TWI746328B - Resin molding device and manufacturing method of resin molded product - Google Patents

Abstract

The subject of the present invention is to provide a resin molding apparatus that can sufficiently approximate a molded object even if the elastic constant of the elastic member is not set too large. The solution to this problem is a resin molding apparatus having a molding die for molding a substrate 5 as a molding object, characterized in that the molding die includes an upper die 100 and an upper die 100 for determining The positioning member 141 for the position of the substrate 5 in the direction parallel to the lower surface. The resin molding apparatus further includes a molded object holding mechanism 150, a molded object block mechanism 110, a pusher 203, and a pressing mechanism 210. The resin molding apparatus of the present invention can be used for resin encapsulation of molded objects and the like.

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

In the manufacture of resin molded products, a positioning mechanism is sometimes used to determine the position of a substrate that is a molded object of resin molding. Specifically, as shown in FIGS. 6 to 8 of Patent Document 1, in a transfer resin molding apparatus, a positioning mechanism for positioning a substrate arranged on the lower surface of an upper mold is known. The positioning mechanism is provided with a substrate block mechanism that draws the substrate placed on the upper mold into contact with the reference pin for positioning. In this structure, since the substrate is arranged on the lower surface of the upper mold, in order not to drop the substrate, a substrate locking mechanism is provided, and a substrate flap mechanism that applies a rotational force is provided.

[Prior Technical Literature] Patent Document 1: JP 2010-027890 A.

[Problems to be Solved by Invention]

In the positioning mechanism shown in FIGS. 6 to 8 of Patent Document 1, the substrate is moved by the rotation operation of the substrate flap mechanism, and a torsion spring (elastic member) is used to apply the rotational force of the substrate flap mechanism. In the positioning using the substrate block mechanism like this, if the approaching force is small, there is a risk that the substrate as the molding target cannot be approached sufficiently. In order to solve the above problems, consider increasing the spring constant of the torsion spring to enhance the approaching force.

However, in the positioning mechanism described in Patent Document 1, since the molded object is arranged under the upper mold, it is necessary to insert the molded object between the reference pin and the pressing locking piece. Therefore, it is necessary to rotate the pressing member in the opposite direction to the approaching operation, and if the spring constant of the elastic member increases, there is a risk of hindering the insertion operation of the molded object.

Therefore, the object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can sufficiently approximate the molded object even if the spring constant of the elastic member is not set too large. [Methods to solve the problem]

In order to achieve the above-mentioned object, the resin molding apparatus of the present invention is a resin molding apparatus having a molding die for molding a molded object, and is characterized in that: The forming mold has an upper mold and a positioning member, and the positioning member is used to determine the position of the molded object in a direction parallel to the lower surface of the upper mold, The resin molding apparatus further includes a molded object holding mechanism, a molded object block mechanism, a pusher, and a pressing mechanism, The molded object can be held on the lower surface of the upper mold by the molded object holding mechanism, The movable block mechanism of the molded object includes a movable block and an elastic member, The movable part of the movable block can rotate about a rotation axis in a direction parallel to the lower surface of the upper mold as a center, Below the upper mold, a rotational force can be applied to the movable part of the movable block by the elasticity of the elastic member and the molded object can be pressed so that the molded object approaches the positioning member, A part of the lower surface of the movable portion of the movable block is pushed up by the pusher, thereby applying a stress to the elastic member, so that the movable portion of the movable block is opposite to that during the approaching operation of the molded object Direction rotation, By the pressing mechanism, the movable block of the movable block can be laterally pressed below the rotating shaft.

The method of manufacturing a resin molded product of the present invention is a method of manufacturing a resin molded product using a resin molding device, and is characterized in that: The resin molding device is the resin molding device of the present invention, The method of manufacturing the resin molded article includes a molded object position adjustment step of adjusting the position of the molded object, and a resin molding step of resin molding the molded object, The step of adjusting the position of the molded object includes The first molding object approaching step, under the upper mold, applying a rotational force to the movable part of the movable block through the elasticity of the elastic member and pressing the molding object to perform the first molding object approaching operation, So that the molded object approaches the positioning component, In the step of pushing up the movable part of the movable block, a part of the lower surface of the movable part of the movable block is pressed and pushed up by the pusher, thereby applying stress to the elastic member, causing the movable part of the movable block to face the first A shaped object rotates in the opposite direction when approaching, In the second molding object approaching step, the movable portion of the movable block is laterally pressed below the rotating shaft by the pressing mechanism, and the molding object approaches the positioning member. [Effects of the invention]

According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that can sufficiently approximate the molded object even if the spring constant of the elastic member is not set too large.

Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description.

In the resin molding apparatus of the present invention, for example, the molding target flap mechanism may be arranged on the upper mold.

The resin molding apparatus of the present invention further includes, for example, a molded object conveying mechanism that conveys the molded object, and the pressing mechanism may be arranged in the molded object conveying mechanism.

The resin molding apparatus of the present invention further has, for example, a molded object support mechanism that supports the molded object. The molded object supporting mechanism includes a molded object supporting movable part and an elastic member, The molded object supporting movable portion may be rotated about a rotation axis in a direction parallel to the lower surface of the upper mold.

In the resin molding apparatus of the present invention, for example, the rotation axis of the movable block may be located above the rotation axis of the molding object supporting movable portion.

In the method of manufacturing a resin molded article of the present invention, for example, the step of adjusting the position of the molded article further includes a step of uniformizing the temperature of the molded article, and after the step of approaching the first molded article, the second molded article Before the approaching step, the temperature of the molded object is homogenized.

In the method of manufacturing a resin molded product of the present invention, for example, the step of uniformizing the temperature of the molded object may include a holding operation, and the molded object is held on the lower surface of the upper mold by the molded object holding mechanism .

In the method of manufacturing a resin molded article of the present invention, for example, the resin molded article may be an electronic component.

According to the present invention, for example, it has a pressing mechanism that presses the movable part of the movable block laterally to allow the molded object to approach the positioning member, and the second molded object is approached by the above-mentioned pressing mechanism, thereby, the molded object can be further changed. Precise positioning. In addition, as a result, for example, the approaching operation of the molded object can be fully performed, and a more accurate positioning of the molded object can be realized without hindering the operation of arranging the molded object to the molding die.

In the present invention, the resin molding method is not particularly limited. For example, it may be compression molding, transfer molding, or injection molding.

In the present invention, the "molding mold" is, for example, a metal mold, but is not limited to this, and may be a ceramic mold or the like.

In the present invention, the resin molded product is not particularly limited. For example, it may be a resin molded product in which only resin is molded, or a resin molded product in which components such as a wafer are resin-encapsulated. In the present invention, the resin molded product may be an electronic component or the like as described above.

In the present invention, the resin material before molding and the resin after molding are not particularly limited. For example, they may be thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. In addition, it may be a composite material partially containing thermosetting resin or thermoplastic resin. In the present invention, the form of the resin material before molding includes, for example, pellet resin, liquid resin, sheet resin, plate resin, and powder resin. In addition, in the present invention, the liquid resin may be in a liquid state at room temperature, and includes a molten resin that is melted by heating and becomes a liquid state.

In addition, generally speaking, "electronic components" sometimes refer to a wafer before resin encapsulation, and sometimes refer to a state where the wafer is resin-encapsulated. However, in the present invention, when only "electronic components" are referred to, unless otherwise stated Indicate, it means that the chip is resin-encapsulated electronic component (as a finished electronic component). In the present invention, “wafer” means a wafer before resin encapsulation, and specifically refers to a wafer such as an integrated circuit (IC), an LED wafer, a semiconductor wafer, and a semiconductor element for power control. In the present invention, in order to distinguish from electronic components after resin encapsulation, the wafer before resin encapsulation is simply referred to as "wafer". However, the "wafer" in the present invention may be a wafer before resin encapsulation, and there is no particular limitation, and it does not have to be a wafer shape.

In the present invention, the “flip chip” refers to an IC chip having bump-like protruding electrodes called bumps on the electrodes (pads) on the surface of the IC chip, or this kind of wafer form. This wafer can be bonded to a wiring part such as a printed circuit board downward (face down), for example. The flip chip can be used, for example, as a chip for wireless bonding or one of bonding methods.

In the present invention, there is no particular limitation on the molded object molded by the resin, and may be, for example, a substrate. In addition, in the present invention, for example, a component (for example, a wafer, a flip chip, etc.) mounted on a substrate (molded object) may be resin-encapsulated (resin molding) to produce a resin molded product. In the present invention, the substrate (also referred to as an interposer) that is the molded object of resin molding is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a wafer, a glass epoxy substrate, a ceramic substrate, and a resin substrate. , Metal substrate, etc. The substrate may be, for example, a mounting substrate on which a wafer is mounted on one or both surfaces. There is no particular limitation on the mounting method of the wafer, and examples thereof include wire bonding, flip chip bonding, and the like. In the present invention, for example, by resin-encapsulating the mounting substrate, it is possible to manufacture electronic components in which the chip is resin-encapsulated. In addition, there are no particular restrictions on the use of the resin-encapsulated substrate by the resin molding apparatus of the present invention. Examples include LED substrates, high-frequency module substrates for mobile communication terminals, module substrates for power control, and machine control. Substrate and so on.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For the convenience of description, schematic descriptions such as appropriate omissions, exaggerations, etc. are made in each drawing. [Example]

In this embodiment, an example of the resin molding apparatus and the method of manufacturing a resin molded product of the present invention will be described.

The bottom view of FIG. 1 shows the main part of the bottom surface of the upper mold of an example of the resin molding apparatus of the present invention. In addition, the cross-sectional view of FIG. 2 shows a cross-sectional view of the main part of the upper mold that is the same as that of FIG. 1. The upper mold shown in the drawing is a part of the resin molding apparatus of the present invention. In addition, in FIG. 2, for convenience of description, the upper mold is shown upside down. That is, the upper side of FIG. 2 is the lower surface side of the upper mold (the side that holds the molded object).

As shown in FIGS. 1 and 2, the main constituent part of the upper mold 100 is a flat upper mold base member 101. The lower surface of the upper mold base member 101 is provided with a molded object holding member 102, a molded object block mechanism 110, a molded object support mechanism 120, a positioning pin 141 as a positioning member, and is elastic by the molded object block mechanism 110 The hinge pin 131 of the deformed hinge member. The molding target flap mechanism 110 includes a flap movable portion 111, a holding portion 112, and a torsion spring 113 as an elastic member. The movable block 111 and the torsion spring 113 are held on the lower surface of the upper mold 100 by the holding portion 112. The rotation axis 114 of the torsion spring 113 faces in a direction parallel to the lower surface of the upper mold 100. As described later, the movable block 111 can rotate about a rotation shaft 114 in a direction parallel to the lower surface of the upper mold 100. The molded object holding member 102 is provided near the center of the lower surface of the upper mold base member 101. The molded object holding member 102 has a flat plate shape, and the substrate 5 as a resin molded molded object can be held in an area near the center of the lower surface of the molded object holding member 102. The flap pin 131 and the positioning pin 141 are respectively mounted on the lower surface of the upper mold base member 101, penetrate the molded object holding member 102, and protrude from the lower surface of the molded object holding member 102. The flap pin 131 and the positioning pin 141 are arranged so as to surround the area of the substrate 5 holding the lower surface of the molded object holding member 102. The upper mold base member 101 is provided with a through hole 101a penetrating from the upper surface to the lower surface. The molded object holding member 102 is provided with a through hole 102a penetrating from the upper surface to the lower surface. The through hole 101a and the through hole 102a communicate with each other. In addition, the resin molding apparatus further has a molded object holding mechanism (not shown in FIGS. 1 to 5) for holding the substrate 5 on the lower surface of the molded object holding member 102. As described later, by suction and pressure reduction inside the through hole 101 a and the through hole 102 a by the molding object holding mechanism, the substrate 5 can be sucked and held on the lower surface of the molding object holding member 102. In addition, the molding object holding mechanism is not particularly limited, and may be, for example, a vacuum pump or the like.

The molded object supporting mechanism 120 includes a molded object supporting movable portion 121, a holding portion 122, and a torsion spring 123 as an elastic member. The molded object supporting movable portion 121 and the torsion spring 123 are held on the lower surface of the upper mold 100 by the holding portion 122. The rotation axis 124 of the torsion spring 123 faces in a direction parallel to the lower surface of the upper mold 100. The molded object supporting movable portion 121 can be rotated about a rotation axis 124 in a direction parallel to the lower surface of the upper mold 100 as described later.

The molding target support mechanism 120 is at the end of the substrate 5 and supports the lower surface of the end of the substrate 5. Two molding target block mechanisms 110 are provided so as to correspond to the two sides of the substrate 5. As will be described later, the movable block mechanism 110 of the molded object can apply a force to the end of the substrate 5 laterally and longitudinally by the movable block pin 131 so that the end surface of the substrate 5 contacts the positioning pin 141.

Next, referring to FIGS. 3 to 6, an example of a step of adjusting the position of a molded article as a part of a method of manufacturing a resin molded article using the above-mentioned resin molding apparatus will be described.

First, as shown in FIG. 3, the substrate 5 is conveyed by the molding target conveying mechanism 200 while the molding target conveying mechanism 200 is positioned below the upper mold 100. As shown in the figure, the above-mentioned molded object conveying mechanism 200 includes a molded object placement portion 202 on which a substrate 5 is placed, a movable block 111 of the molded object block mechanism 110, or a molded object of the molded object support mechanism 120. The pusher 203 that the object support movable portion 121 rotates, the pressing mechanism 210 that laterally presses the molded object block mechanism 110, and the load base 201 that supports the above-mentioned components. The pressing mechanism 210 has a pressing member 211, a rod 212, and an air cylinder 213. The air cylinder 213 is installed on the upper surface of the load base 201. The pressing member 211 is attached to the air cylinder 213 via the rod 212 and is arranged to protrude laterally toward the movable block 111. The rod 212 can advance and retreat by the power of the cylinder 213. As the rod 212 advances toward the movable block 111 side, the pressing member 211 can move in the direction of the movable block 111 to press the movable block 111. In addition, as a power source for enabling the pressing member 211 to advance and retreat, the air cylinder 213 is used for description here, but other power sources such as a servo motor may also be used.

In addition, in the state shown in FIG. 3, the movable block 111 presses the block pin 131 in the direction of the area holding the substrate 5 and deforms it elastically, so that the substrate 5 cannot be inserted. In addition, with regard to the positions of the rotation shafts of the molding target block mechanism 110 and molding target support mechanism 120, the position of the rotation shaft of the molding target block mechanism 110 is higher, so that the block pin 131 can easily move laterally .

Next, as shown by arrow X1 in FIG. 4, the load base 201 is raised. Thereby, the two pushers 203 respectively push up the movable block 111 of the molded object block mechanism 110 or the molded object support movable portion 121 of the molded object support mechanism 120 (the movable block is pushed up step). By the above-mentioned pushing up, stress is applied to the torsion spring 113, and the movable block 111 rotates in the opposite direction from the approaching operation of the first molded object described later, as indicated by the arrow X2 in the figure. As a result, the pressing of the movable portion of the movable block on the block pin 131 is released, and therefore, as shown in the figure, the elastic deformation of the block pin 131 is also released. As a result, the space between the positioning pin 141 and the movable block pin 131 becomes larger, and the substrate 5 can be inserted. In the above state, as shown by the arrow X3 in FIG. 4, the molding target placement portion 202 is raised, and the substrate 5 is inserted between the flap pin 131 and the positioning pin 141 and placed under the upper mold 100. In addition, the spring constants (spring constants) of the torsion springs 113 and 123 are preferably set to the extent that the push-up operation can be performed sufficiently during the push-up operation of the pusher 203 at this time.

Next, as shown by arrow X4 in FIG. 5, the load base 201 is lowered. Thereby, the two pushers 203 are respectively separated from the outer end portions of the movable block 111 of the molded object block mechanism 110 or the molded object support movable portion 121 of the molded object support mechanism 120, and the block movable portion 111 and The molded object supports the movable portion 121 to return to its original state. That is, as indicated by the arrow X5 in FIG. 5, the elasticity of the torsion spring 113 applies a rotational force to the movable block 111, and the outer end of the movable block 111 rotates in the descending direction. Here, stress is applied to the torsion spring 113 by the push-up operation of the push member 203, and therefore, since the push member 203 is lowered, the torsion spring 113 generates elastic force. As a result, as indicated by the arrow X6, the inner end of the movable block 111 of the molding target block mechanism 110 elastically deforms the block pin 131, and the block pin 131 presses the substrate 5. By the above-mentioned pressing, the substrate 5 is moved to approach the positioning pin 141 (first substrate approaching step). In addition, in the same manner, the elasticity of the torsion spring 123 applies a rotational force to the molded object supporting movable portion 121, and the molded object supporting movable portion 121 rotates in the descending direction. As a result, the upper surface of the inner protrusion of the supporting movable portion 121 contacts the lower surface of the end of the substrate 5 and supports the lower surface of the end of the substrate 5. In addition, in the above state, a small gap is formed between the molding target holding member 102 of the upper mold 100 and the substrate 5. In addition, the vertical position of the molding target placement portion 202 is configured not to change due to the lowering operation of the load base 201 shown by the arrow X4 in FIG. 5, so the lower surface of the molding target holding member 102 of the upper mold 100 The distance from the upper surface of the molding target placement portion 202 does not change. In addition, in the molding target placement portion 202, the upper surface of the inner protrusion of the molding target support movable portion 121 without contacting the molding target support movable portion 121 can support the lower surface of the end portion of the substrate 5. An avoidance part with a notch shape is formed.

Furthermore, as shown in FIG. 6, by driving the air cylinder 213 of the pressing mechanism 210, the rod 212 is advanced to the movable block 111 side. As a result, as indicated by the arrow X7 in the figure, the pressing member 211 moves to the movable block 111. Through the above movement, the movable block 111 is pressed laterally below the rotating shaft 114, and is rotated in the direction of the block pin 131 as indicated by the arrow X8 in the figure. As a result, the second molded object approach operation is performed, that is, the substrate 5 is pressed through the movable block pin 131 to bring the substrate 5 closer to the positioning member 141 (the second molded object approach step). For example, in the first molding object approaching step shown in FIG. 5, when the substrate 5 cannot be moved to contact the positioning pins 141, in the second molding object approaching step shown in FIG. 6, the approaching operation can be performed until The base plate 5 contacts the positioning pins 141. As described above, the step of adjusting the position of the molded object can be performed. Then, after the second substrate approaching step, as shown by the arrow A1 in FIG. 6, the inside of the through holes 101 a and 102 a is sucked and reduced by the molded object holding mechanism 150. The molding object holding mechanism 150 is not particularly limited as described above, and may be, for example, a vacuum pump or the like. Thereby, as shown in the figure, the substrate 5 is sucked and the substrate 5 is held on the lower surface of the molded object holding member 102 of the upper mold 100.

In addition, after the first molded object approaching step performed by the molded object block mechanism shown in FIG. 5, and before the second molded object approaching step performed by the pressing mechanism shown in FIG. 5 Steps to homogenize the temperature of the molded object for temperature homogenization. Specifically, for example, the temperature of the substrate 5 can be uniformized by allowing time between the first molding object approaching step shown in FIG. 5 and the second molding object approaching step shown in FIG. 6. For example, the substrate 5 can be heated by the upper mold 100 between the first molded object approaching step shown in FIG. 5 and the second molded object approaching step shown in FIG. 6 to achieve uniform temperature distribution of the substrate 5. Thus, for example, after the warpage of the substrate 5 is reduced, the second molding object approach step can be performed. If the second molding object approach step is performed after reducing the warpage of the substrate 5, for example, the generation of internal stress caused by the deformation of the substrate 5 can be reduced. When the substrate 5 is heated by the upper mold 100, for example, the substrate 5 can be adsorbed and held on the upper mold 100 after the first molding object approaching step, and then the substrate 5 is heated by the upper mold 100, and then the adsorption of the substrate 5 by the upper mold 100 is released. Then, the second step of approaching the molded object is performed.

In addition, as a modified example of FIGS. 1 to 6, in the pressing member 211, at least a part of the surface on the side contacting the movable block 111 may be inclined. Fig. 7 shows such a modification. FIG. 7 is the same as FIG. 6 and shows the second molding object approaching step, and then the step of holding the substrate 5 on the lower surface of the molding object holding member 102 of the upper mold 100. In the resin molding apparatus shown in FIG. 7, in the pressing member 211, the portion of the surface that abuts the movable block 111 that abuts on the movable block 111 goes down toward the movable block 111. Tilt in the opposite direction. By the above-mentioned inclination, for example, it is easy to apply force to the rotation direction of the movable block 111. In addition, the resin molding apparatus of FIG. 7 is the same as the resin molding apparatus of FIGS. 1-6. The steps shown in FIG. 7 can be performed the same as the steps shown in FIG. 6. Specifically, as shown by arrows X7 and X8 in FIG. 7, the second molding object approaching operation can be performed in the same manner as the arrows X7 and X8 shown with the same symbols in FIG. 6 (the second molding object approaching step ). In addition, as shown by the arrow A1 in FIG. 7, the substrate 5 can be sucked in the same manner as the arrow A1 in FIG. 6 to hold the substrate 5 on the lower surface of the molding target holding member 102 of the upper mold 100.

In the foregoing, an example of the resin molding apparatus of the present invention and an example of the step of adjusting the position of the molded object in the method of manufacturing a resin molded article using the above-mentioned resin molding apparatus and its modification have been described using FIGS. 1 to 7. In the present invention, for example, by the step of adjusting the position of the molded object including the second step of approaching the molded object, even if the elastic constant of the elastic member is not set too large, the molded object can be approached sufficiently. Because the elastic constant of the elastic member does not need to be set too large, for example, it is possible to suppress or prevent hindrance to the insertion operation of the molded object. In addition, for example, even if the elastic constant of the elastic member decreases with time, the molded object can be sufficiently approximated by performing the second molded object approximation step.

In addition, in the method of manufacturing a resin molded article of the present invention, the molded object approach step may be performed only twice, but it is not limited to this, and may be performed multiple times, and may be any number of times greater than three times. For example, in addition to the first molding object approaching step and the second molding object approaching step, it may also include a third molding object approaching step and a fourth molding object approaching step. In addition, in the method for manufacturing a resin molded article of the present invention, the molding object approaching step using the pressing mechanism may only be one time of the second molding object approaching step, but it is not limited to this, and may be any number of times or more. . For example, in addition to the second molded object approaching step, a pressing mechanism may be used to perform the third molded object approaching step, the fourth molded object approaching step, and so on. When the molding object approaching step using the pressing mechanism is performed twice or more, the second and subsequent molding object approaching steps can be, for example, the second molding object approaching step (the molding object using the pressing mechanism for the first time) Approximation step) in the same way.

In addition, as described above, the method of manufacturing a resin molded article of the present invention includes a resin molding step of resin molding the molded article in addition to the step of adjusting the position of the molded article. The above-mentioned resin molding step is not particularly limited, and, for example, it may be the same as the resin molding step of a general resin molded product manufacturing method, or may be appropriately changed. In addition, the resin molding method of the resin molding step is as described above and is not particularly limited. For example, it may be compression molding, transfer molding, injection molding, or the like.

In addition, the method of manufacturing a resin molded article of the present invention may include any steps other than the step of adjusting the position of the molded article and the resin molding step, or not.

1 to 7 show a part of the resin molding apparatus of the present invention (mainly showing an upper mold and a molding object conveying mechanism). The overall configuration of the resin molding apparatus of the present invention is not particularly limited, and the plan view of FIG. 8 schematically shows one example. The resin molding apparatus 1 shown in FIG. 8 is, for example, a resin molding apparatus using a compression molding method. This figure shows an example of using liquid resin as a resin material. The liquid resin may be a silicone resin or the like, for example. However, as described above, in the present invention, the form of the resin material before molding is arbitrary and is not limited to liquid resin. For example, as described above, granular resin, sheet resin, plate resin, and powdery resin may be mentioned. Resin etc. In addition, the type of resin material is also arbitrary as described above, and is not limited to silicone resin.

The resin molding apparatus 1 of FIG. 8 includes a substrate supply and storage module 2 for supplying and accommodating a substrate as a molding object, and three molding modules 3A, 3B, 3C, and a resin supply module 4 as components. The substrate supply and storage module 2 as components, the molding modules 3A, 3B, 3C, and the resin supply module 4 are detachable from each other with respect to other components, and can be replaced.

The substrate supply and storage module 2 is provided with a pre-packaged substrate supply section 6 for supplying a pre-packaged substrate 5, a packaged substrate storage section 8 for accommodating a packaged substrate (resin molded product) 7, a pre-packaged substrate 5 and a packaged substrate 7 The substrate mounting portion 9, the substrate conveying mechanism 10 that conveys the pre-packaged substrate 5 and the packaged substrate 7. The substrate transport mechanism 10 is provided with a camera 11 to photograph the positioning state of the substrate 5 before packaging when it is supplied to the mold surface of the molding die. As an imaging element, the camera 11 is equipped with a CCD (Charge “Coupled” Device) image sensor or a CMOS (Complementary “Metal” Oxide” Semiconductor) image sensor. The predetermined position S1 is a position where the substrate conveying mechanism 10 waits when it is not operating.

Each molding module 3A, 3B, 3C is provided with a lower mold 12 that can be raised and lowered, and an upper mold disposed opposite to the lower mold 12 (not shown in FIG. 8, refer to FIGS. 1 to 7). The upper mold and the lower mold 12 together constitute a forming mold. Each of the molding modules 3A, 3B, and 3C has a mold clamping mechanism 13 (a portion indicated by a two-dot chain line in the figure) for opening and closing the upper mold and the lower mold 12. The lower mold 12 is provided with a cavity 14 which is a space where a liquid resin as a resin material is supplied and cured. The lower mold 12 is provided with a release film supply mechanism 15 for supplying a long release film. In addition, the structure in which the cavity 14 is provided in the lower mold 12 is described here, but the cavity may be provided in the upper mold, or may be provided in the upper mold and the lower mold.

The resin supply module 4 is provided with a distributor 16 for supplying liquid resin to the molding die, and a resin conveying mechanism 17 for conveying the distributor 16. The distributor 16 includes a resin discharge portion 18 that discharges liquid resin to a tip portion. The predetermined position R1 is a position where the resin conveying mechanism 17 stands by when it is not operating.

The dispenser 16 shown in FIG. 8 is a single-liquid type dispenser using a liquid resin in which a main agent and a curing agent are mixed in advance. As the main agent, for example, a silicone resin or epoxy resin having thermosetting properties is used. It is also possible to use a two-liquid mixing type dispenser that mixes the main agent and the curing agent when discharging the liquid resin.

The resin supply module 4 is provided with a control unit 19. The control unit 19 includes a memory 20 that stores image data captured by the camera 11 provided in the substrate transport mechanism 10, a processor 21 that performs data processing such as image processing and arithmetic processing based on the captured image data, and a processor 21 for controlling resin molding Functions required by device 1, etc.

The control unit 19 controls the transportation of the pre-packaged substrate 5 and the packaged substrate 7, the positioning of the pre-packaged substrate 5, the supply of liquid resin, the heating of the molding die, the opening and closing of the molding die, and the like. In other words, the control unit 19 controls each operation of the board supply and storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4.

The position of the disposition control unit 19 is not limited, and may be disposed in at least one of the substrate supply and storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4, or may be disposed outside each module. In addition, the control unit 19 may be configured as a plurality of control units, and at least a part is separated according to the operation of the control object.

The resin molded product manufactured by the resin molding apparatus or the resin molded product manufacturing method of the present invention is not particularly limited, and for example, a microlens of a component such as a resin-encapsulated LED chip is preferable. In the above-mentioned microlens, it is necessary to precisely align the microlens formed by resin molding and the resin encapsulation component. That is, it is necessary to precisely align the position of the substrate on which the resin-encapsulated component is arranged. According to the present invention, even if the elastic constant of the elastic member is not set too large, the substrate can be approached sufficiently, so that the substrate alignment can be performed precisely and accurately. However, the resin molded product manufactured by the resin molding apparatus or resin molded product manufacturing method of the present invention is arbitrary and is not limited to microlenses. For example, it may be any electronic component in which any components such as wafers and leads are resin-encapsulated. The type and form of the wafer are not particularly limited, and for example, it may be at least one of the above-mentioned various forms (including flip chip).

Further, the present invention is not limited by the above-mentioned embodiments, and can be combined, changed, or selected arbitrarily and appropriately as required within the scope not departing from the gist of the present invention.

This case claims priority based on the Japanese patent application 2020-007873 filed on January 21, 2020, and all the contents disclosed are incorporated in this specification.

1: Resin molding device 2: Board supply and storage module 3A, 3B, 3C: molding module 4: Resin supply module 5: Substrate before packaging (substrate, molding object) 6: Substrate supply part before packaging 7: Packaged substrate (resin molded product) 8: Packaged substrate storage section 9: Board placement section 10: Substrate transport mechanism 11: Camera 12: Lower die 13: Clamping mechanism 14: Cavity 15: Release film supply mechanism 16: Distributor 17: Resin transport mechanism 18: Resin discharge part 19: Control Department 20: Memory 21: Processor 100: upper die 101: Upper die base part 101a: Through hole 102: Molded object holding part 102a: Through hole 110: Molding object block mechanism 111: movable part of live block 112: Holding part 113: Torsion spring (elastic part) 114: Rotation axis 120: Molding object support organization 121: Movable part for molding object support 122: Holding Department 123: Torsion spring (elastic part) 124: Rotation axis 131: Live block pins 141: Positioning pin (positioning part) 150: Molding object holding mechanism 200: Molding object conveying mechanism 201: Load base 202: Molding object placement part 203: Push pieces 210: pressing mechanism 211: Pressing parts 212: Rod 213: Cylinder A1, X1~X8: Arrow

FIG. 1 is a bottom view of the main part of an upper mold of an example of the resin molding apparatus of the present invention.

Fig. 2 is a cross-sectional view of the main part of the same upper mold as in Fig. 1.

3 is a step cross-sectional view showing one step of an example of the method of manufacturing a resin molded article of the present invention, and is a main view showing a state in which the molded object conveying mechanism is located below the same upper mold as in FIGS. 1 and 2 Partial cross-sectional view.

4 is a step cross-sectional view showing another step of the method of manufacturing a resin molded article similar to that of FIG. 3, and is a cross-sectional view of a main part for explaining an operation accompanying the ascending of the molded object conveying mechanism.

5 is a cross-sectional view of a step showing still another step in the method of manufacturing a resin molded product that is the same as that of FIG. 3, and is a cross-sectional view of a main part for explaining the operation accompanying the lowering of the molded object conveying mechanism in the first molding object approaching step .

6 is a step sectional view showing still another step in the method of manufacturing a resin molded article similar to FIG. 3, and is a main part sectional view illustrating the approaching operation by the pressing mechanism in the second molding object approaching step.

7 is a step cross-sectional view showing a modification of the resin molding apparatus and the method of manufacturing a resin molded product of FIGS. 1 to 6 and is a cross-section of a main part explaining the approaching operation by the pressing mechanism in the second molding object approaching step picture.

Fig. 8 is a plan view schematically illustrating the overall structure of the resin molding apparatus of the present invention.

2: Board supply and storage module 100: upper die 102: Molded object holding part 102a: Through hole 110: Molding object block mechanism 111: movable part of live block 112: Holding part 113: Torsion Spring 114: Rotation axis 120: Molding object support organization 121: Movable part for molding object support 122: Holding Department 123: Torsion Spring 124: Rotation axis 131: Live block pins 141: positioning pin 150: Molding object holding mechanism 200: Molding object conveying mechanism 201: Load base 202: Molding object placement part 203: Push pieces 210: pressing mechanism 211: Pressing parts 212: Rod 213: Cylinder A1, X7, X8: Arrow

Claims (8)

A resin molding device is a resin molding device having a molding die for molding a molded object, and is characterized in that: The molding mold has an upper mold and a positioning member, and the positioning member determines the position of the molded object in a direction parallel to the lower surface of the upper mold, and The resin molding apparatus further includes a molded object holding mechanism, a molded object block mechanism, a pusher, and a pressing mechanism, The molded object can be held on the lower surface of the upper mold by the molded object holding mechanism, The movable block mechanism of the molded object includes a movable block and an elastic member, The movable part of the movable block can rotate about a rotation axis parallel to the lower surface of the upper mold as a center, Below the upper mold, a rotational force can be applied to the movable part of the movable block by the elasticity of the elastic member and the molded object can be pressed so that the molded object approaches the positioning member, A part of the lower surface of the movable portion of the movable block is pushed up by the pusher, thereby applying a stress to the elastic member, and the movable portion of the movable block is moved in the opposite direction to that of the approaching operation of the molded object Rotating, By the pressing mechanism, the movable block of the movable block can be laterally pressed below the rotating shaft. The resin molding apparatus according to claim 1, wherein the molding target block mechanism is arranged on the upper mold. The resin molding mechanism according to claim 1 or 2, wherein: Further having a molded object conveying mechanism for conveying the molded object, The pressing mechanism is arranged in the molding object conveying mechanism. The resin molding apparatus according to claim 1 or 2, wherein: It further has a molded object support mechanism that supports the molded object, The molded object supporting mechanism includes a molded object supporting movable part and an elastic member, The molded object supporting movable portion may be rotated about a rotation axis in a direction parallel to the lower surface of the upper mold. The resin molding apparatus according to claim 4, wherein the rotation axis of the movable block is located above the rotation axis of the molded object supporting movable portion. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product using a resin molding device, characterized in that: The resin molding apparatus is the resin molding apparatus according to any one of claims 1 to 5, The method of manufacturing the resin molded article includes: a molded object position adjustment step of adjusting the position of the molded object; and a resin molding step of resin molding the molded object, The step of adjusting the position of the molded object includes: The first molding object approaching step, under the upper mold, applying a rotational force to the movable part of the movable block through the elasticity of the elastic member and pressing the molding object to perform the first molding object approaching operation, So that the molded object approaches the positioning component, In the step of pushing up the movable part of the movable block, a part of the lower surface of the movable part of the movable block is pressed and pushed up by the pusher, thereby applying stress to the elastic member, causing the movable part of the movable block to face the first A shaped object rotates in the opposite direction when approaching, In the second molding object approaching step, the movable portion of the movable block is laterally pressed below the rotating shaft by the pressing mechanism, and the molding object approaches the positioning member. The method of manufacturing a resin molded product according to claim 6, wherein the step of adjusting the position of the molded object further comprises: a step of uniformizing the temperature of the molded object, and after the first molded object approaching step, the second 2. Before the step of approaching the molded object, the temperature of the molded object is uniformized. The method of manufacturing a resin molded article according to claim 7, wherein the step of uniformizing the temperature of the molded object includes a holding operation, and the molded object is held on the upper surface by the molded object holding mechanism. The lower surface of the mold.

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