜 5‧‧‧框架 7‧‧‧框架單元 9‧‧‧卡匣 11‧‧‧搬出搬入口 13‧‧‧把手 2‧‧‧切割裝置 4‧‧‧裝置基台 4a‧‧‧控制單元 4b‧‧‧處理模式登錄部 6‧‧‧卡匣載置部 6a‧‧‧卡匣載置台 8‧‧‧搬出搬入手段 10‧‧‧暫置區域 12‧‧‧對位手段 14‧‧‧搬送手段 16‧‧‧卡盤台 16a‧‧‧保持面 18‧‧‧夾具 20‧‧‧攝影機 22‧‧‧切割單元 24‧‧‧切割刀片 26‧‧‧主軸 28‧‧‧搬送手段 30‧‧‧清洗單元 32‧‧‧清洗台 34‧‧‧清洗噴嘴 36‧‧‧操作手段 38‧‧‧顯示螢幕 40‧‧‧紫外線照射單元 42‧‧‧紫外線光源 44‧‧‧殼體 44a‧‧‧搬出搬入口 46a、46b‧‧‧支架 48‧‧‧昇降機構 50‧‧‧導軌 52‧‧‧滾珠螺桿 54‧‧‧脈衝馬達 56‧‧‧移動板
圖1為示意性表示切割裝置、卡匣、以及框架單元的立體圖。 圖2為示意性表示卡匣載置部、以及紫外線照射單元的立體圖。 圖3為示意性表示卡匣載置部、以及紫外線照射單元的剖面圖。 圖4（A）為說明切割裝置示意性的流程圖，圖4（B）為說明紫外線照射裝置模式的流程圖，圖4（C）為說明清洗裝置模式的流程圖。

Claims (1)

  1. 一種切割裝置，其具備：卡盤台，其保持框架單元，該框架單元包含環狀框架、黏貼於該環狀框架上且黏著力藉由照射紫外線而降低的黏著膠膜、以及該黏著膠膜黏貼的工件；切割單元，其以切割刀片切割保持於該卡盤台的該框架單元所含的該工件；清洗單元，其清洗包含以該切割單元切割過的該工件的該框架單元；紫外線照射單元，其對該框架單元的該黏著膠膜照射紫外線；卡匣載置部，其載置可容納該框架單元的卡匣；搬送單元，其在載置於該卡匣載置部上的該卡匣、該卡盤台、該清洗單元、以及該紫外線照射裝置之間搬送該框架單元；以及控制單元，其控制包含該切割單元、該清洗單元、該紫外線照射單元、以及搬送單元的各構成要素；其特徵在於：該控制單元具有處理模式登錄部，其登錄有：在可對該框架單元實施的多種處理的各處理中，該控制單元輸出到該各構成要素的指令；該處理模式登錄部中登錄有以下指令：切割裝置模式的指令，其係使該切割單元切割從該卡匣搬出並保持於該卡盤台的該框架單元所含的工件，使搬送單元搬送包含切割過的工件的該框架單元，使其搬入該卡匣內；以及紫外線照射裝置模式的指令，其係不使該切割單元切割從該卡匣搬出的該框架單元所含的工件，而使該紫外線照射單元對該框架單元照射該紫外線，使搬送單元搬送照射過紫外線的該框架單元，使其搬入該卡匣內；該控制單元具備下述功能：從處理模式登錄部取得與對該框架單元實施的處理對應的指令，輸出該指令到該各構成要素；該處理模式登錄部中進一步登錄有：清洗裝置模式的指令，其係不使該切割單元切割從該卡匣搬出的該框架單元，而使該清洗單元清洗該框架單元，使搬送單元搬送清洗過的該框架單元，使其搬入該卡匣內。
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