TW202019657A - Molding die, resin molding device, and method for manufacturing resin-molded product includes two mold-film pressing members to clamp and apply tension to the release film - Google Patents

Abstract

The present invention provides a molding die that is capable of suppressing or preventing slacking or wrinkles of a release film. The forming die 1000 is characterized by including a mold 100 and another mold 200. The mold 100 is a mold that has a cavity 100A formed on the mold surface, and release film 40 sucked on the mold surface at the same time. The mold 100 includes a mold-film pressing member 103 that is movable in a molding die opening/closing direction. The other mold 200 includes the other mold-film pressing member 203 that is movable in the molding die opening/closing direction. The mold-film pressing member 103 and the other mold-film pressing member 203 can clamp together to hold the release film 40 and apply tension to the release film 40.

Description

Mold, resin molding device, and method for manufacturing resin molded product

The present invention relates to a molding die, a resin molding device, and a method of manufacturing a resin molded product.

In resin molding using a molding die, the mold surface of the molding die may be covered with a release film to form a resin. At this time, in order to suppress slack, wrinkles, and the like of the release film, an adsorption groove is provided in the mold (Patent Document 1).

[Prior Technical Literature] [Patent Literature] 1. Patent Document 1: Japanese Patent Laid-Open No. 2000-299334.

[Problems to be solved by the invention]

In the release film, there are various release films of different materials and thicknesses. If the types of the release film are different, physical properties such as thermal expansion rate, tensile strength, and tensile elongation may be different. For example, a large release film such as a thermal expansion rate and a tensile elongation rate is easily stretched. When a release film that is easily stretched is used, it may not be possible to suppress slack, wrinkles, etc. of the release film only by adsorption to the mold.

Therefore, an object of the present invention is to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product that can suppress or prevent slack or wrinkles of a release film.

[Method of solving the problem]

To achieve this object, the molding die of the present invention is characterized by: Contains one mode and another mode, The one mold is a mold in which a cavity is formed on the surface of the mold, and a mold release film is adsorbed on the surface of the mold, The one mold includes a mold film pressing member, The one mold film pressing member can move toward the opening and closing direction of the mold, The other mold includes another mold film pressing member, The other mold film pressing member can move in the opening and closing direction of the mold, It is possible to sandwich and hold the release film with the one mold film pressing member and the other mold film pressing member, and apply tension to the mold release film.

The resin molding apparatus of the present invention is characterized by including the molding die of the present invention.

The method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product using the molding die of the present invention or the resin molding device of the present invention, and is characterized by comprising: A step of installing a release film, installing a release film on the forming mold; A step of absorbing the release film, absorbing the release film on the mold surface of the forming mold; A tension addition step, applying tension to the release film; and In the resin molding step, the resin is molded by the molding die in a state where the mold surface adsorbs the release film, In the tension addition step, tension is applied to the release film in a state where the one mold film pressing member and the other mold film pressing member sandwich and hold the release film, In the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold in a state where the release film is absorbed.

[Effect of invention]

According to the present invention, it is possible to provide a molding die, a resin molding device, and a method for producing a resin molded product that can suppress or prevent slack or wrinkles of a release film.

Hereinafter, the present invention will be described in detail with examples. However, the present invention is not limited to the following description.

In the molding die of the present invention, for example, the one die may be a lower die, and the other die may be an upper die. Also, for example, the one mold may be an upper mold, and the other mold may be a lower mold.

In the molding die of the present invention, for example, the other die can be mounted on another die base member, and the other die film pressing member can move in the opening and closing direction of the molding die relative to the other die base member .

In the molding die of the present invention, for example, the one mold may include a side member and a bottom member, and the cavity may be formed by a space surrounded by the side member and the bottom member.

For example, the molding die of the present invention may further include a first elastic member, and the first mold member pressing member is movable in the opening and closing direction of the molding die by expansion and contraction of the first elastic member.

The molding die of the present invention can further include, for example, a second elastic member, and the expansion and contraction of the second elastic member allows the other mold film pressing member to move in the opening and closing direction of the molding die.

The molding die of the present invention can further include, for example, a first elastic member and a second elastic member. By the expansion and contraction of the first elastic member, the one mold film pressing member can move in the opening and closing direction of the molding die, and the second elastic member The expansion and contraction of the member allows the other mold film pressing member to move in the opening and closing direction of the molding die, and the spring constant of the second elastic member is greater than the spring constant of the first elastic member. In this case, for example, the one mold may include a side member, a bottom member, and a third elastic member, and the cavity may be formed by a space surrounded by the side member and the bottom member. The spring constant is greater than the spring constant of the second elastic member, and the side member can move in the opening and closing direction of the mold due to the expansion and contraction of the third elastic member.

In the molding die of the present invention, for example, the first elastic member may be replaced with an elastic member having a different length in the opening and closing direction of the molding die.

In the molding die of the present invention, for example, the one mold film pressing member can be moved in the opening and closing direction of the molding die relative to the side member.

In the molding die of the present invention, for example, the one die may further include a piping member, the one die film pressing member has an adsorption hole that adsorbs the release film, the piping member has a through hole, and the through hole is While the suction holes are in communication, the piping member can move in the opening and closing direction of the mold together with the one mold film pressing member. In this case, for example, the suction hole may have a groove shape surrounding the entire circumference of the cavity.

For the molding die of the present invention, the mold can be demolded in a state where the one mold and the other mold are close to each other, for example, when the mold release film is mounted on the one mold The membrane applies tension.

The molding die of the present invention can further include, for example, a driving section, and the driving section can be used to move the other mold film pressing member in the opening and closing direction of the molding die.

For the method of manufacturing a resin molded article of the present invention, for example, in the tension adding step, the one mold and the other mold can be brought closer to each other than in the step of installing the release film , Tension can be applied to the release film.

The method for manufacturing a resin molded product of the present invention is as described above, and although it includes the mold release film installation step, the mold release film adsorption step, the tension addition step, and the resin molding step, it may include any other steps . In addition, the order of performing the steps is not particularly limited, and is arbitrary.

In the present invention, “resin molding” is not particularly limited. For example, although resins such as wafers may be encapsulated with resin, they may be molded without resin encapsulation. Similarly, in the present invention, the "resin molded product" is not particularly limited, for example, it may be a resin molded product (product or semi-finished product, etc.) that encapsulates a resin such as a wafer, or it may be a resin-free package, and only a resin Formed products or semi-finished products. In addition, in the present invention, the “resin molded body” may be the resin molded product (product or semi-finished product) itself, but may also be a resin molded product in the middle of the manufacturing method of the resin molded product. For example, the “resin molded body” may be a resin molded body after the resin molding step and before the mold release step.

In addition, in the present invention, “resin molding” may, for example, resin-mold one or both sides of the molded object. However, the present invention is not limited to this. For example, it is possible to perform resin molding without using molded objects. In addition, for example, although an accessory resin such as a wafer fixed to one or both sides of the molded object may be encapsulated, it is not necessary to encapsulate the accessory resin, and only one or both sides of the molded object may be resin-molded.

In the present invention, the "molding object" is, for example, a substrate.

In the present invention, the method of “resin molding” is not particularly limited as long as it is a method of resin molding using a release film, and may be compression molding, for example, transfer molding, extrusion molding, or the like.

In the present invention, "resin molding" means, for example, a state where the resin is cured (hardened) and the cured resin is molded. The hardness of the cured resin is not particularly limited, and may be, for example, a degree to which the cured resin is not deformed or necessary to protect the wafer encapsulated by the resin, regardless of the hardness. Furthermore, in the present invention, the curing (hardening) of the resin is not limited to the state where the resin is completely cured (hardened), but may be a state where it can be further cured.

In the present invention, "mounting" includes "fixing".

Generally, "electronic parts" may refer to a wafer before resin encapsulation and a state in which the wafer is resin-encapsulated, but in the present invention, the case where it is only referred to as "electronic parts" unless otherwise specified means that the wafer is encapsulated with resin by electronic parts ( As a finished electronic accessory). Specific examples of the "wafer" in the present invention include wafers of passive components such as resistors, capacitors, and inductors, diodes, transistors, integrated circuits (Integrated Circuit (IC), semiconductor devices for power control, etc. Semiconductor wafers, sensors, filters, etc. In addition, in the present invention, the resin-encapsulated components are not limited to wafers, and may be at least one of wafers, leads, bumps, electrodes, wiring patterns, and the like, for example, and may include components that are not wafer-shaped.

The substrate (also referred to as a frame or an intermediate layer) which is a molded object of resin molding according to the resin molding apparatus or resin molding method of the present invention is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a silicon wafer, etc. The semiconductor wafer, ceramic substrate, metal substrate, etc. may be, for example, a circuit board such as a printed circuit board. In the case of resin molding such a molded object, this resin molding is sometimes referred to as "resin encapsulation". In the present invention, "resin molding" includes "resin encapsulation". For example, only one side of the substrate may be resin molded, or both sides of the resin may be molded. In addition, the substrate may be, for example, a mounting substrate on which wafers are mounted on one or both sides, or a wiring-only substrate. The method of mounting the wafer is not particularly limited, and examples include wire bonding and flip chip bonding. In the present invention, for example, by encapsulating one side or both sides of the mounting substrate with resin, an electronic accessory whose wafer is encapsulated with resin can be manufactured.

Also, according to the resin molding apparatus or resin molding method of the present invention, the use of the resin molded substrate is not particularly limited. Examples of applications of the substrate include module substrates for power control, high-frequency module substrates for mobile communication terminals, engine control substrates for transportation equipment, motor control substrates, and drive system control substrates. In addition, the shape of the substrate may be any shape and form as long as it can be molded. For example, a substrate that is regarded as a rectangle and a circle on a plane can be used.

In the present invention, the “resin molded product” is not particularly limited, and for example, it may be an electronic accessory that encapsulates a wafer resin by compression molding or the like. In addition, the “resin molded article” of the present invention may be an intermediate product for manufacturing single or multiple electronic accessories such as semiconductor products and circuit modules. In addition, the “resin molded product” of the present invention is not limited to electronic parts and intermediate products encapsulated with a wafer resin, and may be other resin molded products and the like.

In the present invention, the resin material (resin for resin molding) is not particularly limited. For example, it may be a thermosetting resin such as epoxy resin and silicone resin, or a thermoplastic resin. Also, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. As the form of the resin supplied to the resin encapsulating device, for example, granular resin, fluid resin, sheet resin, plate resin, powder resin and the like can be exemplified.

In addition, in the present invention, the "fluid resin" is not particularly limited as long as it has fluidity, and examples thereof include liquid resins and molten resins. In addition, in the present invention, "liquid" means having fluidity at normal temperature (room temperature) and flowing according to a force, without involving the level of fluidity, in other words, the degree of viscosity. That is, in the present invention, "liquid resin" refers to a resin that has fluidity at normal temperature (room temperature) and flows according to a force. In addition, in the present invention, "melted resin" refers to a resin that becomes liquid or has a fluid state by being melted by heating. The form of the molten resin is not particularly limited, and for example, it can be supplied to the cavity of the molding die.

In the present invention, the forming mold is not particularly limited, and for example, it may be a metal mold, a ceramic mold, or the like.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For the convenience of explanation, the drawings are appropriately omitted, exaggerated, etc., and schematically drawn.

[Example 1]

In this embodiment, an example of the resin molding apparatus of the present invention, an example of the peeling method of the release film of the present invention using the same, and an example of the method of manufacturing the resin molded article of the present invention are shown.

An example of the structure of the molding die of the present invention is schematically shown in the cross-sectional view of FIG. 1. In the same figure, as will be described later, the base members (upper mold base member and lower mold base member) to which the molding die is attached are also shown. As shown in the figure, the molding die 1000 includes a lower die 100 and an upper die 200. The lower mold 100 corresponds to the "one mold" of the present invention, and the upper mold 200 corresponds to the "other mold" of the present invention. The lower mold 100 is a mold that adsorbs a release film on the surface of the mold, as described later.

The lower mold 100 includes a lower mold side member 101 and a lower mold bottom member 102. The lower mold side member 101 corresponds to the "side member" in the "one mold" of the present invention. The lower die bottom member 102 corresponds to the "bottom member" in the "one die" of the present invention. The lower mold side member 101 is arranged so as to surround the lower mold bottom member 102. The space surrounded by the lower mold side member 101 and the lower mold bottom member 102 forms a cavity 100A on the mold surface of the lower mold 100 as shown. The lower mold bottom member 102 is fixed to the upper surface of the lower mold base member 110. The lower mold base member 110 corresponds to "one mold base member". The lower mold side member 101 is connected to the upper surface of the lower mold base member 110 through a third elastic member 101s. In addition, the lower mold base member 110 is formed of an upper lower mold base upper member 110A (one mold base upper member) and a lower lower mold base lower member 110B (one mold base lower member). According to the expansion and contraction of the third elastic member 101s, the lower mold side member 101 can move in the opening/closing direction of the molding die (in the figure, the vertical direction on the paper surface). The lower die base member 110 and the lower die bottom member 102 have through holes 100B. The through hole 100B penetrates from the lower surface to the upper surface of the lower mold base member 110 and further penetrates from the lower surface of the lower mold bottom surface member 102 to the side surface. The through hole 100B communicates the gap between the lower mold side member 101 and the lower mold bottom member 102. As described later, the mold release film can be attracted to the mold surface of the lower mold 100 by suction from the through hole 100B.

The lower mold 100 further includes a lower mold film pressing member (one mold film pressing member) 103, and a first elastic member 103s. The lower mold film pressing member 103 is fixed by the first elastic member 103s to the side of the peripheral portion of the lower mold side member 101 that is not in contact with the release film on the side opposite to the upper mold 200. According to the expansion and contraction of the first elastic member 103s, the lower mold film pressing member 103 can move in the opening/closing direction of the forming mold (the up and down direction on the paper in the figure). The lower mold film pressing member 103 is formed of three members: a lower mold film pressing upper outer member 103a, a lower mold film pressing lower member 103b, and a lower mold film pressing upper inner member 103c. The lower film presses the lower end of the lower member 103b and is connected to the first elastic member 103s. On the upper surface of the lower mold film pressing lower member 103b, the lower mold film pressing upper outer member 103a is fixed to the outside, and the lower mold film pressing upper inner member 103c is fixed to the inside. The gap between the lower mold film pressing upper outer member 103a and the lower mold film pressing upper inner member 103c forms a groove-shaped suction hole 100D that sucks the release film. In addition, the lower mold base lower member 110B has a through hole 100C penetrating from the upper surface to the lower surface of the lower mold base lower member 110B below the suction hole 100D. As described later, the suction hole 100D and the through hole 100C communicate with each other.

The lower mold 100 further has a piping member 104. The piping member 104 is connected to the lower die film pressing lower member 103b, and penetrates from the upper end of the first elastic member 103s to the lower end of the lower die base upper member 110A. The piping member 104 can move in the opening and closing direction of the mold together with the lower mold film pressing member 103. In addition, the piping member 104 has a through hole penetrating from the upper end to the lower end. The through hole of the piping member 104 communicates with the suction hole 100D of the lower mold film pressing member 103 at its upper end. The through hole of the piping member 104 communicates with the through hole 100C of the lower die base member 110 at the lower end thereof. As described later, the release film can be attracted to the lower mold film pressing member 103 of the lower mold 100 through the through hole 100C, the through hole of the piping member 104, and the suction hole 100D. That is, the mold release film can be attached to the lower mold 100 by attracting the mold release film to the lower mold film pressing member 103. In addition, an O-ring 104o is attached to the lower mold film pressing member 103 and the lower mold base member 110 so as to surround the piping member 104, respectively. The airtightness around the piping member 104 is maintained by the O-ring 104o.

The upper mold 200 includes an upper mold body 202, an upper mold film pressing member (another mold film pressing member) 203, and a second elastic member 203s. The upper mold body 202 is located directly above the lower mold bottom member 102 and the lower mold side member 101 and is fixed to the lower surface of the upper mold base member 210. The upper mold base member 210 corresponds to "another mold base member". As described later, the molding object can be fixed on the lower surface of the upper mold body 202. The upper mold film pressing member 203 is arranged so as to surround the upper mold body 202 and is located directly above the lower mold film pressing member 103. The upper mold film pressing member 203 is attached to the lower end of the upper mold base member 210 via the second elastic member 203s. According to the expansion and contraction of the second elastic member 203s, the upper mold film pressing member 203 can move in the opening and closing direction of the mold. As will be described later, the lower mold film pressing member 103 and the upper mold film pressing member 203 can sandwich and hold the release film and apply tension to the release film.

In addition, the spring constant of the second elastic member 203s is greater than that of the first elastic member 103s, and the spring constant of the third elastic member 101s is greater than that of the second elastic member 203s.

In addition, the mold 1000 of FIG. 1 constitutes a part of the resin molding apparatus. The resin molding apparatus may include any constituent elements (not shown) in addition to the mold 1000. Specifically, for example, the resin molding apparatus may include a suction mechanism (such as a vacuum pump) for adsorbing the mold release film, or may include an external air blocking member for decompressing the inside of the molding mold 1000. In addition, other constituent elements shown in FIG. 20 described later may be included.

2 to 11 show an example of a method of manufacturing a resin molded product using the mold 1000 of FIG. 1. First, as shown in FIG. 2, the substrate (object to be molded) 10 is fixed to the lower surface of the upper mold body 202. The tool for fixing the substrate 10 is not particularly limited. For example, the substrate 10 can be fixed using a jig (not shown) or the like. In addition, a through hole may be provided in the upper mold body 202 and the upper mold base member 210, and the through hole may be sucked by a suction mechanism (not shown, such as a vacuum pump) to suck the substrate 10 under the upper mold body 202. Surface and fix. As shown in the figure, a wafer 11 and a bonding wire 12 are mounted on the lower surface of the substrate 10. However, the structure of the substrate 10 is not limited to this. For example, any other components may be installed in addition to or instead of the wafer 11 and the bonding wire 12, or no components may be installed.

Next, as shown in FIG. 3, the release film 40 is transferred to a position on the mold surface of the lower mold 100 together with the resin material 20 a placed thereon. Then, the release film 40 is supplied onto the mold surface of the lower mold 100, and is mounted (installed) (release film installation step). Specifically, as shown in the figure, the release film 40 is placed on the upper surfaces of the lower mold side member 101 and the lower mold film pressing member 103. The tools and methods for placing the resin material 20a on the release film 40 are not particularly limited. For example, known tools and methods such as a feeder can be used as appropriate. In addition, although the resin material 20a is a sheet-shaped resin in this embodiment, it is not limited thereto, and may be, for example, a granular resin, a liquid resin, a plate-shaped resin, a semi-solid fluid resin, or the like.

Next, as shown by an arrow 100 a in FIG. 4, the inside of the through hole 100C of the lower mold base member 110 is sucked by a suction mechanism (not shown, for example, a vacuum pump or the like). According to this suction, the inside of the through hole 100C, the through hole of the piping member 104 communicating therewith, and the suction hole 100D are decompressed. According to this reduced pressure, the release film 40 is attracted to the upper surfaces of the lower mold side member 101 and the lower mold film pressing member 103.

In addition, an O-ring 104o surrounding the piping member 104 is disposed in the groove provided in the lower mold film pressing member 103 and the lower mold base upper member 110A. As a modification, as shown in the block diagram at the bottom left of FIG. 4, instead of the grooves of the lower mold film pressing member 103 and the lower mold base member 110, the piping member 104 may be provided with a groove for mounting the O-ring 104 o.

Furthermore, in this embodiment, the molding die 1000 is often preheated and heated up by a heater (not shown) provided therein. Due to the temperature increase due to this preheating, the resin material 20a starts to be melted when it is placed in the cavity 100A together with the release film 40, and becomes the molten resin 20b soon as will be described later. In addition, the pre-heating of the mold 1000 is performed before or at the same time as the release film installation step, for example. In addition, the pre-heating of the mold may be started after the release film installation step.

In the state of FIG. 4, the release film 40 is heated by the lower mold 100 which has been heated up. Therefore, as shown in FIG. 5, the release film 40 thermally expands. At this time, slack, wrinkles, and the like appear on the release film 40.

Next, as shown by arrow X1 in FIG. 6, the lower mold 100 is raised. Thus, as shown in the figure, the upper mold film pressing member 203 is brought into contact with the release film 40. By doing so, the lower mold film pressing member 103 and the upper mold film pressing member 203 sandwich and hold the release film 40.

In this state, as shown by the arrow X2 in FIG. 7, the lower mold 100 is further raised. In this way, the compression force is applied to the first elastic member 103s, the second elastic member 203s, and the third elastic member 101s, respectively. Here, as described above, the spring constant of the second elastic member 203s is greater than that of the first elastic member 103s, and the spring constant of the third elastic member 101s is greater than that of the second elastic member 203s. Therefore, as shown in FIG. 7, the first elastic member 103s with the smallest spring constant contracts. Thus, as shown in the figure, the lower mold film pressing member 103 is pressed downward relative to the lower mold side member 101. Thereby, as shown in the figure, the release film 40 can be pulled downward and tension can be applied (tension addition step). Thereby, slack, wrinkles, etc. of the release film 40 can be suppressed.

In addition, as shown in the figure, the first elastic member 103s is provided in the groove of the side member 101 of the lower mold. Therefore, when the lower mold 100 is further raised as shown in FIG. 7, if the lower mold side member 101 and the lower mold film pressing member 103 come into contact, the first elastic member 103s will not further shrink. As this modification, a stopper or the like can be provided so that the first elastic member 103s is not lower than a predetermined height (without further contraction).

Next, as shown by an arrow 100 b in FIG. 8, the inside of the through-holes 100B of the lower mold base member 110 and the lower mold bottom surface member 102 of the lower mold is sucked and decompressed by a suction mechanism (not shown, for example, a vacuum pump or the like). Thereby, as shown in the figure, the mold release film 40 is adsorbed on the mold surface (cavity surface) of the lower mold 100, and the mold surface of the lower mold 100 is covered with the mold release film 40. This step is a step of adsorbing the release film 40 on the mold surface of the lower mold 100, that is, the mold surface of the forming mold 1000, and therefore corresponds to the "release film adsorption step" of the present invention. In addition, in the present embodiment, although the release film adsorption step is performed after the tension addition step of applying tension to the release film, as described later, the timing of performing the release film adsorption step is not limited to this.

Next, as shown by arrow X3 in FIG. 9, the lower mold 100 is further raised. As a result, the second elastic member 203s provided in the upper mold contracts. If the lower mold 100 is further raised, as shown in the figure, the release film 40 contacts the substrate 10 and is sandwiched between the substrate 10 and the lower mold side member 101. Therefore, the lower mold side member 101 cannot be further raised. Therefore, the second elastic member 203s does not shrink further. In addition, a stopper or the like can be provided so that the second elastic member 203s is not lower than a predetermined height (without further contraction).

In this state, as shown by arrow X4 in FIG. 10, the lower mold 100 is further raised. In this way, as shown in the figure, the third elastic member 101s connected to the lower mold side member 101 contracts. As a result, the lower mold bottom surface member 102 is pushed upward relative to the lower mold side surface member 101 and the upper mold body 202. Therefore, the volume of the cavity 100A of the lower mold becomes small. At this time, as shown in FIG. 10, the resin material 20a is melted into molten resin (fluid resin) 20b. In this state, as shown in the figure, the lower mold bottom surface member 102 is pushed upward until the cavity 100A is filled with molten resin 20b. Thus, as shown in the figure, while the wafer 11 and the bonding wire 12 are immersed in the molten resin 20b, one surface of the substrate 10 (the surface on which the wafer 11 and the bonding wire 12 are mounted) contacts the molten resin 20b. In addition, a stopper and the like can be provided so that the third elastic member 101s is not lower than a predetermined height (without further contraction).

Further, the molten resin 20b is solidified (hardened) in this state. In so doing, the resin is molded according to the molding die 1000 (resin molding step). The method of curing the molten resin 20b is not particularly limited, as long as an appropriate method is selected according to the type of resin or the like. For example, when the molten resin 20b is a thermosetting resin, the mold can be further heated by a heater inside it to be cured. Further, for example, when the molten resin 20b is a thermoplastic resin, the heating of the molding die may be stopped, and the molten resin 20b may be solidified by natural cooling or by quenching the molding die.

After the solidification of the molten resin 20b is completed, as shown in FIG. 11, the lower mold 100 is lowered and the mold is opened. In the same figure, the molten resin 20b solidifies to become the cured resin 20. In this way, as shown in the figure, the resin molded product 30 including the substrate 10 and the cured resin 20 can be manufactured. In addition, in the resin molded product 30 of the same figure, the wafer 11 and the bonding wire 12 mounted on one surface of the substrate 10 are resin-encapsulated (resin molding) with the cured resin 20. In addition, the used release film 40 can be carried out to the outside of the mold 1000 after peeling off from the mold surface of the lower mold 100, for example.

[Example 2]

Next, different embodiments of the invention are shown.

12 to FIG. 14 is a step cross-sectional view showing a molding die of this embodiment and a method of manufacturing the resin molded article of this embodiment using the same.

As shown in FIG. 12, the molding die 1000 of this embodiment has an upper die film pressing member 203α in addition to the upper die film pressing member instead of the upper die film pressing member 203, the upper die film pressing member does not have the second elastic member 203s, and has Except for the driving portion 205 that moves the upper mold film pressing member 203α up and down, it is the same as the forming mold 1000 of FIGS. 1 to 11.

The state of FIG. 12 is a state where the lower mold film pressing member 103 and the upper mold film pressing member 203α sandwich and hold the release film 40 in the same manner as FIG. 6. The steps up to this point can be performed in the same manner as in FIGS. 2 to 6.

From the state of FIG. 12, as shown by an arrow Y1 in FIG. 13, the upper mold film pressing member 203α is pressed down by the driving unit 205. In this way, as shown in the figure, the first elastic member 103 s contracts, and the lower mold film pressing member 103 is pressed downward relative to the lower mold side member 101. Thereby, as shown in the figure, the release film 40 can be pulled downward and tension can be applied (tension addition step). Thereby, slack, wrinkles, etc. of the release film 40 can be suppressed. The tension adding step of FIG. 13 can be performed in the same manner as the tension adding step of FIG. 7 except that the upper die film pressing member 203α is pressed down by the driving section 205 instead of raising the lower die 100.

The state of FIG. 14 is a state in which the lower mold 100 is pushed up to fill the cavity 100A with the molten resin 20b, and the wafer 11 and the bonding wire 12 are immersed in the molten resin 20b. From the state of FIG. 13 to FIG. 14, it can be performed in the same manner as FIGS. 8 to 10. Other steps in this embodiment can also be performed in the same manner as in Embodiment 1 (FIGS. 2 to 11 ).

In addition, in the present invention, like the second elastic member, the first elastic member is also arbitrary. That is, as long as one of the mold film pressing members can be moved in the opening and closing direction of the mold, there may be any first elastic member.

In addition, in the molding die 1000 of Example 1 and Example 2, the shape of the suction hole 100D in the lower die 100 and the piping member 104 is not particularly limited. One example is shown in FIGS. 15(a) and (b). FIG. 15(a) is a plan view of the lower mold 100 in Embodiment 1 and Embodiment 2 (FIG. 1 to FIG. 14). 15(b) is a cross-sectional view of the same lower mold 100, which is the same as the cross-sectional view of the lower mold 100 in FIGS. 1 to 14. The shape of the suction hole 100D is, for example, as shown in the plan view of FIG. 15( a ), preferably a groove shape that surrounds the entire periphery of the cavity 100A. According to such a shape, for example, since the adsorption force of the release film 40 is increased, it is possible to suppress slack, wrinkles, and the like of the release film 40. However, in the present invention, the shape of the suction holes of one die and piping member is not limited to this. For example, the shape of the suction hole may be a shape that only surrounds a part of the molding model cavity rather than the whole. In addition, although the suction hole in FIG. 15(a) has a single groove shape, it is not limited to this. The suction hole may be divided into a plurality of shapes, and may have other arbitrary shapes (for example, dot shape, etc.) instead of the groove shape.

In addition, in the present invention, as described above, it is possible to apply tension to the release film in a state where one mold and the other mold are close to each other compared to when the release film is attached to one mold. Thereby, for example, slack and wrinkles of the release film can be further suppressed. In the following, this is further explained in detail.

16 and 17 are cross-sectional views showing the same state as in FIGS. 5 and 6, respectively. FIG. 16 is a state where the release film 40 heated by the heated lower mold 100 is thermally expanded after the release film installation step (FIG. 4) as described with reference to FIG. 5. In this state, the central portion 40a of the release film 40 does not contact the lower mold 100, and the peripheral portion 40b of the release film 40 contacts the lower mold 100. Therefore, although the central portion 40a receives heat radiation from the lower mold 100, there is no heat conduction by contact with the lower mold 100. On the other hand, the peripheral edge portion 40b is heated by direct thermal conduction from the lower mold 100 in contact. Therefore, the temperature of the central portion 40a is lower than that of the peripheral portion 40b. That is, the temperature of the release film 40 varies depending on the location. In this state, when tension is applied to the release film 40 or the release film 40 is covered on the surface of the cavity, phenomena such as a portion where the temperature is high are easily stretched, and a portion where the temperature is low is not easy to be stretched. In this case, slack, wrinkles, etc. may occur on the release film 40.

Therefore, as shown in FIG. 17 (FIG. 6), after the release film installation step (FIG. 4), the lower mold 100 and the upper mold 200 are brought closer. As a result, as shown in the figure, the influence of heat radiation from the upper mold 200 becomes greater, and the release film 40 receives heat radiation H from both the lower mold 100 and the upper mold 200. As a result, the temperature of the entire release film 40 approaches a constant. After doing so, tension can be applied to the film as explained in FIG. 7. Thereby, for example, slack, wrinkles, etc. of the release film 40 can be suppressed. In addition, in order to make the temperature of the entire release film 40 closer to a certain level, for example, the rising speed of the lower mold 100 may be reduced or temporarily stopped near the position where the release film 40 and the upper mold film pressing member 203 are in contact.

In addition, as described above, in the method of manufacturing a resin molded article of the present invention, the order of performing each step is not particularly limited. An example of this is shown in the step cross-sectional view of FIG. 18. The molding die 1000 of FIG. 18 is the same as the molding die 1000 of Example 1 (FIGS. 1 to 11 ). FIG. 18 shows a state in which the inside of the through holes 100B of the lower mold base member 110 and the lower mold bottom member 102 of the lower mold 100 are attracted and decompressed in the same manner as FIG. 8 after the state of FIG. 5. Thus, as shown in the drawing, the mold release film 40 is adsorbed on the mold surface (cavity surface) of the lower mold 100, and the mold surface of the lower mold 100 is covered with the mold release film 40 (mold release film adsorption step). In the manufacturing method of the resin molded product of FIGS. 2 to 11, as shown in FIGS. 6 to 8, a tension addition step (FIG. 7) is performed after the release film installation step, and then a release film adsorption step ( Figure 8). However, as shown in FIG. 18, the release film adsorption step may be performed after the release film installation step and before the tension addition step. After the release film adsorption step of FIG. 18 is performed, for example, the tension addition step can be performed as in FIG. 7. The other steps can be performed in the same manner as the method of manufacturing the resin molded product of Example 1 (FIGS. 2 to 11 ), for example.

Further, as described above, the resin molding apparatus of the present invention can change the tension applied to the release film by replacing the first elastic member with an elastic member having a different length in the opening and closing direction of the mold. One example is shown in the cross-sectional views of FIGS. 19(a) and (b). The lower die 100 of FIG. 19(a) is the same as the lower die 100 of Example 1 and Example 2. The lower mold 100 of FIG. 19(b) is the same as FIG. 19(a) except that the first elastic member 103s is replaced with an elastic member having a different height (length in the opening and closing direction of the mold). 19(a) is higher than the height of the first elastic member 103s in FIG. 19(b). As shown in the figure, in a state where the first elastic member 103s is not contracted, the distance between the lower end of the lower mold film pressing member 103 and the lower mold side member 101 is A in FIG. 19(a) and is in FIG. 19(b). B, distance A is greater than distance B. By changing the height of the first elastic member 103s in this way, the tension applied to the release film 40 can be changed. Specifically, the upper limit of the retractable length of the first elastic member 103s is equal to the distance between the lower end of the lower mold film pressing member 103 and the lower mold side member 101. In addition, this distance is equal to the maximum value of the distance by which the lower mold side member 101 can be pressed down. Also, as described above, the distance is A in FIG. 19(a) and B in FIG. 19(b), and the distance in FIG. 19(a) is larger. Therefore, the maximum value of the tension that can be applied to the release film 40 in FIG. 19(a) is larger than that in FIG. 19(b).

In the conventional molding die and resin molding apparatus, in order to change the tension applied to the release film as described above, for example, since the depth of the suction groove of the lower mold side member must be changed, the entire lower mold side member must be replaced. However, in the present invention, for example, as shown in FIGS. 19(a) and 19(b), the tension applied to the release film can be changed only by replacing the first elastic member.

[Example 3]

Next, another embodiment of the present invention is shown.

An example of the structure of the resin molding apparatus of this invention is shown in the plan view of FIG. As shown in the figure, the resin molding apparatus 5000 includes a molding portion 2000, a substrate portion (molded object portion) 3000, and a resin portion 4000. The substrate part 3000 is arranged adjacent to the molding part 2000. The resin portion 4000 is arranged adjacent to the molding portion 2000 on the opposite side of the substrate portion 3000. The molding section 2000 includes a molding die 1000. The molding die 1000 can be the same as the molding die 1000 of Example 1 or Example 2 (FIGS. 1 to 14 ), for example. The substrate part 3000 includes a substrate supply part 3100 before molding, a substrate discharge part 3200 after molding, and a substrate loader (substrate conveying mechanism) 3300. The resin part 4000 includes a release film and a resin supply part 4100, a release film discharge part 4200 after use, and a resin loader (resin conveying mechanism) 4300. As shown by the arrows, the substrate pre-molding substrate supply unit 3100 can carry out the substrate before molding (object to be molded) by the substrate loader 3300 and supply it to the molding die 1000. The substrate before molding can be the same as the substrate 10 of Example 1, for example. Furthermore, according to the substrate loader 3300, the molded substrate can be carried out from the molding die 1000 and stored in the molded substrate discharge portion 3200. The substrate after molding can be the same as the resin molded product 30 shown in FIG. 11, for example. In addition, the resin loader 4300 can carry out the mold release film and the resin material from the mold release film and resin supply unit 4100 and supply it to the mold 1000. The release film and the resin material are, for example, as shown in FIG. 4 of Example 1, the release film 40 on which the resin material 20a is placed. In addition, the post-use release film can be carried out from the mold 1000 by the resin loader 4300 and stored in the post-use release film discharge part 4200. The post-use release film may be, for example, a release film that is peeled from the mold surface of the mold after resin molding is completed (for example, in the state of FIG. 11 of Example 1).

However, the structure of the resin molding apparatus of the present invention is not limited to FIG. 20, and may be arbitrary.

The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected and adopted as needed within a range not departing from the gist of the present invention.

This application claims priority based on Japanese Patent Application 2018-220061 filed on November 26, 2018, and the entire contents of the disclosure are incorporated herein by reference.

10: substrate (object to be molded) 11: Wafer 12: Bonding line 20: cured resin 20a: resin material 20b: molten resin (fluid resin) 30: Resin molded product 40: Release film 40a: the central part of the release film 40 40b: The peripheral part of the release film 40 100: lower die (one die) 100A: cavity 100B: through hole 100C: through hole 100D: adsorption hole 101: side member of lower die (side member) 101s: the third elastic member 102: Lower mold bottom member (bottom member) 103: Lower mold film pressing member (one mold film pressing member) 103a: the lower mold film presses the upper outer member 103b: The lower mold film presses the lower member 103c: the lower mold film presses the upper inner member 103s: the first elastic member 104: piping member 104o: O-ring 110: lower mold base member (one mold base member) 110A: Lower mold base upper member (one mold base upper member) 110B: Lower mold base lower member (one mold base lower member) 200: upper mold (another mold) 202: Upper mold body 203: Upper mold film pressing member (another mold film pressing member) 203s: the second elastic member 203α: upper mold film pressing member (another mold film pressing member) 205: Drive unit 210: Upper mold base member (another mold base member) X1, X2, X3, X4: arrows indicating the rising direction of the lower die 100 Y1: Arrow indicating the downward direction of the upper mold film pressing member 203α 100a, 100b: Arrows indicating suction (decompression) by suction mechanism 1000: forming mold 2000: Molding Department 3000: substrate part (molding object part) 3100: Substrate supply section before molding 3200: substrate discharge section after molding 3300: substrate loader (substrate handling mechanism) 4000: Resin Department 4100: Release film and resin supply unit 4200: Release part of release film after use 4300: Resin loader (resin handling mechanism) 5000: resin molding device

FIG. 1 is a cross-sectional view illustrating the structure of the molding die of the present invention.

FIG. 2 is a cross-sectional view showing one step in an example of the method for manufacturing the resin molded article of the present invention using the mold of FIG. 1.

3 is a cross-sectional view showing another step in the method of manufacturing the same resin molded product as FIG. 2.

4 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

FIG. 5 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

6 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

7 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

FIG. 8 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

9 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

FIG. 10 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

FIG. 11 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 2.

Fig. 12 is a cross-sectional view showing another example of a method of manufacturing a resin molded article using the mold in another example of the mold structure of the present invention.

13 is a cross-sectional view showing another step in the method of manufacturing the same resin molded product as FIG. 12.

14 is a cross-sectional view showing still another step in the method of manufacturing the same resin molded product as FIG. 12.

FIG. 15 is a diagram illustrating the structure of one of the molding dies of the present invention. 15(a) is a plan view, and FIG. 15(b) is a cross-sectional view.

16 is a cross-sectional view showing one step in still another example of the method for manufacturing a resin molded article of the present invention.

17 is a cross-sectional view showing one step in still another example of the method for manufacturing the resin molded article of the present invention.

18 is a cross-sectional view showing one step in still another example of the method for manufacturing a resin molded article of the present invention.

19 (a) and (b) are cross-sectional views showing still another example of the structure of the molding die of the present invention.

20 is a plan view showing an example of the structure of the resin molding apparatus of the present invention.

10: substrate (object to be molded)

11: Wafer

12: Bonding line

20a: resin material

40: Release film

100: lower die (one die)

100A: cavity

100B: through hole

100C: through hole

100D: adsorption hole

101: side member of lower die (side member)

101s: the third elastic member

102: Lower mold bottom member (bottom member)

103: Lower mold film pressing member (one mold film pressing member)

103a: the lower mold film presses the upper outer member

103b: The lower mold film presses the lower member

103c: the lower mold film presses the upper inner member

103s: the first elastic member

104: piping member

104o: O-ring

110: lower mold base member (one mold base member)

110A: Lower mold base upper member (one mold base upper member)

110B: Lower mold base lower member (one mold base lower member)

200: upper mold (another mold)

202: Upper mold body

203: Upper mold film pressing member (another mold film pressing member)

203s: the second elastic member

210: Upper mold base member (another mold base member)

1000: forming mold

Claims (17)

A molding die, including one die and another die, The one mold is a mold in which a cavity is formed on the surface of the mold, and a mold release film is adsorbed on the surface of the mold, The one mold includes a mold film pressing member, The one mold film pressing member can move toward the opening and closing direction of the mold, The other mold includes another mold film pressing member, The other mold film pressing member can move in the opening and closing direction of the mold, It is possible to sandwich and hold the release film with the one mold film pressing member and the other mold film pressing member, and apply tension to the mold release film. The molding die according to claim 1, wherein the one die is a lower die and the other die is an upper die. The mold according to claim 1 or 2, wherein the other mold is mounted on another mold base member, The other mold film pressing member is movable in the opening and closing direction of the mold relative to the other mold base member. The mold according to claim 1 or 2, wherein the one mold includes a side member and a bottom member, The cavity is formed by a space surrounded by the side member and the bottom member. The molding die according to claim 1 or 2, further comprising a first elastic member, By the expansion and contraction of the first elastic member, the one mold film pressing member can move in the opening and closing direction of the mold. The molding die according to claim 1 or 2, further comprising a second elastic member, By the expansion and contraction of the second elastic member, the other mold film pressing member can move in the opening and closing direction of the mold. The molding die according to claim 1 or 2, further comprising a first elastic member and a second elastic member, By the expansion and contraction of the first elastic member, the one mold film pressing member can move in the direction of opening and closing of the mold, By the expansion and contraction of the second elastic member, the other mold film pressing member can move in the opening and closing direction of the mold, The spring constant of the second elastic member is greater than the spring constant of the first elastic member. The molding die according to claim 7, wherein the one die includes a side member, a bottom member, and a third elastic member, Forming the cavity by a space surrounded by the side member and the bottom member, The spring constant of the third elastic member is greater than the spring constant of the second elastic member, Due to the expansion and contraction of the third elastic member, the side member can move in the opening and closing direction of the mold. The molding die according to claim 5, wherein the first elastic member can be replaced with an elastic member having a different length in the opening and closing direction of the molding die. The molding die according to claim 4, wherein the one mold film pressing member is movable in the opening and closing direction of the molding die relative to the side member. The mold according to claim 1 or 2, wherein the one mold further includes a piping member, The one mold film pressing member has an adsorption hole for adsorbing the release film, The piping member has a through hole, While the through hole communicates with the suction hole, the piping member can move in the direction of opening and closing the molding die together with the one film pressing member. The molding die according to claim 11, wherein the suction hole has a groove shape surrounding the entire circumference of the cavity. The molding die according to claim 1 or 2, wherein, when the mold release film is mounted on the one mold, in a state where the one mold and the other mold are close to each other, the The release film applies tension. The molding die according to claim 1 or 2, further comprising a driving section, and the driving section can be used to move the other mold film pressing member in a direction in which the molding mold is opened and closed. A resin molding apparatus comprising the molding die described in any one of claims 1 to 14. A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using the mold according to any one of claims 1 to 14 or the resin molding apparatus according to claim 15, which includes the following steps: A step of installing a release film, installing a release film on the forming mold; A step of absorbing the release film, absorbing the release film on the mold surface of the forming mold; A tension addition step, applying tension to the release film; and In the resin molding step, the resin is molded by the molding die in a state where the mold surface adsorbs the release film, In the tension addition step, tension is applied to the release film in a state where the one mold film pressing member and the other mold film pressing member sandwich and hold the release film, In the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold in a state where the release film is absorbed. The method for manufacturing a resin molded product according to claim 16, wherein in the tension adding step, when the one die and the other die are closer to each other than in the step of installing the release film In this state, tension is applied to the release film.

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