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CN113517206A - Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product - Google Patents

Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product Download PDF

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Publication number
CN113517206A
CN113517206A CN202110334362.4A CN202110334362A CN113517206A CN 113517206 A CN113517206 A CN 113517206A CN 202110334362 A CN202110334362 A CN 202110334362A CN 113517206 A CN113517206 A CN 113517206A
Authority
CN
China
Prior art keywords
sheet
sealing
seal
space
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110334362.4A
Other languages
Chinese (zh)
Inventor
秋月伸也
山本雅之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ridong Precision Machine Co ltd
Nitto Seiki Co Ltd
Nitto Denko Corp
Original Assignee
Ridong Precision Machine Co ltd
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ridong Precision Machine Co ltd, Nitto Denko Corp filed Critical Ridong Precision Machine Co ltd
Publication of CN113517206A publication Critical patent/CN113517206A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a device sealing method, a device sealing apparatus and a method for manufacturing semiconductor products, which can seal a device with high precision and facilitate the processing of a workpiece and a sealing material in the sealing process. The device sealing method includes: a 1 st sealing step of housing the sealing sheet (S) and the substrate (10) on which the LED (11) is mounted in the cavity (29) and bringing the sealing sheet (S) into contact with the surface of the substrate (10) on which the LED (11) is mounted in a state in which the internal space of the cavity (29) is depressurized, thereby covering the LED (11) with the sealing sheet (S); and a 2 nd sealing process of sealing the LED11 with the sealing sheet S by increasing a pressure of an inner space of the chamber 29 after the 1 st sealing process.

Description

Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product
Technical Field
The present invention relates to a device sealing method, a device sealing apparatus, and a method for manufacturing a semiconductor product for sealing a device, such as a semiconductor chip or an electronic component, mounted on a workpiece, such as a semiconductor wafer (hereinafter, referred to as a "wafer" as appropriate) or a substrate.
Background
In a process of manufacturing an electronic product such as a BGA (Ball grid array) package, a process of sealing a device such as a semiconductor chip mounted on a surface of a workpiece such as a wafer or a substrate with a sealing material such as a resin composition to form a package is performed. As an example of a conventional sealing method, there is a method in which a resin in a liquid state is injected into a mold in which a workpiece on which a device is mounted is placed, and then the resin is thermally cured to seal the device (see, for example, patent document 1).
Patent document 1: japanese patent laid-open publication No. 2017-087551
Disclosure of Invention
Problems to be solved by the invention
However, the conventional apparatus described above has the following problems.
In a conventional sealing method using a liquid resin, the flatness of the resin sealing the periphery of the device in a state after sealing is completed is low. Since the flatness is low, there is a problem that the accuracy of the electronic product is lowered. In order to avoid a decrease in the accuracy of an electronic product, a step of molding the surface of a packaged electronic product is required, and therefore, the manufacturing efficiency of the electronic product is decreased. Further, there is a concern that handling of a liquid resin in each step is difficult as compared with a solid resin.
The present invention has been made in view of the above circumstances, and a main object thereof is to provide a device sealing method, a device sealing apparatus, and a method for manufacturing a semiconductor product, in which a device is sealed with high accuracy and handling of a work and a sealing material during sealing is facilitated.
Means for solving the problems
The present invention has the following configuration to achieve the above object.
That is, the present invention provides a device sealing method including: a 1 st sealing step of accommodating a sheet-like sealing material and a workpiece having a device mounted thereon in a chamber, and bringing the sheet-like sealing material into contact with a device mounting surface of the workpiece in a state where an internal space of the chamber is depressurized, thereby covering the device with the sheet-like sealing material; and a 2 nd sealing process of sealing the device with the sheet sealing member by increasing a pressure of the inner space of the chamber after the 1 st sealing process.
(action/Effect)
With this structure, the device is sealed using a sheet-like sealing member which is previously flattened into a flat sheet shape. Therefore, the flatness of the sheet-like sealing member sealing the device in a state after the sealing of the device is completed can be improved.
In the 1 st sealing process, the interior of the lower space in which the workpiece is disposed in the chamber is depressurized. That is, since the peripheral space of the device mounted on the workpiece is decompressed to discharge air, when the sheet seal covers the device, gas can be prevented from being trapped between the sheet seal and the device. Therefore, a decrease in the adhesion force due to the entrainment of the gas can be avoided.
And, in the 2 nd sealing process, the device is sealed with the sheet sealing member by increasing the pressure of the inner space of the chamber. In this case, the pressing force can be uniformly applied to the entire sheet-like seal by the pressurization of the internal space. Therefore, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet seal due to variations in the force acting on the sheet seal, and thus it is possible to more reliably improve the flatness of the sheet seal in the state in which the device is sealed.
In the 2 nd sealing process, the gas pressure of the internal space in the 2 nd sealing process can be arbitrarily adjusted by appropriately pressurizing the internal space. Therefore, a sufficiently large pressing force can be applied to the sheet-like seal, and therefore the sheet-like seal can be reliably filled into the gap between the devices. Therefore, the device can be sealed with higher accuracy.
In the invention described above, it is preferable that in the 1 st sealing process, the sheet seal is deformed into a convex shape toward the device mounting surface of the workpiece, so that the sheet seal is brought into contact with the device mounting surface of the workpiece.
(action/Effect)
With this configuration, since the sheet-like seal is deformed in a convex shape toward the device mounting surface of the workpiece, the sheet-like seal can be brought into contact with the device mounting surface of the workpiece so as to radially spread from one point. Therefore, it is possible to avoid air bubbles from being involved when the sheet-like sealing member is brought into contact with the device.
In the above invention, it is preferable that, in the 2 nd sealing step, the pressure in the internal space of the chamber is increased to a pressure equal to or higher than atmospheric pressure. In this case, since a relatively large pressing force can be applied between the sheet seal and the device, the device can be sealed more precisely by the sheet seal.
In the above invention, it is preferable that the sheet-like seal is held by a long conveying sheet, the chamber includes an upper casing and a lower casing, and the 1 st sealing step includes: a vertical space forming step of dividing an internal space of the chamber into a lower space in which the workpiece in a state in which the device mounting surface faces upward is disposed and an upper space facing the lower space with the sheet seal held by the conveying sheet interposed therebetween, by sandwiching the conveying sheet between the upper case and the lower case; an upper-lower space decompression process in which the upper space and the lower space are decompressed; and a contact step of deforming the sheet-like seal into a convex shape toward the device mounting surface and bringing the sheet-like seal into contact with the device mounting surface of the workpiece by a pressure difference between the upper space and the lower space caused by the pressure in the upper space being higher than the pressure in the lower space after the upper and lower space pressure reduction step.
(action/Effect)
With this configuration, in the 1 st sealing process, the upper space and the lower space are depressurized, and then the sheet seal is brought into contact with the device mounting surface of the workpiece by using a pressure difference generated by making the pressure in the upper space higher than the pressure in the lower space. That is, since the sheet-like sealing member is brought into contact with the device in a state where the air in the lower space is discharged by the pressure reduction, it is possible to more reliably avoid the air bubbles from being caught between the sheet-like sealing member and the device at the time of sealing. Further, since the pressure difference is uniformly applied to the entire sheet seal, it is possible to avoid the occurrence of damage to the work or damage to the device due to variations in the applied force.
In the above invention, it is preferable that the sheet-like seal is held by a long conveying sheet, the chamber includes an upper casing and a lower casing, and the 1 st sealing step includes: a vertical space forming step of dividing an internal space of the chamber into a lower space in which the workpiece in a state in which the device mounting surface faces upward is disposed and an upper space facing the lower space with the sheet seal held by the conveying sheet interposed therebetween, by sandwiching the conveying sheet between the upper case and the lower case; and a reduced-pressure contact step of deforming the sheet-like seal into a convex shape toward the device mounting surface by a pressure difference generated between the upper space and the lower space by reducing the pressure of only the lower space of the upper space and the lower space, and bringing the sheet-like seal into contact with the device mounting surface of the workpiece in a state where the lower space is reduced in pressure.
(action/Effect)
With this configuration, in the 1 st sealing process, only the lower space is depressurized, and the sheet seal is brought into contact with the device mounting surface of the workpiece by using the generated pressure difference. That is, since the sheet-like sealing member is brought into contact with the device in a state where the air in the lower space is discharged by the pressure reduction, it is possible to more reliably avoid the air bubbles from being caught between the sheet-like sealing member and the device at the time of sealing. Further, since the pressure difference is uniformly applied to the entire sheet seal, it is possible to avoid the occurrence of damage to the work or damage to the device due to variations in the applied force. Further, since only the lower space needs to be decompressed, a structure for decompressing the upper space is not necessary. Therefore, complication and high cost of the apparatus can be avoided.
In the above invention, it is preferable that the sheet-like sealing member has a predetermined shape corresponding to a device mounting surface of the workpiece, and is held by the long conveying sheet.
(action/Effect)
With this configuration, the sheet seal has a predetermined shape corresponding to the device mounting surface of the workpiece in advance. Therefore, the sheet seal can appropriately seal the device according to the position and shape of the device mounting surface of the workpiece. Further, since a step of cutting the sheet-like sealing material into an appropriate predetermined shape or the like is not required, the step of sealing the device can be shortened.
In the above invention, it is preferable that the sheet-shaped elastic body be provided inside the upper case, and the sheet-shaped elastic body be provided so as to be in contact with a surface of the conveying sheet on which the sheet-shaped seal is not held, by sandwiching the conveying sheet between the upper case and the lower case during formation of the upper and lower spaces. In this case, the sheet-like elastic body is deformed into a convex shape as a whole at a more uniform bending ratio by the pressure difference. Therefore, the sheet seal is easily deformed in accordance with the shape of the device mounting surface of the workpiece, and therefore, the filling property of the sheet seal with respect to the gap portion between the devices can be improved. Thus, the device can be sealed with more accuracy by the sheet seal.
In the above invention, it is preferable that the device sealing method includes a heating step of heating the sheet-like sealing material by heating at least one of the lower space and the upper space, and in the 1 st sealing step, the sheet-like sealing material in a state heated by the heating step is brought into contact with a device mounting surface of the workpiece.
(action/Effect)
With this structure, by heating the sheet seal with the heating process, the sheet seal becomes softer. That is, the sheet seal is easily deformed in accordance with the shape of the device mounting surface of the workpiece, and therefore, the filling property of the sheet seal with respect to the gap portion between the devices can be improved.
In the above invention, it is preferable that the work has 1 or two or more convex members on a surface opposite to the device mounting surface, and the device sealing method further includes a holding step of holding the work with a holding member having a concave portion at a central portion thereof in a state where the convex members are arranged inside the concave portion, and the 1 st sealing step is performed after the work is held by the holding member.
(action/Effect)
With this configuration, the holding member includes a recess in the central portion. Thus, the holding member can hold the workpiece in a state in which the convex member provided on the non-device-mounting surface of the workpiece is disposed inside the concave portion. In this case, since the concave portion is present, it is possible to avoid a situation in which the convex member is damaged due to the surfaces of the convex member and the holding member interfering with each other. That is, even in a workpiece having a convex member, the device can be sealed favorably without damaging the workpiece.
In order to achieve the above object, the present invention may employ the following configuration.
That is, the present invention provides a device sealing apparatus comprising: a 1 st sealing mechanism that houses a sheet-like sealing material and a workpiece having a device mounted thereon in a chamber, and covers the device with the sheet-like sealing material by bringing the sheet-like sealing material into contact with a device mounting surface of the workpiece in a state where an internal space of the chamber is depressurized; and a 2 nd sealing mechanism for sealing the device with the sheet seal by increasing a pressure of an inner space of the chamber after the 1 st sealing mechanism completes its operation.
(action/Effect)
With this structure, the device is sealed using a sheet-like sealing member which is previously flattened into a flat sheet shape. Therefore, the flatness of the sheet-like sealing member sealing the device in a state after the sealing of the device is completed can be improved.
Further, the 1 st sealing mechanism depressurizes the inside of a lower space in the chamber in which the work is disposed. That is, since the peripheral space of the device mounted on the workpiece is decompressed to discharge air, when the sheet seal covers the device, gas can be prevented from being trapped between the sheet seal and the device. Therefore, a decrease in the adhesion force due to the entrainment of the gas can be avoided.
And, the 2 nd sealing mechanism seals the device with the sheet seal by increasing the pressure of the internal space of the chamber. In this case, the pressing force can be uniformly applied to the entire sheet-like seal by the pressurization of the internal space. Therefore, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet seal due to variations in the force acting on the sheet seal, and thus it is possible to more reliably improve the flatness of the sheet seal in the state in which the device is sealed.
In order to achieve the above object, the present invention may employ the following configuration.
That is, the present invention provides a method for manufacturing a semiconductor product in which a device mounted on a workpiece is sealed by a sheet-like sealing member, the method comprising: a 1 st sealing step of accommodating a sheet-like sealing material and a workpiece having a device mounted thereon in a chamber, and bringing the sheet-like sealing material into contact with a device mounting surface of the workpiece in a state where an internal space of the chamber is depressurized, thereby covering the device with the sheet-like sealing material; and a 2 nd sealing process of sealing the device with the sheet sealing member by increasing a pressure of the inner space of the chamber after the 1 st sealing process.
(action/Effect)
With this configuration, a semiconductor product in which a device mounted on a work is sealed by a sheet-like sealing material can be preferably manufactured. That is, since the device is sealed by using the sheet-like sealing member which is previously formed into a flat sheet shape, the flatness of the sheet-like sealing member in which the device is sealed in the semiconductor product can be improved. In addition, since the air inside the chamber is discharged by the decompression in the 1 st sealing process, it is possible to prevent the gas from being involved between the device and the sheet seal. In addition, in the 2 nd sealing process, since the device is sealed by increasing the pressure of the internal space of the chamber, the sheet-like sealing member can be reliably filled into the gap between the devices by a high pressure. Therefore, a semiconductor product in which the device is sealed more accurately can be manufactured.
ADVANTAGEOUS EFFECTS OF INVENTION
With the device sealing method, device sealing apparatus, and semiconductor product manufacturing method of the present invention, a device is sealed using a sheet-like sealing member that is previously formed into a flat sheet shape. Therefore, the flatness of the sheet-like sealing member sealing the device in a state after the sealing of the device is completed can be improved.
In the 1 st sealing process, the interior of the lower space in the chamber in which the workpiece is disposed is depressurized. That is, since the peripheral space of the device mounted on the workpiece is decompressed to discharge air, when the sheet seal covers the device, gas can be prevented from being trapped between the sheet seal and the device. Therefore, a decrease in the adhesion force due to the entrainment of the gas can be avoided.
And, in the 2 nd sealing process, the device is sealed with the sheet sealing member by increasing the pressure of the inner space of the chamber. In this case, the pressing force can be uniformly applied to the entire sheet-like seal by the pressurization of the internal space. Therefore, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet seal due to variations in the force acting on the sheet seal, and thus it is possible to more reliably improve the flatness of the sheet seal in the state in which the device is sealed.
Drawings
Fig. 1 is a diagram showing the structure of a seal member according to an embodiment. Fig. 1 (a) is a perspective view of the back surface side of the sealing member, and fig. 1 (b) is a longitudinal sectional view of the sealing member.
FIG. 2 is a perspective view showing the structure of the base plate and the ring frame of the embodiment.
Fig. 3 is a top view of the device sealing apparatus of the embodiment.
Fig. 4 is a front view of the device sealing apparatus of the embodiment.
Fig. 5 is a front view of the sealing unit of the embodiment.
Fig. 6 is a longitudinal sectional view of the chamber of the embodiment.
Fig. 7 is a flowchart showing the operation of the device sealing apparatus according to the embodiment.
Fig. 8 is a diagram illustrating step S2 of the embodiment.
Fig. 9 is a diagram illustrating step S2 of the embodiment.
Fig. 10 is a diagram illustrating step S3 of the embodiment.
Fig. 11 is a diagram illustrating step S3 of the embodiment.
Fig. 12 is a diagram illustrating step S4 of the embodiment.
Fig. 13 is a diagram illustrating step S4 of the embodiment.
Fig. 14 is a diagram illustrating step S5 of the embodiment.
Fig. 15 is a diagram illustrating an example of a structure for heating the sealing member.
Fig. 16 is a diagram illustrating step S6 of the embodiment.
Fig. 17 is a diagram illustrating step S6 of the embodiment.
Fig. 18 is a diagram illustrating step S7 of the embodiment.
Fig. 19 is a diagram illustrating the effects of the embodiment. Fig. 19 (a) is a vertical sectional view illustrating a structure in which a gap portion is formed when the chamber is depressurized and sealed, and fig. 19 (b) is a vertical sectional view illustrating a state in which the gap portion is filled by pressurizing and sealing the chamber.
Fig. 20 is a diagram illustrating a structure of a modification. Fig. 20 (a) is a vertical sectional view showing the structure of the substrate of the modification, and fig. 20 (b) is a vertical sectional view explaining the structure of the holding base of the modification.
Fig. 21 is a diagram illustrating the step S3 in the modification.
Fig. 22 is a diagram illustrating the step S4 in the modification.
Fig. 23 is a diagram illustrating a structure of a modification. Fig. 23 (a) is a vertical sectional view showing the structure of a seal member of a modification, fig. 23 (b) is a view explaining a problem that may occur in a seal member of a comparative example having no elastic body, and fig. 23 (c) is a view explaining an advantage in a comparative example having an elastic body.
Fig. 24 is a diagram illustrating a structure of a modification. Fig. 24 (a) is a vertical cross-sectional view showing the structure of a seal member according to a modification, fig. 24 (b) is a view showing the state of step S4 according to the modification, and fig. 24 (c) is a view showing the state of step S5 according to the modification.
Fig. 25 is a diagram illustrating a structure of a modification. Fig. 25 (a) is a vertical sectional view showing the structure of a sealing member of a modification, and fig. 25 (b) is a perspective view explaining the structure of a sheet cutting device provided in the modification.
Description of the reference numerals
1. A device sealing means; 3. a substrate conveying mechanism; 5. a container; 6. a seal body recovery unit; 7. an aligner; 8. a holding stage; 9. a rack supply section; 10. a substrate (workpiece); 11. an LED (device); 13. a sealing unit; 16. a substrate conveying device; 17. a rack transport device; 23. a holding arm; 27. an adsorption plate; 28. a suction cup; 31. a vacuum device; 32. a pressurizing device; 33. a control unit; 38. a rack holding section; 71. a sheet supply section; 72. a separator recovery unit; 73. a device sealing section; 74. a sheet recovery unit; 81. a device sealing mechanism; 82. a sheet cutting mechanism; 85. attaching a roller; 86. a grip roller; 95. a cutter; f. an annular frame; t, conveying sheet; s, sealing the sheet; p, a sealing member; MF, sealing body; ta, a base material; tb, adhesive material; sa, base material; sb, sealing element.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 (a) is a perspective view showing the back side of the seal member P, and fig. 1 (b) is a longitudinal sectional view of the seal member P. Fig. 2 is a perspective view showing the structure of the ring frame f and the substrate 10 to be sealed by the sealing member P.
As shown in fig. 1 (a), the sealing member P of the present embodiment includes a sealing sheet S and a conveying sheet T. The sealing sheet S is cut in advance into a predetermined shape corresponding to the shape of the substrate 10. In the present embodiment, the sealing sheet S is cut into a substantially rectangular shape in advance. Here, the substantially rectangular shape means a shape in which each corner of a rectangle is rounded as shown in fig. 1 (a). In the present embodiment, the seal sheet S is set to be larger than the base plate 10 and smaller than the inner diameter of the lower case 29A described later.
The transportation sheet T is long, and the sealing sheets S are stuck to and held by the transportation sheet T at predetermined pitches. The seal sheet S corresponds to a sheet seal in the present invention.
As shown in fig. 1 (b), the conveying sheet T has a structure in which a non-adhesive base Ta and an adhesive Tb having adhesiveness are laminated. Examples of the material constituting the base Ta include polyolefin, polyethylene, and the like. Examples of the material constituting the adhesive material Tb include an acrylate copolymer.
As shown in fig. 1 (b), the sealing sheet S has a structure in which a non-adhesive base material Sa and an adhesive seal Sb are laminated. The base material Sa is stuck to the adhesive material Tb of the transportation sheet T, whereby the transportation sheet T holds the sealing sheet S. Examples of the material constituting the base material Sa include polyolefin and polyethylene. In the present embodiment, the shape of the sealing sheet S is a substantially rectangular shape, but the shape of the sealing sheet S can be appropriately changed according to the shape of the substrate 10.
A separation sheet, not shown, is attached to the sealing material Sb, and the separation sheet is peeled off to expose the adhesive surface of the sealing material Sb. In the present embodiment, as a material constituting the sealing member Sb, OCA (Optical Clear Adhesive) which is an optically transparent Adhesive material is used.
As shown in fig. 2, a plurality of LEDs 11 and TFTs (not shown) are mounted in a two-dimensional matrix on the central portion of the front surface of the substrate 10. That is, the surface of the substrate 10 is formed with irregularities by the LEDs 11. The LED11 is connected to the substrate 10 via a TFT, a bump (not shown), and the like. Examples of the substrate 10 include a glass substrate, an organic substrate, a circuit board, and a silicon wafer. In the present embodiment, the substrate 10 has a substantially rectangular shape, but the shape of the substrate 10 may be appropriately changed to any shape exemplified by a rectangular shape, a circular shape, a polygonal shape, and the like. The substrate 10 corresponds to a workpiece in the present invention. The LED11 corresponds to the device in the present invention.
The annular frame f has a size and a shape surrounding the substrate 10. The device sealing apparatus 1 of the embodiment is configured to seal the LED11 mounted on the board 10 with the sealing sheet S, thereby producing a sealing body MF in which the board 10 and the ring frame f are integrated with each other by the sealing member P.
< description of the entire Structure >
Here, the overall structure of the device sealing apparatus 1 of the embodiment is explained. Fig. 3 is a plan view showing a basic structure of the device sealing apparatus 1 of the embodiment. The device sealing apparatus 1 has a structure including a laterally long rectangular portion 1a and a protruding portion 1 b. The protruding portion 1b is connected to the center of the rectangular portion 1a and protrudes upward. In the following description, the longitudinal direction of the rectangular portion 1a is referred to as the left-right direction (x direction), and the horizontal direction (y direction) orthogonal thereto is referred to as the front-back direction.
A substrate conveyance mechanism 3 is provided on the right side of the rectangular portion 1 a. Two containers 5 containing substrates 10 are placed in parallel on the lower right side of the rectangular portion 1 a. The rectangular portion 1a is provided at its left end with a seal recovery portion 6 for recovering a seal MF described later.
The aligner 7, the holding table 9, and the rack feeding section 12 are provided in this order from the right of the upper side of the rectangular section 1 a. The protruding portion 1b is provided with a sealing unit 13, and the sealing unit 13 seals the LEDs 11 mounted on the board 10 with a sealing sheet S.
As shown in fig. 4, the substrate transfer mechanism 3 is provided with a substrate transfer device 16 supported on the right side of a guide rail 15 so as to be movable in a left-right reciprocating manner, and the guide rail 15 is horizontally erected on the upper portion of the rectangular portion 1a in the left-right direction. Further, a rack transport device 17 supported on the guide rail 15 so as to be movable in the left-right direction is provided on the left side of the guide rail 15.
The substrate transfer device 16 is configured to be able to transfer the substrate 10 taken out from any one of the containers 5 in the right and left directions and in the front and back directions. The substrate transport device 16 is equipped with a movable table 18 for left and right movement and a movable table 19 for front and rear movement.
The movable right-left movement table 18 is configured to be capable of reciprocating in the right-left direction along the guide rail 15. The movable forward-backward movement table 19 is configured to be capable of reciprocating in the forward-backward direction along a guide rail 20 provided on the movable leftward-rightward movement table 18.
Further, a holding unit 21 for holding the substrate 10 is provided below the front-rear movable stage 19. The holding unit 21 is configured to be capable of reciprocating in the vertical direction (z direction) along a lifting rail 22 extending in the longitudinal direction. The holding unit 21 is rotatable about an axis in the z direction by a rotation shaft, not shown.
A horseshoe-shaped holding arm 23 is provided at the lower portion of the holding unit 21. A plurality of suction pads are provided on the holding surface of the holding arm 23 so as to slightly protrude, and the substrate 10 is sucked and held by the suction pads. The holding arm 23 is connected to the compressed air device through a flow path formed inside thereof and a connection flow path connected to the base end side of the flow path.
By using the movable structure, the substrate 10 sucked and held can be moved forward and backward, leftward and rightward, and rotated about the z-direction axis by the holding arm 23.
The rack transport device 17 includes a movable leftward and rightward movement table 24, a movable forward and rearward movement table 25, a telescopic link mechanism 26 connected to a lower portion of the movable leftward and rightward movement table 24, and an adsorption plate 27 provided at a lower end of the telescopic link mechanism 26. The suction plate 27 sucks and holds the substrate 10. A plurality of suction pads 28 for suction-holding the ring frame f are provided around the suction plate 27. Therefore, the rack transport device 17 can suck and hold the ring rack f or the seal body MF placed and held on the holding base 9 and transport it up and down, front and rear, left and right. The suction cup 28 is slidably adjustable in the horizontal direction corresponding to the size of the ring frame f.
As shown in fig. 5, 6, and the like, the holding table 9 is a metal chuck table having a size equal to or larger than the shape of the substrate 10, and is connected to a vacuum device 31 and a pressurizing device 32 provided outside, respectively. The operations of the vacuum device 31 and the pressurizing device 32 are controlled by the control unit 33.
As shown in fig. 5, the holding base 9 is housed in a lower case 29A constituting the chamber 29, and is coupled to one end of a rod 35 penetrating the lower case 29A. The other end of the rod 35 is drivingly connected to a driver 37 including a motor and the like. Therefore, the holding table 9 can be moved up and down inside the chamber 29.
The lower case 29A includes a holder holding portion 38 that surrounds the lower case 29A. The holder holding portion 38 is configured to make the upper surface of the annular holder f flush with the cylindrical top of the lower case 29A when the annular holder f is placed. The cylindrical top of the lower case 29A is preferably subjected to a mold release treatment.
As shown in fig. 3, the holding base 9 is configured to be capable of reciprocating between an initial position and a sealing position along a rail 40 attached in the front-rear direction. The initial position is inside the rectangular portion 1a, and is the position of the holding base 9 indicated by a solid line in fig. 3. In this placement position, the substrate 10 and the ring frame f are placed on the holding table 9.
The sealing position is inside the projection 1b, and is a position where the holding base 9 is indicated by a broken line in fig. 3. By moving the holding table 9 to the sealing position, the sealing process using the sealing member P can be performed on the substrate 10 placed on the holding table 9.
The rack supply unit 12 stores drawer-type boxes in which a predetermined number of ring racks f are stacked and stored.
As shown in fig. 5, the sealing unit 13 includes a sheet supply unit 71, a separation sheet collection unit 72, a device sealing unit 73, a sheet collection unit 74, and the like. The sheet supply section 71 is configured to peel the separator by the separator peeling roller 75 in the process of supplying the sealing member P to the sealing position from the supply bobbin filled with the material roll around which the sealing member PS with the separator (the sealing member P with the separator attached) is wound.
The separator recovery section 72 is provided with a recovery winding drum for winding up the separator peeled off from the sealing member P. The recovery bobbin is driven and controlled by a motor to rotate forward and backward.
The device sealing portion 73 is constituted by the chamber 29, the device sealing mechanism 81, the sheet cutting mechanism 82, and the like.
The chamber 29 is constituted by a lower case 29A and an upper case 29B. The lower case 29A is disposed so as to surround the holding base 9, and reciprocates in the front-rear direction between the initial position and the sealing position together with the holding base 9. The upper case 29B is provided on the protruding portion 1B and configured to be able to move up and down.
As shown in fig. 6, the lower case 29A and the upper case 29B are connected in communication with the vacuum device 31 and the pressurizing device 32, respectively, via the flow path 101. Further, an electromagnetic valve 103 is provided in the flow passage 101 on the upper case 29B side. Further, a flow path 109 is connected to each of the two cases 29A and 29B, and the flow path 109 is provided with electromagnetic valves 105 and 107 for opening the atmosphere.
A flow path 111 is connected to the upper case 29B in a communicating manner, and the flow path 111 includes a solenoid valve 110 that adjusts the internal pressure after the temporary pressure reduction by the bleed-off. The opening and closing operations of these solenoid valves 103, 105, 107, and 110, the operation of the vacuum device 31, and the operation of the pressurizing device 32 are controlled by the control unit 33.
That is, the vacuum device 31 is configured to be capable of independently performing pressure reduction adjustment of the air pressure in the space on the lower case 29A side and the air pressure in the space on the upper case side. The pressurizing device 32 is configured to be capable of independently pressurizing and adjusting the air pressure in the space on the lower case 29A side and the air pressure in the space on the upper case side.
The device sealing mechanism 81 includes a movable table 84, an application roller 85, a nip roller 86, and the like. The movable stand 84 horizontally moves in the left-right direction along a guide rail 88 extending in the left-right direction. The sticking roller 85 is pivotally supported by a bracket coupled to a distal end of a cylinder provided on the movable table 84. The pinch roller 86 is disposed on the sheet collecting portion 74 side, and includes a conveying roller 89 driven by a motor and a pinch roller 90 that is raised and lowered by a cylinder.
The sheet cutting mechanism 82 is provided on a lift drive table 91 that moves the upper case 29B up and down, and includes a support shaft 92 extending in the z direction and a boss 93 that rotates about the support shaft 92. The hub 93 has a plurality of support arms 94 extending in the radial direction. A circular plate-shaped cutter 95 for cutting the conveying sheet T of the sealing member P along the ring frame f is provided at the tip of at least 1 support arm 94 so as to be movable up and down. A pressing roller 96 is provided at the tip of the other support arm 94 so as to be movable up and down.
The sheet collecting unit 74 includes a collecting bobbin that collects the unnecessary transport sheet T that has been peeled off after cutting. The recovery bobbin is driven and controlled by a motor, not shown, to rotate forward and backward.
As shown in fig. 4, the sealing body recovery unit 6 includes a box 41 for mounting and recovering the sealing body MF. The case 41 is provided with: a longitudinal rail 45 coupled and fixed to the assembly frame 43; and a lifting table 49 which is lifted and lowered by the motor 47 along the longitudinal rail 45 by screw feeding. Therefore, the seal body recovery unit 6 is configured to mount the seal body MF on the lift table 49 and perform pitch feed lowering (japanese: ピッチ feeding り lowering).
As shown in fig. 6 and the like, the device sealing mechanism 81 has a heating mechanism 120 inside the upper case 29B. The heating mechanism 120 includes a cylinder 121 and a heating member 123. The cylinder 121 is coupled to an upper portion of the heating member 123, and the heating member 123 can be moved up and down inside the chamber 29 by the operation of the cylinder 121. Note that the heating member 123 may not be configured to be movable up and down if it can heat the sealing member P.
The heating member 123 is formed in a disk shape as a whole and has a shape slightly larger than the sealing sheet S. A heater 125 for heating the conveying sheet T and the sealing sheet S is embedded in the heating member 123. The heating temperature by the heater 125 can be adjusted to a temperature at which the transfer sheet T and the sealing sheet S are softened. An example of the heating temperature is about 50 to 70 ℃.
< summary of basic actions >
Here, the basic operation of the device sealing apparatus of the embodiment is explained. Fig. 7 is a flowchart illustrating a series of steps of sealing the LED11 mounted on the board 10 with the sealing sheet S using the device sealing apparatus 1.
Step S1 (supply of work)
When a sealing command is issued, the ring frame f is conveyed from the frame supply portion 12 to the frame holding portion 38 of the lower case 29A, and the substrate 10 is conveyed from the container 5 to the holding stage 9.
That is, the rack transport device 17 sucks the ring rack f from the rack supply unit 12 and transfers it to the rack holding unit 38. After the suction of the ring frame f is released and the ring frame f is lifted by the frame transfer device 17, the ring frame f is positioned. This positioning is performed, for example, by synchronously moving a plurality of support pins erected so as to surround the rack holder 38 in the central direction. The ring frame f stands by with being mounted on the frame holding portion 38 until the substrate 10 is conveyed.
The frame transfer device 17 transfers the ring frame f, and the substrate transfer device 16 inserts the holding arm 23 between the substrates 10 stored in multiple stages. The holding arm 23 sucks and holds a portion (a portion on the peripheral side) of the surface of the substrate 10 where the LED11 is not mounted, sends out the substrate 10, and conveys the substrate 10 to the aligner 7. The aligner 7 adsorbs the center of the back surface of the substrate 10 with a suction cup protruding from the center thereof. At the same time, the substrate transfer device 16 releases the suction of the substrate 10 and retreats upward. The aligner 7 performs alignment by a notch or the like while holding the substrate 10 by a chuck and rotating the substrate 10.
After the alignment is completed, the suction pad holding the substrate 10 is protruded from the surface of the aligner 7. The substrate transfer device 16 is moved to this position to suction and hold the substrate 10 from the front surface side of the substrate 10. The suction cup is released from the suction and descends.
The substrate transport device 16 moves above the holding table 9, and places the substrate 10 on the holding table 9 with the surface side on which the LEDs 11 are mounted facing upward. When the holding table 9 suction-holds the substrate 10 and the holder holding portion 38 suction-holds the ring holder f, the lower housing 29A moves from the initial position to the sealing position on the device sealing mechanism 81 side along the rail 40. Fig. 8 shows a state in which the substrate 10 is supplied to the holding table 9 and moved to the sealing position.
Step S2 (sealing sheet supply)
After the workpiece is supplied by the substrate transfer device 16 or the like, the sealing sheet S is supplied by the sealing unit 13. That is, a predetermined amount of the sealing member P is discharged from the sheet supply portion 71 while peeling the separator. The sealing member P, which is long as a whole, is guided upward of the sealing position along a predetermined conveyance path. At this time, as shown in fig. 9, the seal sheet S held by the conveying sheet T is positioned above the substrate 10 placed on the holding table 9.
Step S3 (formation of Chamber)
After the work and the seal sheet S are supplied, the sticking roller 85 is lowered as shown in fig. 10. Then, as shown in fig. 11, the sticking roller 85 sticks the transport sheet T so as to straddle the top of the lower case 29A and the loop frame f while rolling on the transport sheet T. In conjunction with the movement of the sticking roller 85, a predetermined amount of the sealing member P is discharged from the sheet supply portion 71 while peeling the separator.
After the transport sheet T is attached to the ring frame f, the attachment roller 85 is returned to the initial position, and the upper case 29B is lowered. As the upper case 29B is lowered, as shown in fig. 11, the portion of the transport sheet T attached to the top of the lower case 29A is sandwiched between the upper case 29B and the lower case 29A to form the chamber 29.
At this time, the conveying sheet T in the sealing member P functions as a sealing material, and the chamber 29 is divided into two spaces by the conveying sheet T. That is, the sheet T is divided into a lower space H1 on the lower case 29A side and an upper space H2 on the upper case 29B side. The base board 10 and the LED11 located in the lower case 29A are respectively close to and opposed to the sealing sheet S with a predetermined gap therebetween.
Step S4 (1 st sealing process)
After the chamber 29 is formed, the 1 st sealing process is started. First, the controller 33 operates the vacuum apparatus 31 to reduce the air pressure in the lower space H1 and the air pressure in the upper space H2 to predetermined values in a state where the electromagnetic valves 105, 107, and 110 shown in fig. 6 are closed. Examples of the predetermined value include 10Pa to 100 Pa. At this time, the opening degree of the solenoid valve 103 is adjusted so that the lower space H1 and the upper space H2 are depressurized at the same speed.
When the lower space H1 and the upper space H2 are depressurized to a predetermined value, the control part 33 closes the electromagnetic valve 103 and stops the operation of the vacuum apparatus 31. Then, the controller 33 adjusts the opening degrees of the solenoid valves 103, 105, 107, and 110 to perform the relief so that the air pressure in the upper space H2 becomes higher than the air pressure in the lower space H1. By making the air pressure of the upper space H2 higher than the air pressure of the lower space H1, as shown in fig. 12, a pressure difference Fa is generated between the two spaces. By generating the pressure difference Fa, the adhesive member P is sucked from the central portion toward the lower case 29A side to be deformed into a convex shape.
In the present embodiment, in a state where the solenoid valves 103 and 107 connected to the lower space H1 are closed, the opening degree of the solenoid valve 110 connected to the upper space H2 is adjusted to release the solenoid valve 110, and the solenoid valve 110 is finally fully opened. By this adjustment, the state in which the air pressure of the lower space H1 is reduced to the predetermined value is maintained, and the air pressure of the upper space H2 gradually rises from the predetermined value and returns to the atmospheric pressure, so that the pressure difference Fa is generated.
After the pressure difference Fa is generated, as shown in fig. 13, the actuator 37 is driven to raise the holding table 9. The seal sheet S radially contacts the surface of the base plate 10 from the center toward the outer periphery in the lower space H1 where air is discharged by the rise of the holding base 9 and the deformation of the adhesive member P caused by the pressure difference Fa. By this contact, the LEDs 11 mounted on the board 10 are covered with the sealing sheet S.
After the LED11 is covered with the sealing sheet S, the controller 33 fully opens the solenoid valves 103, 105, 107, and 110 to open the upper space H2 and the lower space H1 to the atmosphere. The atmosphere is opened, thereby completing the 1 st sealing process. Thus, in the 1 st sealing process, the following operations are performed: the sealing sheet S is brought into contact with the surface of the substrate 10 in a state where the internal space of the cavity 29 is depressurized, thereby covering the LED11 with the sealing sheet S.
Further, it is preferable that the upper space H2 is heated in advance using the heating mechanism 120 before starting step S4. That is, the controller 33 operates the heater 125 to heat the heating member 123 to a predetermined temperature. By heating the heating member 123, the upper space H2 is heated by the heat conduction effect, and the conveying sheet T and the sealing sheet S are further heated.
The transportation sheet T and the sealing sheet S are heated and softened, and therefore, the deformability by the pressure difference Fa is improved. That is, when the sealing sheet S covers the LED11, the following ability of the sealing member P to the upper surface of the board 10 and the upper surface of the LED11 can be further improved. As shown in fig. 15, the heating member 123 may be lowered to come into contact with the transport sheet T, and the sealing member P may be directly heated by the heating member 123.
Step S5 (2 nd sealing process)
After the chamber 29 is formed, the 2 nd sealing process is started. First, the controller 33 controls the actuator 37 to lower the holding base 9 to the initial position. Next, the controller 33 operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2 in a state where the electromagnetic valves 105, 107, and 110 shown in fig. 6 are closed, and pressurizes the lower space H1 and the upper space H2 to specific values. Examples of the specific value include 0.3MPa to 0.5 MPa. By the pressurizing operation of the pressurizing device 32, the air pressure of the lower space H1 and the air pressure of the upper space H2 are both higher than the atmospheric pressure.
As shown in fig. 14, the pressing force V1 acts on the sealing sheet S from the upper space H2 due to the pressurization of the upper space H2. Further, since the entire upper space H2 is pressurized, the pressing force V1 uniformly acts on the entire sealing sheet S. In addition, by pressurizing the entire lower space H1, the pressing force V2 is uniformly applied from the lower space H1 toward the back surface of the substrate 10. That is, the sealing material Sb of the sealing sheet S is filled in the gap between the LEDs 11 by the pressing force V1 and the pressing force V2. As a result, the substrate 10 and the sealing sheet S are further closely attached, and the LED11 is sealed by the sealing sheet S.
After a pressing force is applied between the sealing sheet S and the LED11 for a predetermined time in a state where the lower space H1 and the upper space H2 are pressurized to an air pressure higher than the atmospheric pressure, the control unit 33 stops the operation of the pressurizing device 32. Then, the controller 33 opens the solenoid valves 103, 105, 107, and 110 fully to open the lower space H1 and the upper space H2 to the atmosphere. The controller 33 raises the upper case 29B to open the cavity 29, and also raises the holding table 9 to bring the back surface of the substrate 10 into contact with the substrate holding surface of the holding table 9.
Step S6 (cutting sheet)
While the steps of step S4 and step S5 are performed in the chamber 29, the sheet cutting mechanism 82 is operated to cut the sealing member P. At this time, as shown in fig. 16, the cutter 95 cuts the sealing member P (specifically, the conveying sheet T) attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 presses the ring frame f while rolling along the cutter 95 at the sheet cut portion on the ring frame f.
Since the sealing of the sealing sheet S to the LED11 and the cutting of the sealing member P have already been completed at the time of raising the upper case 29B, the pinch roller 90 is raised to release the nip of the conveying sheet T. Thereafter, as shown in fig. 17, the pinch roller 86 is moved to wind and collect the cut unnecessary transport sheet T into the sheet collection unit 74, and a predetermined amount of the sealing member P is discharged from the sheet supply unit 71. Through the steps up to step S6, the sealing body MF is formed by integrating the ring frame f and the substrate 10 with the sealing member P.
After the unnecessary transport sheet T is wound and collected, the grip roller 86 and the application roller 85 are returned to the initial positions. Then, the holding table 9 moves from the sealing position to the home position while holding the sealing body MF.
Step S7 (recovery of seal body)
When the holding base 9 returns to the initial position, as shown in fig. 18, the suction pads 28 provided on the rack transport device 17 suck and hold the seal body MF and separate the seal body MF from the lower case 29A. The carriage conveyance device 17 that adsorbs and holds the seal body MF conveys the seal body MF to the seal body recovery unit 6. The transported sealing body MF is loaded in the cassette 41.
As described above, the series of operations for sealing the LED11 mounted on the board 10 with the sealing sheet S is completed. Thereafter, the above process is repeated until the sealing body MF reaches a predetermined number. In this manner, the sealing body MF in a state where the sealing sheet S seals the LED11 in close contact is manufactured by the device sealing apparatus 1. The sealing body MF in which the sealing sheet S is brought into a state of closely sealing the LED11 in the 2 nd sealing process corresponds to the semiconductor device in the present invention.
In the embodiment, the case of using the ring frame f is exemplified, but the process of manufacturing the sealed body MF as the semiconductor device is not limited to the case of using the ring frame f. That is, by performing the steps of step S1 to step S7, the sealing sheet S is sealed in close contact with the LED11 mounted on the substrate 10, thereby producing the sealing body MF in which the sealing sheet S and the substrate 10 are integrated.
< Effect of the Structure based on the embodiment >
With the device of the above embodiment, the LED11 mounted on the board 10 is sealed with the sealing sheet S by adjusting the air pressure inside the chamber 29. In a conventional sealing method in which a liquid sealing material is filled around a device and then the sealing material is cured, the flatness of the surface of the sealing material is reduced due to, for example, air bubbles mixed into the uncured resin.
On the other hand, in the configuration of the present invention, the base Sa and the seal Sb included in the seal sheet S are each formed into a flat sheet shape in advance. Therefore, the flatness of the surface of the seal piece S can be improved in a state after the sealing by the seal piece S is completed. Further, since the base plate 10 and the seal sheet S are sealed by adjusting the air pressure inside the cavity 29 in a state where they are arranged inside the cavity 29, the pressure difference Fa, the pressing force V1, and the pressing force V2 uniformly act on the entire seal sheet S. Therefore, it is possible to reliably avoid the occurrence of irregularities on the surface of the sealing sheet S due to variations in the force acting on the sealing sheet S, and therefore it is possible to more reliably improve the flatness of the sealing sheet S.
In the 1 st sealing process of the present invention, the inside of the lower space H1 in which the substrate 10 is disposed inside the chamber 29 is depressurized. That is, since the space around the LED11 mounted on the board 10 is decompressed to discharge air, when the sealing sheet S comes into contact with the LED11 and covers the LED11, gas can be prevented from being trapped between the sealing sheet S and the LED 11. Therefore, a decrease in the adhesion force due to the entrainment of the gas can be avoided.
In the 2 nd sealing process of the present invention, the gas pressure in the lower space H1 and the gas pressure in the upper space H2 are increased to be higher than the atmospheric pressure, whereby the sealing material Sb of the sealing sheet S is accurately filled in the gap between the LEDs 11.
When the pressure difference Fa is generated by depressurizing the inside of the chamber using the vacuum apparatus, the magnitude of the pressure difference Fa generated by depressurization from the atmospheric pressure state is equal to or less than the atmospheric pressure. That is, when the sealing sheet S is pressed against the LED11 by the pressure difference Fa, there is an upper limit to the amount of force with which the LED11 is pressed against the sealing sheet S. Therefore, in a state where the LED11 is covered with the sealing material Sb of the sealing sheet S by the pressure difference Fa due to the pressure reduction, as shown in fig. 19 (a), the peripheral space of the LED11 may not be completely filled with the sealing material Sb, and a gap portion J may be generated.
In contrast, in the present invention, the upper space H2 and the lower space H1 in the chamber 29 are pressurized to a pressure greater than atmospheric pressure using the pressurizing device 32. That is, in the 2 nd sealing process, the pressing forces V1, V2 larger than the pressure difference Fa can be applied to the sealing sheet S and the LED 11. Therefore, as shown in fig. 19 (b), the uncured seal Sb is further subjected to pressing deformation by the pressing force V1 and the pressing force V2, and the gap J is reliably filled. Therefore, by performing the 2 nd sealing process, the LED11 can be sealed more accurately.
Further, by appropriately controlling the pressurizing device 32 in the 2 nd sealing process, the magnitudes of the pressing force V1 and the pressing force V2 can be adjusted to arbitrary values. Thus, even in the case where the sealing conditions are changed, exemplified by the constituent material of the sealing member Sb or the size and structure of the LED11, the LED11 can be reliably sealed by appropriately adjusting the magnitudes of the pressing force V1 and the pressing force V2. Further, since the pressing force V1 and the pressing force V2 having appropriate magnitudes uniformly act on the entire sealing sheet S, it is possible to avoid damage to the substrate 10 or the LED11 due to an excessive pressing force or variation in the pressing force.
Further, in the conventional device sealing method using the die and the liquid seal, it is necessary to prepare different dies depending on the size, material, and the like of the workpiece and the device, and therefore, the labor and cost required for manufacturing the device sealing apparatus are large.
On the other hand, in the device sealing method of the present invention, the device can be sealed without using a mold, and therefore the time and cost required for manufacturing the device sealing apparatus 1 can be greatly reduced. Even when various conditions of the workpiece and the device are changed, the shape of the seal sheet S can be changed to cope with the change of the workpiece. Therefore, the device sealing apparatus according to various conditions can be set quickly and easily.
In addition, all the aspects of the embodiments disclosed herein are illustrative and not restrictive. The scope of the present invention is defined not by the description of the above embodiments but by the claims, and includes all modifications (variations) within the meaning and scope equivalent to the claims. As an example, the present invention can be modified as described below.
(1) The workpiece of the embodiment has been described using the substrate 10 having the LEDs 11 mounted on the front surface side and the flat rear surface side, but the rear surface side of the workpiece is not limited to a flat configuration. That is, as shown in fig. 20 (a), a substrate 131 having a convex member 130 on the back side may be used as the workpiece. The convex member 130 is an electronic component such as an LED, and may be a constituent material of the substrate 131. That is, the substrate 131 having irregularities on the back surface side also includes a structure in which irregularities are formed on the back surface of the substrate 131 itself.
When the LED11 mounted on the front surface side is sealed with the sealing sheet S with respect to the substrate 131 provided with the convex member 130 on the back surface side, the device sealing apparatus 1 includes a holding base 135 as shown in fig. 20 (b) instead of the holding base 9.
The holding base 135 includes an annular protrusion 137 at an outer peripheral portion thereof and a recess 139 at a central portion thereof. That is, the holding base 135 is hollow as a whole. The concave portion 139 is formed at a position including a region of the substrate 131 where the convex member 130 is arranged in a plan view. The protrusion 137 supports a portion of the back surface of the substrate 131 where the convex member 130 is not disposed, so that the holding base 135 can hold the substrate 131 without contacting the convex member 130.
Fig. 21 shows a state in which the holding base 135 supports the substrate 131 in a configuration in which the lower case 29A is provided with the holding base 135. This state corresponds to the step of forming the chamber 29 in step S3. In the configuration including the holding base 135, the steps of sealing the LEDs 11 on the board 10 with the sealing sheet S are the same as those in the above-described embodiment, and thus detailed description thereof is omitted.
(2) In step S4 of the embodiment, after the air pressure of the lower space H1 and the air pressure of the upper space H2 are depressurized to predetermined values, the air pressure of the upper space H2 is returned to the atmospheric pressure, thereby generating the pressure difference Fa, but the adjustment of the air pressure in step S4 is not limited thereto. That is, after the air pressure in the lower space H1 and the air pressure in the upper space H2 are reduced to predetermined values, the air pressure in the lower space H1 may be maintained at the predetermined values, and the opening degree of the electromagnetic valve 105 may be appropriately adjusted to perform the relief.
In this case, the pressure in the upper control space H2 increases from a predetermined value to a predetermined value lower than the atmospheric pressure, and the pressure difference Fa is generated by this control. After the LED11 is covered with the seal sheet S by the pressure difference Fa, the controller 33 fully opens the solenoid valves 103, 105, 107, and 110 to open the upper space H2 and the lower space H1 to the atmosphere. Through this atmospheric opening, the 1 st sealing process ends.
In the configuration in which the pressure difference Fa is generated by restoring the atmospheric pressure of the upper space H2 to the atmospheric pressure as in the embodiment, the pressure difference Fa can be further increased, and therefore, the process of deforming the sealing member P to cover the LED11 with the sealing sheet S can be completed more quickly. On the other hand, in the structure in which the pressure difference Fa is generated by adjusting the gas pressure in the upper space H2 to a specific value higher than the gas pressure in the lower space H1 and lower than the atmospheric pressure as in the modification (2), the deformation speed of the seal member P is suppressed to be low. Therefore, it is possible to avoid a situation in which the sealing sheet S covers the LED11 prematurely while the air discharge of the lower space H1 is incomplete, and therefore it is possible to prevent a gap from being generated between the sealing sheet S and the LED 11.
(3) In step S5 of the embodiment, the pressurizing device 32 pressurizes the insides of both the lower space H1 and the upper space H2, but is not limited thereto. That is, the pressurizing device 32 may pressurize only the upper space H2 to an air pressure higher than the atmospheric pressure, and seal the LED11 with higher accuracy by the pressing force V1.
As a further modification of the structure for pressurizing only the upper space H2, the following structure may be adopted: the inside of the upper space H2 is pressurized to a pressure higher than the atmospheric pressure while maintaining a state in which the inside of the lower space H1 is depressurized to a pressure lower than the atmospheric pressure, thereby sealing the LED 11. In this structure, after the 1 st sealing process based on the pressure difference Fa is performed in step S4, the state in which the air pressure of the lower space H1 is reduced to a predetermined value is maintained, and the electromagnetic valve 105 connected to the upper space H2 is opened to open only the upper space H2 to the atmosphere. Then, in step S5, the pressurizing device 32 is operated to pressurize the interior of the upper space H2 to a pressure higher than the atmospheric pressure.
In this modification, in step S5, the inside of the upper space H2 is pressurized in a state where the holding base 9 is raised and the holding base 9 is brought into contact with the back surface of the substrate 10. By generating the pressing force V1 by pressurizing the upper space H2 in a state where the substrate 10 is held by the holding base 9, the pressing force V1 can be uniformly applied to the entire surface of the sealing sheet S and the entire surface of the substrate 10 even in a state where the lower space H1 is depressurized to a pressure lower than the atmospheric pressure.
(4) In step S4 of the embodiment, the sealing sheet P is deformed into a convex shape by generating the pressure difference Fa in the chamber 29 using the vacuum apparatus 31 and is brought into contact with the LED11, but the method of deforming the sealing sheet P into a convex shape is not limited to the configuration in which the pressure difference Fa is generated. That is, as shown in fig. 22, the pressing member 141 may be provided inside the upper case 29B.
The pressing member 141 has a convex bottom surface (e.g., a hemispherical bottom surface), and the pressing member 141 is disposed above the sealing sheet S. Therefore, by lowering the pressing member 141, the bottom surface of the pressing member 141 having a convex shape presses the sealing sheet S, and the sealing sheet S can be deformed into a convex shape and brought into contact with the LED. In this case, the structure of the vacuum apparatus 31 and the like necessary for generating the pressure difference Fa can be omitted. In addition, as another structure for deforming the seal sheet P into a convex shape, there is a structure in which the seal sheet P is pressed from above using a roller or the like.
(5) In an embodiment, as shown in fig. 23 (a), the chamber 29 may be provided with a sheet-like elastic body Ds. The elastic body Ds is disposed inside the upper case 29B and configured to contact the inner diameter of the upper case 29B. Further, the lower surface of the elastic body Ds and the cylindrical bottom portion of the upper case 29B are configured to be flush. Therefore, when the chamber 29 is formed by the lower case 29A and the upper case 29B sandwiching the transport sheet T, the elastic body Ds abuts against the transport sheet T. Specifically, the elastic body Ds abuts against a surface of the transportation sheet T on the side opposite to the surface holding the seal sheet S (upper surface side in the drawing). By disposing the elastic body Ds in contact with the inner diameter of the lower case 29A, the elastic body Ds is not sandwiched when the chamber 29 is formed, and therefore, the sealability of the chamber 29 can be prevented from being lowered by the elastic body Ds. Examples of the material constituting the elastic body Ds include rubber, an elastic body, and a gel-like polymer material.
By providing the elastic body Ds in the seal member P, the curvature of the seal member P can be made more uniform when the seal member P is deformed into a convex shape in step S4. As an example, when the seal sheet S is made of a relatively hard material, the curvature of the seal member P becomes uneven as shown in fig. 23 (b).
That is, in the region P1 where the seal sheet S is held by the conveying sheet T in the seal member P, the curvature of the seal member P based on the pressure difference Fa is small because the seal sheet S is hard. On the other hand, in the region P2 where the sealing sheet S is not held by the conveying sheet T in the sealing member P, the curvature ratio of the sealing member P based on the pressure difference Fa is relatively large. That is, the region P2 is more easily deformed by the pressure difference Fa, whereby the bending ratio of the seal member P in the region P1 is further reduced. As a result, the sealing sheet S is not easily deformed, and thus the filling property of the sealing material Sb with respect to the uneven portion (the mounting region of the LED 11) of the substrate 10 is reduced.
On the other hand, when the elastic body Ds is provided, as shown in fig. 23 (c), the entire elastic body Ds is uniformly deformed into a convex shape by the pressure difference Fa. Therefore, the bending ratio of the seal member P in the region P1 is increased. That is, the sealing sheet S is easily deformed according to the shape of the upper surface of the substrate 10 in the region where the LED11 is mounted, and therefore, the filling property of the sealing material Sb into the concave and convex portions of the substrate 10 can be improved. Therefore, the sealing sheet S can seal the LED11 more accurately.
(6) In the embodiment, the heating mechanism 120 is disposed on the upper space H2 side in the chamber 29 and heats the upper space H2, but the present invention is not limited thereto. That is, the heating mechanism 120 may be configured to heat the lower space H1. As an example, the following structure can be given: the heater 125 is disposed inside the holding base 9, and the lower space H1 is heated by the heater 125 to heat the conveying sheet T and the sealing sheet S. Further, the heating mechanism 120 may be configured to heat both the upper space H2 and the lower space H1.
(7) In the embodiment, the LED11 is described as an example of a device to be sealed by the sealing sheet S, but the invention is not limited to this. As other examples of the device, a semiconductor element, an electronic component, and the like can be given in addition to the optical element exemplified by the LED 11.
(8) In the embodiment, after the LED11 is sealed with the sealing sheet S, the step of curing the sealing material Sb of the sealing sheet S may be performed. The step of curing the sealing material Sb may be appropriately changed depending on the material of the sealing material Sb, and examples thereof include curing by heat treatment, curing by ultraviolet treatment, and the like.
(9) In the embodiment, OCA is used as the seal Sb, but is not limited thereto. That is, the sealing member Sb may be made of a material which is not optically transparent, a material which is colorless or colored, or the like.
(10) In the embodiment, the description has been given taking as an example a configuration in which the sealing member P includes the long conveyance sheet T and the sealing sheet S having a predetermined shape, but the sealing member P is not limited to a configuration including the conveyance sheet T. As an example, the seal member P may be formed of an elongated seal sheet S as shown in fig. 24 (a). Fig. 24 (b) shows the structure of step S3 in the case where the LED11 is sealed with the long sealing sheet S. That is, the lower case 29A and the upper case 29B form the cavity 29 by sandwiching the sealing sheet S.
In step S4, the long sealing sheet S is deformed into a convex shape, so that the LED11 is covered with the sealing sheet S as shown in fig. 24 (b). Then, in step S5, by pressurizing at least the air pressure in the upper space H2 to atmospheric pressure or higher, the sealing sheet S seals the LED11 as shown in fig. 24 (c).
(11) In the embodiment, the holding base 9 is moved up and down at predetermined timing to seal the LED11, but the movement of the holding base 9 up and down may be changed as appropriate. For example, the pressurizing process of step S5 is not limited to the configuration in which the holding base 9 is lowered and then performed, and the pressurizing process may be performed while maintaining the raised state.
(12) In the embodiment, the rack holding portion 38 is disposed outside the lower case 29A, but the rack holding portion 38 may be disposed inside the lower case 29A. In this case, the processes after step S4 are performed in a state where the ring frame f and the substrate 10 are housed in the chamber 29.
(13) In the embodiment, the sealing sheet S provided in the sealing member P is formed in advance in a predetermined shape corresponding to the shape of the LED11 mounting surface of the board 10, but the invention is not limited thereto. That is, the sheet supply portion 71 may load the seal member P formed by loading the long seal sheet S in the long conveying sheet T. The structure of the sealing member P in which the long sealing sheet S is attached to the long conveying sheet T is shown in fig. 25 (a). In this case, the device sealing apparatus 1 includes a sheet cutting apparatus 201 upstream of the chamber 29, and the sheet cutting apparatus 201 forms the long seal sheet S into a predetermined shape.
The structure of the sheet cutting apparatus 201 is shown in fig. 25 (b). The sheet cutting device 201 includes a support base 203, a cutter 205, and a seal piece collecting unit 207. The support table 203 is arranged to horizontally receive the long seal member P fed and paid out from the sheet feeding portion 71 in the direction L. The cutter 205 is disposed above the support table 203 and can be moved up and down by a movable table, not shown. As an example of the cutter 205, a thomson blade having a substantially rectangular shape can be used.
By lowering the cutter 205, the layer of the sealing sheet S in the sealing member P is cut off in a substantially rectangular shape. The structure in which the cutter 205 cuts the seal piece S is not limited to this, and another example is a structure in which the cutter 205 in the shape of a knife is moved along a substantially rectangular track to cut the seal piece S in a substantially rectangular shape.
The seal fin recovery unit 207 recovers unnecessary seal fins Sn remaining around the seal fins S cut into a substantially rectangular shape. The unnecessary part of the sealing sheet Sn is peeled off from the conveying sheet T immediately behind the conveying roller 208. The peeled sealing sheet Sn is guided to the recovery bobbin 210 by the guide roller 209. The recovery winding drum 210 winds and recovers the sealing sheet Sn peeled off from the transfer sheet T. Therefore, the sealing member P is in a state where the sealing sheet S formed into a substantially rectangular shape by the cutter 205 remains on the transportation sheet T by the sheet cutting device 201. The sealing sheet S cut into a substantially rectangular shape is guided to the chamber 29 together with the conveying sheet T.

Claims (11)

1.一种器件密封方法，其特征在于，1. a device sealing method, is characterized in that, 该器件密封方法具备：The device sealing method has: 第1密封过程，在该第1密封过程中，将片状密封件和搭载有器件的工件收纳于腔室，以对所述腔室的内部空间进行了减压的状态使所述片状密封件接触于所述工件的器件搭载面，由此利用所述片状密封件来覆盖所述器件；以及A first sealing process in which a sheet-like seal and a workpiece on which the device is mounted are housed in a chamber, and the sheet-like seal is sealed in a state in which the internal space of the chamber is depressurized contacting the device mounting surface of the workpiece, thereby covering the device with the sheet seal; and 第2密封过程，该第2密封过程是在所述第1密封过程之后，通过提高所述腔室的内部空间的压力，从而利用所述片状密封件来密封所述器件。In the second sealing process, after the first sealing process, the device is sealed with the sheet-like seal by increasing the pressure of the inner space of the chamber. 2.根据权利要求1所述的器件密封方法，其特征在于，2. The device sealing method according to claim 1, wherein, 在所述第1密封过程中，通过使所述片状密封件朝向所述工件的器件搭载面变形为凸状，从而使所述片状密封件接触于所述工件的器件搭载面。In the first sealing process, the sheet-like seal is brought into contact with the device-mounting surface of the workpiece by deforming the sheet-like seal into a convex shape toward the device-mounting surface of the workpiece. 3.根据权利要求1所述的器件密封方法，其特征在于，3. The device sealing method according to claim 1, wherein, 在所述第2密封过程中，将所述腔室的内部空间的压力提升至大气压以上的压力。In the second sealing process, the pressure of the inner space of the chamber is raised to a pressure equal to or higher than atmospheric pressure. 4.根据权利要求2所述的器件密封方法，其特征在于，4. The device sealing method according to claim 2, wherein, 所述片状密封件被长条的输送用片所保持，The sheet-like seal is held by a long conveying sheet, 所述腔室具备上壳体和下壳体，The chamber has an upper casing and a lower casing, 所述第1密封过程具有：The first sealing process has: 上下空间形成过程，在该上下空间形成过程中，通过利用所述上壳体和所述下壳体来夹持所述输送用片，从而将所述腔室的内部空间划分为供处于所述器件搭载面朝上的状态的所述工件配置的下空间、和隔着被所述输送用片所保持的所述片状密封件与所述下空间相对的上空间；A process of forming an upper and lower space, in which the upper case and the lower case are used to sandwich the conveying sheet, thereby dividing the inner space of the chamber into spaces for the a lower space in which the workpiece is arranged with the device mounting surface facing upward, and an upper space facing the lower space across the sheet-like seal held by the conveying sheet; 上下空间减压过程，在该上下空间减压过程中，对所述上空间和所述下空间进行减压；以及an upper and lower space decompression process during which the upper space and the lower space are decompressed; and 接触过程，该接触过程是在所述上下空间减压过程之后，在使所述上空间的压力高于所述下空间的压力而在所述上空间与所述下空间之间产生的压力差的作用下，使所述片状密封件朝向所述器件搭载面变形为凸状，使所述片状密封件接触于所述工件的器件搭载面。A contact process, which is a pressure difference between the upper space and the lower space after the upper and lower spaces are decompressed and the pressure in the upper space is made higher than the pressure in the lower space Under the action of , the sheet-shaped sealing member is deformed into a convex shape toward the device mounting surface, so that the sheet-shaped sealing member is brought into contact with the device mounting surface of the workpiece. 5.根据权利要求2所述的器件密封方法，其特征在于，5. The device sealing method according to claim 2, wherein, 所述片状密封件被长条的输送用片所保持，The sheet-like seal is held by a long conveying sheet, 所述腔室具备上壳体和下壳体，The chamber has an upper casing and a lower casing, 所述第1密封过程具有：The first sealing process has: 上下空间形成过程，在该上下空间形成过程中，通过利用所述上壳体和所述下壳体来夹持所述输送用片，从而将所述腔室的内部空间划分为供处于所述器件搭载面朝上的状态的所述工件配置的下空间、和隔着被所述输送用片所保持的所述片状密封件与所述下空间相对的上空间；以及A process of forming an upper and lower space, in which the upper case and the lower case are used to sandwich the conveying sheet, thereby dividing the inner space of the chamber into spaces for the a lower space in which the workpiece is arranged with the device mounting surface facing upward, and an upper space facing the lower space across the sheet-like seal held by the conveying sheet; and 减压接触过程，在该减压接触过程中，在通过仅对所述上空间和所述下空间中的所述下空间进行减压而在所述上空间与所述下空间之间产生的压力差的作用下，使所述片状密封件朝向所述器件搭载面变形为凸状，以所述下空间被减压的状态使所述片状密封件接触于所述工件的器件搭载面。A decompression contact process in which the air generated between the upper space and the lower space by decompressing only the lower space of the upper space and the lower space Under the action of the pressure difference, the sheet-like seal is deformed into a convex shape toward the device mounting surface, and the sheet-like seal is brought into contact with the device mounting surface of the workpiece in a state where the lower space is decompressed . 6.根据权利要求4或5所述的器件密封方法，其特征在于，6. The device sealing method according to claim 4 or 5, wherein, 所述片状密封件具有与所述工件的器件搭载面相对应的规定形状，并被所述长条的输送用片所保持。The sheet-like seal has a predetermined shape corresponding to the device mounting surface of the workpiece, and is held by the long conveying sheet. 7.根据权利要求4或5所述的器件密封方法，其特征在于，7. The device sealing method according to claim 4 or 5, wherein, 具备配设于所述上壳体的内部的片状的弹性体，including a sheet-like elastic body disposed inside the upper case, 所述片状的弹性体配设成，通过在所述上下空间形成过程中利用所述上壳体和所述下壳体来夹持所述输送用片，从而所述片状的弹性体抵接于所述输送用片中的未保持所述片状密封件的面。The sheet-like elastic body is arranged so that the sheet-like elastic body is pressed against the conveying sheet by the upper case and the lower case sandwiching the conveying sheet during the formation of the upper and lower spaces. It is connected to the surface of the conveyance sheet that does not hold the sheet-like seal. 8.根据权利要求4或5所述的器件密封方法，其特征在于，8. The device sealing method according to claim 4 or 5, characterized in that, 该器件密封方法具备加热过程，在该加热过程中，通过对所述下空间和所述上空间中的至少一者进行加热来加热所述片状密封件，The device sealing method has a heating process in which the sheet-like sealing member is heated by heating at least one of the lower space and the upper space, 在所述第1密封过程中，使通过所述加热过程被加热的状态的所述片状密封件接触于所述工件的器件搭载面。In the first sealing process, the sheet-like sealing material in a state heated by the heating process is brought into contact with the device mounting surface of the workpiece. 9.根据权利要求1至5中任一项所述的器件密封方法，其特征在于，9. The device sealing method according to any one of claims 1 to 5, wherein, 所述工件在与所述器件搭载面相反侧的面具备1个或两个以上的凸状构件，The workpiece includes one or more protruding members on a surface opposite to the device mounting surface, 该器件密封方法还具备保持过程，在该保持过程中，使用在中央部具有凹部的保持构件，以使所述凸状构件配置于所述凹部的内部的状态来保持所述工件，The device sealing method further includes a holding process in which the workpiece is held in a state in which the convex member is disposed inside the concave portion using a holding member having a concave portion in the center portion, 在所述工件被所述保持构件保持之后，执行所述第1密封过程。After the workpiece is held by the holding member, the first sealing process is performed. 10.一种器件密封装置，其特征在于，10. A device sealing device, characterized in that: 该器件密封装置具备：The device sealing device has: 第1密封机构，其将片状密封件和搭载有器件的工件收纳于腔室，以对所述腔室的内部空间进行了减压的状态使所述片状密封件接触于所述工件的器件搭载面，由此利用所述片状密封件来覆盖所述器件；以及A first sealing mechanism that accommodates a sheet-like seal and a workpiece on which the device is mounted in a chamber, and brings the sheet-like seal into contact with the workpiece in a state where the internal space of the chamber is reduced in pressure. a device mounting surface whereby the device is covered with the sheet seal; and 第2密封机构，在所述第1密封机构完成工作之后，该第2密封机构通过提高所述腔室的内部空间的压力，从而利用所述片状密封件来密封所述器件。The second sealing mechanism seals the device with the sheet-like seal by increasing the pressure of the inner space of the chamber after the first sealing mechanism has completed its operation. 11.一种半导体产品的制造方法，其用于制造成为搭载于工件的器件被片状密封件密封的状态的半导体产品，该半导体产品的制造方法的特征在于，11. A manufacturing method of a semiconductor product for manufacturing a semiconductor product in a state in which a device mounted on a workpiece is sealed by a sheet-like sealing material, the manufacturing method of the semiconductor product characterized by: 该半导体产品的制造方法具备：The manufacturing method of the semiconductor product includes: 第1密封过程，在该第1密封过程中，将片状密封件和搭载有器件的工件收纳于腔室，以对所述腔室的内部空间进行了减压的状态使所述片状密封件接触于所述工件的器件搭载面，由此利用所述片状密封件来覆盖所述器件；以及A first sealing process in which a sheet-like seal and a workpiece on which the device is mounted are housed in a chamber, and the sheet-like seal is sealed in a state in which the internal space of the chamber is depressurized contacting the device mounting surface of the workpiece, thereby covering the device with the sheet seal; and 第2密封过程，该第2密封过程是在所述第1密封过程之后，通过提高所述腔室的内部空间的压力，从而利用所述片状密封件来密封所述器件。In the second sealing process, after the first sealing process, the device is sealed with the sheet-like seal by increasing the pressure of the inner space of the chamber.
CN202110334362.4A 2020-03-30 2021-03-29 Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product Pending CN113517206A (en)

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