JP4474381B2 - Molded product fall prevention mechanism - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device.

  There are various types of resin-sealed molds for sealing a molded product such as a semiconductor chip with a resin using a mold. For example, in the method of supplying a molded product, there are formats that are supplied to the lower mold side and formats that are supplied to the upper mold side.

  Among these, a resin sealing apparatus 1 described in Patent Document 1 is known as an apparatus of a type in which a molded product is supplied to the upper mold side.

  In the resin sealing apparatus 1, the surface of the upper mold 10 is supplied to the pre-sealing substrate (molded product) 30 supplied to the upper mold 10 by suction using the suction / discharge holes 16, the communication holes 17, and the air-permeable member 18. Can be adsorbed and retained. Apart from this, a fall prevention mechanism for holding the pre-sealing substrate 30 by the chuck member (holding member) 13 is also provided.

  The pre-sealing substrate 30 held by suction is filled with resin, and the lower mold 20 comes into contact with the upper mold 10 to be resin-sealed. Reference numeral 15 denotes a seal member for maintaining the pressure around the pre-sealing substrate 30 after the upper mold 10 and the lower mold 20 are in contact with each other.

JP 2005-225133 A

  In the resin sealing device, the pressure around the molded product is generally reduced at the time of sealing in order to supply the input resin evenly without forming voids around the semiconductor chip. The mold is used in a heated state (for example, about 180 ° C.) in order to melt the resin to be charged. At this time, as in the resin sealing device 1 described in Patent Document 1, the power for operating the chuck member 13 that holds the pre-sealing substrate 30 is applied to the mounting rod 19 that penetrates the upper mold 10 in the vertical direction and the elasticity. If the configuration is obtained from the outside via the member 14, it is necessary to accurately seal the portion of the mounting rod 19 that penetrates the upper mold 10. Of course, it must also have heat resistance. As a result, the structure of the upper mold becomes complicated, and the manufacturing cost of the upper mold is increased. In addition, since the seal portion is increased, the reliability of decompression is also lowered.

  On the other hand, it is possible to hold the product to be molded on the surface of the upper mold only by suction force without adopting such a fall prevention mechanism (chuck member 13, mounting rod 19, elastic member 14). If the suction is not performed for some reason, an expensive molded product (a product such as a semiconductor chip) is dropped and damaged.

  Therefore, an object of the present invention is to provide a drop prevention mechanism that can reliably prevent the molded product from dropping with a simple structure and that does not reduce the decompression reliability.

The present invention relates to a drop prevention mechanism for a molded article supplied to the upper mold surface of a resin sealing device, and the fall prevention mechanism is disposed on the lower mold side of the upper mold, and has a holding position and release. A holding member that can hold and release the molded product by moving between positions, a support member that supports the holding member in a movable manner with respect to the upper mold, and a holding member. by configuring the anti-drop mechanism to comprise a power transmission structure for transmitting to said holding member from the lower mold side power for causing said movement solves the above problems.

  In this way, the holding member is moved (for example, repetitive movement) using the power received from the lower die side, and the repetitive movement can hold the molded article or release the holding member. It has become possible. That is, since power can be transmitted without penetrating the upper die in the vertical direction, it is not necessary to seal the upper die separately for holding the reduced pressure, and the reliability of the reduced pressure during sealing is not lowered. Further, since the structure of the upper mold itself is not complicated, the resin sealing device can be configured at low cost.

  In the present invention, the power transmission structure receives a power from the outside, moves the holding member from the holding position to the release position, and moves the holding member from the release position to the release position. A second action member that moves to the holding position, and when the external action power is not transmitted to the first action member, the second action member causes the holding member to be positioned at the holding position. It may be configured.

  As a result, the necessary external power is only one type (one direction) of force (the force that moves the holding member from the holding position to the held position). Therefore, for example, power that the lower mold mechanism attempts to contact the upper mold mechanism can be used, and the structure of the fall prevention mechanism can be simplified.

  By applying the present invention, the molded product can be prevented from dropping. Moreover, it is not necessary to newly arrange a seal member for maintaining the reduced pressure.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a structural diagram of a resin sealing device 100 including a fall prevention mechanism 130 which is an example of an embodiment of the present invention.

  The resin sealing device 100 includes an upper mold mechanism 101 and a lower mold mechanism 201. The upper mold mechanism 101 and the lower mold mechanism 201 can be brought into contact with and separated from each other by, for example, a press mechanism (not shown).

  The upper mold mechanism 101 is disposed so as to surround the upper mold base 120, the upper mold 110 installed and fixed on the lower side (lower mold mechanism 201 side) of the upper mold base 120, and the upper mold 110. And a pressure reducing seal 150. Further, on the lower mold mechanism 201 side of the upper mold 110, a fall prevention mechanism 130 (details will be described later) for preventing the article 300 supplied to the surface of the upper mold 110 from being dropped by a transport mechanism (not shown). Is equipped. Further, although not shown in the drawing, an adsorption hole (adsorption mechanism) capable of adsorbing and holding the molded product 300 is formed on the surface of the upper mold 110 (the surface of the lower mold mechanism 201 side).

  On the other hand, the lower mold mechanism 201 includes a lower mold base 220, a bottom mold 212 installed and fixed at a substantially central portion of the upper surface of the lower mold base 220, and arranged around the bottom mold 212 and to the lower mold base 220. The frame mold 214 is movable up and down, and the clamp spring 216 is movable up and down. In other words, a through-hole through which the bottom mold 212 can penetrate is formed in the frame mold 214, and the frame mold 214 can be moved up and down with the bottom mold 212 penetrating through the through-hole. The bottom mold 212 and the frame mold 214 constitute the lower mold 210.

  Next, the fall prevention mechanism 130 provided in the upper mold 110 will be described with reference to FIG. FIG. 2 is an enlarged view of the drop prevention mechanism 130 in FIG. 1, and FIGS. 2A to 2D show the steps of holding the molded product 300 by the drop prevention mechanism 130 in time series. Note that the position of the holding member 132 shown in FIG. 2A or FIG. 2D is a “holding position (position where the molded product can be held)”, and FIG. 2B or FIG. ) Is the “release position (position where the molded product cannot be held: position to release)”.

  The fall prevention mechanism 130 repeatedly rotates between the holding position and the release position to hold and release the product 300, and the holding member 132 is attached to the upper mold 110. A fixed pin (supporting member) 134 that is rotatably supported with respect to the holding member 132 and a power transmission structure 140 that transmits power for rotating the holding member 132 are provided. The holding member 132 is a member having a shape including a first crank portion 132B on the distal end side of the arm portion 132C and a second crank portion 132D on the rear end side. A further distal end side of the first crank portion 132B is configured as a claw portion 132A that directly holds the molded product 300. Further, the rear end side of the second crank portion 132D is configured as a base portion 132E that receives power from the outside. The holding member 132 is rotatably supported and fixed to the upper mold 110 by the fixing pin 134 described above in the second crank portion 132D.

  The power transmission structure 140 includes a first action member 136 and a second action member 138. The first action member 136 is a member that performs an action of moving the holding member 132 from the holding position to the release position, while the second action member has an action of moving the holding member 132 from the release position to the holding position. It is a member to perform. In the present embodiment, the first action member 136 is disposed on the upper surface of the upper pin 110 and a push pin 136A in which a part of the first action member 136 is protruded (to the lower die 210 side). And the first elastic body 136B. The first elastic body 136B is in contact with the head of the push pin 136A and at the same time is in contact with the base 132E of the holding member 132. Further, the elastic coefficient of the first elastic body 136B is set to be larger (not easily deformed) than the elastic coefficient of the second elastic body 138 described later. In other words, external power (reaction force received from the conveying device 400 in this embodiment) is transmitted to the push pin 136A, whereby the holding member 132 is interposed via the push pin 136A, the first elastic body 136B, and the base portion 132E. Can be rotated from the holding position to the release position (rotation in the direction of arrow B). A second elastic body 138 that is a second action member is disposed on the arm portion 132 </ b> C of the holding member 132. The second elastic body 138 is in contact with the upper mold 110 at the same time as being in contact with the arm portion 132C of the holding member 132. As a result, the second elastic body 138 is compressed and relaxed in conjunction with the holding member 132 repeating between the holding position and the release position. That is, it is in the most relaxed state when the holding member 132 is in the holding position, and the holding member 132 is rotated from the holding position to the releasing position by the first action member 136 described above and is simultaneously compressed. On the other hand, when transmission of power from the outside to the first action member 136 is released, the holding member 132 may be returned from the release position to the holding position (rotation in the direction indicated by arrow A) by its own elastic force. Is possible.

  Note that, as described above, the power transmission mechanism 140 receives external power from the lower mold mechanism 201 side (lower mold 210 side) and does not have a member that penetrates the upper mold 110 in the vertical direction. As a result, there is no need to separately seal the penetrating portion, and the reliability of pressure reduction does not decrease even when the pressure inside the mold is reduced during sealing.

  Various elastic members can be used. For example, rubber can be used to form a low cost structure, and springs can be used to form a fall prevention mechanism that is resistant to secular change. it can.

  Next, the operation of the fall prevention mechanism 130 will be described.

  As shown in FIG. 2A, the product 300 such as a semiconductor chip is transported and supplied to the surface of the upper mold 110 by the transport mechanism 400. At this time, the holding member 132 is still at the holding position and stands by, and in this state, the claw portion 132A becomes an obstacle and cannot receive the molded product 300.

  Next, as shown in FIG. 2B, as the transport mechanism 400 further moves up, a part of the upper surface of the transport mechanism 400 pushes up the push pin 136A. Accordingly, the holding member 132 rotates from the holding position to the release position via the push pin 136A, the first elastic body 136B, and the base portion 132E (rotation in the direction indicated by the arrow B). At this time, since the elastic coefficient of the first elastic body 136B is set to be larger than the elastic coefficient of the second elastic body 138, the second elastic body 138 overcomes the force to hold the holding member 132 in the holding position. The holding member 132 can be moved to the release position. Even when the elastic coefficients of the first and second elastic bodies 136B and 138 are the same, the distance from the fixed pin 134 that pivotally supports the holding member 132 (the position at which each elastic body abuts from the fixed pin 134). It is also possible to carry out the same action by changing the distance to.

  Further, the transport mechanism 400 continues to rise, but the transport mechanism 400 is allowed to rise due to the subsequent compression of the first elastic body 136B (there is still room for compression in the first elastic body 136B) ( FIG. 2 (C)).

  When the molded product 300 reaches the surface of the upper mold 110, the molded product 300 is sucked and held on the surface of the upper mold 110 by a suction mechanism (not shown). Thereafter, as shown in FIG. 2 (D), when the transfer of power to the push pin 136A is interrupted by the lowering of the transport mechanism 400, the molded product 300 is sucked and held on the surface of the upper mold 110. The holding member 132 in the release position is returned to the holding position by the second elastic body 138. Thus, the molded product 300 is sucked and held by the suction mechanism, and at the same time, the drop prevention mechanism 130 reliably prevents the drop.

  Note that the vertical movement of the transport mechanism 400 may be configured to receive power from the lower mold mechanism 201, for example, so that it is not necessary to separately provide a power source for moving the transport mechanism 400 up and down.

  Next, another embodiment of the fall prevention mechanism will be described with reference to FIGS. 3 and 4. 3 and 4 are both enlarged views of the fall prevention mechanism portion. Note that portions that are the same as or similar to the fall prevention mechanism 130 illustrated in FIG. 2 are described with the same reference numerals, and descriptions of overlapping configurations and operations are omitted.

  The fall prevention mechanism 130 ′ shown in FIG. 3 is different from the fall prevention mechanism 130 described above in that the second elastic body 138 as the second action member is arranged not on the arm portion 132 C of the holding member 132 but on the base portion 132 E. Is different. Here, the first elastic body 136B and the second elastic body 138 are arranged in the vertical direction across the base portion 132E of the holding member 132, and the second elastic body 138 comes into contact with the base portion 132E of the holding member 132. At the same time, it abuts on the upper mold 110. As a result, the holding member 132 can be rotated with respect to the upper mold 110. In consideration of the size and thickness of the upper mold 110, it is possible to adopt such a configuration.

  Next, the fall prevention mechanism 130 ″ shown in FIG. 4 does not rotate the holding member 132 between the holding position and the release position and repeatedly moves, but does not move repeatedly by sliding. 300 can be held and released.

  The holding member 132 has a claw portion 132 </ b> A that holds the molded product 300. Further, a groove 132F cut in an oblique direction is formed in the middle of the arm portion 132C. A roller 136C provided to the push pin 136A is incorporated in the groove 132F, and can roll along the groove 132F. The push pin 136A and the roller 136C constitute a first action member 136. The holding member 132 is slidably supported on the upper mold 110 by a slider (support member) 134. Further, an elastic body 138 that is a second action member is in contact with the arm portion 132C. The elastic body 138 is also in contact with the upper mold 110 at the same time.

  In the fall prevention mechanism 130 ″, when the push pin 136A is pushed up by the raising of the conveying mechanism 400 (the raising of the conveying mechanism 400 itself or the lower die mechanism 201 may be raised indirectly), the groove 132F Since the roller 136C rolls inside, the holding member generates a component force in the direction indicated by the arrow A. At this time, since the holding member 132 is slidable with respect to the upper mold 110 by the slider 134, the holding member 132 slides from the holding position to the release position as the push pin 136A is raised. On the other hand, when the transport mechanism 400 is lowered, the holding member is pushed in the direction indicated by the arrow B by the elastic force of the elastic body 138, so that it is slid back to the holding position again.

  After the molded product 300 is held in this way, a sealing resin is supplied from the outside, and the upper mold mechanism 101 and the lower mold mechanism 201 are closed to complete the resin sealing.

  In addition, although rotation and a slide were illustrated as an example of repetitive movement, it is not limited to this, For example, it is also possible to repetitively move a holding member using a cam etc., for example.

  The present invention can be widely applied to a sealing device in which an article to be molded is supplied to an upper mold regardless of the sealing method.

Structural drawing of a resin sealing device provided with a fall prevention mechanism as an example of an embodiment of the present invention Enlarged view of the fall prevention mechanism Another embodiment of the fall prevention mechanism Still another embodiment of the fall prevention mechanism Resin sealing device described in Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing device 101 ... Upper mold | type mechanism 110 ... Upper mold | type 120 ... Upper mold | type base 130 ... Fall prevention mechanism 132 ... Holding member 132A ... Claw part 132B ... 1st crank part 132C ... Arm part 132D ... 2nd crank part 132E ... Base 134 ... Fixed pin 136A ... Push pin 136B ... First elastic body 138 ... Second elastic body 140 ... Power transmission structure 150 ... Depressurization seal 201 ... Lower mold mechanism 210 ... Lower mold 212 ... Bottom mold 214 ... Frame mold 216 ... Clamp spring 220 ... Lower mold base

Claims (5)

A drop prevention mechanism for a molded product supplied to the upper mold surface of the resin sealing device,
The fall prevention mechanism is disposed on the lower mold side of the upper mold,
A holding member capable of holding and releasing the molded article by moving between a holding position and a releasing position;
A support member that movably supports the holding member with respect to the upper mold;
Power to be molded article drop preventing mechanism, characterized in that it and a power transmission structure for transmitting to said holding member from the lower mold side for causing the movement of the holding member. In claim 1,
The power transmission structure receives a power from outside and moves the holding member from the holding position to the release position; and a first action member that moves the holding member from the release position to the holding position. Having two working members,
A drop prevention mechanism for a molded product, wherein the holding member is located at the holding position by the second action member when no external power is transmitted to the first action member. In claim 2,
The said 2nd action member is comprised with the elastic body. The fall prevention mechanism of the to-be-molded product characterized by the above-mentioned. In claim 3,
At least a part of the first action member is made of an elastic body,
A mechanism for preventing a molded article from falling, wherein the first acting member has a larger elastic coefficient than the second acting member. In any one of Claims 1 thru | or 4,
At least a part of the first working member is arranged to protrude from the upper mold toward the lower mold,
The power transmitted to the holding member by the power transmission structure is a reaction force generated in the first action member when the upper surface of the conveying device for the molded product comes into contact with the first action member. A drop prevention mechanism for molded products.

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