TW201717337A - Resin-sealing device and resin-sealing method - Google Patents

Abstract

Provided is a resin-sealing device capable of balancing suppression of substrate warping and double-sided molding of the substrate. This resin-sealing device resin-seals both surfaces of a substrate by compression molding, and is characterized in that one mold among an upper mold and a lower mold includes a rigid member and a first elastic member, while the other of the molds includes a second elastic member exhibiting a larger spring constant than the first elastic member, and in that: the rigid member stops the movement by an upper-mold frame member or a lower-mold frame member in the direction that opens/closes the upper and lower molds; or a substrate pin is provided on the outside of a lower-mold cavity so as to project upward, and it is possible to mount the substrate pin while the substrate has been released from the top surface of the lower mold; or an outside-air blocking member and a substrate support means are also provided in the resin-sealing device, and while the mold cavity interior is depressurized and a substrate surface that has not been resin-sealed is supported, it is possible to resin-seal the other surface thereof by compression molding.

Description

Resin packaging device and resin packaging method

The present invention relates to a resin encapsulating device and a resin encapsulating method.

In the resin encapsulation step in the manufacturing steps of electronic components such as a Ball Grid Array (BGA) package, resin encapsulation is generally performed only on one side of the substrate. However, the resin in the manufacturing steps of a board-on-board (BOC) package and a window ball grid array (WindowBGA, WBGA, trade name) package corresponding to a dynamic random access memory (DRAM) In the encapsulation step, it is required to perform resin encapsulation at a part of the other surface in addition to one side of the substrate (for example, Patent Document 1).

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: JP-A-2001-53094.

In order to perform resin encapsulation on both surfaces of the substrate, there is a resin encapsulation method in which a hole is formed in the substrate (a hole for flowing resin from one surface side to the other surface side of the substrate, hereinafter referred to as "opening"). Then, resin encapsulation is performed on one surface of the substrate by transfer molding, and resin is transferred from the opening to the other surface side, and resin encapsulation is performed on the other surface.

On the other hand, recently, with the increase in density of portable devices and the like, it is required to mount a package of a wafer on almost the entire surface (on both sides) of the substrate. In the manufacturing step of the package, it is necessary to perform resin encapsulation on almost the entire surface of each of both sides of the substrate.

However, in the manufacture of the package, when the resin encapsulation method is used to simultaneously encapsulate both sides of the substrate, a cavity (upper mold or lower mold cavity) on one side (upper mold or lower mold) is firstly resinized. The case of filling. For example, when the cavity of the lower mold (lower mold cavity) is first filled with resin, the problem of convex bending (deformation) of the substrate occurs. This is because if the resin is packaged on both sides by transfer molding, there is a case where the cavity on one side is filled with the resin due to gravity, flow resistance, or the like. At this time, the resin flows through the opening of the substrate from one surface side to the other surface side of the substrate. Then, due to the flow resistance of the resin flowing from the opening of the substrate, the substrate may be swollen toward the other surface side. Thus, the cavity on the other side is filled with the resin in a state where the substrate is swollen. When the cavity on one side and the other side is filled with resin, the resin pressure is applied to the substrate, but the resin pressure applied to one surface and the other surface of the substrate is the same pressure (the cavity on one side and the other side is connected by the opening of the substrate, The resin pressure is the same), and does not generate a force for returning the substrate from the swelled state to the flat state. Therefore, the resin is cured in a state in which the other surface side of the substrate is swollen, and the molding is completed in a state in which the substrate is swollen (deformed state). That is, if the resin encapsulation method is simultaneously performed on one side and the other side (both sides) of the substrate, deformation of the substrate may occur.

Accordingly, it is an object of the present invention to provide a bend that inhibits the substrate A resin encapsulation device and a resin encapsulation method for forming both sides of a substrate and a substrate.

In order to achieve the above object, a first resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulating both surfaces of a substrate, comprising: a molding module for compression molding having an upper mold and a lower mold; The upper mold encapsulates the upper surface of the substrate by compression molding, and the lower surface of the substrate is resin-molded by compression molding through the lower mold; one of the upper mold and the lower mold includes a rigid member and a first elasticity a member, the upper mold and the other of the lower molds comprising a second elastic member having a larger spring constant than the first elastic member; The upper mold further includes an upper mold base member and an upper mold frame member, the upper mold frame member being disposed in a manner surrounding a cavity of the upper mold; the lower mold further comprising a lower mold base member and a lower mold frame member, the lower mold The frame member is disposed in a manner surrounding the cavity of the lower mold; the upper mold frame member is suspended from the upper mold base member via one of the first elastic member and the second elastic member; the lower mold frame member is passed through the first One of the elastic members and the second elastic member is placed on the lower mold base member; and when the resin is packaged, the substrate is sandwiched by the upper mold frame member and the lower mold member to make the upper portion The movement of the mold or the frame member of the lower mold in the direction in which the upper mold and the lower mold are opened is stopped by the rigid member.

A second resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulating both surfaces of a substrate, comprising: a first molding module for compression molding, a second molding module for compression molding, and a substrate a pin through which the one side of the substrate is compression-molded by the first molding module a resin package by which the other side of the substrate is compression-molded by the second molding module; the substrate pin is provided with a lower mold of at least one of the first molding module and the second molding module The outer side of the cavity is provided to protrude upward; the substrate pin can be placed in a state of being detached from the upper surface of the lower mold.

A third resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulating both surfaces of a substrate, comprising: a first molding module for compression molding; and a second molding module for compression molding; The first molding module includes an external gas blocking component and a substrate supporting component, and the molding die of the first molding module and the external gas can be blocked by the external gas blocking component; the first molding module can be formed by the molding a mold and a foreign gas are blocked, and the other side of the substrate which is decompressed in the cavity and is not encapsulated by the resin is supported by the substrate supporting member, and one side of the substrate is resin-molded by compression molding; the second molding The module may be resin-sealed on the one side of the substrate, and the other side of the substrate may be resin-molded by compression molding.

The first resin encapsulation method of the present invention is a resin encapsulation method for resin encapsulating both sides of a substrate, which uses the first resin encapsulating device of the present invention, and includes a first resin encapsulating step through which the upper mold is applied Resin encapsulating the upper surface of the substrate by compression molding; and a second resin encapsulating step of resin encapsulating the lower surface of the substrate by compression molding; the first resin encapsulating step and the second resin encapsulating step a frame of the upper mold or the lower mold including the rigid member in a state in which the substrate is sandwiched by the upper mold frame member and the lower mold frame member The movement of the member in the direction in which the upper mold and the lower mold are opened and closed is stopped by the rigid member.

A second resin encapsulation method of the present invention is a resin encapsulation method for resin encapsulating both sides of a substrate, which uses the second resin encapsulation apparatus of the present invention, and includes: a first resin encapsulation step by which the first a molding module, wherein one side of the substrate is resin-molded by compression molding; a second resin encapsulating step, the other side of the substrate is subjected to compression molding to perform resin encapsulation; and the substrate mounting step is passed The substrate pin is placed in a state of being detached from the upper surface of the lower mold.

A third resin encapsulation method of the present invention is a resin encapsulation method for resin encapsulating both sides of a substrate, which uses the third resin encapsulation device of the present invention, and includes: a first resin encapsulation step, the first The molding die of the molding module is blocked by the external gas and the other surface of the substrate which is decompressed in the cavity and is not encapsulated by the resin is supported by the substrate supporting member, and the first molding module is used to The one side of the substrate is resin-encapsulated by compression molding; and the second resin encapsulating step is performed in a resin-packed state on the one side of the substrate after the first resin encapsulation step, and the second molding module is used to The other side of the substrate is resin-wrapped by compression molding.

According to the present invention, it is possible to provide a resin package device and a resin package method which can achieve both bending suppression of a substrate and molding of both surfaces of a substrate.

1‧‧‧ wafer

2‧‧‧Substrate

3‧‧‧Wire

4‧‧‧Flip Chip

5‧‧‧Spherical terminals

6‧‧‧flat terminal

10‧‧‧First resin packaging device

10a‧‧‧Second resin packaging device

10b‧‧‧Resin packaging device

11‧‧‧Installation substrate

20a, 30a, 150a‧‧‧ granule resin

20b, 30b, 150b‧‧‧ molten resin (liquid resin)

20, 30, 150‧ ‧ encapsulation resin

31‧‧‧Internal through holes

32‧‧‧Frame parts

40, 130‧‧‧ release film

200, 200a, 900‧‧‧ upper mold

201‧‧‧Upper mold base parts

202, 940‧‧‧Upper pedestal

203‧‧‧Upper mold external gas blocking component

204A, 204B, 304‧‧‧ O-ring

205‧‧‧ hole in the upper mold

210‧‧‧Upper frame parts

220, 901‧‧‧ upper model cavity

230‧‧‧Upper mold cavity upper surface parts

231‧‧‧Rigid parts

232‧‧‧First elastic part (or second elastic part)

300, 300a, 700‧‧‧

301, 730‧‧‧ lower mold base parts

302‧‧‧Down base

303‧‧‧Down mold external gas blocking component

310, 720‧‧‧ lower mold frame parts

320, 701‧‧‧ model cavity

330, 710‧‧‧ lower cavity part of the model cavity

331‧‧‧Substrate Positioning Department

332‧‧‧Second elastic part (or first elastic part)

500‧‧‧First molding module

550‧‧‧

600‧‧‧Substrate holding parts (upper mold)

601, 1001‧‧‧ cavity

602‧‧‧Flexible parts

603‧‧‧Air access

604‧‧‧Air holes

610‧‧‧Connected parts

620‧‧‧ Cavity upper surface and frame parts

640‧‧‧plate parts

650‧‧‧High pressure gas source

702‧‧‧Flexible parts

711‧‧ ‧Slide hole

800‧‧‧Second molding module

1000‧‧‧Substrate holding parts (lower mold)

1010‧‧‧ cavity lower surface parts

1020‧‧‧ cavity frame parts

1030‧‧‧Flexible parts

1040‧‧‧Body parts

1100‧‧‧Substrate transport mechanism

1200‧‧‧Up and down molding module

X, Y‧‧‧ arrows

1 is a cross-sectional view showing a first resin package device of Embodiment 1.

2 is a cross-sectional view showing one step of an example of the first resin encapsulation method of Exemplary Embodiment 1.

Fig. 3 is a cross-sectional view showing another step of the first resin encapsulation method which is the same as Fig. 2.

4 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as that of FIG. 2.

Fig. 5 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 2.

Fig. 6 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 2.

Fig. 7 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 2.

Fig. 8 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 2.

Fig. 9 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 2.

Fig. 10 is a cross-sectional view showing a modification of the first resin encapsulating method which is the same as Fig. 2 .

Fig. 11 is a cross-sectional view showing still another step of the first resin encapsulation method which is the same as Fig. 10.

Fig. 12 (a) is a cross-sectional view of the same resin sealing device as that of Figs. 1 to 11 . Fig. 12 (b) is a cross-sectional view showing a modification of the resin sealing device of Fig. 12 (a).

Fig. 13 (a) is another modification of the resin package device of Fig. 12 (a) Sectional view. Fig. 13 (b) is a cross-sectional view showing still another modification of the resin sealing device of Fig. 12 (a).

Fig. 14 (a) is a cross-sectional view showing a second resin package device of the second embodiment and a substrate on which resin is encapsulated. Fig. 14 (b) is a cross-sectional view showing a modification of the substrate pin of Fig. 1 (a).

15(a) to 15(c) are cross-sectional views showing the steps of an example of the resin encapsulation method of the second embodiment.

16 is a cross-sectional view showing a first molding die of a third resin package device of Embodiment 3 and a substrate through which resin is encapsulated.

Fig. 17 is a cross-sectional view showing a second molding module of the third resin package device of Example 3 and a substrate through which resin is encapsulated.

18 is a cross-sectional view showing one step of the third resin encapsulation method of Exemplary Embodiment 3.

Fig. 19 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 18.

Fig. 20 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 18.

Fig. 21 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 18.

22(a) to (b) are cross-sectional views showing a substrate on which resin is encapsulated by the resin sealing device of the present invention.

23(a) to (b) are cross-sectional views showing a resin package device in which the rigid member is not provided and a substrate on which resin is encapsulated.

Hereinafter, the present invention will be described in more detail by way of examples. However, the invention is not limited to the following description.

In the present invention, the term "resin encapsulation" means a state in which the resin is cured (hardened), but it is not limited to the case where the both surfaces described later are molded together. That is, in the present invention, in the case where the both surfaces described later are integrally molded, the "resin encapsulation" may mean that at least the resin is filled in the cavity at the time of mold clamping, and the resin may be uncured (hardened). The state of flow.

The first resin package device, the second resin package device, and the third resin package device of the present invention are characterized in that they all include a molding module for compression molding, and resin encapsulation is performed on both sides of the substrate by compression molding. Therefore, in the resin package device of the present invention, one side of the substrate can be resin-molded by compression molding by a molding module for compression molding, and then the other surface can be resin-sealed. When the other surface is resin-sealed, the resin is supported by the compression molding resin, and the resin is pressed against the substrate from the other surface side to suppress the bending of the substrate. Alternatively, when the both sides of the substrate are simultaneously resin-molded by compression molding by the molding module for compression molding, uniform resin pressure can be applied to both surfaces of the substrate at the same time. Therefore, in the present invention, both the suppression of the bending of the substrate and the molding of both sides of the substrate can be achieved. Further, in the substrate used in the present invention, it is not necessary to provide an opening for allowing the resin to flow from one surface side to the other surface side of the substrate. Further, since the opening is not provided, the resin does not flow from the one surface side of the substrate to the other surface side through the opening. Therefore, deformation (bending) of the substrate due to flow resistance when the resin passes through the substrate opening does not occur.

The foregoing conventional method, that is, providing an opening on a substrate, passing In the method of performing the resin molding of both sides of the substrate by hand molding, there is a problem of cost due to opening of the opening in the substrate. In addition, when the resin is packaged from the opening to the other surface side and resin-sealed, the flow distance until the entire surface of the other surface is resin-sealed becomes long, and pores (bubbles) are generated and wires as constituent members are generated. The problem of deformation.

On the other hand, in the present invention, first, it is possible to resin-encapsulate both surfaces of the substrate without opening the opening of the substrate, so that the cost of opening the opening of the substrate does not occur, and the resin is sealed until the both surfaces are sealed. The flow distance is also short, and the generation of pores (bubbles) and deformation of the wires can be suppressed.

Further, the first resin package device of the present invention is characterized in that one of the upper mold and the lower mold includes a rigid member and a first elastic member, and the other of the upper mold and the lower mold includes the first The elastic member has a second elastic member having a larger spring constant. When the resin is packaged, the upper mold or the frame member of the lower mold is made in a state in which the substrate is sandwiched by the upper mold frame member and the lower mold frame member. The movement in the direction in which the upper mold and the lower mold are opened and closed is stopped by the rigid member. For example, the upper mold frame or the lower mold frame member may be opened and closed by the upper mold or a portion of the lower mold that abuts the front end of the rigid member. The movement in the direction stops. A more specific description is as follows, for example.

That is, in the first resin package device of the present invention, for example, a stopper (the rigid member) is provided so as to hang down from the upper mold base member. By the brake member abutting on the upper mold frame member during mold clamping, the upper mold frame can be prevented The component rises above the specified position (target package thickness position). Further, the brake member abuts against the upper mold frame member, and as described below, it also has an effect of suppressing the inclination of the upper mold and the lower mold frame member (substrate) due to the change in the resin input. Further, an elastic member (second elastic member) having a larger spring constant than the elastic member (first elastic member) of the upper mold is provided in the lower mold. In doing so, the upper mold frame member can be more reliably pressed against the brake member during mold clamping. Further, when the mold is closed, by providing an elastic member having a large spring constant in the lower mold, the elastic member of the upper mold is more elastically deformed, so that the upper mold cavity can be filled with the resin first. Specifically, it will be described in the first embodiment to be described later. Further, the amount of resin supplied to the upper mold cavity is preferably set to be substantially the same volume as the cavity volume when the upper mold frame member is fixed by the brake member. In doing so, when the resin is filled in the upper mold cavity, at least the deformation of the substrate due to the excessive shortage of the resin amount can be reduced. Therefore, even if the resin pressure is applied to the substrate after filling the mold cavity downward, the deformation of the substrate can be suppressed because the resin of the upper mold cavity supports the substrate. Further, in the above, an example in which the upper mold includes the brake member (the rigid member) and the first elastic member and the lower mold include the second elastic member has been described. However, the first resin encapsulating device of the present invention may also be opposite to the case where the lower mold includes a stopper (the rigid member) and the first elastic member, and the upper mold includes the second elastic member.

In the first resin sealing device of the present invention, the number of the first elastic member and the second elastic member is not particularly limited, and may be any. Further, the "second elastic member having a larger spring constant than the first elastic member" in the present invention is not limited to the second elastic member of the single product (each) The spring constant is greater than the spring constant of the first elastic member of the individual product (each). This is because, for example, even if the single product has the same spring constant, the spring constant as a whole can be changed by changing the number of settings. Therefore, when a plurality of elastic members are provided, the total spring constant of the entire plurality of second elastic members may be larger than (or plural) the total spring constants of the entire first elastic members.

The rigid member is not particularly limited, and examples thereof include metals such as steel, aluminum, and iron, plastics such as fiber reinforced plastic (FRP), wood, and gypsum.

The height of the solid member is not particularly limited, and in the case where the rigid member is disposed in the upper mold, for example, it may be configured such that if the upper mold frame member reaches a specified position (target package thickness position, or target cavity height), The manner in which the upper mold frame member abuts against the rigid member. Also, in the case where the rigid member is disposed in the lower mold, for example, it may be configured such that if the lower mold frame member reaches a specified position (target package thickness position, or target cavity height), the lower mold frame member is The way the rigid parts abut.

The position where the rigid member is provided is described as being provided so as to hang down from the upper mold base member. However, the position is not limited to this example and may be any position. The rigid member is disposed such that, for example, when the mold is closed, one of the upper mold frame member and the lower mold frame member is opened and closed in the direction of the upper mold and the lower mold (for example, a drawing to be described later) 1 to 13 is a position at which the movement in the vertical direction of the paper surface is stopped.

The position of the rigid member is set, for example, as follows. First, in the case where the upper mold is provided with a rigid member, the rigid member may be disposed in a manner of hanging down from the upper mold base member, and may also be used as the upper mold frame member. Prominent way to set. In the case where the rigid member is provided to hang down from the upper mold base member, the upper mold frame member abuts against the front end of the rigid member at the time of mold clamping, and the movement of the upper mold frame member is stopped. In the case where the rigid member is provided to protrude from the upper surface of the upper mold frame member, the upper mold base member abuts against the front end of the rigid member at the time of mold clamping, and the movement of the upper mold frame member is stopped. In the case where the lower mold is provided with a rigid member, for example, the rigid member may be provided to protrude from the upper surface of the lower mold base member, or it may be provided to hang down from the lower mold frame member. In the case where the rigid member is provided to protrude from the upper surface of the lower mold base member, the movement of the lower mold frame member is stopped by the abutment of the lower mold frame member and the front end of the rigid member at the time of mold clamping. In the case where the rigid member is suspended from the lower mold frame member, the lower mold base member abuts against the front end of the rigid member at the time of mold clamping, and the movement of the lower mold frame member is stopped.

The first elastic member and the second elastic member are not particularly limited, and examples thereof include a resin having elasticity such as a spring, a coil spring, a disc spring, and an anthrone rubber.

For the first resin encapsulating device of the present invention, the upper mold includes a rigid member and a first elastic member, and the lower mold includes a second elastic member through which the upper surface of the substrate can be resin-molded by compression molding. And the lower surface of the substrate can be resin-sealed by the lower mold. In this case, the upper mold includes the rigid member and the first elastic member, and the lower mold includes the second elastic member, and the upper mold frame member hangs from the upper mold base member via the first elastic member, a lower mold frame member is placed on the lower mold base member via the second elastic member, from which the rigid member The mold base member is suspended, and when the resin is packaged, the upper mold frame member and the lower mold frame member are held by the upper mold frame member, and the upper mold frame member is brought into contact with the front end of the rigid member. The movement of the frame member in the direction in which the rigid member is disposed is stopped.

Further, in the first resin package device of the present invention, the lower mold includes the rigid member and the first elastic member, and the upper mold includes the second elastic member, and the upper surface of the substrate is compression-molded by the upper mold The resin is encapsulated, and the lower surface of the substrate is subjected to resin molding by compression molding through the lower mold. In this case, the lower mold includes the rigid member and the first elastic member, and the upper mold includes the second elastic member, and the lower mold frame member is placed on the lower mold base member via the first elastic member. The upper mold frame member hangs from the upper mold base member via the second elastic member, the rigid member protrudes from an upper surface of the lower mold base member, and passes through the upper mold frame member and the lower mold frame during resin packaging When the member holds the substrate, the lower mold frame member abuts against the front end of the rigid member, and the movement of the lower mold frame member in the direction in which the rigid member is disposed can be stopped.

In the second resin package device of the present invention, the substrate pin can be placed in a state of being detached from the upper surface of the lower mold. The term "placement" as used herein also includes "fixed". Therefore, when the second resin packaging device decompresses the inside of the mold during the intermediate mold clamping, since the lower mold cavity does not have the substrate as a cover, the pressure can be reduced in the lower mold cavity. Thereby, excess air or the like remaining in the lower mold cavity can be effectively prevented (reduced), and the bending of the substrate can be further suppressed. There are many residuals in the lower model cavity In the case of the remaining air or the like, air or the like other than the resin is also contained in the lower mold cavity. In this way, the lower mold cavity is filled with resin or the like first than the upper mold cavity, and pressure (resin pressure) is first applied to the lower mold cavity. Therefore, in the case where excess air remains in the lower mold cavity, bending of the substrate may occur. Such a problem can be prevented by the substrate pin.

Further, the substrate pin may be integrated with the lower mold or may be separated from the lower mold.

In the second resin packaging device of the present invention, the upper and lower mold forming modules (one molding module) can double as the first molding module and the second molding module. An upper mold and a lower mold are disposed in the upper and lower mold forming modules. In this case, the upper surface of the substrate can be resin-molded by compression molding by the upper mold, and the lower surface of the substrate can be resin-molded by compression molding by the lower mold. Thereby, the both sides of the substrate can be integrally molded by using one molding module, so that the production efficiency can be improved, and since the structure is simplified, the cost can be reduced, which is preferable.

The substrate pin can be formed, for example, as a stepped pin, and includes a projecting substrate positioning portion at its tip end. The substrate pin can be placed on the substrate by inserting the substrate positioning portion into the through hole provided in the substrate. Thereby, the substrate can be stably placed on the substrate pin at a specified position, which is preferable.

The second resin packaging device of the present invention can provide an exit hole for the substrate positioning portion on the upper mold frame member or the like.

The first resin encapsulating device of the present invention, like the second resin encapsulating device, may include a substrate pin. The substrate pin is in the lower model of the molding module The outer side of the cavity is provided to protrude upward, and the substrate pin can be placed in a state of being detached from the upper surface of the lower mold. Further, the substrate pin can include a projecting substrate positioning portion at its tip end by, for example, forming a stepped pin. The substrate pin can be placed on the substrate by inserting the substrate positioning portion into the through hole provided in the substrate.

Each of the first resin encapsulating device, the second resin encapsulating device, and the third resin encapsulating device of the present invention may further include a ejector pin. The ejector rod is disposed to enter and exit from a cavity surface of at least one of the upper mold and the lower mold provided by at least one of the first molding module and the second molding module, and the ejector rod is open when the mold is opened The front end can be raised or lowered to protrude from the cavity surface, and the front end thereof can be raised or lowered without protruding from the cavity surface when the mold is closed. Thereby, the resin-encapsulated substrate can be easily released from the lower mold, which is preferable. Further, the molding die provided with the ejector pin may be, for example, an upper die or a lower die, or may be both an upper die and a lower die.

The first resin package device, the second resin package device, and the third resin package device of the present invention may further include a substrate transfer mechanism and a resin transfer mechanism. The substrate transfer mechanism transports the substrate on which the resin is packaged at a predetermined position of each molding module. The resin transfer mechanism can transfer, for example, a resin supplied to the substrate onto the substrate. Further, the resin transfer mechanism can transfer the resin to the mold cavity, for example. In the resin sealing device, the substrate transfer mechanism can also serve as the resin transfer mechanism.

The second resin package device and the third resin package device of the present invention may further include a substrate inversion mechanism. This substrate inversion mechanism reverses the vertical direction of the substrate on which the resin is packaged.

In the first resin encapsulating device, the second resin encapsulating device, and the third resin encapsulating device of the present invention, for example, one molding die may be placed on each of the molding modules, or two molding dies may be placed in parallel. When two such molding dies are placed in parallel, for example, in order to absorb a change in the amount of resin, a spring or the like may be provided on a block (member) constituting a cavity of the molding module for compression molding, and the resin may be pressurized. Further, a ball screw, a hydraulic cylinder, or the like may be attached to the block (member) constituting the cavity, and pressurized by linear motion.

The first resin encapsulating device, the second resin encapsulating device and the third resin encapsulating device of the present invention may be provided on both the upper mold and the lower mold for demolding the molded resin encapsulating product from the molding die. An easy release film can be provided on at least one or not.

In addition, when air or the like contained in the air or the resin contained in the resin is heated to form a gas, for example, pores (air bubbles) may be generated. If voids (bubbles) are generated, the durability or reliability of the resin packaged product may be lowered. Here, the first resin encapsulating device, the second resin encapsulating device, and the third resin encapsulating device of the present invention may include a vacuum pump that performs resin encapsulation molding under vacuum (decompression) in order to reduce air bubbles as necessary. Wait.

The third resin packaging device of the present invention may also be that the first molding die has a lower mold, and the lower surface of the substrate may be resin-molded by compression molding through the lower mold, and the second molding die has an upper mold. The upper surface of the substrate was resin-molded by compression molding by the upper mold. Further, in the third resin package device of the present invention, the substrate supporting member is not particularly limited, and may be, for example, supported (pressurized) by a high pressure gas or a gelled solid. The element of the other side of the substrate.

The substrate to be resin-sealed by the first resin sealing device, the second resin sealing device, and the third resin sealing device of the present invention may be, for example, a mounting substrate on which wafers are mounted on both surfaces thereof. As the mounting substrate, for example, as shown in FIG. 22(a), a wafer 1 and a wire 3 for electrically connecting the wafer 1 and the substrate 2 are provided on one of the two faces thereof, and the other two sides thereof are provided. A flip-chip 4, a mounting substrate 11 as a ball terminal 5 as an external terminal, and the like are provided.

Here, when molding both surfaces of the substrate 2 having such a structure, it is necessary to expose the spherical terminals 5 from at least one surface. When the ball terminal 5 is exposed on the compression molding side, the ball terminal 5 is preferably pressed to the release film and exposed. Further, if necessary, in order to expose the spherical terminal 5 after resin encapsulation, the encapsulating resin may be subjected to a polishing treatment or the like. Further, for example, as shown in the mounting substrate of FIG. 22(b), the flat terminal 6 may be used instead of the spherical terminal 5. In addition, the mounting substrate 11 of FIG. 22(b) is not provided with the spherical terminal 5 of the mounting substrate 11 of FIG. 22(a) on the one surface, but is provided as the flat terminal 6 on the other surface, and The mounting substrate 11 of Fig. 22(a) is the same.

In the present invention, the substrate to be resin-sealed is not limited to each of the mounting substrates 11 of FIGS. 22(a) and 22(b), and may be any. As the substrate on which the resin is packaged, at least one of the wafer 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) can be mounted on the substrate as shown in FIGS. 22(a) and 22(b). On one side of the 2, it can also be mounted on both sides of the substrate 2. Further, for example, the terminal may be electrically connected (for example, a power supply circuit, a signal circuit, or the like of the substrate). In addition, The shape and size of each of the substrate 2, the wafer 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) are not particularly limited.

The substrate on which the resin is encapsulated by the first resin sealing device, the second resin sealing device, and the third resin sealing device of the present invention is, for example, a high-frequency module substrate for a mobile communication terminal. In the substrate for the mobile communication terminal, in order to resin-encapsulate both surfaces of the substrate, an opening may be formed in the bracket portion. However, it is desirable to have a resin package molding method in which the opening is not required to be vacated. Further, when the substrate for the mobile communication terminal is small and the components are densely built, it may be difficult to vacate the opening and perform resin encapsulation molding. On the other hand, in the first resin sealing device and the second resin sealing device of the present invention, as described above, both sides of the substrate can be resin-sealed without leaving the opening, and the present invention can be applied to such a small-sized member. A substrate built in high density. The substrate to be resin-sealed by the resin sealing device of the present invention is not particularly limited, and examples thereof include a power control module substrate, a mechanical control substrate, and the like.

In order to supply the substrate to the molding die, a frame member having a through hole can be used. At this time, for example, the substrate is adsorbed and fixed on the lower surface of the frame member. Then, the resin is supplied into the through hole of the frame member. The substrate fixed by the frame member enters between the upper mold and the lower mold in the mold opening state, for example, and the substrate is placed on the substrate pin or the like by lowering the frame member or lifting the lower mold or the like. The frame components can be withdrawn as needed. By using the frame member, the resin can be disposed in a stable state on the substrate, which is preferable.

The resin is not particularly limited and may be, for example, an epoxy resin or A thermosetting resin such as an anthrone resin may be a thermoplastic resin. Further, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. The form of the resin to be supplied is not particularly limited, and examples thereof include a particulate resin, a fluid resin, a sheet resin, a plate resin, and a powder resin. In the present invention, the fluid resin is not particularly limited as long as it is a fluid resin, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin is, for example, a resin which is liquid at room temperature or has fluidity. In the present invention, the molten resin is, for example, a resin which is in a liquid state or has a fluidity state by melting. The form of the resin may be supplied to the cavity of the molding die or the like, and other forms may be used.

In addition, the term "electronic component" generally refers to a case of a wafer before resin encapsulation, and refers to a state in which a wafer is resin-encapsulated. However, in the present invention, when only "electronic component" is referred to, unless otherwise specified, it means The wafer is subjected to resin-sealed electronic components (as electronic components of the finished product). In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specific examples thereof include a wafer such as an IC, a semiconductor wafer, or a semiconductor element for power control. In the present invention, in order to distinguish a wafer before resin encapsulation from a wafer after resin encapsulation, it is referred to as a "wafer" for the sake of convenience. However, the "wafer" in the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in the form of a wafer.

In the present invention, "flip-chip" refers to an IC wafer having a knob-shaped protruding electrode called a bump on an electrode (pad) on a surface portion of an IC wafer, or such a wafer form. The wafer is mounted on a wiring portion such as a printed circuit board face down (face down). The flip chip is used, for example, as a crystal for wire bonding One of the pieces or installation methods.

The first resin encapsulating method, the second resin encapsulating method, and the third resin encapsulating method of the present invention are all resin encapsulating methods for resin encapsulating both sides of a substrate, including: a first resin encapsulating step, using the present invention The first resin encapsulating device, the second resin encapsulating device or the third resin encapsulating device, the one side of the substrate is resin-molded by compression molding; and the second resin encapsulating step, the other side of the substrate is compression-molded Perform resin encapsulation. Therefore, the first resin encapsulation method and the second resin encapsulation method of the present invention, by the first resin encapsulation step, first encapsulate one side of the substrate by compression molding, after the first resin encapsulation step, When the other surface of the substrate is resin-molded by compression molding, the resin is supported by the resin for compression molding, and the resin is pressed against the substrate from the other surface side to suppress the bending of the substrate. Alternatively, when resin encapsulation is performed by compression molding on the other surface of the substrate simultaneously with the first resin encapsulation step, uniform resin pressure may be applied to both surfaces of the substrate at substantially the same time. Therefore, in the present invention, both the suppression of the bending of the substrate and the molding of both sides of the substrate can be achieved.

Due to the tolerances in the production of the molding module, fluctuations in the amount of supply of the resin, and the like, it may be difficult to simultaneously resin-bond the both surfaces of the substrate. On the other hand, the first resin sealing method, the second resin encapsulating method, and the third resin encapsulating method of the present invention perform the second resin encapsulating step, for example, even after the first resin encapsulating step. Both the bending suppression of the substrate and the molding of both sides of the substrate can be achieved.

Furthermore, the first resin encapsulation method of the present invention is characterized by the tree The fat encapsulating device is the first resin encapsulating device of the present invention, and in the first resin encapsulating step and the second resin encapsulating step, in a state in which the substrate is sandwiched by the upper mold frame member and the lower mold frame member, One of the upper mold frame member and the lower mold frame member abuts against the front end of the rigid member, and the movement of the upper mold frame member or the lower mold frame member in a direction in which the rigid member is disposed is stopped. More specifically, it is as described in detail for the description of the first resin package device of the present invention. That is, for example, the upper mold frame member can be prevented from rising to a predetermined position (target package thickness position) or more by the stopper (the rigid member) provided in the upper mold at the time of mold clamping and the upper mold frame member abutting. Further, the upper mold frame member is abutted by the stopper, and as described below, there is also an effect of suppressing the inclination of the upper mold and the lower mold frame member (substrate) due to the fluctuation of the input of the resin. Further, by mounting an elastic member (the second elastic member) having a larger spring constant than the elastic member (the first elastic member) of the upper mold on the lower mold, the upper portion can be more reliably closed at the time of mold clamping The mold frame member is pressed against the brake member. Further, at the time of mold clamping, by providing the elastic member having a large spring constant in the lower mold, the elastic deformation is larger than that of the elastic member of the upper mold, so that the upper mold cavity can be filled with the resin first. The details will be described in the first embodiment to be described later. Further, it is preferable to set the amount of the resin supplied to the upper mold cavity to be substantially the same volume as the cavity volume when the upper mold frame member is fixed by the stopper. Thus, when the upper mold cavity is filled with the resin, at least the deformation of the substrate due to the excessive and insufficient amount of the resin can be reduced. Therefore, even if the resin is filled in the lower mold and the resin pressure is applied to the substrate, the deformation of the substrate can be suppressed because the resin of the upper mold cavity supports the substrate. In addition, as described above, this The invention is not limited to the example in which the upper mold includes the brake member (the rigid member) and the first elastic member and the lower mold include the second elastic member. Conversely, the lower mold may include the brake member (the rigid member) and the first The elastic member and the upper mold include the second elastic member.

In the first resin encapsulation method of the present invention, the first resin encapsulation step and the second resin encapsulation step may be simultaneously performed. In addition, the term "simultaneously" as used herein does not have to be strict, and may be slightly biased. As described above, it may be difficult to perform resin encapsulation on both surfaces of the substrate at the same time due to tolerances in production of the molding module, fluctuations in the amount of supply of the resin, and the like. However, according to the first resin encapsulation method of the present invention, It is not necessary to strictly perform resin encapsulation on both sides of the substrate at the same time, and it is also possible to achieve both the suppression of the bending of the substrate and the molding of both sides of the substrate.

In the first resin encapsulation method of the present invention, in the first resin encapsulation step and the second resin encapsulation step, the upper mold is passed through the state in which the substrate is sandwiched by the upper mold frame member and the lower mold frame member. The frame member abuts against the front end of the rigid member to stop the movement of the upper mold frame member in a direction in which the rigid member is disposed.

In the second resin encapsulating method of the present invention, the resin encapsulating device is the second resin encapsulating device of the present invention, the resin encapsulating method further comprising a substrate mounting step, the substrate is driven from the lower die by the substrate pin The state in which the upper surface is detached is placed. Therefore, when the mold is decompressed in the mold during the intermediate mold clamping, since the lower mold cavity does not have the substrate as a cover, the lower mold cavity can be depressurized. Thereby, excess air remaining in the lower mold cavity can be effectively prevented (reduced), and the bending of the substrate can be suppressed.

In the second resin encapsulation method of the present invention, in the first resin encapsulation step, the upper surface of the substrate may be resin-molded by compression molding through the upper mold, and in the second resin encapsulation step, The lower mold is resin-sealed by compression molding the lower surface of the substrate.

In the first resin encapsulation method of the present invention, as in the second resin encapsulation method of the present invention, a substrate mounting step may be included, in which the substrate is detached from the upper surface of the lower mold by the substrate pin Placed.

In the substrate mounting step, the substrate positioning portion can be inserted into the through hole provided in the substrate, and the substrate can be placed by the substrate pin.

In the first resin encapsulating method and the second encapsulation method of the present invention, the resin encapsulating device may protrude from the cavity surface by raising or lowering a front end of the ejector rod when the mold is opened. And a step of raising or lowering the front end of the ejector pin without protruding from the cavity surface when the mold is closed by the resin packaging device.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. The drawings are schematically described for convenience of explanation, appropriate omission, exaggeration, and the like.

[Example 1]

In the present embodiment, an example of the first resin sealing device of the present invention will be described first, and then an example of the first resin sealing method of the present invention will be described. In addition, the substrate used in the present embodiment is the same as the substrate 2 of FIG. 22(a).

Fig. 1 shows a cross-sectional view of a first resin package device 10 of the present embodiment. The first resin package device 10 shown in FIG. 1 is over the mold 200 and the upper mold The lower die 300 of 200 is disposed as a constituent element. On the die face (lower surface) of the upper die 200 and the die face (upper face) of the lower die 300, as shown in the drawing, for example, the release film 40 can be fixed by suction (mounting).

In the first resin package device 10 of the present embodiment, the upper mold 200 is, for example, an upper mold base member 201, an upper mold frame member 210, an upper mold cavity upper surface member 230, a rigid member 231, and a (first) elastic member (spring 232. The upper mold base 202 and the upper mold outer gas blocking member 203 having an O-ring 204A and an O-ring 204B. The upper mold 200 constitutes the upper mold cavity 220 through the upper mold cavity upper surface member 230 and the upper mold frame member 210. The upper mold 200 is fixed to, for example, a fixed disk (not shown) of the first resin package device 10. Further, on the upper mold 200 or the first resin package device 10, for example, a heating element (not shown) for heating the upper mold 200 is provided. By heating the upper mold 200 with the heating element, the resin in the upper mold cavity 220 is heated to be solidified (melted and solidified). Further, the heating element may be provided, for example, on either or both of the upper mold 200 and the lower mold 300, and the position thereof is not limited as long as at least one of the upper mold 200 and the lower mold 300 can be heated.

The upper mold base member 201 is attached, for example, in a state of being suspended from the upper mold base 202. The upper mold frame member 210 hangs down on the upper mold base member 201 via, for example, the (first) elastic member 232, and the upper mold cavity upper surface member 230 hangs down on the upper mold base member 201. The rigid member 231 hangs down, for example, on the upper mold base member 201. As shown in Fig. 1, in the state in which the rigid member 231 is opened, the front end thereof is not in contact with the upper mold frame member 210, but is slightly separated. At the outer peripheral position of the upper mold base member 201, for example, an upper mold outer gas blocking member 203 is provided. The upper mold outer gas blocking member 203 is as follows, The O-ring 204B is joined to the lower mold external gas blocking member 303, so that the inside of the cavity can be in an external gas blocking state. An O-ring 204A for blocking external air is provided, for example, on the upper end surface of the upper mold outer gas blocking member 203 (the portion sandwiched between the upper mold base 202 and the upper mold outer gas blocking member 203). Further, on the lower end surface of the upper mold outer gas blocking member 203, for example, an O-ring 204B for blocking the outside air is also provided. Further, on the upper mold base 202, for example, a hole (through hole) 205 of the upper mold 200 for forcibly sucking the air in the space in the mold to be decompressed is provided.

In addition, the first resin package device 10 of FIG. 1 is a structure in which the upper mold frame member 210 and the upper mold cavity upper surface member 230 are separated, but the resin package device of the present embodiment is not limited thereto, and the two sides may be integrated. Structure.

The lower mold 300 is formed, for example, by a lower mold base member 301, a lower mold frame member 310, a lower mold cavity lower surface member 330, a (second) elastic member 332, a lower mold base 302, and a lower mold outer gas blocking member 303, The mold outer gas blocking member 303 has an O-ring 304. The lower mold 300 constitutes the lower mold cavity 320 through the lower mold cavity lower surface member 330 and the lower mold frame member 310. Further, on the lower mold 300 or the first resin package device 10, for example, a heating element (not shown) for heating the lower mold 300 is provided. By heating the lower mold 300 with the heating element, the resin in the lower mold cavity 320 is heated to be solidified (melted and solidified). The lower mold 300 is movable in the up and down direction by, for example, a drive mechanism (not shown) provided on the first resin package device 10. That is, the lower mold 300 (fixed) can be moved in the direction of approaching the upper mold 200 to close the mold. Moreover, the lower mold 300 can be moved away from the upper mold 200. Mold.

The lower mold base member 301 is attached, for example, in a state of being placed on the lower mold base 302. The lower mold frame member 310 is placed on the lower mold base member 301 via, for example, a (second) elastic member (spring) 332, and the lower mold cavity lower surface member 330 is placed, for example, on the lower mold base member 301. At the outer peripheral position of the lower mold base member 301, for example, a lower mold outer gas blocking member 303 is provided. The lower end surface of the lower mold outer gas blocking member 303 (the portion sandwiched by the lower mold base 302 and the lower mold outer gas blocking member 303) is provided with, for example, an O-ring 304 for blocking external air.

The first resin sealing device 10 of the present embodiment may include a substrate pin, for example, similarly to the second embodiment (FIGS. 14 to 15) to be described later. The substrate pin is provided on the outer side of the lower mold cavity 320 so as to protrude upward, and the substrate 2 can be placed in a state of being detached from the upper surface of the lower mold 300. Further, the substrate pin may be, for example, a stepped pin, and includes a projecting substrate positioning portion at a tip end thereof. Each of the substrate pins can be inserted into the substrate positioning portion through a through hole (not shown) provided in the substrate 2, for example, and the substrate 2 can be fixed in a state of being detached from the lower mold 300.

Further, the mold release lever 550 may be provided on the bottom of the lower mold cavity 320 of the lower mold 300 as shown in FIG. 9 which will be described later. The ejector pin may be one or plural. The ejector pins can be raised from the bottom surface of the lower mold cavity 320 of the lower mold 300 when the mold is opened, and the front end thereof is lowered without being protruded from the bottom surface of the lower mold cavity 320 of the lower mold 300 when the mold is closed. .

Next, the first resin encapsulation method of the present embodiment will be described using FIGS. 2 to 9. The following applies to the resin encapsulating apparatus using the present embodiment. The resin encapsulation method will be described. More specifically, the resin package device of FIGS. 2 to 9 is the same as the resin package device of FIG. In addition, the ejector rod 550 in FIG. 9 may or may not be available. As described below, the "first resin encapsulating step" and the "second resin encapsulating step" of the first resin encapsulating method of the present invention are substantially simultaneously performed in the examples of FIGS. 2 to 9.

Next, in the first resin encapsulation method of the present embodiment, the mold temperature raising step, the release film supply step, the resin supply step, and the substrate supply step, which will be described later, are performed before the first resin encapsulation step. Each step is an arbitrary component in the resin encapsulation method.

First, the heating element (not shown) heats the molding die (the upper die 200 and the lower die 300) to raise the temperature until the molding die (the upper die 200 and the lower die 300) can cure (melt and cure) the resin ( Forming mold heating step). Next, the release film 40 is supplied to the upper mold 200 and the lower mold 300 (release film supply step). Next, as shown in FIG. 2, the pellet resin 30a is supplied to the bottom surface of the lower mold cavity 320 (first resin supply step). Further, in the release film supply step, only the release film 40 can be supplied to the lower mold 300, and the particulate resin 30a can be additionally supplied to the release film 40. Alternatively, in the release film supply step, the release film 40 on which the particulate resin 30a is placed may be simultaneously supplied to the lower mold 300 together with the particulate resin 30a. Further, the particulate resin 30a is heated by the lower mold 300 heated (heated) by the heating element, whereby the particulate resin 30a is melted into the fluid resin 30b as shown in FIG. However, as described below, the particulate resin 30a may be melted to become the fluid resin 30b during the period of contact with the wafer 1 and the lead wire 3, and does not necessarily have to be melted in the stage of FIG. Next, as shown in FIG. 3, the lower mold of the downward mold 300 The frame member 310 is supplied to the substrate 2 (substrate supply step). The substrate 2 can be fixed by, for example, a jig (not shown) provided on the lower mold 300 or by suction (suction) of a suction hole (not shown) provided on the lower mold 300. At this time, the wafer 1 and the lead wires 3 mounted on the lower surface of the substrate 2 may be immersed in the fluid resin 30b in the lower mold cavity, or as shown in Fig. 3, may not be impregnated at this stage. Next, as shown in FIG. 3, the pellet resin 20a is supplied to the upper surface of the substrate 2 (second resin supply step). Further, in the resin encapsulating method of the present invention, the pellet resin 20a is supplied to the upper surface of the substrate 2 without being limited to the supply of the substrate 2 to the lower mold 300. For example, the pellet resin 20a may be supplied to the upper surface of the substrate 2, and then The lower mold 300 supplies the substrate 2 to which the particulate resin 20a has been supplied. Further, as shown in FIGS. 10 to 11 to be described later, when the particulate resin 20a supplied to the upper surface of the substrate 2 is preheated, the particulate resin 30a can be supplied to the lower mold cavity 320.

Next, as shown in FIGS. 4 to 5, for example, the first resin encapsulating step (the step of resin encapsulating the upper surface of the substrate by compression molding by the upper mold) and the second resin encapsulating step are performed (almost simultaneously) ( The step of resin encapsulating the lower surface of the substrate by compression molding by a lower mold). In the present embodiment, the both sides of the substrate 2 are resin-molded by compression molding by the first resin encapsulating step and the second resin encapsulating step. However, as an example of a method of performing resin encapsulation by the compression molding, specifically, The intermediate mold clamping step, the upper mold cavity resin filling step, the lower mold cavity resin filling step, and the mold opening step described below are performed.

First, as shown in FIG. 4, the lower mold 300 is lifted by a drive mechanism (not shown) to perform intermediate mold clamping (intermediate mold clamping step). In this case, outside the upper mold The gas blocking member 203 and the lower mold external gas blocking member 303 are joined via the O-ring 204B, and the inside of the mold is in an external gas blocking state. Then, the suction in the direction of the arrow X as shown in FIG. 4 is started from the hole 205 of the upper mold 200 to decompress the inside of the mold. At this time, as shown in the drawing, since the substrate 2 and the lower mold frame member 310 are in contact with each other, the lower mold cavity 320 is in a covered state, and it may be difficult to decompress the inside of the lower mold cavity 320. In this case, a vent (a groove deep to the extent that the air and gas can be discharged without leaking the resin) can be provided on the upper surface of the lower mold frame member 310 (the abutment surface of the lower mold frame member 310 and the substrate 2). ). Doing so can decompress the lower mold cavity 320.

Next, as shown in Fig. 5, the lower mold frame member 310 and the lower mold cavity lower surface member 330 are lifted together to bring the heated upper mold and the lower mold closer. At this time, for example, the position of the resin in the upper mold cavity 220 and the lower mold cavity 320 can be temporarily stopped or temporarily accelerated. For example, FIG. 5 shows an example in which the upper mold frame member 210 is temporarily stopped at a position where the mold release film 40 abuts (closes) the substrate 2, but is not limited to this example. As shown in FIG. 5, in this state, the wafer 1 and the lead wires 3 mounted on the lower surface of the substrate 2 are not immersed in the molten resin (flowable resin) 30b. Further, the front end of the rigid member 231 is not in contact with the upper mold frame member 210.

Next, from the state in Fig. 5, the lower mold 300 is lifted by a drive mechanism (not shown), as shown in Fig. 6, the front end of the rigid member 231 abuts on the upper mold frame member 210, and stops at the position. The mold frame member 210 is moved up. Further, at this time, the lower mold frame member 310 abutting on the upper mold frame member 210 via the substrate 2 also stops moving upward. Further, the amount of resin supplied to the upper mold cavity 220 is set to be upwardly shifted from the upper mold frame member 210. The volume of the upper mold cavity 220 at the stopped position is substantially the same volume, and the upper mold cavity 220 can be filled with resin at a position where the upper mold frame member 210 is moved up and stopped (the upper mold cavity 220 is filled with resin) (Upper mold cavity resin filling step). Further, the clamping position of the substrate 2 is fixed by the stop (fixing) of the upward movement of the upper mold frame member 210. Thereby, even if a deviation of the resin occurs in the upper mold cavity 220 or the lower mold cavity 320 at the time of supplying the resin, the inclination of the substrate 2 due to the influence thereof can be prevented. Then, by heating (heating) the upper mold 200, as shown in FIG. 6, the pellet resin 20a is heated and melted to become a molten resin (flowable resin) 20b. Then, as shown in FIG. 7, by further lifting the lower mold 300 (lower mold cavity lower surface member 330), the lower mold cavity 320 can be filled with resin (lower mold cavity resin filling step). At this time, as shown in the drawing, the wafer 1 and the wires 3 are immersed in the molten resin (flowable resin) 30b in the lower mold cavity 320. In addition, in the present embodiment, after the pellet resin 30a is completely melted into the molten resin (flowable resin) 30b, the lower mold 300 (the lower mold cavity lower surface member 330) is lifted, and the molten resin (liquid resin) is used. An example in which the wafer 1 and the wires 3 are immersed in 30b. However, as described above, the invention is not limited thereto. For example, the resin may be melted into a molten resin (flowable resin) 30b before the instant at which the wafer 1 and the wire 3 are in contact with the resin in the lower mold cavity, and specifically, for example, in the lower mold 300 (under the lower mold cavity) During the rise of the surface member 330), the resin in the lower mold cavity is melted.

Further, after the lower mold cavity 320 is filled with the resin, resin pressure (clamping) can be applied to the upper mold cavity 220 and the lower mold cavity 320 by pressurizing (lifting) the lower mold 300 (lower mold cavity lower surface member). At this time, the upper model cavity Since the resin in the 220 supports the substrate, even if the lower mold cavity lower surface member 330 presses the substrate 2 via the resin in the lower mold cavity 320, deformation (bending) of the substrate 2 can be suppressed. Further, the upper mold cavity resin filling step and the lower mold cavity filling step may be performed in a vacuum (reduced pressure) state.

Next, as shown in FIG. 8, for example, after the molten resin (flowable resin) 20b and 30b are solidified to form the encapsulating resins 20 and 30, the lower mold 300 is lowered by a drive mechanism (not shown) to perform mold opening (mold opening step). . Thereafter, the substrate on which both sides of the encapsulating resin are resin-sealed is taken out from the lower mold 300 (released).

Further, as described above, the ejector pin can be used at the time of mold opening. That is, as shown in FIG. 9, the first resin encapsulating method of the present embodiment may further include a step of ascending, and the front end of the ejector rod 550 is raised to protrude from the bottom surface of the lower mold cavity 320 at the time of mold opening. Furthermore, the first resin encapsulation method of the present embodiment may further include a lowering step of lowering the front end of the ejector rod 550 without protruding from the bottom surface of the lower mold cavity 320 during mold clamping.

In FIGS. 2 to 9, the substrate is fixed (provided) in the lower mold and then compression-molded. Alternatively, as shown in FIGS. 10 to 11, the substrate may be fixed (provided) in the upper mold and then compression-molded. Further, as shown in FIGS. 14 to 15 to be described later, the substrate may be fixed (provided) by placing the substrate on the substrate pin using the substrate pin. In addition, the resin sealing methods shown in FIGS. 2 to 15 are all examples in which the "first resin encapsulating step" and the "second resin encapsulating step" are performed almost simultaneously.

The resin encapsulation method will be described below with reference to FIGS. 10 to 11. First, the mold temperature raising step is performed in the same manner as the method of FIGS. 2 to 9. And a release film supply step. Next, as shown in FIG. 10, the substrate 2 on which the particulate resin 20a is placed in advance is fixed to the upper mold frame member 210 by a jig (not shown) or the like. Thereby, as shown in FIG. 10, the upper mold cavity 220 is filled with the particulate resin 20a (substrate supply step and first resin supply step). Thereafter, the particulate resin 20a is preheated by the heated upper mold 200.

Then, during the preheating of the particulate resin 20a, as shown in Fig. 11, on the release film 40 supplied to the die face of the lower mold, the pellet resin 30a is supplied (second resin supply step). In addition, in FIGS. 2 to 9, the pellet resin for resin encapsulation of the lower mold is supplied first in the first resin supply step, and then the pellet resin for resin encapsulation of the upper mold is supplied in the second resin supply step. However, the present embodiment is not limited thereto, and as described in FIGS. 10 to 11, the pellet resin for resin encapsulation of the upper mold may be supplied first in the first resin supply step, and then in the second resin supply step. A pellet resin for resin encapsulation supplied to the lower mold.

Next, after the second resin supply step shown in FIG. 11, the state of the intermediate mold clamping is performed in the same manner as in FIG. This intermediate mold clamping can be performed in the same manner as in Fig. 4 except that the substrate 2 is fixed to the upper mold 200 (the upper mold frame member 210) instead of being fixed to the lower mold 300 (the lower mold frame member 310). Thereafter, a resin encapsulation method (compression molding) can be carried out in the same manner by performing the same steps as those in FIGS. 5 to 9. At this time, the pellet resin 20a and the pellet resin 30a are heated by the upper mold 200 and the lower mold 300 which are heated in advance, and become molten resin (flowable resin) 20b and 30b, similarly to the method of FIG. The particle resin 30a can also be used in the same manner as in the methods of FIGS. 2 to 9, in contact with the wafer 1 and the wire 3. During the period, it melts into a molten resin (flowable resin) 30b.

In the first resin encapsulating method of the present embodiment, one side of the substrate 2 is first resin-molded by compression molding by a molding module for compression molding, and then resin-encapsulated on the other side, by performing resin for compression molding on one side. The support can suppress the bending of the substrate even if the resin pressure is applied from the other surface side. Further, when resin encapsulation is performed by compression molding on both surfaces of the substrate 2, uniform resin pressure can be applied to both surfaces of the substrate 2 almost simultaneously. Therefore, in the present invention, both the suppression of the bending of the substrate and the molding of both sides of the substrate can be achieved.

In the first resin encapsulation method of the embodiment, the first resin encapsulation step and the second resin encapsulation step may be performed simultaneously (almost simultaneously), or the first resin encapsulation step may be performed first, and then The second resin encapsulation step is performed.

Further, in the first resin encapsulation method of the present embodiment, since the first resin encapsulating device 10 having the rigid member 231 is used, it is possible to suppress the inclination (bending) of the substrate which occurs when the resin supply is deviated. The resin package device 10b shown in Fig. 23(a) and the first resin package device 10 of the present embodiment are the same resin package device, but differ in that the rigid member 231 is not provided. When the first resin encapsulating step and the second resin encapsulating step are performed using the resin encapsulating device 10b shown in Fig. 23 (a), for example, as shown in Fig. 23 (a), the granular resin supplied to the upper mold cavity 220 is subjected to When the fluid resin 150b which is heated and melted and the fluid resin 150b which is heated and melted by the pellet resin supplied to the lower mold cavity 320 are biased toward one, as shown in FIG. 23(b), the upper mold frame member 210 and the lower portion The mold frame members 310 are each inclined, and thus the inclination (bending) of the substrate 2 occurs. In this way, the substrate 2 will appear The problem of molding in the inclined state and curing as the fluid resin 150b.

On the other hand, in the first resin sealing device and the first resin encapsulating method of the present invention, as described above, one of the upper mold frame member and the lower mold frame member abuts against the front end of the rigid member, thereby suppressing The effect of the mold frame member and the lower mold frame member being inclined (the inclination of the substrate). That is, the inclination of the upper mold frame member 210 and the lower mold frame member 310 as shown in Fig. 23 (b) can be prevented or suppressed. 1 to 11 show a case where the rigid member 231 hangs from the upper mold base member 201, and the front end of the rigid member 231 abuts against the upper mold frame member 210, but as described above, the first resin package device of the present invention Not limited to this. Various modifications of the first resin sealing device of the present invention are shown in Figs. 12 and 13 . Fig. 12 (a) is a cross-sectional view of the same resin sealing device as that of Figs. 1 to 11 . Fig. 12 (b) is a cross-sectional view showing a modification of the resin sealing device of Fig. 12 (a). In the first resin sealing device 10 of FIG. 12(b), the rigid member 231 does not hang down from the upper mold base member 201, but protrudes from the upper surface of the upper mold frame member 210. As described above, in the state in which the substrate is sandwiched by the upper mold frame member 210 and the lower mold frame member 310, the front end of the rigid member 231 abuts against the upper mold base member 201, and the movement of the upper mold frame member 210 can be stopped. . Except for this, the resin package device of Fig. 12(b) is the same as Fig. 12(a). Further, the first resin sealing device 10 of FIGS. 13(a) and 13(b) is the same as FIGS. 12(a) and (b) except that the rigid member 231 is provided on the lower mold 300 instead of the upper mold 200. More specifically, in FIG. 13(a), the rigid member 231 protrudes from the upper surface of the lower mold base member 301. In the same figure, when performing resin encapsulation, it is passed through the upper mold frame member 210 and the lower mold frame member 310. In the state in which the substrate is held, the front end of the rigid member 231 abuts against the lower mold frame member 310, and the movement of the lower mold frame member 310 can be stopped. Further, in FIG. 13(b), the rigid member 231 is suspended from the lower mold frame member 310. In the same figure, when the resin is packaged, the front end of the rigid member 231 is brought into contact with the lower mold base member 301 in a state in which the substrate is sandwiched by the upper mold frame member 210 and the lower mold frame member 310, so that the lower mold frame can be stopped. Movement of component 310. Further, as shown in FIGS. 13(a) and 13(b), when the rigid member 231 is provided in the lower mold, the elastic member 332 of the lower mold is referred to as a "first elastic member", and the elastic member 232 of the upper mold is used. As the "second elastic member" having a larger spring constant than the elastic member 332 of the lower mold.

Further, in the first resin package device of the present invention, for example, as shown in FIGS. 1 to 11, the height of the rigid member is determined by the height of the rigid member (the cavity depth at which the rigid member abuts). . Therefore, in order to make the package height (cavity depth) suitable, it is preferable to appropriately set the height of the rigid member. For example, it is configured such that a rigid member can be detached from the upper or lower mold, and a plurality of rigid members having different heights are prepared, and the package height is adjusted by replacing it.

In addition, the first resin encapsulation method of the present embodiment can form both sides of the substrate 2 by using one molding module, thereby improving production efficiency, and also reducing the cost by simplifying the structure.

In the resin encapsulation method of the present embodiment, for example, as shown in the second embodiment to be described later, in the substrate supply step, the substrate 2 is placed on the substrate pin in a state of being detached from the upper surface of the lower mold 300. The substrate loading step above. In addition, the substrate positioning portion can be inserted into the substrate 2 The through hole (not shown) is placed on the substrate pin.

In the present invention, as described above, one of the two cavities of the molding die is first filled by compression molding, or two cavities are filled by resin for compression molding, on both sides of the substrate. Apply substantially the same resin pressure. Thereby, as described above, both the bending (deformation) suppression of the substrate and the double-sided molding of the substrate can be achieved. This is because the resin amount of the resin (resin for compression molding) supplied to the cavity can be adjusted as long as it is compression molding. Specifically, for example, as described above, the amount of resin supplied to the upper mold cavity or the lower mold cavity is preferably set to be substantially the same as the cavity volume when the position of the upper mold frame member or the lower mold frame member is fixed by the rigid member (brake member). volume of. Thus, when the resin is filled in the upper mold cavity or the lower mold cavity, at least the deformation of the substrate due to an excessive or insufficient amount of the resin can be reduced. More specifically, for example, when the volume of the resin is adjusted, if the specific gravity of the resin is known, the amount of the resin can be adjusted by measuring the weight of the supplied resin. Further, for example, the amount of the resin for compression molding may be set to be substantially the same as the volume of one of the substrates (the side where the rigid member is provided) when the substrate is in a flat state, and the resin for compression molding may be supplied to the one cavity to be filled. . Thus, at least the swelling or depression of the substrate due to an excessive or insufficient amount of the resin can be suppressed. Thereafter, the resin is filled into the other cavity. At this time, even if the resin pressure is applied from the other surface side of the substrate, the resin for compression molding having substantially the same volume as the one cavity is supported from one side of the substrate, and the substrate can be flat. The state is completed.

On the other hand, for example, when a cavity is first filled by transfer molding, the amount of resin supplied to the one cavity changes depending on the upper and lower positions of the plunger. Therefore, it is possible to cause the substrate to swell or sag due to an excessive or insufficient amount of the resin. Therefore, it is preferred to first fill at least one cavity by compression molding.

Further, in the case where one cavity is first filled by compression molding, if the resin for compression molding in a molten state has a high viscosity, when the resin is filled in one cavity, strong resistance may be generated to the substrate. In this case, sometimes the resin does not fill the entirety of the one cavity, and the substrate is swollen due to the volume portion of the unfilled portion. In this case, by filling the resin in the other cavity, a resin pressure is applied to the substrate from the other surface side of the substrate, and the swelled substrate is planarized to fill the resin into the entire cavity.

[Embodiment 2]

In the present embodiment, an example of the second resin package device of the present invention will be described first. Next, an example of the second resin encapsulating method of the present invention will be described. In addition, the substrate used in the present embodiment is the same as the substrate 2 in Fig. 22(a).

The second resin packaging device of the embodiment includes a top and bottom mold forming module (one molding module) and a substrate pin, and the upper and lower mold forming module also serves as the first molding module for compression molding and the compression molding. The second molding module. An upper mold and a lower mold are disposed in the upper and lower mold forming modules.

Fig. 14 is a cross-sectional view showing the second resin package device 10a of the present embodiment and the substrate 2 through which the resin is packaged. As shown in Fig. 14 (a), the upper and lower mold forming modules 1200 are used as the constituent elements of the upper mold 200a and the lower mold 300a disposed opposite to the upper mold 200a. In the die face (lower surface) of the upper die 200a and the die face (upper face) of the lower die 300a, as shown in the drawing, for example, it is adsorbable The release film 40 is fixed (mounted).

In the second resin sealing device 10a of the present embodiment, the upper mold 200a, the lower mold 300a, and the substrate pin 333 are provided as constituent elements. The upper mold 200a is the same as the upper mold 200 of the first resin sealing device 10 shown in Fig. 1 except that the rigid member 231 is not provided. The lower mold 300a is further disposed outside the lower mold cavity 320 of the lower mold 300a, and the substrate pins 333 are each disposed to protrude upward in a state of being placed on the elastic member 340 provided inside the lower mold frame member 310, and in FIG. The lower mold 300 of the first resin package device 10 shown is the same. In addition, in FIG. 1, the elastic member (second elastic member) 332 of the lower mold uses a member having a larger spring constant than the elastic member (first elastic member) 232 of the upper mold, but the embodiment is not limited thereto.

As shown in FIG. 14(a), each of the substrate pins 333 is provided to protrude upward from the outside of the lower mold cavity 320, and the substrate 2 can be placed in a state of being detached from the upper surface of the lower mold cavity 300. Further, as shown in FIG. 14(b), each of the substrate pins 333 may be, for example, a stepped pin, and may include a projecting substrate positioning portion 331 at its tip end. The substrate pin 333 of FIG. 14(b) is the same as the substrate pin 333 of FIG. 14(a) except that the substrate positioning portion 331 is included. For example, as shown in FIG. 14(b), each of the substrate pins 333 can be detached from the lower mold frame member 310 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2. fixed.

In the second resin package device 10a of the present embodiment, at the bottom of the lower mold cavity 320 of the lower mold 300a, further, a ejector pin (not shown) may be provided as in Fig. 7. For each of the ejector rods, the front end can be raised from The bottom surface of the lower mold cavity 320 of the lower mold 300a protrudes, and at the time of mold clamping, the front end thereof is lowered without protruding from the bottom surface of the lower mold cavity 320 of the lower mold 300a. The ejector pin may be one or plural.

Next, the second resin encapsulation method of the present embodiment will be described. Hereinafter, a resin encapsulation method using the second resin package device 10a of the present embodiment will be described. The second resin encapsulation method performs the first resin encapsulation step and the second resin encapsulation step by the upper and lower mold forming modules 1200.

In the second resin encapsulation method of the embodiment, before the performing the first resin encapsulation step and the second resin encapsulation step, the mold temperature raising step, the release film supply step, and the substrate mounting are performed hereinafter. The step and the resin supply step. Each step is an arbitrary component in the resin encapsulation method.

The second resin encapsulating method of the present embodiment can be carried out in substantially the same manner as in Figs. 2 to 9 of the first embodiment as described below. First, the mold temperature raising step was carried out in the same manner as in the mold temperature increasing step of the first embodiment. Next, the release film supply step was carried out in the same manner as the release film supply step of Example 1. Next, by the first resin supply step, as in Fig. 2, the particulate resin 30a is supplied onto the release film 40 of the lower mold. In the same manner as in the first embodiment, the release film 40 of the lower mold and the particulate resin 30a may be simultaneously supplied, or the release film 40 may be supplied, and then the pellet resin 30a may be supplied. Then, in the substrate mounting step, the substrate 2 is placed on the substrate pin 333 in a state of being detached from the upper surface of the lower mold 300a, and is the same as FIG. 3 of the first embodiment except for the substrate supply step of the first embodiment. Conducted. Then the second tree The fat supply step is carried out in the same manner as the second resin supply step of the first embodiment, and the pellet resin 20a for resin encapsulation of the upper mold is supplied. As described above, after the substrate 2 is supplied to the lower mold 300, the granular resin 20a is supplied to the upper surface of the substrate 2. Alternatively, the substrate 2 supplied with the particulate resin 20a may be supplied after the granular resin 20a is supplied to the upper surface of the substrate 2 in advance. To the lower die 300. Further, here, a through hole (not shown) provided in the substrate 2 can be inserted through the substrate positioning portion 331 , and the substrate 2 can be placed on the substrate pin 333 . Further, for example, the first resin encapsulating step and the second resin encapsulating step (the intermediate mold clamping step, the upper mold cavity resin filling step, the lower mold cavity resin filling step, the lower mold cavity resin filling step) are performed in the same manner as in FIGS. 4 to 9 of Embodiment 1. Steps and mold opening steps). As described above, the second resin encapsulation method of the present embodiment can be performed. In the above, substantially the same method as that of FIGS. 2 to 9 of the first embodiment is shown, but instead of the same as in FIGS. 10 to 11 of the first embodiment, the substrate may be fixed in the upper mold, and The order in which the particulate resin 30a is supplied to the lower mold during the preheating of the upper mold. Further, in the upper mold cavity resin filling step and the lower mold cavity resin filling step, the front end 333 of the substrate pin can be lowered with respect to the upper surface of the lower mold frame member 310 by the contraction of the elastic member 340 at the time of mold clamping. Therefore, the substrate 2 can abut against the upper surface of the lower mold frame member 310 via the release film 40. Thus, as in Fig. 5, both sides of the substrate can be clamped using the (first) elastic member (spring) 232 and the (second) elastic member (spring) 332. Thereby, uniform resin pressure can be applied almost simultaneously on both surfaces of the substrate, and resin encapsulation can be performed on both sides.

In the second resin encapsulation method of the present embodiment, one side of the substrate 2 is first compression-molded by the upper and lower mold forming modules 1200 for compression molding. After the resin is encapsulated and the resin is encapsulated on the other surface, the resin for compression molding is supported. Therefore, even if the resin pressure is applied from the other surface side, the bending of the substrate can be suppressed. Therefore, in the present embodiment, both the bending suppression of the substrate and the double-sided molding of the substrate can be achieved. Further, since both sides of the substrate 2 can be integrally molded by using one molding module, productivity is improved, and since the structure is also simplified, the cost can be reduced.

Further, in the second resin sealing method of the present embodiment, the substrate pin 333 is placed in a state where the substrate 2 is detached from the upper surface of the lower mold 300. Thus, in the second resin encapsulation method, when the inside of the mold is decompressed during the intermediate mold clamping, since the substrate 2 is not provided as a cover on the lower mold cavity 320, the lower mold cavity 320 can be effectively prevented (reduced). Excess air remains in the sheet, which further suppresses the bending of the substrate. When excess air or the like remains in the lower mold cavity 320, air or the like other than the resin is also contained in the lower mold cavity 320. Thereby, the lower mold cavity 320 is first filled with resin or the like as compared with the upper mold cavity 220, and pressure (resin pressure) is first applied to the lower mold cavity 320. Therefore, in the case where excess air remains in the lower mold cavity 320, bending of the substrate may occur. Such a problem can be prevented by the substrate pin 333. Further, in order to solve the problem caused by the residual of the excess air or the like, the above-described vents may be used in addition to the substrate pins, or the vents described above may be used instead of the substrate pins.

In the second resin encapsulating method of the present embodiment, the raising step and the descending step of the ejector rod may be included in the same manner as in Fig. 7 of the first embodiment.

Although the first and second embodiments have been described above, the present invention is not limited thereto. Various changes can be made here. For example, the first resin package device (including the rigid member, the first elastic member, and the second elastic member) may be combined with the same substrate pin as the second resin package device. More specifically, for example, the lower mold frame member 310 of the first resin package device 10 of FIG. 1 can be provided with the same substrate as the second resin package device 10a of FIG. 14 as shown in FIGS. 15(a) to (c). A pin 333 and an elastic member 340. Further, in at least one of the resin supply step and the substrate supply step, for example, as shown in FIGS. 15(a) to 15(c), a frame member can be used. Specifically, for example, the mold temperature raising step, the release film supply step, and the supply of the pellet resin 30a to the bottom surface of the mold cavity 320 (first resin supply step) are performed in the same manner as in FIG. 2 . Further, as described above, the particulate resin 30a is melted into a molten resin (flowable resin) 30b. Further, as shown in Fig. 15 (a), the substrate 2 is then fixed by suction on the lower surface of the frame member 32 having the internal through hole 31, and the particulate resin 20a is supplied to the through hole 31 in the frame member 32. Then, as shown in the figure, when the upper mold 200 and the lower mold 300 are opened, the frame member 32, the substrate 2, and the particulate resin 20a are fed between the upper and lower molds. Next, as shown in FIG. 15(b), the substrate 2 on which the frame member 32 and the pellet resin 20a are placed is placed on the substrate pin 333 by the lower frame member 32 or the lower mold 300. Then, as shown in Fig. 15 (c), the frame member 32 is withdrawn. Thereafter, the same steps as those of FIGS. 4 to 9 can be performed, for example. Thereby, as shown in FIGS. 15(a) to 15(c), the resin such as the pellet resin 20a can be stably supplied onto the substrate 2 by using the frame member 32.

In addition, the frame member 32 shown in FIGS. 15(a) to (c) may be in the first resin package device 10 of FIG. 1 or the second resin package device 10a of FIG. Use it the same way. Further, in the first resin sealing device 10 of FIG. 15, the resin member may be packaged in the same manner as in the first embodiment without using the frame member 32. Further, an example in which the frame member 32 is used for the supply of the substrate 2 is shown in FIGS. 15(a) to 15(c), but the use of the frame member is not limited thereto. For example, a frame member may be used in the supply of the release film 40 and the particulate resin 30a to the lower mold cavity 320. Specifically, for example, the release film 40 is adsorbed instead of the substrate 2 on the lower surface of the frame member 32 of FIGS. 15( a ) to 15 ( c ). Then, the particulate resin 30a is supplied onto the release film 40 in the inner through hole 31 of the frame member 32. Next, when the upper mold 200 and the lower mold 300 are opened, the frame member 32, the release film 40, and the particulate resin 30a are fed between the upper and lower molds. Then, after the release film 40 and the particulate resin 30a are supplied to the die face of the lower mold, only the frame member 32 is withdrawn. Further, the frame member 32 can be used again to perform the steps of Figs. 15(a) to (c) as described above.

[Example 3]

In the present embodiment, first, an example of the third resin sealing device of the present invention will be described. Next, an example of the third resin sealing method of the present invention will be described. In addition, the substrate used in the present embodiment is the same as the substrate 2 of FIG. 22(a).

The resin package device of this embodiment includes a first molding module for compression molding and a second molding module for compression molding. The first molding module includes an external gas blocking member and a substrate supporting member, and the external gas blocking member can block the molding die of the first molding module from the outside air.

Fig. 16 is a cross-sectional view showing the first molding module 500 of the present embodiment and the substrate 2 through which the resin is packaged. As shown in Figure 16, the first The module 500 includes a substrate holding member (upper mold) 600 and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600. Although the illustration is omitted for simplification, the first molding module 500 of the drawing includes an upper mold base and a lower mold base, and an upper mold outer gas blocking member and a lower mold outer gas blocking member. The upper mold base and the lower mold base, and the upper mold outer gas blocking member and the lower mold outer gas blocking member are as follows, and for example, the same members as those of the first or second embodiment can be used. Further, these upper mold outer gas blocking members and lower mold outer gas blocking members correspond to the "outer gas blocking member" in the third resin packaging device of the present invention.

The substrate holding member (upper mold) 600 is composed of a communication member 610 that communicates with a high-pressure gas source 650 such as a compressor or a compressed air tank, a cavity upper surface, a frame member 620, a plurality of elastic members 602, and a plate member 640. The high pressure gas source 650 corresponds to the "substrate support member" of the third resin package device of the present invention. The upper surface of the cavity and the frame member 620 have a cavity 601. The communication member 610 and the upper surface of the cavity and the frame member 620 are attached to the plate member 640 via a plurality of elastic members 602. The communication member 610 is provided with an air passage (air passage) 603 for pumping air compressed by the high pressure gas source 650 in the cavity 601. The upper surface of the cavity and the frame member 620 are constructed by integrating an upper mold cavity upper surface member having a cavity 601 and a frame member surrounding the upper mold cavity upper surface member. On the upper surface of the cavity 601, a plurality of air holes 604 for communicating the air passage 603 of the communication member 610 and the cavity 601 are provided. The plate member 640 is provided in a state of being suspended from the upper die base 202 (not shown), for example, as in FIG. 1 or FIG. 14 . In the upper die base 202, for example with Figure 1 or 14 is the same, the upper mold outer gas blocking member 203 (not shown) having the O-rings 204A and 204B is provided, and the hole of the upper mold 200 for forcibly sucking the air in the space portion of the mold to be decompressed is provided ( Through hole) 205 (not shown).

The lower mold 700 is a molding die for compression molding, and is formed, for example, by a lower mold cavity lower surface member 710, a lower mold frame member 720, an elastic member 702, and a lower mold base member 730. The lower mold 700 constitutes the lower mold cavity 701 through the lower mold cavity lower surface member 710 and the lower mold frame member 720. The lower mold cavity lower surface member 710 is attached, for example, in a state of being placed on the lower mold base member 730. Further, the lower mold cavity lower surface member 710 is attached, for example, in a state of being placed on the lower mold base member 730 via the elastic member 702. The lower mold frame member 720 is disposed so as to surround the lower mold cavity lower surface member 710 in a state of being placed on the lower mold base member 730 via a plurality of elastic members 702, for example. Further, the sliding hole 711 is formed by the gap between the lower mold cavity lower surface member 710 and the lower mold frame member 720. As described below, the release film or the like can be adsorbed by, for example, suction through the slide hole 711. On the lower mold 700, for example, a heating element (not shown) for heating the lower mold 700 is provided. The resin in the lower mold cavity 701 is heated to be solidified (melted and solidified) by heating the lower mold 700 by the heating element. The lower mold 700 can be moved in the up and down direction by, for example, a drive mechanism (not shown) provided on the first molding module 500. In addition, the lower mold outer gas blocking member of the lower mold 700 is omitted for simplification and detailed description. The lower mold outer gas blocking member may be the same as the lower mold outer gas blocking member of FIG. 1 or FIG. 14, for example. That is, the lower mold 700 can be placed, for example, on the same lower mold base (not shown) as the lower mold base 302 of FIG. 1 or FIG. 14, and the outer peripheral position of the lower mold base can be compared with FIG. 1 or 14 set the same mold External gas blocking member and O-ring.

Fig. 17 is a cross-sectional view showing the second molding module 800 of the resin package device of the present embodiment. As shown in FIG. 17, the second molding die set 800 includes an upper die 900 and a substrate holding member (lower die) 1000 disposed opposite to the upper die. The upper mold 900 is the same as the upper mold 200 of FIG. 1 of the first resin sealing device 10 of the first embodiment except that the rigid member 231 is provided.

The substrate holding member (lower die) 1000 is, for example, a plate for placing the substrate 2 which is resin-sealed on one side by the first molding die set 500, and the cavity of the cavity lower surface member 1010 surrounding the cavity lower surface member 1010 The frame member 1020, the plurality of elastic members 1030, the base member 1040, and the lower mold outer gas blocking member 303 are formed, and the lower mold outer gas blocking member 303 has an O-ring 304. The substrate holding member (lower mold) 1000 constitutes the cavity 1001 through the cavity lower surface member 1010 and the cavity frame member 1020. The cavity lower surface member 1010 is mounted, for example, in a state in which the base member 1040 is placed. The cavity frame member 1020 is mounted in a state of being placed on the base member 1040 via a plurality of elastic members 1030, for example. As shown in FIG. 17, the substrate 2 is placed on the substrate holding member (lower mold) 1000 so that the sealing resin 150 in the resin package region is housed in the cavity 1001.

Next, the third resin encapsulation method of the present embodiment will be described using FIGS. 18 to 21. Hereinafter, the third resin encapsulation method using the resin package device shown in FIGS. 16 and 17 of the present embodiment will be described, but the third resin encapsulation method of the present embodiment is not limited to use in FIG. 16 and The resin package device shown in 17.

In the resin encapsulation method of the embodiment, the first resin seal is performed Before the mounting step, the substrate supply step and the resin supply step described below are performed first. Each step is an arbitrary component in the resin encapsulation method.

First, as shown in FIG. 18, the substrate 2 is transported by the substrate transfer mechanism 1100, the substrate 2 is supplied onto the substrate holding member (upper mold) 600 of the first molding module 500, and the substrate 2 is further passed through the substrate holder and the suction hole. (Slightly shown) Fixing (adsorption) (substrate supply step). After the substrate supply step, the substrate transfer mechanism 1100 is withdrawn.

Next, a resin transfer mechanism (not shown) is fed between the substrate holding member (upper die) 600 and the lower die 700. By the resin transfer mechanism, as shown in FIG. 19, the pellet resin 150a supplied to the release film 130 is transferred to the lower mold 700. Then, by sucking the arrow direction Y shown in FIG. 19 from the sliding hole 711 of the gap between the lower mold cavity lower surface member 710 and the lower mold frame member 720, the release film 130 is adsorbed, thereby supplying the mold release to the lower mold cavity 701. The film 130 and the particulate resin 150a (resin supply step). Thereafter, the resin transfer mechanism is withdrawn.

Next, as shown in FIGS. 19 to 21, the first resin encapsulation step of the present embodiment is performed. In the present embodiment, one side of the substrate is resin-molded by compression molding using the first molding module 500 having the lower mold 700 by the first resin encapsulation step.

Specifically, the same intermediate mold clamping as in the first embodiment is first performed. Specifically, the lower mold 700 is lifted by a drive mechanism (not shown), whereby the upper mold outer gas blocking member (not shown) and the lower mold outer gas blocking member (not shown) pass through the O-ring. (The drawing is abbreviated), and the inside of the lower mold (molding mold) 700 is in a state of being blocked from the outside air. Then, and Example 1 (Figure 4) Similarly, the hole in the upper mold (not shown) is sucked to decompress the inside of the mold. At this time, the substrate 2 is placed (fixed) on the upper mold 600 (the upper surface of the cavity and the frame member 620) as shown in FIG. That is, the inside of the cavity is depressurized in a state where the substrate 2 is not used as a cover on the lower mold 700 (lower mold cavity 701). Thereby, the lower mold cavity (model cavity) 701 is decompressed. Thus, excess air remaining in the lower mold cavity 701 can be effectively prevented (reduced), and the bending of the substrate can be more suppressed. Further, in the case where the substrate 2 is a cover on the lower mold 700 (lower mold cavity 701), the same vents as in the first and second embodiments can be used in order to reduce the pressure of the lower mold cavity 701.

Next, as shown in FIG. 20, the pellet resin 150a is heated and melted into a molten resin (flowable resin) 150b by the lower mold 700 heated by the heating element (not shown). Further, although the example in which the particulate resin 150a is melted after the intermediate mold clamping step has been described here, the time point at which the particulate resin 150a is melted is not limited thereto. Specifically, in the same manner as in the first and second embodiments, the pellet resin 150a may be melted into a molten resin (fluid resin) 150b during the period of contact with the wafer 1 and the lead wires 3. Further, similarly to the first embodiment (Fig. 3), the particulate resin 150a may be melted into a molten resin (flowable resin) 150b before the intermediate mold clamping. Next, as shown in FIG. 20, the lower mold 700 is lifted by a drive mechanism (not shown), and the wafer 1 mounted on the lower surface of the substrate 2 is immersed in the molten resin (flowable resin) 150b filled in the lower mold cavity 320, and Wire 3. Then, the lower mold 700 is further lifted (pressurized) by a driving mechanism (not shown), and a molding pressure (resin pressure) is applied to the substrate 2, or at a later time point, the high-pressure gas source 650 is in FIG. Supplying and molding the same pressure to the substrate holding member (upper mold) 600 in the direction of the arrow air. Thereby, the bending of the substrate can be suppressed, and the resin package can be performed on one surface (lower surface) of the substrate 2.

Further, in the present embodiment, for example, in the first molding die set 500, instead of supplying a high-pressure gas such as compressed air to the cavity 601, the cavity 601 may be filled with a gel-like solid. By pressing the substrate 2 with the gel-like solid, the bending of the substrate 2 can be suppressed. That is, as the "substrate supporting member" in the third resin packaging device of the present invention, for example, instead of the high-pressure gas source 650 shown in FIGS. 18 to 21, the substrate 2 may be pressed with the gel-like solid. mechanism.

Next, as shown in FIG. 21, after the molten resin (flow type resin) 150b is solidified to form the encapsulating resin 150, the lower mold 700 is lowered by a driving mechanism (not shown) and the mold opening is performed (opening step). At the time of mold opening, for example, as shown in FIG. 21, the suction through the slide hole 711 can be released. Then, after the mold is opened, the substrate holding member 1100 transfers the one surface (lower surface) formed substrate 2 to the substrate holding member (lower mold) 1000 of the second molding module 800 (second module transfer step).

Then, as shown in FIG. 17, the substrate 2 is placed on the substrate holding member (lower mold) 1000 in such a manner that the encapsulating resin 150 of the resin package region is housed in the cavity 1001. Thereafter, the resin resin 20a is supplied to the upper surface of the substrate 2 by a resin transfer mechanism (not shown) (resin supply step).

Further, the second resin encapsulation step is performed in the same manner as in FIGS. 2 to 9 of the first embodiment except that resin encapsulation is performed on only the upper surface of the substrate 2 instead of performing resin encapsulation on both surfaces of the substrate 2. At this time, since the lower surface of the substrate 2 is finished with the resin package, it is not necessary to melt the package tree again. The grease 150 is thus not required to heat the substrate holding member (lower mold) 1000. As described above, the second resin encapsulation method of the present embodiment can be performed.

In the third resin encapsulation method of the present embodiment, one side of the substrate 2 is resin-sealed by compression molding, and when the other side is subjected to resin encapsulation, one side is supported by a resin for compression molding, and resin is applied from the other surface side. The pressure also suppresses the bending of the substrate. Further, when the one side is first resin-sealed by compression molding, the other surface of the substrate that is not encapsulated by the resin is supported (pressurized) by the substrate supporting member (for example, the high-pressure gas or gel). In this state, the one side of the substrate is resin-molded by compression molding. Thereby, even if the resin pressure is applied from the one surface side, the bending of the substrate can be suppressed. Therefore, in the present embodiment, both the bending suppression of the substrate and the double-sided molding of the substrate can be achieved.

Further, as described above, the third resin encapsulating method of the present embodiment can be used for the resin encapsulation on the one side side by using an external gas blocking member or a vent or the like. 19 to 21, the lower mold cavity 701) of the lower mold 700 is decompressed. Thereby, excess air remaining in the cavity can be effectively prevented (reduced), and the bending of the substrate can be further suppressed.

The third resin encapsulating device and the third resin encapsulating method of the present embodiment are not limited to the devices and methods illustrated in FIGS. 16 to 21, and various modifications can be added. For example, similarly to the first and second embodiments, the lifting step and the lowering step of the ejector rod may be included using the ejector rod, and as shown in FIGS. 15(a) to (c), the frame member may be used for resin encapsulation. method. Also, for example, the order in which the compression steps are performed may be reversed. That is, in Figure 16 In Fig. 21, the upper mold is fixed to the substrate, and the lower surface of the substrate is first compression-molded in a state in which the upper surface of the substrate is supported (pressurized) by the substrate supporting member (high-pressure gas source). However, in contrast to this, in the state in which the lower mold is fixed to the substrate, and the lower surface of the substrate is supported (pressurized) by the substrate supporting member, the upper surface of the substrate is first compression-molded.

The present invention is not limited to the above-described embodiments, and any combination of appropriate and appropriate combinations, alterations, or selections may be employed as needed within the scope of the present invention.

10‧‧‧First resin packaging device

40‧‧‧ release film

200‧‧‧上模

201‧‧‧Upper mold base parts

202‧‧‧Upper pedestal

203‧‧‧Upper mold external gas blocking component

204A, 204B, 304‧‧‧ O-ring

205‧‧‧ hole in the upper mold

210‧‧‧Upper frame parts

220‧‧‧Upper model cavity

230‧‧‧Upper mold cavity upper surface parts

231‧‧‧Rigid parts

232‧‧‧First elastic part (or second elastic part)

300‧‧‧Down

301‧‧‧Mold base parts

302‧‧‧Down base

303‧‧‧Down mold external gas blocking component

310‧‧‧Down frame parts

320‧‧‧Model cavity

330‧‧‧ Lower cavity under the model cavity

332‧‧‧Second elastic part (or first elastic part)

Claims (18)

A resin encapsulating device for resin encapsulating both sides of a substrate, the resin encapsulating device comprising: a molding module for compression molding having an upper mold and a lower mold; the upper surface of the substrate can be compressed by the upper mold Forming is performed by resin encapsulation, and the lower surface of the substrate is resin-molded by compression molding through the lower mold; one of the upper mold and the lower mold includes a rigid member and a first elastic member, and the upper mold and the lower mold The other includes a second elastic member having a larger spring constant than the first elastic member; the upper mold further includes an upper mold base member and an upper mold frame member to surround the cavity of the upper mold The lower mold further includes a lower mold base member and a lower mold frame member, the lower mold frame member being disposed in a manner surrounding the cavity of the lower mold; the upper mold frame member via the first elastic member and the first One of the two elastic members hangs from the upper mold base member; the lower mold frame member passes through the other of the first elastic member and the second elastic member Mounted on the lower mold base member; in the state of resin encapsulation, the upper mold or the lower mold frame member is passed through the rigid member in a state in which the substrate is sandwiched by the upper mold frame member and the lower mold frame member The movement in the direction in which the upper mold and the lower mold are opened and closed is stopped. The resin encapsulating device according to claim 1, wherein the rigid member is suspended from the upper mold base member or protrudes from an upper surface of the lower mold base member; when the resin is packaged, the upper mold frame member and the lower portion are passed through a state in which the mold frame member holds the substrate, and one of the upper mold frame member and the lower mold frame member abuts against a front end of the rigid member, so that the upper mold frame member or the lower mold frame member is opened and closed The movement of the upper mold and the direction of the lower mold is stopped. The resin encapsulating device of claim 1, wherein the rigid member protrudes from the upper surface of the upper mold frame member or hangs from the lower mold frame member; and when the resin is packaged, passes through the upper mold frame member and the lower mold a state in which the frame member holds the substrate, and one of the upper mold base member and the lower mold base member abuts against the front end of the rigid member, so that one of the upper mold frame member and the lower mold frame member is opened The movement in the direction of the upper mold and the lower mold is stopped. The resin encapsulating device of claim 1, wherein the upper mold comprises the rigid member and the first elastic member, the lower mold comprises the second elastic member; the upper mold frame member is from the upper elastic member The mold base member hangs down; The lower mold frame member is placed on the lower mold base member via the second elastic member; the rigid member is suspended from the upper mold base member; and the resin is packaged to pass the upper mold frame member and the lower mold frame member In a state in which the substrate is sandwiched, the upper mold frame member abuts against the front end of the rigid member, and the movement of the upper mold frame member in the direction in which the rigid member is provided is stopped. The resin encapsulating device of claim 1, wherein the lower mold comprises the rigid member and the first elastic member, the upper mold includes the second elastic member; and the lower mold frame member is placed on the first elastic member The lower mold base member; the upper mold frame member is suspended from the upper mold base member via the second elastic member; the rigid member protrudes from the upper surface of the lower mold base member; and is passed through the upper mold frame during resin encapsulation The member and the lower mold frame member are in a state in which the substrate is sandwiched, and the lower mold frame member abuts against the front end of the rigid member, and the movement of the lower mold frame member in the direction in which the rigid member is provided is stopped. The resin encapsulating device according to any one of claims 1 to 5, wherein the resin encapsulating device further comprises a substrate pin; The substrate pin is provided to protrude upward from the outer side of the lower mold cavity of the molding module; the substrate pin can be placed in a state of being detached from the upper surface of the lower mold. The resin package device according to claim 6, wherein the substrate pin includes a protruding substrate positioning portion at a front end thereof; and the substrate pin can be inserted into the substrate by inserting the substrate positioning portion into the through hole provided in the substrate . The resin encapsulating device according to any one of claims 1 to 5, wherein the resin encapsulating device further comprises a ejector rod; the ejector rod is disposed to be at least from an upper mold and a lower mold of the molding module a cavity surface in and out; when the mold ram is opened, the front end thereof can be raised or lowered to protrude from the cavity surface; when the ejector pin is closed, the front end thereof can be raised or lowered to not The cavity surface is prominent. A resin encapsulating device for resin encapsulating both sides of a substrate, the resin encapsulating device comprising: a first molding module for compression molding, a second molding module for compression molding, and a substrate pin; a molding module, wherein one side of the substrate is resin-molded by compression molding, and the other surface of the substrate is resin-sealed by compression molding through the second molding module; The substrate pin is disposed to protrude upwardly on an outer side of a cavity of the lower mold provided in at least one of the first molding module and the second molding module; the substrate pin can make the substrate from the lower mold The state in which the upper surface is detached is placed. The resin encapsulating device of claim 9, wherein the resin encapsulating device comprises a top and bottom mold forming module having an upper mold and a lower mold; the upper and lower mold forming module also serving as the first molding module and the second molding module The upper surface of the substrate can be resin-molded by compression molding through the upper mold, and the lower surface of the substrate is resin-sealed by compression molding through the lower mold. The resin package device according to claim 9 or 10, wherein the substrate pin includes a protruding substrate positioning portion at a front end thereof; and the substrate pin can be placed by inserting the substrate positioning portion into a through hole provided in the substrate The substrate. The resin package device according to any one of claims 1 to 5, wherein the substrate is a mounting substrate on which a wafer is mounted on both surfaces thereof. A resin encapsulating device for resin encapsulating both sides of a substrate, the resin encapsulating device comprising: a first molding module for compression molding; and a second molding module for compression molding; The first molding module includes an external gas blocking member and a substrate supporting member, and the external molding gas blocking member can block the molding die of the first molding module from the external gas; In other words, the molding die and the external gas may be blocked to reduce the pressure in the cavity and the other surface of the substrate not encapsulated by the resin is supported by the substrate supporting member, and one side of the substrate is compression molded. The second molding module may be resin-sealed by compressing the other surface of the substrate in a state in which the one side of the substrate is encapsulated with a resin. The resin encapsulating device of claim 13, wherein the first molding module has a lower mold, and the lower surface of the substrate can be resin-molded by compression molding; the second molding module has an upper mold. The upper surface of the substrate can be resin-molded by compression molding through the upper mold. The resin package device of claim 13 or 14, wherein the substrate supporting member is an element supporting the other side of the substrate by a high pressure gas or a gelled solid. A resin encapsulation method for performing resin encapsulation on both sides of a substrate, the resin encapsulation method being carried out using the resin encapsulation apparatus according to any one of claims 1 to 8, and comprising the steps of: a first resin encapsulation step, The upper surface of the substrate is resin-molded by compression molding through the upper mold; a second resin encapsulating step of resin encapsulating the lower surface of the substrate by compression molding through the lower mold; in the first resin encapsulating step and the second resin encapsulating step, to pass the upper mold frame member and the lower portion The state in which the mold frame member holds the substrate, by which the movement of the upper mold or the lower mold member including the rigid member in the direction in which the upper mold and the lower mold are opened is stopped. A resin encapsulation method for performing resin encapsulation on both sides of a substrate, the resin encapsulation method being carried out using the resin encapsulation apparatus according to any one of claims 9 to 12, and comprising the steps of: a first resin encapsulation step, Forming, by the first molding module, one side of the substrate by resin molding by compression molding; and a second resin packaging step, by using the second molding module, resin-packaging the other side of the substrate by compression molding; In the step, the substrate is placed in a state of being detached from the upper surface of the lower mold by the substrate pin. A resin encapsulation method for performing resin encapsulation on both sides of a substrate, the resin encapsulation method being carried out using the resin encapsulation apparatus according to any one of claims 13 to 15, and comprising the steps of: a first resin encapsulation step, a state in which the molding die of the first molding module is blocked from the outside air and the other surface of the substrate which is decompressed in the cavity and is not encapsulated by the resin is supported by the substrate supporting member, Passing the one side of the substrate by the first molding module to perform resin encapsulation by compression molding; and the second resin encapsulating step, after the first resin encapsulation step, passing the one side of the substrate in a state of being encapsulated by the resin The second molding module encapsulates the other side of the substrate by compression molding.