KR102301482B1 - Resin-molding die and resin-molding device - Google Patents

Abstract

An object of the present invention is to provide a resin mold die that can be clamped without excessive stress acting on the work, regardless of the presence or absence of unevenness in the thickness of the work or its size.
As a solution, before the mold resin is injected into the cavity, the height of the workpiece support part 37 is adjusted by the plate thickness variable mechanism according to the thickness of the substrate 1 , and the height of the cavity is adjusted to the height of the semiconductor chip 5 . The height of the cavity recessed part 32 is adjusted by a variable mechanism.

Description

Resin mold mold and resin mold apparatus {RESIN-MOLDING DIE AND RESIN-MOLDING DEVICE}

[0001] The present invention relates to a resin molding apparatus for resin molding by clamping a workpiece.

The present applicant has already proposed a transfer molding apparatus capable of mass-producing a thin package without a resin unfilled area by molding the thickness dimension of the package part to a desired thickness when resin-sealing a thin semiconductor device.

Specifically, the workpiece loaded into the mold is clamped by the clamper while maintaining the retracted position where the cavity piece is retreated by a predetermined thickness from the thickness dimension of the molded product, and the clamper operates the plunger while clamping the workpiece to concave the cavity. The molten resin is filled into the section to maintain the first holding pressure. After the resin filling, the cavity piece is further pushed into the cavity concavity to a molding position corresponding to the thickness dimension of the molded article, and the excess resin in the cavity concavity is pushed back from the gate to the port side, thereby matching the desired thickness dimension of the molded article. Adjust the amount of resin. Moreover, the sealing resin is heat-hardened, maintaining the 2nd holding pressure higher than the 1st holding pressure by operating the plunger again (patent document 1).

Japanese Patent Laid-Open No. 2009-190400

However, in the mold die used in Patent Document 1 described above, the work is clamped by the upper die in which the upper die insert is movably installed and the lower die of a rigid structure on which the work (substrate, etc.) is mounted. , for example, there is no problem when the workpiece has a small unevenness in thickness as in a single-layer substrate, but when the unevenness in thickness is large as in a multi-layer substrate, unevenness occurs in the clamping force between the clamper and the substrate, resulting in a flash burr of the mold resin ( burr) was generated, and there was a fear that the molding quality would be deteriorated.

For example, in a product molded by exposing a workpiece from a mold resin, specifically, a product having a heat dissipation part, there is a possibility that molding quality may be deteriorated due to resin flash.

In addition, if the mold clamping force is strengthened to suppress resin spatter, excessive clamping stress may be applied to the work, which may cause damage or damage to the work. Moreover, in the case of a thinned product, such as a memory, the shaping|molding thickness is influenced by the thickness of a workpiece|work, and it may become difficult to shape|mold uniformly the shaping|molding thickness.

The present invention solves the problems of the prior art, and provides a resin mold mold that can be clamped without excessive stress acting on the workpiece regardless of the presence or absence or size of unevenness in the thickness of the workpiece, and the mold clamping balance using the same is stable It is intended to provide a resin mold apparatus with improved molding quality that does not cause flash burrs.

In order to achieve the above object, the present invention has the following configuration.

That is, it is a resin mold die for resin-molding a work in which a second member is mounted on a first member, wherein the second member is accommodated by a cavity piece forming a cavity bottom and a first insert disposed surrounding the cavity piece The other die provided with the one die in which the cavity recessed part which comprises the cavity to be used is formed, the work support part which supports the said workpiece|work, and the 2nd insert adjacent to the said work support part, and the said one A port and a plunger assembled in either a mold or the other mold to supply a mold resin, and a cavity height in which the height of the cavity concave portion is variable in accordance with the height of the second member by moving the cavity piece in the mold opening/closing direction a variable mechanism; and a plate thickness variable mechanism for varying the height of the work support portion in accordance with the thickness of the first member by moving the work support portion in a mold opening/closing direction with respect to the second insert, wherein the mold resin is Before being injected into the cavity, the height of the workpiece support is adjusted by the plate thickness variable mechanism according to the thickness of the first member, and the cavity height is adjusted by the cavity height variable mechanism according to the height of the second member. It is characterized by adjusting the height.

If the resin mold mold is used, the height of the workpiece support and the cavity recess is adjusted regardless of the presence or absence of uneven thickness in the mold opening/closing direction for all workpieces (the first member, the second member), or the size of the amount of unevenness, It becomes possible to prevent the occurrence of resin flash burrs by stabilizing the mold clamping balance without applying excessive stress to the workpiece.

Moreover, the said cavity height variable mechanism may be provided with the wedge mechanism which moves a movable taper block with a drive source, and adjusts the position of the said cavity piece in the mold opening/closing direction.

In this case, since positional control of the cavity piece in the mold opening/closing direction can be made with high precision, the stress acting on the workpiece (second member) at the time of clamping the mold can be reduced as much as possible, and high-precision molding quality can be maintained. .

Moreover, as for the said cavity height variable mechanism, the one or both of the said cavity piece and the said 1st insert may be floatingly supported by the said one die chase.

In this case, the depth of the cavity (height from the substrate to the cavity piece) can be changed instantaneously by adjusting the float amount of the cavity piece and/or the first insert in accordance with the mold opening/closing operation. In particular, even if there is a non-uniformity of the height position of the second member from the first member, the difference in resin capacity can be absorbed by the cavity piece and/or the float structure of the first insert, and resin molding can be performed.

Moreover, the said plate|board thickness variable mechanism may be provided with the wedge mechanism which moves a movable taper block with a drive source, and adjusts the position in the mold opening/closing direction of the said workpiece|work support part.

In this case, since the position control of the mold opening/closing direction of the workpiece support part can be increased with high precision, the stress acting on the workpiece (first member) at the time of clamping the mold can be reduced as much as possible, and high-precision molding quality can be maintained. .

Further, it is preferable that a dummy cavity is provided on the clamp surface of the first insert, and the surplus resin is accommodated from the cavity recess to the dummy cavity.

Thereby, the void generated in the mold resin filled in the cavity concave portion can be pushed into the dummy cavity and flowed, thereby improving the molding quality. In particular, the resin filling property at the time of performing underfill molding can be improved.

Moreover, you may be provided with the closing means which stops the discharge|emission of air by pressurizing the clamp surface which opposes the outer peripheral side from the said dummy cavity of the said 1st insert.

In this case, it is possible to stop the discharge of the air from the decompression space by the closing means at a desired timing to prevent the resin leakage from the dummy cavity and the unfilling of the resin in the cavity.

It is preferable to provide a pressure reducing mechanism in which a closed space blocked from the external space is formed before the one mold and the other mold are mold-closed, and the pressure-reduced space including the cavity is formed by depressurizing the inside of the closed space. do.

Thereby, it becomes difficult to generate|occur|produce a void in mold resin by exhausting the air which remains in a cavity.

In addition, a through hole for accommodating the second member and a resin path communicating therewith are formed, and the outer peripheral end of the first member supported by the work support portion and the second insert; An intermediate plate may be provided to be used while being overlapped with the other die clamp surface over the gap.

In this case, gold plating for a runner is not required on the first member (for example, the substrate), and even if a mold resin having a low viscosity and high fluidity with a fine filler is used, the gap between the first member and the mold is used. There is also no risk of mold resin leaking into the mold and causing mold sliding failure.

Further, a dummy cavity may be formed on the outer peripheral side from the first member of the intermediate plate, and the surplus resin may be accommodated from the through hole to the dummy cavity. In this case, if the dummy cavity is formed on the outer peripheral side from the first member, the number of molded articles on the first member (for example, the substrate) can be increased to improve the utilization rate of the substrate.

In addition, if the dummy cavity is formed in the through hole penetrating the intermediate plate, the unnecessary resin can be easily released.

Moreover, you may be provided with the swivel mechanism which is guided by the guide surface part of the guide piece arrange|positioned opposite to the workpiece abutting surface of the said cavity piece which abuts the said 2nd member, and can tilt the said cavity piece.

As a result, even if the second member (eg, semiconductor chip) mounted on the first member (eg, the substrate) has an inclination, it does not come into contact with the inclination of the second member via the cavity piece and the release film. Therefore, since the cavity piece inclines, excessive stress does not act on a 2nd member, and a possibility that a 2nd member may be damaged or damaged is eliminated.

Moreover, the said 2nd member pressing surface of the said cavity piece may be formed in the convex surface part, and the periphery may be formed in the uneven|corrugated surface in which the recessed groove part was formed.

In this case, for example, the light emitting surface of the semiconductor chip is pressed by the convex surface of the cavity piece to expose it, and a low-viscosity silicone resin (white resin) is filled in the concave groove surrounding it to form a reflector surrounding the light emitting surface. It can be efficiently molded by a transfer mold.

In addition, if a release film that covers and holds the one mold clamp surface including the cavity concave portion is provided, the mold resin does not come into direct contact with the cavity concave portion, thus reducing mold maintenance and resin leakage. can prevent Moreover, when the cavity piece which forms a cavity bottom part contact|abuts to a workpiece|work via a release film, it can prevent that a workpiece|work surface is damaged.

In addition, in the resin molding apparatus, any one of the resin mold molds described above is provided, and a work supply unit, a press unit for clamping and resin molding the work with the resin mold die, and a housing unit for the molded product, According to the thickness of the first member and the height of the second member, before injecting the mold resin into the cavity, the operation amount of the cavity height variable mechanism is set to determine the height position of the cavity piece in the mold opening/closing direction. After setting to the position, the first member is clamped to perform resin molding.

When the resin mold apparatus is used, the stress applied to the first member or the second member that is a work-in when clamping the resin mold mold can be reduced as much as possible.

A liquid resin supply part is provided adjacent to the press part, and you may make it supply liquid resin by moving a supply nozzle forward and backward in the port of the mold die which the said press part mold-opened. In this case, an underfill mold of a flip-chip mounted semiconductor chip using a low-viscosity epoxy-based liquid resin can be realized by a transfer mold, or a low-viscosity silicone resin is used to mold LEDs, reflectors, etc. Longer lifespan can be achieved by improving quality.

In addition, it is not limited to liquid resin, and tablet resin may be sufficient.

By using the present invention described above, it is possible to provide a resin mold mold that can be clamped without excessive stress acting on the workpiece regardless of the presence or size of unevenness in the thickness of the workpiece, and by using this, the mold clamping balance is stabilized. , it is possible to provide a resin mold apparatus with improved molding quality that does not cause resin flash burrs.

BRIEF DESCRIPTION OF THE DRAWINGS It is a layout block diagram of the resin mold apparatus which concerns on Example 1. FIG.
2A and 2B are mold cross-sectional views for explaining the molding operation of the mold mold according to the first embodiment.
3C and 3D are mold cross-sectional views for explaining the molding operation of the mold mold following FIGS. 2A and 2B.
Fig. 4E is a cross-sectional view of a mold for explaining a molding operation of the mold mold following Figs. 3C and 3D.
5A and 5B are mold cross-sectional views for explaining the molding operation of the mold mold according to the second embodiment.
6A and 6B are mold cross-sectional views for explaining the molding operation of the mold mold according to the third embodiment.
7A and 7B are mold cross-sectional views for explaining the molding operation of the mold mold according to the fourth embodiment.
8A to 8C are die cross-sectional views for explaining the molding operation of the molding die according to the fifth embodiment.
9A to 9C are die cross-sectional views for explaining the molding operation of the molding die according to the sixth embodiment.
Fig. 10 is a layout configuration diagram of a resin mold apparatus according to a seventh embodiment.
11A to 11C are cross-sectional views of the mold for explaining the operation of supplying liquid resin to the mold according to the seventh embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the resin mold apparatus which concerns on this invention is demonstrated in detail with an accompanying drawing. In the following embodiment, a transfer molding apparatus using a mold die in which a cavity concave portion is formed on the upper die side and a port is formed on the lower die side is exemplified and described. In addition, in a transfer molding apparatus, a lower mold is made into a movable mold, and an upper mold is made into a fixed mold, and is demonstrated.

[Example 1]

As shown in Fig. 1, the resin mold apparatus of this embodiment has a work supply unit (A), a preheating unit (B) for preheating the work, a press unit (C) for resin molding the work, and a molded article storage unit ( D) and a conveyance mechanism (E). The press part C is equipped with the press apparatus with which the mold metal mold|die which clamps and resin-molds a workpiece|work is attached. The conveyance mechanism E carries out the conveyance action|action of carrying in a workpiece|work into the press part C, and carrying out a molded article from the press part C. As shown in FIG.

(workpiece supply (A))

In FIG. 1, the work supply part A is equipped with the stocker which accommodates the magazine which accommodated the board|substrate (lead frame, resin board|substrate, etc.) 1 formed in the elongate shape, for example. The boards 1 cut out from each magazine by the pusher are placed face to face on a set stand 2 in sets of, for example, two sheets. Moreover, you may make it move the board|substrate 1 from the magazine which accommodated the direction of the board|substrate 1 to the turntable with a pusher from the magazine which accommodated it in one direction so that it faces and arrange|positions, and transfers the board|substrate 1 to the set stand 2 from the said turntable.

A tablet supply unit 4 for supplying the resin tablet 3 according to the planar arrangement of the pot of the mold die is provided on the side of the set table 2 . The board|substrate 1 of the set table 2 is hold|maintained by the conveyance mechanism E (loader 16) mentioned later, and it is conveyed to the preheating part B. As shown in FIG. Moreover, the resin tablet 3 of the tablet supply part 4 is hold|maintained by the loader 16, and is conveyed to the press part C. As shown in FIG.

The work (product to be molded) as the object of the resin mold corresponds to the "first member" of the present invention, for example, a semiconductor corresponding to the "second member" of the present invention on the substrate 1 formed in an elongated shape. It is a product in which the chip 5 is mounted (flip chip mounting, wire bonding mounting, etc.) (refer to FIG. 2B ). In addition, a product in which the semiconductor chips 5 are mounted on the substrate 1 in one stage or in multiple stages, a product in which a semiconductor device is mounted on the substrate 1 , and an imaging element mounted on the substrate 1 and an imaging element Products in which light-transmitting glass is laminated to the light-receiving surface of Moreover, as a "first member" in this invention, various plate-shaped members, such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer, can be used. As the "second member" in the present invention, in addition to the semiconductor chip, various members such as a heat sink, a lead frame used for wiring and heat dissipation, and an electronic component such as a bump for electrical connection can be used. Therefore, the "workpiece" in this invention means the thing of the state which mounted and laminated|stacked the "2nd member" on these "1st member". Also in the form of resin molding, each mounting component may be individually accommodated in a cavity and resin molded, or a plurality of mounting components mounted on a board may be accommodated in one cavity and collectively resin molded. By performing the resin mold mentioned later by these structures, it can also seal so that the end surface of a 1st member and the end surface of a 2nd member may be exposed.

(Preheating part (B))

The substrate 1 supplied from the work supply unit A is transferred from the measuring table to a heater block (not shown) provided in the preheating unit B by a loader 16 among a conveying mechanism E to be described later. The heater block is preheated to a predetermined temperature with the substrate 1 mounted thereon. It is preferable that the heater block be configured so as to be covered with an open/close cover around the heater block to suppress the influence on other units. The board|substrate 1 after preheating is hold|maintained by the loader 16, and is conveyed to the press part C. As shown in FIG.

(press part (C))

The press unit C includes a press device 6 that opens and closes the mold die 19 (refer to Fig. 2A) to clamp the preheated work and mold the resin. The press device 6 is a press mechanism that presses the mold die 19 to be described later in the mold opening/closing direction, and resin melted in the pot 35 of the mold die 19 from the pot 35 into the cavity. A transfer mechanism for filling the recessed portion 32 (refer to Fig. 2A) is provided.

The press device 6 includes a cavity height variable mechanism that pushes the cavity piece 23 (see FIG. 2A ) in the mold opening/closing direction and a plate thickness variable mechanism that pushes the workpiece support 37 (see FIG. 2A ) in the mold opening/closing direction. is provided The cavity height variable mechanism is provided with the upper die drive part 7 which makes the height of a cavity recessed part relatively variable, for example by pushing the upper die insert member (cavity piece 23) in the die opening/closing direction. This upper die drive unit 7 has a servo motor 31 described later by the number of cavities provided with respect to one substrate (in other words, the number of cavity pieces 23), so that the height of the cavity can be individually adjusted. Consists of. Therefore, in the rectangular substrate 1, when forming a plurality (for example, three) of resin-sealed regions, the same number of servo motors 31 (in this case, three) and a drive mechanism described later are provided. you may be doing

Moreover, the plate|board thickness variable mechanism is provided with the lower mold|die drive part 8 which presses the insert member (workpiece support part 37) of a lower mold|die in the mold opening/closing direction (refer FIG. 2A). Depending on the workpiece 1, before injecting the mold resin into the cavity, the amount of operation of the cavity height variable mechanism and the plate thickness variable mechanism is adjusted so that the height position of the cavity recessed portion 32 in the mold opening/closing direction is relatively set to a predetermined position. set it to be That is, before pouring mold resin into a cavity, while setting a cavity height variable mechanism according to the height of the semiconductor chip 5, according to the thickness of the board|substrate 1, a plate|board thickness variable mechanism is set.

In addition, in this embodiment, the method of coat|covering the metal mold|die surface (resin mold surface) of a mold metal mold|die with the release film 10 and resin molding is used. For this reason, the press apparatus 6 is equipped with the film supply mechanism 9 which supplies the release film 10 to the metal mold|die surface of a mold die. The film supply mechanism 9 is equipped with the supply roll 9a which supplies the release film 10 to the metal mold|die surface (upper mold surface) on both sides of a mold die, and the winding roll 9b which winds up the release film 10 do. However, you may employ|adopt the structure which does not coat|cover the metal mold|die surface of a mold metal mold|die with the release film 10. Moreover, you may employ|adopt the structure which is not provided with the release film 10. For example, by arranging a ring-shaped sealing member made of resin or metal on the outer periphery of the cavity piece 23, and eliminating the clearance with the upper die insert block 26 described later by thermal expansion of the sealing member, from this clearance of resin may be prevented from leaking.

(Molded part receiving part (D))

The molded article accommodating part D includes a set part 12 for setting the molded article 11 after resin molding, a gate break part 13 for removing unnecessary resin such as a gate from the molded article 11, and a molded article from which unnecessary resin is removed. A accommodating part (14) for accommodating (11) is provided. The molded article 11 is accommodated in the magazine 15 for storage, and the magazine 15 in which the molded article is accommodated is sequentially accommodated in the stocker.

(Transfer mechanism (E))

The conveyance mechanism E is equipped with the loader 16 which carries in a workpiece|work into the press part C, and the unloader 17 which carries out the molded article 11 from the press part. The work supply unit (A), the preheating unit (B), the press unit (C), and the molded product storage unit (D) are connected to unitized mounts to assemble a resin mold apparatus. Guide portions 18 are respectively provided on the device depth side of each unit, and guide rails are formed by assembling the guide portions 18 to linearly connect each other. The loader 16 and the unloader 17 are provided so that reciprocating motion is possible along a guide rail, respectively. The loader 16 and the unloader 17 linearly advance and retreat from a predetermined position on the guide unit 18 toward the work supply unit A, the preheat unit B, the press unit C, and the molded product storage unit D. It is installed to be movable.

Therefore, by changing the structure of a unit, the structural aspect of the resin mold apparatus can be changed, maintaining the state which connected the guide parts 18 comrades. For example, although the example shown in FIG. 1 is an example in which two press apparatuses 6 are installed, it is also possible to comprise the resin mold apparatus which the press apparatus 6 was connected in a single number or three or more units|sets. Similarly, it is good also as a structure provided with the liquid resin supply part F mentioned later in plural units.

An outline of the resin mold operation will be described. The work (substrate 1) set on the set table 2 in the work supply unit A is picked up by the loader 16 and held along the guide unit 18 to the preheating unit B. Moving, the resin is preheated before being molded.

On the other hand, in parallel with the operation in which the unloader 17 takes out the molded article 11 after the resin mold from the press device 6, the loader 16 moves on the guide rail, and the resin tablet ( While picking up 3), the board|substrate 1 is picked up from the preheating part B. Then, the loader 16 moves to the side of the press apparatus 6, enters into the said press apparatus 6, and supplies the board|substrate 1 and the resin tablet 3 to the mold die which opened the mold. The substrate 1 and the resin tablet 3 are heated by a heater (not shown) provided in the mold die. After the loader 16 is withdrawn from the press device 6, the workpiece is clamped by a mold die 19 (see Fig. 3C), and a cavity recessed portion 32 for accommodating the semiconductor chip 5 to form a cavity. (refer to FIG. 3D) is filled with the molten mold resin, and the semiconductor chip 5 is resin molded.

The unloader 17 enters from the side of the press apparatus 6 to the mold die opened after resin molding, picks up a molded article, and carries out the molded article 11 from the press apparatus 6 . The unloaded molded article 11 is moved along the guide rail by the unloader 17 to be transferred to the set part 12 of the molded article accommodating part D and mounted, and then from the set part 12 to the gate brake part 13 It is transferred to a gate break, unnecessary resin is removed, and the molded product 11 is accommodated in the storage unit 14 . In addition, when using liquid resin as mold resin, the thickness measurement part of the molded article 11 is provided, the thickness of the resin mold part is measured, and the supply amount can also be adjusted based on the measurement result of the thickness of the said resin mold part.

As mentioned above, while supplying the board|substrate 1 sequentially from the workpiece|work supply part A, the board|substrate 10 is resin-molded in the press part C, and the molded article 11 is accommodated in the molded article accommodating part D. do.

In the resin molding apparatus of the present embodiment, by driving the mold die so as to clamp according to the thickness of the workpiece (the substrate 1 and the semiconductor chip 5) and then molding the resin, the stress acting on the workpiece by the mold clamp is reduced. It can be reduced as much as possible, and resin molds can be molded with high precision without generating resin burrs.

Next, the structure of the mold metal mold|die with which the resin molding apparatus is equipped is demonstrated with reference to FIG. The mold die 19 is provided with the upper die 20 (one die) and the lower die 21 (the other die).

The configuration of the upper die 20 will be described with reference to FIG. 2A . The upper die 20 is supported by a cavity piece 23 forming a cavity bottom on the upper die chase block 22 via a spring 24 interposed therebetween. A tapered surface 23a is formed on a surface opposite to the workpiece abutting surface of the cavity piece 23 . The cavity piece 23 is supported so that the tapered surface 23a may overlap with the tapered surface 25a of the 1st movable taper block 25 provided between the upper die chase block 22 (wedge mechanism).

In addition, the upper die insert block 26 (first insert) is supported by the upper die chase block 22 in a rigid state. The cavity piece 23 is inserted into the through hole 26a so as to form the bottom of the cavity concave part formed in the upper die insert block 26, and is suspended and supported. Further, the cavity piece 23 may be supported by the first movable taper block 25 in a state in which the spring 24 is extended beyond its natural length (a state in which a restoring force is applied). In this case, the cavity piece 23 is supported rigidly (rigidly) by the 1st movable taper block 25 and tapered surfaces contact|abutting. In the upper die insert block 26, a resin furnace such as a concave portion 26b forming a cavity concave portion 32, an upper die curl 26c, an upper die runner 26d, or a dummy cavity 26e is formed on the upper die clamp surface. has been speculated. In addition, the depth of the groove part (through gate) which connects the dummy cavity 26e and the cavity recessed part 32 is the clearance gap with the board|substrate 1 (in other words, the part to be underfilled if it is the flip-chip mounted semiconductor chip 5). ) can be formed narrower. In this case, it is preferable because the underfill under the semiconductor chip 5 can be given priority over the filling of the resin into the dummy cavity 26e. Moreover, the upper die seal ring 27 which closes the clearance gap between the outer peripheral surface of the upper die insert block 26 and the inner wall surface of the upper die chase block 22 which opposes is provided. The upper die seal ring 27 is provided in order to implement|achieve each function by the pressure-reduction apparatus 29 and 58 of 2 systems mentioned later. That is, it is provided in order to separate the space which pressure-reduces the suction of the release film 10 by the upper mold seal ring 27, and the cavity by the pressure reduction device 58. As shown in FIG.

The upper die chase block 22 is provided with an upper die suction path 28 . The upper die suction path 28 is connected to the pressure reducing device 29 . The gap between the upper mold chase block 22 and the upper mold insert block 26, the gap between the upper mold insert block 26 and the cavity piece 23, and the suction hole (not shown) formed in the clamp surface of the upper mold insert block 26 are It is connected to the upper die suction path 28 and is connected to the pressure reducing device 29 . The release film 10 is an upper die clamp surface including a cavity piece 23 by a suction mechanism using a suction hole (not shown) formed in the upper die clamp surface, and a gap between the cavity piece 23 and the upper die insert block 26 . is retained by adsorption. The release film 10 has heat resistance that can withstand the heating temperature of the mold die 19, is easily peeled off from the mold surface, and is a film material having flexibility and extensibility, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. are used suitably.

The first movable tapered block 25 is formed with a tapered surface 25a having a predetermined inclination angle so that the plate thickness decreases (or increases) toward the cavity piece 23 . The 1st movable taper block 25 is connected to the servomotor 31 via the screw shaft 30 (upper mold drive part 7). When the servo motor 31 is started in a predetermined direction, the first movable taper block 25 screw-fitted via the screw shaft 30 moves forward and backward along the bottom of the upper die chase block 22 . Thereby, the cavity piece 23 can adjust the height position (upper surface part) of the mold opening/closing direction of the cavity recessed part 32 via the release film 10. As shown in FIG. In addition, the servomotor 31 can be arrange|positioned so that it may be spaced apart with respect to the wall surface of the mold heated in the upper mold 20. As shown in FIG. In addition, the servomotor 31 may be comprised so that connection with the screw shaft 30 can be cancelled|released as needed in order to prevent heating by a mold, and to improve maintainability.

Next, with reference to FIG. 2A, the structure of the lower mold|type 21 is demonstrated. The lower die 21 is known to raise and lower the lower die movable platen on which the lower die chase block 33 is mounted via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). The mold opening and closing is performed by the mold clamping mechanism of In addition, even with a configuration in which the inclination of the lower mold movable platen with respect to the fixed platen supporting the upper mold is corrected by supporting each part of the lower mold movable platen by three or more ball screw mechanisms and finely adjusting the driving amount do. In these cases, as for the lifting operation of the lower mold 21 , the moving speed, the pressing force, etc. can be arbitrarily set, the operation of filling the cavity concave portion 32 with the mold resin and the surplus resin, which will be described later, is pressed from the cavity concave portion 32 . In the returning operation, the flow rate of the mold resin and the resin pressure can be arbitrarily set. For this reason, since these also become controllable by a clamping mechanism, an apparatus structure can be simplified.

A lower mold insert block 34 (second insert) is assembled to the lower mold chase block 33 . At the center of the lower mold insert block 34, a cylindrical port 35 in which a mold resin (resin tablet 3) is loaded is assembled. The upper end surface of the lower mold insert block 34 is formed on the same surface as the upper end surface of the port 35 . In the port 35, a plunger 36 that moves up and down by a known transfer drive mechanism is provided. As the plunger 36, a plurality of plungers corresponding to the plurality of ports 35 are provided in a support block (not shown). An elastic member (not shown) is provided on the support portion of each plunger 36, and each plunger 36 is slightly displaced by the elasticity of the elastic member to avoid excessive pressing force and unevenness in the amount of resin in the tablet at the time of holding pressure. able to adapt to

On the upper surface of the lower mold chase block 33, adjacent to both sides of the lower mold insert block 34, a workpiece support part 37 on which a workpiece is mounted is provided. As the work, a product for one-side mold in which the semiconductor chip 5 is mounted on one surface of the substrate 1 is used. The work support part 37 is supported floatingly by the spring 38 provided between the upper surface of the lower mold|type chase block 33 and the work support part 37. As shown in FIG.

Between the work support part 37 and the lower mold|type chase block 33, the fixed taper block 57 and the 2nd movable taper block 39 overlap and are provided. The tapered surface 57a formed on the lower surface of the fixed taper block 57 and the tapered surface 39a formed on the upper surface of the second movable taper block 39 are overlapped and supported on the lower mold chase block 33 ( wedge mechanism). The work support part 37 can be set as the structure in which the spring 38 was supported in the state (state which elastic force acted) shortened from its natural length. The 2nd movable taper block 39 is connected to the servomotor 41 via the screw shaft 40 (lower mold|type drive part 8). When the servo motor 41 is started in a predetermined direction, the second movable taper block 39 screwed through the screw shaft 40 moves forward and backward along the bottom of the lower mold chase block 33 . Thereby, the position of the mold opening/closing direction of the workpiece support part 37 can be adjusted according to the plate|board thickness of the workpiece|work (substrate 1), and it can adjust so that, for example, the board|substrate upper surface may become substantially flush with the lower die clamp surface. That is, regardless of the thickness of the substrate 1 , by making the upper surface of the substrate 1 rise by the same amount from the lower clamping surface, the substrate 1 is not damaged and the resin leakage can be prevented. Although the work support part 37 is rigidly supported by the fixed taper block 57, the clearance gap may be formed between the fixed taper block 57. As shown in FIG. In this case, it is possible to clamp the substrate 1 without applying an excessive clamping force due to the bending of the spring 38 . Moreover, according to the thickness of the work (substrate 1), the work support part 37 from which thickness differs can be replaced|exchanged and the board|board thickness can also be adjusted. Moreover, the work support part 37 may be equipped with the suction structure not shown in figure. In this case, even if the substrate 1 is prone to distortion due to preheating, it may be clamped while being held flat by adsorbing to the work support 37 . Thereby, even if it is a thin board|substrate 1 which warps easily, it can hold|maintain reliably, and can clamp reliably without shifting a position.

Moreover, the lower mold|type seal ring 42 is provided in the outer peripheral position of the lower mold|type chase block 33 (lower mold|type 21). Further, the lower mold chase block 33 is provided with a lower mold suction path 43 . The lower mold suction path 43 is connected to a pressure reducing device 58 . The lower mold suction path 43 is opened from the lower mold seal ring 42 to the inner peripheral side. When the mold die 19 is closed, the upper die chase block 22 and the lower die chase block 33 are in a state with the lower die seal ring 42 interposed therebetween, and the outer periphery between the upper die 20 and the lower die 21 . A closed space is formed. When the decompression device 58 is activated, a decompression space is formed through the lower mold suction path 43 .

Here, the opening/closing operation according to the resin molding operation of the mold die 19 will be described with reference to FIGS. 2A and 2B, 3C, 3D, and 4E. 2A shows a state in which the mold die 19 is mold-opened. On the upper die clamp surface, the pressure reducing device 29 is actuated, and the release film 10 is adsorbed and held. In this embodiment, for example, according to the thickness of the workpiece (the substrate 1 and the semiconductor chip 5), the operation amount of the cavity height variable mechanism and the plate thickness variable mechanism is finely adjusted before the mold die 19 is closed. do.

That is, according to the height of the semiconductor chip 5, the servo motor 31 is started, the first movable taper block 25 is slid (forward movement or backward movement) to either side via the screw shaft 30, and the cavity piece (23) is adjusted to a height position that can be pressed without applying excessive stress to the semiconductor chip 5.

Further, in accordance with the plate thickness of the substrate 1, the servo motor 41 is started, the second movable taper block 39 is slid (forward movement or backward movement) to either side via the screw shaft 40, and the work support part (37) is adjusted to a height position at which the substrate 1 can be clamped without excessive stress.

Next, in FIG. 2B , the work is supplied by the loader 16 (refer to FIG. 1 ) to the lower die 21 of the mold die 19 that has been opened. That is, the substrate 1 on which the semiconductor chip 5 is mounted is loaded into the work support 37 , and the resin tablet 3 is loaded into the port 35 . At this time, since the thickness of the workpiece|work support part 37 is adjusted in advance by the lower mold|type drive part 8, the board|substrate 1 is supported so that it may become substantially flush with the lower mold|type clamp surface. In addition, the semiconductor chip 5 may be wire-bonding mounted. In this case, the cavity piece 23 has a protrusion shape that can be clamped with respect to the flat portion of the inner side to which the wire of the semiconductor chip 5 is bonded, so that even a workpiece on which the semiconductor chip 5 is wire-bonded is clamped. can be molded.

Next, in FIG. 3C, the lower die 21 is raised and the mold die 19 is mold-closed. At this time, prior to or together with the start of the clamping operation, the pressure reducing device 58 may operate to start the suction operation from the lower mold suction path 43 . When the upper die chase block 22 abuts against the lower die seal ring 42 , a closed space is formed between the upper die 20 and the lower die 21 , and the pressure-reduced space is formed by the suction operation from the lower die suction path 43 . is formed

The clamping operation proceeds further, so that the upper insert block 26 is in contact with the lower insert block 34 and the substrate 1 with the release film 10 interposed therebetween, and the cavity piece 23 is brought into contact with the release film 10 with the release film 10 interposed therebetween. When it comes into contact with the semiconductor chip 5, the clamping operation is completed. In addition, after the mold die 19 is mold-closed, you may fine-tune the operation amount of the cavity height variable mechanism and the plate|board thickness variable mechanism.

Next, in Fig. 3D, the transfer mechanism is operated, the plunger 36 is pushed up, and the melted mold resin is press-feed to the cavity recessed portion 32 via the upper die curl 26c and the upper die runner 26d. At this time, since the upper surface of the semiconductor chip 5 is pressed against the cavity piece 23 , if it is the flip chip mounted semiconductor chip 5 , the molten resin can be induced between the semiconductor chip 5 and the substrate 1 for underfilling. That is, the mold underfill (MUF) in which the underfill is performed in the mold die 19 can be performed. In addition, even if there are voids in the molten resin filled in the region immediately below the semiconductor chip 5 to be underfilled, the mold resin overflows from the cavity recessed portion 32 to the dummy cavity 26e, thereby pushing the voids to flow, thereby filling the resin in the cavity. performance can be improved. The air bubbles mixed in the mold resin may flow preferentially to the resin and, after overflowing, may be discharged to the reduced pressure space through an air vent (not shown), and may be sucked from the lower mold suction path 43 and exhausted. Moreover, by the operation of the plate thickness variable mechanism, it is possible to press and flow the mold resin into the dummy cavity 26e through a groove portion having a uniform depth regardless of the thickness of the substrate 1 . That is, depending on the material of the substrate 1, it is possible to prevent a situation such as being deformed by a clamping force and bulging into the groove portion to narrow the cross-sectional area. Therefore, even if there is unevenness in the thickness of each workpiece, the resin leakage can be prevented while reliably overflowing the mold resin into the dummy cavity 26e, so that voids can be reliably discharged regardless of the thickness of the workpiece, improving molding quality It is possible to stabilize

Fig. 4E shows a process of overmolding the semiconductor chip 5 mounted on the substrate 1 without exposing the semiconductor chip 5 as well as performing the underfilling of the mold. This step can be arbitrarily carried out according to the product requirements of the work. In Fig. 3D, in the case of the flip-chip mounted semiconductor chip 5, after underfill molding is performed, that is, after the mold resin overflows into the dummy cavity 26e, the upper die drive unit 7 is activated to activate the cavity piece 23. to increase the volume of the cavity concave portion 32 . Specifically, the servo motor 31 is started to slide the 1st movable taper block 25 via the screw shaft 30 in the direction retracted from the planar position of the cavity piece 23. As shown in FIG. Thereby, the cavity piece 23 rises along the inclination of the tapered surface 25a, a clearance gap (cavity volume) is formed between the semiconductor chip 5, and the mold resin is filled. Thus, by performing the overmolding process after performing the underfill process in advance, compared with the case where these processes are performed simultaneously, the non-filling in underfill can be prevented more reliably.

In addition, in order to further improve the filling property in underfill, you may repeat the vertical motion of the cavity piece 23. As shown in FIG. In this case, the first movable taper block 25 is moved forward and backward through the screw shaft 30 by driving the servo motor 31 forward/reverse rotation, that is, the state of FIGS. 3D and 4E is repeated. Moreover, you may make it push back resin from the cavity recessed part 32 to the pot 35 side by repeating the vertical motion of the plunger 36 at the same time. Thereby, it becomes easy to fill in the space part which is a clearance gap by increasing the flow amount of mold resin. Moreover, when using the structure which makes the height of the cavity piece 23 variable by a mold closing operation like the Example mentioned later, repetition can be performed quickly and shaping|molding with high filling property can be performed in a short time.

When the mold 19 is used, even if there is a non-uniformity in the thickness of the substrate, by changing the height position of the work support part 37 by the plate thickness adjustment mechanism, the upper surface of the substrate 1 can be adjusted to match the mold clamp surface. Therefore, even if the height (including the stacked height) of the semiconductor chip 5 from the substrate 1 varies from work to work, by changing the height position of the cavity piece 23 by the cavity piece adjustment mechanism, molding It can be adjusted so that the thickness is constant.

Therefore, regardless of the presence or absence of unevenness in the thickness direction of the workpiece (substrate 1, semiconductor chip) or the magnitude of the unevenness, excessive stress does not act on the workpiece and the clamping balance can be stabilized and clamped. If a wedge mechanism for adjusting the position in the mold opening/closing direction is provided on both the cavity piece 23 and the work support part 37, the position control in the mold opening/closing direction of the cavity piece 23 and the work support part 37 in the mold opening/closing direction is highly precise. Therefore, the stress acting on the workpiece at the time of clamping the mold can be reduced as much as possible, and high-precision molding quality can be maintained.

In addition, voids generated in the mold resin filled with the cavity concave portion 32 can be pressed into the dummy cavity to flow, thereby improving molding quality. In particular, the resin filling property at the time of performing underfill molding can be improved.

Therefore, it is possible to provide a resin mold apparatus with a uniform molding thickness and no flash burrs, with improved molding quality.

[Example 2]

Next, another example of a resin mold apparatus is demonstrated. Since the device configuration is common, the description will be mainly focused on the change points of the mold. The same number is attached|subjected to the member same as Example 1, and description shall be invoked.

5A and 5B, the difference is that the resin molding is performed by interposing the intermediate plate 44 between the upper die 20 and the lower die 21. As shown in FIG. In the intermediate plate 44, a first through hole 44a communicating with the port 35, a gate 44b (with resin) communicating with the upper die runner 26d, and a semiconductor chip with the gate 44b communicating A second through hole 44c (corresponding to the cavity) for accommodating 5) and a through gate 44d (made of resin) for communicating the second through hole 44c and the dummy cavity 26e are formed. The intermediate plate 44 is used, for example, with a plate thickness matching the height of the semiconductor chip 5 of the work and a resin mold region matching the second through hole 44c.

In FIG. 5A, as a premise, according to the measurement result in the workpiece measurement part B, the servomotor 31 is started according to the height of the semiconductor chip 5, and the 1st movable taper block via the screw shaft 30. (25) is slid in either direction (forward movement or backward movement), and the cavity piece 23 is adjusted in advance to a height position that can be pressed without applying excessive stress to the semiconductor chip 5 .

Further, in accordance with the plate thickness of the substrate 1, the servo motor 41 is started, the second movable taper block 39 is slid (forward movement or backward movement) to either side via the screw shaft 40, and the work support part (37) is pre-adjusted to a height position at which the substrate 1 can be clamped without excessive stress.

Next, by the loader 16 , the substrate 1 is mounted on the work support part 37 , the resin tablet 3 is loaded into the port 35 , and then the intermediate plate 44 is attached to the outer peripheral end of the substrate 1 . and the lower mold insert block 34 overlap the lower mold clamp surface. At this time, the intermediate plate 44 is positioned so that the first through hole 44a is aligned with the port 35 and the semiconductor chip 5 is accommodated in the second through hole 44c, so that the first through hole 44a is aligned with the lower mold clamp surface. is mounted The intermediate plate 44 may be supplied to the mold die 19 by means of an original conveying mechanism by providing a supply unit, or may be supplied together with the resin tablet 3 by the loader 16 .

Next, the lower die 21 is raised to close the mold die 19 . When the upper die chase block 22 abuts against the lower die seal ring 42 , a closed space is formed between the upper die 20 and the lower die 21 , and the pressure-reduced space is formed by the suction operation from the lower die suction path 43 . is formed The clamping operation proceeds further, so that the upper mold insert block 26 comes into contact with the intermediate plate 44 with the release film 10 interposed therebetween, and the cavity piece 23 is attached to the semiconductor chip 5 with the release film 10 interposed therebetween. When abutting, the clamping operation is completed.

Next, in Fig. 5B, the transfer mechanism is operated, the plunger 36 is pushed up, and the melted mold resin is transferred to the first through hole 44a, the upper die curl 26c, the upper die runner 26d, and the gate 44b. through the pressure feed to the second through hole 44c. At this time, the molten mold resin is directly injected into the second through hole 44c constituting the cavity over the gap between the substrate 1 and the mold by passing through the upper surface of the intermediate plate 44 . In the case of the flip-chip mounted semiconductor chip 5 , the upper surface thereof is pressed against the cavity piece 23 , so that underfill molding can be performed by inducing a molten resin between the semiconductor chip 5 and the substrate 1 . Further, by overflowing the mold resin from the second through hole 44c to the dummy cavity 26e through the through gate 44d, voids (unfilled) can be pressed to flow, thereby improving the resin filling properties in the cavity.

In this case, gold plating for facilitating peeling of portions that need to be peeled off after molding, such as a runner or a dummy cavity, on the substrate 1 becomes unnecessary, and the gap between the substrate 1 and the lower mold insert block 34 is eliminated. There is also no risk of mold resin leaking into the mold and causing mold sliding failure.

[Example 3]

Next, another example of a resin mold apparatus is demonstrated. Since the device configuration is common, the description will be mainly focused on the change points of the mold. The same number is attached|subjected to the member same as Example 1, and description shall be invoked.

The present embodiment is the same as the second embodiment in that the intermediate plate 44 is used, but is different in that the swivel mechanism 45 is added to the upper die 20 . The guide piece 46 is provided between the 1st movable taper block 25 and the cavity piece 23 which contact|abuts to the semiconductor chip 5 via the release film 10 specifically,. The guide piece 46 is suspended and supported by the upper die chase block 22 by a spring 24 . Between the cavity piece 23 and the guide piece 46, that is, on the side opposite to the workpiece abutment side, a pressure spring 47 having a sufficiently smaller output than the spring 24 is attached, and the cavity piece 23 ) and a gap is formed between the guide piece 46 . In addition, although this gap is not necessarily provided, it is preferable to form a small gap in order to make the sliding resistance between the cavity piece 23 and the guide piece 46 low and to perform tilting of the cavity piece 23 smoothly. .

A convex surface portion 23d (guide surface portion) is formed in the central portion of the opposing surface of the cavity piece 23 facing the guide piece 46, and in the center portion of the opposite surface of the cavity piece 23 and the opposite guide piece 46 A concave surface portion (guide surface portion; not shown) fitted with the convex surface portion 23d is formed. When the cavity piece 23 is in contact with a plurality (or a single number) of semiconductor chips 5 via the release film 10 , an appropriate inclination state is obtained according to the unevenness (inclination) of the height of the semiconductor chips 5 . and pressurizes in a tilted state centering on the convex surface portion 23d. When the clamping of the upper die 20 and the lower die 21 is completed, the pressing spring 47 between the cavity piece 23 and the guide piece 46 is compressed so that the convex surface portion 23d and the concave surface portion (not shown) are fitted. Thus, it is clamped in a rigid (rigid volume) state in which the gap is eliminated. In this case, the convex surface portion 23d may be configured as a spherical surface, and the center of the spherical surface may be made to match the cross section of the cavity piece 23 facing the semiconductor chip 5 . According to this, even if the semiconductor chip 5 is clamped while the cavity piece 23 is inclined, since it can clamp without generating stress in the shear direction in the said semiconductor chip 5, it is more preferable. However, you may form the convex surface part 23d on the guide piece 46 side.

In FIG. 6A , as a premise, according to the measurement result in the workpiece measuring unit B, the servo motor 31 is started in accordance with the height of the semiconductor chip 5 so that the cavity piece 23 is attached to the semiconductor chip 5 . Pre-adjust to a height position that can be pressurized without excessive stress. Similarly, the servomotor 41 is started according to the thickness of the substrate 1 , and the work support part 37 is adjusted in advance to a height position at which the substrate 1 can be clamped without excessive stress.

Next, by the loader 16 , the substrate 1 is mounted on the work support part 37 , the resin tablet 3 is loaded into the port 35 , and then the intermediate plate 44 is attached to the outer peripheral end of the substrate 1 . and the lower mold insert block 34 overlap the lower mold clamp surface.

Next, the lower die 21 is raised to close the mold die 19 . When the upper die chase block 22 abuts against the lower die seal ring 42 , a closed space is formed between the upper die 20 and the lower die 21 , and the pressure-reduced space is formed by the suction operation from the lower die suction path 43 . is formed The clamping operation proceeds further, so that the upper mold insert block 26 comes into contact with the intermediate plate 44 with the release film 10 interposed therebetween, and the cavity piece 23 is attached to the semiconductor chip 5 with the release film 10 interposed therebetween. When abutting, the clamping operation is completed while the cavity piece 23 is tilted centering on the convex surface portion 23d by the swivel mechanism 45 .

Next, in Fig. 6B, by operating the transfer mechanism, the plunger 36 is pushed up and the molten mold resin is fed through the first through hole 44a, the upper die curl 26c, the upper die runner 26d, and the gate 44b. through the pressure feed to the second through hole 44c. At this time, since the upper surface of the semiconductor chip 5 is pressed against the cavity piece 23, if it is a flip-chip mounted semiconductor chip 5, molten resin can be induced between the semiconductor chip 5 and the substrate 1 to perform underfill molding. .

Further, by overflowing the mold resin from the second through hole 44c to the dummy cavity 26e through the through gate 44d, the voids can be pressed and flowed, thereby improving the resin filling property in the cavity.

From the above, even if an inclination occurs in the semiconductor chip 5 mounted on the substrate 1 , the cavity piece 23 is not biased through the cavity piece 23 and the release film 10 and does not come into contact with the inclination of the semiconductor chip 5 . ) tilts, so that stress is not generated in the semiconductor chip 5, and there is no possibility that the chip may be damaged or broken, or a flash burr may occur. Accordingly, the molding quality is improved. In addition, by making the cavity piece 23 tiltable in this way, other elements such as a package constituting an inverter by sandwiching an IGBT (Insulated Gate Bipolar Transistor) and FWD (Free Wheeling Diode) between a pair of lead frames can be installed. Because it is sandwiched, the occurrence of flash burrs can be reliably prevented even for workpieces in which a pair of lead frames tend to tilt. In addition, in such a molding example, the lead frame arrange|positioned at the lower side corresponds to "1st member" of this invention, and IGBT, FWD, and the lead frame arrange|positioned at the upper side correspond to "2nd member" of this invention. .

[Example 4]

Next, another example of a resin mold apparatus is demonstrated. Since the device configuration is common, the description will be mainly focused on the change points of the mold. The same number is attached|subjected to the member same as Example 1, and description shall be invoked.

In Fig. 7A, on the clamp surface of the upper die insert block 26, a dummy cavity 26e is provided outside from the substrate-facing surface. Further, a closing pin 48 (closing means) for stopping the decompression operation by pressing the clamping surface of the opposite lower die insert block 34 through the release film 10 to the clamping surface on the outer peripheral side from the dummy cavity 26e. ) may be provided so that forward and backward movement is possible. The closing pin 48 may be moved forward and backward by a driving mechanism such as a solenoid or a cylinder.

According to the above configuration, since it is not necessary to form the dummy cavity 26e on the substrate 1 , the number of molded articles 11 on the substrate 1 can be increased to improve the utilization rate of the substrate 1 . Further, at a desired timing, for example, in a state in which the dummy cavity 26e is filled with the overflowed mold resin, air is prevented from being discharged from the inside of the mold die 19, whereby leakage of the resin can also be prevented. In addition, since an air vent (not shown) extending outwardly from the dummy cavity 26e and discharging air from the cavity is deeply formed to make it easier to discharge air, pressure can be quickly and reliably reduced to prevent unfilling. have.

7B shows the embodiment using the intermediate plate 44, the dummy cavity 44e is provided on the outer peripheral side from the substrate facing surface. The dummy cavity 44e is formed by a through hole, and overflows from the second through hole 44c through the through gate 44d to accommodate the surplus resin. Further, the upper die insert block 26 has a closing pin 48 that presses the clamping surface of the opposing intermediate plate 44 via the release film 10 to the clamp surface on the outer peripheral side from the dummy cavity 44e. installed. According to the above configuration, if the dummy cavity 44e is formed outside the substrate 1, there is no need to form the groove portion connecting the dummy cavity 44e and the cavity recessed portion 32 on the substrate 1, , it is possible to increase the number of molded articles 11 on the substrate 1 to improve the utilization rate of the substrate 1 . In addition, if the dummy cavity 44e is formed in the through hole penetrating the intermediate plate 44, the unnecessary resin filled in the dummy cavity 44e can be released simply by pushing it with a pin or the like (not shown). , it is also possible to facilitate the release of unnecessary resin. Moreover, it is good also as a structure provided with both the dummy cavity 26e and the dummy cavity 44e.

[Fifth embodiment]

Next, another example of a resin mold apparatus is demonstrated. It mainly describes the change points of the mold. The same number is attached|subjected to the member same as Example 1, and description shall be invoked. In Examples 1 to 4, the cavity piece 23 was supported via a wedge mechanism as a cavity height variable mechanism, but as shown in FIG. 8A, the cavity piece 23 was rigidly attached to the upper die chase block 22 is supported by In addition, the upper die insert block 26 may be suspended and supported by the spring 49 . The upper die 20 is not provided with a wedge mechanism, but only a wedge mechanism by the work support part 37 of the lower die 21 and the second movable taper block 39 is provided.

When the clamping operation of the mold die 19 is described, in FIG. 8A , the servo motor 41 is started according to the plate thickness of the substrate 1 and the second movable taper block 39 is passed through the screw shaft 40 . is slid in either direction (forward movement or backward movement), and the work support part 37 is adjusted to a height position at which the substrate 1 can be clamped without excessive stress. In this state, the work is supplied by the loader 16 (refer to Fig. 1) to the lower die 21 of the mold die 19 that has been opened. At this time, since the plate|board thickness of the workpiece|work support part 37 is adjusted in advance by the lower mold|die drive part 8, the board|substrate 1 is supported so that it may become the same plane as the lower mold|type clamp surface, or it may become slightly higher than the lower mold|type clamp surface.

Next, in FIG. 8B, the lower mold|die 21 is raised and the mold metal mold|die 19 is mold-closed. At this time, prior to or together with the start of the clamping operation, the pressure reducing device 58 may operate to start the suction operation from the lower mold suction path 43 . When the upper die chase block 22 abuts against the lower die seal ring 42 , a closed space is formed between the upper die 20 and the lower die 21 , and the pressure-reduced space is formed by the suction operation from the lower die suction path 43 . is formed

The clamping operation proceeds so that the upper mold insert block 26 comes into contact with the lower mold insert block 34 and the substrate 1 with the release film 10 interposed therebetween.

As the clamping operation proceeds further, the spring 49 is compressed while the upper insert block 26 is in contact with the lower insert block 34 and the substrate 1, as shown in FIG. 8C, so that the cavity piece 23 is released from the release film. Abuts against the semiconductor chip 5 via (10). In this case, a clamping force generated as a reaction force with respect to the lower mold movable platen by compression of the spring 49 is detected, and the clamping operation is completed when a predetermined clamping force is reached.

Thereby, since the cavity piece 23 moves up and down relatively with respect to the upper die insert block 26 and moves in the die opening/closing direction, the die clamping mechanism which raises and lowers the lower die movable platen functions as a cavity height variable mechanism. Then, the transfer mechanism is operated to push up the plunger 36 , and the molten mold resin is pressurized and injected into the cavity recessed portion 32 . In this case, the cavity height is set to match the height of the semiconductor chip 5 only by completing the mold closing operation before injecting the mold resin into the cavity recessed portion 32 .

In addition, in order to close the gap between the substrate 1 and the lower mold insert block 34, a pressing mechanism for pressing the substrate 1 from the outside to the wall surface of the lower mold insert 34 on the port 35 side as needed; You may provide a crushing mechanism etc. which physically deform the board|substrate 1 and eliminate a clearance gap. Thereby, leakage of high fluidity|liquidity mold resin can be prevented as much as possible.

Moreover, although the cavity piece 23 was supported by the upper die chase block 22 in a rigid state, it may be suspended and supported via a spring. In this case, by supporting the upper die insert block 26 to the upper die chase block 22 in a rigid state, the die closing may be completed after clamping the semiconductor chip 5 with the cavity piece 23 before the completion of clamping.

According to the above configuration, in the mold closing operation of the mold die 19, the cavity piece 23 and/or the upper die insert block 26 only by raising the lower die 21 by a predetermined amount according to the height of the semiconductor chip 5. (clamper) float amount is adjusted. Thereby, it can set without performing the other operation|movement which adjusts the depth position (height from the board|substrate 1 to the cavity piece 23) of a cavity. That is, only by raising the lower die 21 to a position set in accordance with the height of the semiconductor chip 5, it is possible to clamp the workpiece without applying an excessive pressing force, and the same effect as the above-described embodiment can be achieved by a simple configuration. can indicate

[Example 6]

Next, another example of a resin mold apparatus is demonstrated. Since the device configuration is common, the description will be mainly focused on the change points of the mold. The same number is attached|subjected to the member same as Example 1, and description shall be invoked.

In FIG. 9A , the cavity piece 23 and the upper die insert block 26 are suspended and supported by the upper die chase block 22 by springs 24 and 49 , respectively. Moreover, the semiconductor chip abutting surface of the cavity piece 23 is formed in the protrusion shape provided to protrude downward from the periphery. That is, the convex surface portion 23b and the concave groove portion 23c are formed around it. Moreover, similarly to Example 5, the wedge mechanism is not provided in the upper die 20, but only the wedge mechanism by the workpiece|work support part 37 of the lower die 21 and the 2nd movable taper block 39 is provided. .

When the clamping operation of the mold die 19 is described, in FIG. 9A , the servo motor 41 is started according to the plate thickness of the substrate 1 and the second movable taper block 39 is passed through the screw shaft 40 . is slid in either direction (forward movement or backward movement), and the work support part 37 is adjusted to a height position at which the substrate 1 can be clamped without excessive stress. In this state, the work is supplied by the loader 16 (refer to Fig. 1) to the lower die 21 of the mold die 19 that has been opened. At this time, since the plate|board thickness of the workpiece|work support part 37 is adjusted in advance by the lower mold|die drive part 8, the board|substrate 1 is supported so that it may become the same plane as the lower mold|type clamp surface, or it may become slightly higher than the lower mold|type clamp surface.

Next, in FIG. 9B, the lower mold|die 21 is raised and the mold metal mold|die 19 is mold-closed. At this time, prior to or together with the start of the clamping operation, the pressure reducing device 58 may operate to start the suction operation from the lower mold suction path 43 . When the upper die chase block 22 abuts against the lower die seal ring 42 , a closed space is formed between the upper die 20 and the lower die 21 , and the pressure-reduced space is formed by the suction operation from the lower die suction path 43 . is formed

The clamping operation proceeds so that the upper mold insert block 26 comes into contact with the lower mold insert block 34 and the substrate 1 with the release film 10 interposed therebetween. Moreover, when the convex-surface part 23b formed in the cavity piece 23 contacts each semiconductor chip 5 via the release film 10, a clamping operation|movement is completed. At this time, the excessive pressing force of the cavity piece 23 pressing the semiconductor chip 5 and the upper die insert block 26 pressing the substrate 1, respectively, can be avoided by bending the springs 24 and 49 . Therefore, as in the case of using a top-emitting LED element as the semiconductor chip 5, the top surface of the semiconductor chip 5 is more reliably protected while also flashing to the top surface of the chip is prevented and the molding quality is improved even when clamping is required. can

In Fig. 9C, the transfer mechanism is operated, the plunger 36 is pushed up, and the molten mold resin is press-feed to the cavity concave portion 32 through the upper die curl 26c and the upper die runner 26d. At this time, since the upper surface of each semiconductor chip 5 is pressed by the convex surface portion 23b of the cavity piece 23, if it is a flip-chip mounted semiconductor chip 5, the molten resin is formed between the semiconductor chip 5 and the substrate 1. In addition, the concave groove portion 23c is also filled with a mold resin and resin molded so as to surround the upper surface portion of each semiconductor chip 5 . The mold resin filled in the cavity concave portion 32 overflows into the dummy cavity 26e through the through gate 26f to press the void to flow, thereby improving the resin filling property in the cavity.

According to the above configuration, the light emitting surface of the LED element as the semiconductor element 5 is pressed by the convex surface portion 23b of the cavity piece 23 to expose it, and a silicone resin having a low viscosity in the concave groove portion 23c surrounding it. The reflector which is filled with (white resin) and surrounds the light emitting surface can be efficiently molded by transfer molding. Moreover, as a reflector, the structure which made the height of the periphery of a light emitting surface high is not necessary, and you may provide the reflector of the height used as the same plane as the light emitting surface. In this case, the semiconductor chip abutting surface of the cavity piece 23 is formed in a flat shape.

[Example 7]

Next, another example of a resin mold apparatus is demonstrated. The same number is attached|subjected to the member same as Example 1, and description shall be invoked. Hereinafter, other configurations will be mainly described.

As shown in FIG. 10, the liquid resin supply part F is provided adjacent to the press part C separately from the board|substrate supply part (workpiece supply part A) in the resin mold apparatus. Specifically, the liquid resin supply part F is provided between the press parts C comrades. As in Fig. 1, the unitized mounts are connected so that the guide portions 18 are continuous, and a resin mold apparatus is assembled.

Although the configuration of the mold die 19 is described as being the same as that of the first embodiment, the mold die 19 of another embodiment may be used.

The configuration of the liquid resin supply unit F will be described with reference to FIG. 11A . The dispenser (liquid resin supply device) 50 includes a base (not shown), a moving mechanism (including rails and the like) provided on the base, and a rotating mechanism rotatable on a moving table provided in the moving mechanism. has a The dispenser 50 rotates the syringe 51 held along the vertical direction to a position corresponding to each of the two press devices 6 and then moves forward and backward into the mold die 19 to supply the liquid resin.

The dispenser 50 is disposed on the tip side of the syringe 51 filled with the liquid resin, the tube 52 through which the liquid resin pushed out from the syringe 51 flows, and the tube 52, The dripping mechanism 53 dripped on the 35 is provided. The tube 52 connected to the syringe 51 held in the vertical direction by the dispenser body (not shown) is bent in the horizontal direction by approximately 90 degrees from the vertical direction and extended.

Moreover, the dripping mechanism 53 is provided at the end (it becomes a supply port) of the tube 52 bent from the horizontal direction to the vertically downward direction, and the pinch valve 54 which pinches|pinches the tube 52 and closes it; It has the resin receiving part 55 which can advance and retreat below the tube opening, and the cooling mechanism 56 which cools the circumference|surroundings of the tube 52. The pinch valve 54 seals the tube 52 and prevents the liquid resin from falling, except when the liquid resin is dripped, prevents the liquid resin from being deteriorated by contact with the outside air, or air into the tube 52 enters. or prevent it from happening. Moreover, when dripping liquid resin, the resin receiving part 55 retracts from the opening below of the tube 52, and is located below the opening of the tube 52 other than that, and receives the liquid resin dripped. In addition to preventing dripping of the liquid resin, the resin receiving portion 55 can prevent heating of the tip opening of the tube 52 when it enters the mold die 19 .

The cooling mechanism 56 is used to suppress the reaction of the liquid resin by cooling the periphery of the tube 52 when the dropping mechanism 53 is located inside the high-temperature press device 6 when supplying the liquid resin. will become The cooling mechanism 56 may, for example, be configured to cool the inside of a box provided so as to accommodate the tube 52 by means of air cooling or water cooling cooling means, or may be a liquid phase by passing a coolant through the thickness of the tube 52 . It is good also as a structure which cools resin directly, and these may be used together. Moreover, the tube 52 may be cooled by providing a cooling element (cooling means) like a Peltier element in a box body.

Next, an example of the liquid resin supply operation of the dispenser 50 will be described.

As a premise, according to the height of the semiconductor chip 5 , the servo motor 31 is started and the cavity piece 23 is adjusted in advance to a height position that can be pressed without applying excessive stress to the semiconductor chip 5 . Similarly, in accordance with the plate thickness of the substrate 1 , the servo motor 41 is started and the work support part 37 is adjusted in advance to a height position that can be clamped without applying excessive stress to the substrate 1 .

Next, the substrate 1 is supplied to the work support 37 by the loader 16 . Moreover, as shown in FIG. 11A, the rotating mechanism (not shown) is actuated to rotate toward the press apparatus 6 which supplies the dispenser 50, and the dripping mechanism 53 takes the pinch valve 54 side as the head. The posture is changed so that it can enter between the mold-opened molds 19 . At this time, the pinch valve 54 remains closed and the resin receiving portion 55 is in a closed state just below the opening of the tube 52 . Moreover, the cooling device 56 is started up, and it is set as the state which suppressed reaction of the liquid resin in the tube 52. As shown in FIG.

Next, as shown in FIG. 11B, a moving mechanism (not shown) is operated to move the dispenser 50 so as to approach the press device 6 that supplies it. At this time, the dropping mechanism 53 enters the mold opening 19 of the press device 6 , and the pinch valve 54 provided at the tip of the tube 52 is located directly above the port 35 . place it as much as possible. Then, after the resin receiving portion 55 is retracted from the position below the opening of the tube 52, the pinch valve 54 is opened, and the liquid resin required for one resin mold is discharged from the syringe 51 into the port 35. drop it inside.

When the dripping of the required amount of liquid resin is finished, the pinch valve 54 is closed to move the resin receiving portion 55 to a position below the opening of the tube 52 . Then, a moving mechanism (not shown) is operated to move the dispenser 50 away from the press device 6 that has been supplied. Thereby, the dropping mechanism 53 retracts from the mold die 19 .

Next, similarly to Example 1, in FIG. 3C, the lower die 21 is raised and the mold die 19 is mold-closed. The clamping operation proceeds further, so that the upper insert block 26 is in contact with the lower insert block 34 and the substrate 1 with the release film 10 interposed therebetween, and the cavity piece 23 is brought into contact with the release film 10 with the release film 10 interposed therebetween. When it comes into contact with the semiconductor chip 5, the clamping operation is completed.

Next, similarly to FIG. 3D, by operating the transfer mechanism, the plunger 36 is pushed up, and the liquid resin is pressurized into the cavity recessed portion 32 through the upper die curl 26c and the upper die runner 26d to perform underfill molding. can The liquid resin filled in the cavity concave portion 32 overflows into the dummy cavity 26e to press and flow the void, thereby improving the resin filling property in the cavity.

According to the above configuration, in order to fill the gaps between the fine bumps, the filler becomes fine and the mold underfill using the low-viscosity epoxy-based liquid resin can be realized by the transfer mold. Alternatively, a lens, a reflector, etc. of an LED made of a silicone resin having a low filler filling rate and low viscosity can be formed, thereby improving molding quality and prolonging lifespan.

Although the above-mentioned resin molding apparatus was demonstrated using the mold die of an upper mold|type cavity and a lower mold|type pot arrangement|positioning type, the lower mold|type cavity may be sufficient, and the mold die of the upper mold|type pot and lower mold|type cavity arrangement|positioning may be sufficient.

Moreover, although the fixed mold was demonstrated as the upper mold 20 and the movable mold as the lower mold 21, it is not limited to this, It is good also considering the fixed mold as the lower mold|die 21 and the movable mold|type 20 as the upper mold|type.

Moreover, as a work, it is applicable not only to flip-chip mounting on the board|substrate 1, but to the semiconductor chip 5 by which wire bonding was carried out, also to the thing in which fluorescent substance is mixed with sealing resin by light emitting elements, such as a white LED, etc. are applicable. In addition, as work pieces, switching elements (IGBT, MOS-FET, etc.) used in power supply circuits, elements with high heat generation (CPU, MPU, etc.), semiconductor elements (LEDs, etc.) having input/output units, sensors for input/output of signals ( A substrate on which a CCD sensor, a CMOS sensor, a fingerprint sensor, MEMS, etc.) is mounted may be used. Moreover, wafer-level package molding can also be performed using the wafer on which electronic components, such as a bump and a solder ball, were mounted as a workpiece|work. In this case, by clamping the bump or the solder ball by the cavity piece 32, it is possible to form a wafer level package in which the bump or the solder ball is appropriately clamped and sealed.

Moreover, although the example using the solid resin tablet 3 and liquid resin was demonstrated as mold resin, for example, various resins, such as granular resin and powdery resin, can also be used. In addition, the mold die 19 may be used for resin-sealing a plurality of semiconductor elements individually or collectively, for map-type molding or matrix-type molding.

Moreover, although the port 35 was provided in the lower die insert block 34, it may be provided in the upper die 20 side. Moreover, such a structure WHEREIN: The mold metal mold|die may be arrange|positioned upside down.

Moreover, although the structure which drives the cavity piece 23 by a wedge mechanism as a cavity height variable mechanism was demonstrated, this invention is not limited to this. For example, the upper mold insert block 26 may be driven by a single wedge mechanism. In this case, the cavity height can be changed by rigidly (rigidly) supporting the cavity piece 23 to the upper die chase block 22 and raising and lowering the upper die insert block 26 . In addition, although an example has been described in which a wedge mechanism or a clamping mechanism is used to make the cavity height variable, the cavity piece 23 or the upper die insert block 26 may be directly driven by other driving sources such as hydraulic pressure or a ball screw. .

Moreover, as a plate thickness variable mechanism, the structure in which the workpiece|work support part 37 is provided on each of the two board|substrates 1 with the plunger 36 interposed therebetween and is individually driven by a wedge mechanism has been described. The invention is not limited to this. For example, when arranging the plurality of substrates 1 on both sides with the plunger 36 interposed therebetween, the structure may include a wedge mechanism for separately elevating and lowering the number of work support portions 37 equal to these. Specifically, the servomotor 41 and the wedge mechanism in the lower die drive unit 8 are disposed similarly to the upper die drive unit 7 . In other words, by arranging the lower die drive unit 8 to be inverted with the upper die drive unit 7 in the vertical direction, the thickness of the substrate 1 can also be adjusted more finely. For example, as shown in FIG. 1, one board|substrate 1 is arrange|positioned at each left and right of the three plungers 36 lined up in a line, and the workpiece|work is matched with each plate|board thickness of the board|substrate 1 of 6 sheets in total. After separately adjusting the height of the support part 37, it is good also as a structure which can mold-mold collectively with the mold die 19.

Claims (8)

A resin mold die for resin-molding a work in which a second member is mounted on a first member, comprising:
A cavity piece forming a cavity bottom, a cavity concave portion constituting a cavity in which the second member is accommodated by a first insert disposed to surround the cavity piece; Air through the air vent groove by pressing a dummy cavity formed in the dummy cavity, an air vent groove extending from the dummy cavity to the outer peripheral side, and a second insert facing the first insert from the outer peripheral side from the dummy cavity One of the molds provided with a closing means for stopping the discharge of;
A work support for supporting the work, the second insert adjacent to the work support, and the work support by moving the work support in the mold opening/closing direction with respect to the second insert to match the thickness of the first member to the height of the work support The other mold provided with a plate thickness variable mechanism which makes variable;
A port and a plunger assembled in any one of the one mold or the other mold to supply a mold resin;
Before the one mold and the other mold are mold-closed, a closed space blocked from the external space is formed through a seal ring, and a pressure reduction mechanism including the cavity is formed by depressurizing the inside of the closed space. and
Before the mold resin is injected into the cavity, the height of the work support part is adjusted to match the thickness of the first member by the plate thickness variable mechanism, and the mold resin is injected into the cavity under a reduced pressure environment to form the dummy cavity is filled with the overflowed surplus resin, closing the closing means to stop the discharge of air from the inside of the mold through the air vent groove. The method of claim 1,
and a cavity height variable mechanism for changing the height of the cavity recessed portion according to the height of the second member by relatively moving the cavity piece in a mold opening/closing direction;
Before the mold resin is injected into the cavity, the height of the cavity concave portion is adjusted by the cavity height variable mechanism according to the height of the two members. 3. The method of claim 2,
The cavity height variable mechanism is provided with a wedge mechanism for adjusting the position in the mold opening/closing direction of the cavity piece by moving the movable taper block by a driving source. 4. The method according to claim 2 or 3,
The said cavity height variable mechanism is a resin mold metal mold|die by which one or both of the said cavity piece and the said 1st insert are floatingly supported by the said one mold chase. The method of claim 1,
The plate thickness variable mechanism is provided with a wedge mechanism for moving the movable taper block by a driving source to adjust the position in the mold opening/closing direction of the work support part. A resin mold die for resin-molding a work in which a second member is mounted on a first member, comprising:
One metal mold|die provided with the cavity piece which forms the cavity bottom part, and the cavity recessed part which comprises the cavity in which the said 2nd member is accommodated by the 1st insert which surrounds the said cavity piece and is arrange|positioned;
A work support for supporting the work, a second insert adjacent to the work support, and a height of the work support in accordance with the thickness of the first member by moving the work support in a mold opening/closing direction with respect to the second insert. The other mold provided with the plate thickness variable mechanism made variable, and
A through hole for accommodating the second member and a resin path communicating therewith are formed, and over the gap between the outer peripheral end of the first member supported by the work support and the second insert, the other mold clamping surface is fitted. an intermediate plate used overlaid, and
A port and a plunger assembled in any one of the one mold or the other mold to supply a mold resin;
Before the one mold and the other mold are mold-closed, a closed space blocked from the external space is formed through a seal ring, and a pressure reduction mechanism including the cavity is formed by depressurizing the inside of the closed space. and
a dummy cavity for accommodating the surplus resin formed on the outer peripheral side from the first member of the intermediate plate, an air vent groove extending from the dummy cavity on the outer peripheral side, and facing the first insert from the outer peripheral side from the dummy cavity and closing means for stopping the discharge of air through the air vent groove by pressing the opposite surface of the intermediate plate,
Before the mold resin is injected into the cavity, the height of the work support part is adjusted to match the thickness of the first member by the plate thickness variable mechanism, and the mold resin is injected into the cavity under a reduced pressure environment to form the dummy cavity is filled with the overflowed surplus resin, closing the closing means to stop the discharge of air from the inside of the mold through the air vent groove. 7. The method of claim 1 or 6,
A resin mold metal mold comprising: a release film held by adsorption by covering the one mold clamp surface including the cavity recessed part. delete

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